TW215927B - - Google Patents
Info
- Publication number
- TW215927B TW215927B TW082100653A TW82100653A TW215927B TW 215927 B TW215927 B TW 215927B TW 082100653 A TW082100653 A TW 082100653A TW 82100653 A TW82100653 A TW 82100653A TW 215927 B TW215927 B TW 215927B
- Authority
- TW
- Taiwan
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3236—Heterocylic compounds
- C08G59/3245—Heterocylic compounds containing only nitrogen as a heteroatom
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/06—Triglycidylisocyanurates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Reinforced Plastic Materials (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH62092 | 1992-02-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW215927B true TW215927B (zh) | 1993-11-11 |
Family
ID=4191251
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW082100653A TW215927B (zh) | 1992-02-28 | 1993-02-02 |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0559607A2 (zh) |
JP (1) | JPH0641397A (zh) |
KR (1) | KR100259025B1 (zh) |
CA (1) | CA2090546A1 (zh) |
TW (1) | TW215927B (zh) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5521261A (en) * | 1993-06-07 | 1996-05-28 | Ciba-Geigy Corporation | Epoxy resin mixtures containing advancement catalysts |
JPH0827052A (ja) * | 1994-07-12 | 1996-01-30 | Nippon Kayaku Co Ltd | ポリフェノール類、エポキシ樹脂、エポキシ樹脂組成物及びその硬化物 |
JPH11279376A (ja) * | 1998-03-27 | 1999-10-12 | Hitachi Chem Co Ltd | 印刷配線板用エポキシ樹脂組成物およびこれを用いた印刷配線板 |
WO2000053654A1 (fr) * | 1999-03-11 | 2000-09-14 | Toray Industries, Inc. | Composition de resine epoxy, composition de resine epoxy pour materiau composite a fibres, et materiau composite a fibres contenant ladite composition |
EP1175465A1 (en) * | 1999-04-21 | 2002-01-30 | Vantico AG | Flowable powder coating composition |
JP2001081203A (ja) * | 1999-09-17 | 2001-03-27 | Hitachi Chem Co Ltd | 樹脂シート、金属はく張り積層板及び多層プリント配線板 |
KR20060000313A (ko) * | 2004-06-28 | 2006-01-06 | 루미마이크로 주식회사 | 대입경 형광 분말을 포함하는 색변환 발광 장치 그의 제조방법 및 그에 사용되는 수지 조성물 |
JP2008255367A (ja) * | 2008-07-04 | 2008-10-23 | Dic Corp | エポキシ樹脂組成物およびその成形硬化物 |
US20110250459A1 (en) * | 2008-12-19 | 2011-10-13 | Mitsuyoshi Nishino | Epoxy resin composition, prepreg, laminate board, and multi-layer board |
WO2011072629A1 (de) * | 2009-12-17 | 2011-06-23 | Conti Temic Microelectronic Gmbh | Leiterplatte mit mehreren übereinander angeordneten leiterplattenlagen mit einer bare-die-montage für den einsatz als getriebesteuerung |
JP2013018804A (ja) * | 2011-07-07 | 2013-01-31 | Nagase Chemtex Corp | エポキシ樹脂組成物 |
JP6274112B2 (ja) * | 2012-12-12 | 2018-02-07 | 株式会社ニコン | 組成物、積層体、積層体の製造方法、トランジスタおよびトランジスタの製造方法 |
CN107922590B (zh) * | 2015-07-07 | 2020-08-04 | 陶氏环球技术有限责任公司 | 用于制造复合材料的稳定高玻璃化转变温度环氧树脂系统 |
JP6274364B1 (ja) * | 2016-06-28 | 2018-02-07 | 東レ株式会社 | プリプレグおよび繊維強化複合材料 |
KR102294515B1 (ko) * | 2016-06-28 | 2021-08-27 | 도레이 카부시키가이샤 | 에폭시 수지 조성물, 프리프레그 및 섬유 강화 복합 재료 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6155123A (ja) * | 1984-08-27 | 1986-03-19 | Nitto Electric Ind Co Ltd | 粉末状エポキシ樹脂組成物の製造方法 |
CH672494A5 (zh) * | 1987-07-23 | 1989-11-30 | Ciba Geigy Ag |
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1993
- 1993-02-02 TW TW082100653A patent/TW215927B/zh active
- 1993-02-19 EP EP93810103A patent/EP0559607A2/de not_active Withdrawn
- 1993-02-25 JP JP5061089A patent/JPH0641397A/ja active Pending
- 1993-02-25 KR KR1019930002936A patent/KR100259025B1/ko not_active IP Right Cessation
- 1993-02-26 CA CA002090546A patent/CA2090546A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
EP0559607A2 (de) | 1993-09-08 |
JPH0641397A (ja) | 1994-02-15 |
EP0559607A3 (zh) | 1994-04-20 |
KR930017972A (ko) | 1993-09-21 |
CA2090546A1 (en) | 1993-08-29 |
KR100259025B1 (ko) | 2000-06-15 |