JPWO2025121150A1 - - Google Patents

Info

Publication number
JPWO2025121150A1
JPWO2025121150A1 JP2025555862A JP2025555862A JPWO2025121150A1 JP WO2025121150 A1 JPWO2025121150 A1 JP WO2025121150A1 JP 2025555862 A JP2025555862 A JP 2025555862A JP 2025555862 A JP2025555862 A JP 2025555862A JP WO2025121150 A1 JPWO2025121150 A1 JP WO2025121150A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025555862A
Other languages
Japanese (ja)
Other versions
JPWO2025121150A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2025121150A1 publication Critical patent/JPWO2025121150A1/ja
Publication of JPWO2025121150A5 publication Critical patent/JPWO2025121150A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0205—Non-consumable electrodes; C-electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/03—Alloys based on nickel or cobalt based on nickel

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Powder Metallurgy (AREA)
JP2025555862A 2023-12-07 2024-11-21 Pending JPWO2025121150A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023207004 2023-12-07
PCT/JP2024/041303 WO2025121150A1 (ja) 2023-12-07 2024-11-21 プリフォームはんだ及びその製造方法、並びにはんだ継手の製造方法

Publications (2)

Publication Number Publication Date
JPWO2025121150A1 true JPWO2025121150A1 (https=) 2025-06-12
JPWO2025121150A5 JPWO2025121150A5 (https=) 2025-12-08

Family

ID=95980957

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025555862A Pending JPWO2025121150A1 (https=) 2023-12-07 2024-11-21

Country Status (3)

Country Link
JP (1) JPWO2025121150A1 (https=)
TW (1) TW202537761A (https=)
WO (1) WO2025121150A1 (https=)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012076098A (ja) * 2010-09-30 2012-04-19 Tdk Corp 電子回路モジュール部品及び電子回路モジュール部品の製造方法
JP2012091223A (ja) * 2010-09-30 2012-05-17 Tdk Corp Ｐｂフリーはんだ
JP2013081966A (ja) * 2011-10-06 2013-05-09 Fujitsu Ltd 導電性接合材料、並びに導体の接合方法、及び半導体装置の製造方法
WO2015114771A1 (ja) * 2014-01-30 2015-08-06 千住金属工業株式会社 Ｃｕ核ボール、はんだ継手、フォームはんだ、およびはんだペースト
WO2017154330A1 (ja) * 2016-03-07 2017-09-14 株式会社村田製作所 接合材料及び接合体の製造方法
JP2021020254A (ja) * 2019-07-26 2021-02-18 株式会社日本スペリア社 プリフォームはんだ及び該プリフォームはんだを用いて形成されたはんだ接合体
CN114131237A (zh) * 2021-12-14 2022-03-04 浙江亚通焊材有限公司 一种泡沫焊锡及其制备方法
JP2022155884A (ja) * 2021-03-31 2022-10-14 千住金属工業株式会社 プリフォームはんだ及びその製造方法、並びにはんだ継手の製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012076098A (ja) * 2010-09-30 2012-04-19 Tdk Corp 電子回路モジュール部品及び電子回路モジュール部品の製造方法
JP2012091223A (ja) * 2010-09-30 2012-05-17 Tdk Corp Ｐｂフリーはんだ
JP2013081966A (ja) * 2011-10-06 2013-05-09 Fujitsu Ltd 導電性接合材料、並びに導体の接合方法、及び半導体装置の製造方法
WO2015114771A1 (ja) * 2014-01-30 2015-08-06 千住金属工業株式会社 Ｃｕ核ボール、はんだ継手、フォームはんだ、およびはんだペースト
WO2017154330A1 (ja) * 2016-03-07 2017-09-14 株式会社村田製作所 接合材料及び接合体の製造方法
JP2021020254A (ja) * 2019-07-26 2021-02-18 株式会社日本スペリア社 プリフォームはんだ及び該プリフォームはんだを用いて形成されたはんだ接合体
JP2022155884A (ja) * 2021-03-31 2022-10-14 千住金属工業株式会社 プリフォームはんだ及びその製造方法、並びにはんだ継手の製造方法
CN114131237A (zh) * 2021-12-14 2022-03-04 浙江亚通焊材有限公司 一种泡沫焊锡及其制备方法

Also Published As

Publication number Publication date
WO2025121150A1 (ja) 2025-06-12
TW202537761A (zh) 2025-10-01

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