TW202537761A - 預成型焊料及其製造方法以及焊料接頭的製造方法 - Google Patents

預成型焊料及其製造方法以及焊料接頭的製造方法

Info

Publication number
TW202537761A
TW202537761A TW113145102A TW113145102A TW202537761A TW 202537761 A TW202537761 A TW 202537761A TW 113145102 A TW113145102 A TW 113145102A TW 113145102 A TW113145102 A TW 113145102A TW 202537761 A TW202537761 A TW 202537761A
Authority
TW
Taiwan
Prior art keywords
metal
aforementioned
phase
mass
content
Prior art date
Application number
TW113145102A
Other languages
English (en)
Chinese (zh)
Inventor
司
佐佐木智揮
立花芳恵
Original Assignee
日商千住金屬工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商千住金屬工業股份有限公司 filed Critical 日商千住金屬工業股份有限公司
Publication of TW202537761A publication Critical patent/TW202537761A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0205—Non-consumable electrodes; C-electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/03—Alloys based on nickel or cobalt based on nickel

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Powder Metallurgy (AREA)
TW113145102A 2023-12-07 2024-11-22 預成型焊料及其製造方法以及焊料接頭的製造方法 TW202537761A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-207004 2023-12-07
JP2023207004 2023-12-07

Publications (1)

Publication Number Publication Date
TW202537761A true TW202537761A (zh) 2025-10-01

Family

ID=95980957

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113145102A TW202537761A (zh) 2023-12-07 2024-11-22 預成型焊料及其製造方法以及焊料接頭的製造方法

Country Status (3)

Country Link
JP (1) JPWO2025121150A1 (https=)
TW (1) TW202537761A (https=)
WO (1) WO2025121150A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5742157B2 (ja) * 2010-09-30 2015-07-01 Tdk株式会社 電子回路モジュール部品及び電子回路モジュール部品の製造方法
JP5849422B2 (ja) * 2010-09-30 2016-01-27 Tdk株式会社 Ｐｂフリーはんだ
JP2013081966A (ja) * 2011-10-06 2013-05-09 Fujitsu Ltd 導電性接合材料、並びに導体の接合方法、及び半導体装置の製造方法
WO2015114771A1 (ja) * 2014-01-30 2015-08-06 千住金属工業株式会社 Ｃｕ核ボール、はんだ継手、フォームはんだ、およびはんだペースト
WO2017154330A1 (ja) * 2016-03-07 2017-09-14 株式会社村田製作所 接合材料及び接合体の製造方法
WO2021020309A1 (ja) * 2019-07-26 2021-02-04 株式会社日本スペリア社 プリフォームはんだ及び該プリフォームはんだを用いて形成されたはんだ接合体
JP7014991B1 (ja) * 2021-03-31 2022-02-02 千住金属工業株式会社 プリフォームはんだ及びその製造方法、並びにはんだ継手の製造方法
CN114131237A (zh) * 2021-12-14 2022-03-04 浙江亚通焊材有限公司 一种泡沫焊锡及其制备方法

Also Published As

Publication number Publication date
JPWO2025121150A1 (https=) 2025-06-12
WO2025121150A1 (ja) 2025-06-12

Similar Documents

Publication Publication Date Title
TWI658757B (zh) 陶瓷電路基板、及陶瓷電路基板的製造方法
Yao et al. Effects of multiple reflows on intermetallic morphology and shear strength of SnAgCu–xNi composite solder joints on electrolytic Ni/Au metallized substrate
US10157877B2 (en) Semiconductor device and manufacturing method of semiconductor device
CN115139009B (zh) 预成型焊料及其制备方法、以及焊接接头的制备方法
Takaku et al. Development of Bi-base high-temperature Pb-free solders with second-phase dispersion: Thermodynamic calculation, microstructure, and interfacial reaction
JP2018079480A (ja) 低温用のＢｉ−Ｉｎ−Ｓｎ系はんだ合金、それを用いた電子部品実装基板及びその実装基板を搭載した装置
EP3192609A1 (en) Lead-free eutectic solder alloy comprising zinc as the main component and aluminum as an alloying metal
JP5861559B2 (ja) ＰｂフリーＩｎ系はんだ合金
JP2026048938A (ja) 接合構造及び該接合構造を有する半導体装置
KR102040278B1 (ko) 무연솔더 합금 조성물 및 그 제조방법, 무연솔더 합금 조성물을 이용한 부재 간의 접합방법
JP2011251332A (ja) Ａｌ粉を用いた高温Ｐｂフリーはんだペースト
TWI279281B (en) Lead-free solder alloy and preparation thereof
JPH07121467B2 (ja) Ｓｉ半導体素子をＣｕ基合金製リードフレームに少ない残留熱歪ではんだ付けする方法
KR102040280B1 (ko) 무연솔더 합금 조성물 및 그 제조방법, 무연솔더 합금 조성물을 이용한 부재 간의 접합방법
TW202537761A (zh) 預成型焊料及其製造方法以及焊料接頭的製造方法
CN119387946A (zh) 一种用于钎焊的复合无铅焊料
CN115178910B (zh) 用于电子应用的具有成本效益的无铅焊料合金
TWI795778B (zh) 無鉛焊料合金、焊料球、焊膏及半導體裝置
JP7386826B2 (ja) 成形はんだ及び成形はんだの製造方法
WO2025159119A1 (ja) 接合材及びその製造方法、並びに、はんだ継手及びその製造方法
JP2008080392A (ja) 接合体および接合方法
JP2017136628A (ja) Ｉｎ系クラッド材
JP6887184B1 (ja) 積層体および積層体の製造方法
EP4592007B1 (en) Solder paste and its use to form a solder joint
US20250121461A1 (en) Bonding material and bonded structure