CN121368927A - 布线板的制造方法 - Google Patents

布线板的制造方法

Info

Publication number
CN121368927A
CN121368927A CN202480039547.4A CN202480039547A CN121368927A CN 121368927 A CN121368927 A CN 121368927A CN 202480039547 A CN202480039547 A CN 202480039547A CN 121368927 A CN121368927 A CN 121368927A
Authority
CN
China
Prior art keywords
resin
insulating layer
layer
wiring board
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480039547.4A
Other languages
English (en)
Chinese (zh)
Inventor
冈崎大地
小椋一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Publication of CN121368927A publication Critical patent/CN121368927A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Optics & Photonics (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Laminated Bodies (AREA)
CN202480039547.4A 2023-06-29 2024-04-12 布线板的制造方法 Pending CN121368927A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023107353 2023-06-29
JP2023-107353 2023-06-29
PCT/JP2024/014762 WO2025004499A1 (ja) 2023-06-29 2024-04-12 配線板の製造方法

Publications (1)

Publication Number Publication Date
CN121368927A true CN121368927A (zh) 2026-01-20

Family

ID=93938558

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480039547.4A Pending CN121368927A (zh) 2023-06-29 2024-04-12 布线板的制造方法

Country Status (5)

Country Link
JP (1) JPWO2025004499A1 (https=)
KR (1) KR20260030747A (https=)
CN (1) CN121368927A (https=)
TW (1) TW202504397A (https=)
WO (1) WO2025004499A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005008909A (ja) * 2003-06-16 2005-01-13 Canon Inc 構造体の製造方法
JP5000112B2 (ja) * 2005-09-09 2012-08-15 東京応化工業株式会社 ナノインプリントリソグラフィによるパターン形成方法
JP6337363B1 (ja) * 2016-10-05 2018-06-06 国立大学法人北陸先端科学技術大学院大学 複合部材及びその製造方法

Also Published As

Publication number Publication date
TW202504397A (zh) 2025-01-16
KR20260030747A (ko) 2026-03-06
JPWO2025004499A1 (https=) 2025-01-02
WO2025004499A1 (ja) 2025-01-02

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