TW202504397A - 配線板之製造方法 - Google Patents

配線板之製造方法 Download PDF

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Publication number
TW202504397A
TW202504397A TW113116371A TW113116371A TW202504397A TW 202504397 A TW202504397 A TW 202504397A TW 113116371 A TW113116371 A TW 113116371A TW 113116371 A TW113116371 A TW 113116371A TW 202504397 A TW202504397 A TW 202504397A
Authority
TW
Taiwan
Prior art keywords
layer
resin
insulating layer
wiring board
manufacturing
Prior art date
Application number
TW113116371A
Other languages
English (en)
Chinese (zh)
Inventor
岡崎大地
小椋一郎
Original Assignee
日商味之素股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商味之素股份有限公司 filed Critical 日商味之素股份有限公司
Publication of TW202504397A publication Critical patent/TW202504397A/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Optics & Photonics (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Laminated Bodies (AREA)
TW113116371A 2023-06-29 2024-05-02 配線板之製造方法 TW202504397A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023107353 2023-06-29
JP2023-107353 2023-06-29

Publications (1)

Publication Number Publication Date
TW202504397A true TW202504397A (zh) 2025-01-16

Family

ID=93938558

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113116371A TW202504397A (zh) 2023-06-29 2024-05-02 配線板之製造方法

Country Status (5)

Country Link
JP (1) JPWO2025004499A1 (https=)
KR (1) KR20260030747A (https=)
CN (1) CN121368927A (https=)
TW (1) TW202504397A (https=)
WO (1) WO2025004499A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005008909A (ja) * 2003-06-16 2005-01-13 Canon Inc 構造体の製造方法
JP5000112B2 (ja) * 2005-09-09 2012-08-15 東京応化工業株式会社 ナノインプリントリソグラフィによるパターン形成方法
JP6337363B1 (ja) * 2016-10-05 2018-06-06 国立大学法人北陸先端科学技術大学院大学 複合部材及びその製造方法

Also Published As

Publication number Publication date
KR20260030747A (ko) 2026-03-06
JPWO2025004499A1 (https=) 2025-01-02
WO2025004499A1 (ja) 2025-01-02
CN121368927A (zh) 2026-01-20

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