TW202506891A - 導熱性聚矽氧樹脂組成物 - Google Patents

導熱性聚矽氧樹脂組成物 Download PDF

Info

Publication number
TW202506891A
TW202506891A TW113108910A TW113108910A TW202506891A TW 202506891 A TW202506891 A TW 202506891A TW 113108910 A TW113108910 A TW 113108910A TW 113108910 A TW113108910 A TW 113108910A TW 202506891 A TW202506891 A TW 202506891A
Authority
TW
Taiwan
Prior art keywords
thermally conductive
mass
resin composition
inorganic particles
parts
Prior art date
Application number
TW113108910A
Other languages
English (en)
Chinese (zh)
Inventor
片石拓海
Original Assignee
日商富士高分子工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商富士高分子工業股份有限公司 filed Critical 日商富士高分子工業股份有限公司
Publication of TW202506891A publication Critical patent/TW202506891A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/16—Ethylene-propylene or ethylene-propylene-diene copolymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
    • C08L23/24—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having ten or more carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW113108910A 2023-04-27 2024-03-12 導熱性聚矽氧樹脂組成物 TW202506891A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-073419 2023-04-27
JP2023073419 2023-04-27

Publications (1)

Publication Number Publication Date
TW202506891A true TW202506891A (zh) 2025-02-16

Family

ID=93255983

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113108910A TW202506891A (zh) 2023-04-27 2024-03-12 導熱性聚矽氧樹脂組成物

Country Status (3)

Country Link
JP (1) JP7618897B1 (https=)
TW (1) TW202506891A (https=)
WO (1) WO2024224832A1 (https=)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2715294B1 (fr) * 1994-01-26 1996-03-22 Oreal Composition cosmétique ou dermatologique anhydre contenant l'association d'une huile de silicone et d'une cire d'un homo- ou copolymère d'éthylène .
JP3860363B2 (ja) * 1999-06-09 2006-12-20 北川工業株式会社 熱伝導材の製造方法
JP3563638B2 (ja) * 1999-06-09 2004-09-08 北川工業株式会社 熱伝導材及びその製造方法
JP4514344B2 (ja) * 2001-02-07 2010-07-28 電気化学工業株式会社 熱伝導性樹脂成形体及びその用途
JP4699388B2 (ja) * 2004-12-17 2011-06-08 株式会社ファインラバー研究所 誘電性素材、アンテナ装置、携帯電話機及び電磁波遮蔽体
CN107075400B (zh) * 2014-09-22 2020-06-23 陶氏环球技术有限责任公司 基于超支化烯烃流体的导热油脂
CN107312493A (zh) * 2017-08-04 2017-11-03 东莞市联洲知识产权运营管理有限公司 一种led封装用有机硅导热胶粘剂及其制备方法
WO2022054330A1 (ja) * 2020-09-11 2022-03-17 富士高分子工業株式会社 熱伝導性グリース及びその製造方法
JP7047199B1 (ja) * 2021-04-08 2022-04-04 富士高分子工業株式会社 熱伝導性グリース組成物
US20260103656A1 (en) * 2022-09-26 2026-04-16 Fuji Polymer Industries Co., Ltd. Thermally conductive grease composition

Also Published As

Publication number Publication date
JPWO2024224832A1 (https=) 2024-10-31
WO2024224832A1 (ja) 2024-10-31
JP7618897B1 (ja) 2025-01-21

Similar Documents

Publication Publication Date Title
US11319412B2 (en) Thermally conductive silicone compound
TW201800488A (zh) 熱傳導性聚矽氧組成物和半導體裝置
CN116568741B (zh) 导热性润滑脂组合物
TWI864138B (zh) 熱傳導性聚矽氧組成物及其製造方法
TW200825138A (en) Heat conductive silicone grease composition and cured product thereof
JP2009096961A (ja) リワーク性に優れた熱伝導性シリコーングリース組成物
JP7794946B2 (ja) 熱伝導性シリコーン組成物分野
TWI878629B (zh) 導熱性潤滑脂及其製造方法
TW202104533A (zh) 熱傳導性矽氧組成物、其製造方法及半導體裝置
TW202413534A (zh) 導熱性潤滑脂組成物
TWI890887B (zh) 導熱性潤滑脂組成物
TW202506891A (zh) 導熱性聚矽氧樹脂組成物
JP7376756B1 (ja) 熱伝導性グリース組成物
CN115397944A (zh) 导热性有机硅润滑脂组合物及其制造方法
JP7076400B2 (ja) 熱伝導性シリコーン組成物、半導体装置及びその製造方法
JP2021098768A (ja) 熱伝導性シリコーン組成物、半導体装置及びその製造方法
TWI868378B (zh) 熱傳導性液狀組成物
TW202413514A (zh) 導熱性潤滑脂組成物
TW202202592A (zh) 矽膠組成物及矽膠片
JP6965870B2 (ja) 熱伝導性シリコーン組成物及び半導体装置
TW202607078A (zh) 導熱性片及其製造方法
TW202506890A (zh) 熱導性灌封材料
JP2025058546A (ja) 熱伝導性シリコーングリース組成物
JP2024063779A (ja) 熱伝導性シリコーン組成物
CN121925454A (zh) 可固化有机硅组合物