TW202536043A - 酚樹脂、環氧樹脂、硬化性樹脂組成物、硬化物、及碳纖維強化複合材料 - Google Patents
酚樹脂、環氧樹脂、硬化性樹脂組成物、硬化物、及碳纖維強化複合材料Info
- Publication number
- TW202536043A TW202536043A TW114105747A TW114105747A TW202536043A TW 202536043 A TW202536043 A TW 202536043A TW 114105747 A TW114105747 A TW 114105747A TW 114105747 A TW114105747 A TW 114105747A TW 202536043 A TW202536043 A TW 202536043A
- Authority
- TW
- Taiwan
- Prior art keywords
- resin
- compound
- phenolic
- phenolic resin
- epoxy
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/06—Elements
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024-032088 | 2024-03-04 | ||
| JP2024032088 | 2024-03-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202536043A true TW202536043A (zh) | 2025-09-16 |
Family
ID=96990828
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW114105747A TW202536043A (zh) | 2024-03-04 | 2025-02-17 | 酚樹脂、環氧樹脂、硬化性樹脂組成物、硬化物、及碳纖維強化複合材料 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7829108B2 (https=) |
| TW (1) | TW202536043A (https=) |
| WO (1) | WO2025187370A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5824531A (ja) * | 1981-08-06 | 1983-02-14 | Sumitomo Chem Co Ltd | 新規二価フエノ−ル誘導体とその製造法 |
| JPH06244319A (ja) * | 1993-02-15 | 1994-09-02 | Matsushita Electric Ind Co Ltd | 半導体装置の封止用エポキシ樹脂組成物 |
| WO2012090965A1 (ja) * | 2010-12-27 | 2012-07-05 | 旭化成イーマテリアルズ株式会社 | アルカリ現像用感光性フェノール樹脂組成物、硬化レリーフパターン及び半導体の製造方法、並びにビフェニルジイルトリヒドロキシベンゼン樹脂 |
| JP6809200B2 (ja) * | 2016-12-19 | 2021-01-06 | Dic株式会社 | エポキシ樹脂、硬化性樹脂組成物及びその硬化物 |
| JP6828413B2 (ja) * | 2016-12-19 | 2021-02-10 | Dic株式会社 | フェノール樹脂、硬化性樹脂組成物及びその硬化物 |
| JP7415272B2 (ja) * | 2020-02-18 | 2024-01-17 | Dic株式会社 | インダンビスフェノール化合物、硬化性樹脂組成物、及び、硬化物 |
| JP7786119B2 (ja) * | 2021-10-12 | 2025-12-16 | Dic株式会社 | 硬化性樹脂組成物、硬化物及び物品 |
-
2025
- 2025-02-17 WO PCT/JP2025/005099 patent/WO2025187370A1/ja active Pending
- 2025-02-17 TW TW114105747A patent/TW202536043A/zh unknown
- 2025-02-17 JP JP2025536259A patent/JP7829108B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP7829108B2 (ja) | 2026-03-12 |
| WO2025187370A8 (ja) | 2025-10-02 |
| WO2025187370A1 (ja) | 2025-09-12 |
| JPWO2025187370A1 (https=) | 2025-09-12 |
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