TW202514648A - 導電性粒子、導電性粒子之製造方法、導電材料及連接構造體 - Google Patents

導電性粒子、導電性粒子之製造方法、導電材料及連接構造體 Download PDF

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Publication number
TW202514648A
TW202514648A TW113131787A TW113131787A TW202514648A TW 202514648 A TW202514648 A TW 202514648A TW 113131787 A TW113131787 A TW 113131787A TW 113131787 A TW113131787 A TW 113131787A TW 202514648 A TW202514648 A TW 202514648A
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TW
Taiwan
Prior art keywords
conductive
particles
indium
conductive particles
weight
Prior art date
Application number
TW113131787A
Other languages
English (en)
Chinese (zh)
Inventor
湯川豪
小林洋
Original Assignee
日商積水化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商積水化學工業股份有限公司 filed Critical 日商積水化學工業股份有限公司
Publication of TW202514648A publication Critical patent/TW202514648A/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Non-Insulated Conductors (AREA)
TW113131787A 2023-08-23 2024-08-23 導電性粒子、導電性粒子之製造方法、導電材料及連接構造體 TW202514648A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-135489 2023-08-23
JP2023135489 2023-08-23

Publications (1)

Publication Number Publication Date
TW202514648A true TW202514648A (zh) 2025-04-01

Family

ID=94731864

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113131787A TW202514648A (zh) 2023-08-23 2024-08-23 導電性粒子、導電性粒子之製造方法、導電材料及連接構造體

Country Status (3)

Country Link
JP (1) JPWO2025041831A1 (https=)
TW (1) TW202514648A (https=)
WO (1) WO2025041831A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101241524B1 (ko) * 2005-09-01 2013-03-11 이데미쓰 고산 가부시키가이샤 스퍼터링 타겟, 투명 도전막 및 투명 전극
JP4811048B2 (ja) * 2006-02-17 2011-11-09 株式会社豊田中央研究所 電極材料、並びにそれを用いたバイオセンサー及び燃料電池
JP5832785B2 (ja) * 2011-05-30 2015-12-16 旭化成ケミカルズ株式会社 アンモ酸化用触媒、その製造方法及びアクリロニトリル又はメタクリロニトリルの製造方法
WO2017138521A1 (ja) * 2016-02-08 2017-08-17 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP7166987B2 (ja) * 2019-06-12 2022-11-08 富士フイルム株式会社 圧電素子

Also Published As

Publication number Publication date
JPWO2025041831A1 (https=) 2025-02-27
WO2025041831A1 (ja) 2025-02-27

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