JPWO2025004499A1 - - Google Patents
Info
- Publication number
- JPWO2025004499A1 JPWO2025004499A1 JP2025529462A JP2025529462A JPWO2025004499A1 JP WO2025004499 A1 JPWO2025004499 A1 JP WO2025004499A1 JP 2025529462 A JP2025529462 A JP 2025529462A JP 2025529462 A JP2025529462 A JP 2025529462A JP WO2025004499 A1 JPWO2025004499 A1 JP WO2025004499A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023107353 | 2023-06-29 | ||
| PCT/JP2024/014762 WO2025004499A1 (ja) | 2023-06-29 | 2024-04-12 | 配線板の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2025004499A1 true JPWO2025004499A1 (https=) | 2025-01-02 |
Family
ID=93938558
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025529462A Pending JPWO2025004499A1 (https=) | 2023-06-29 | 2024-04-12 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2025004499A1 (https=) |
| KR (1) | KR20260030747A (https=) |
| CN (1) | CN121368927A (https=) |
| TW (1) | TW202504397A (https=) |
| WO (1) | WO2025004499A1 (https=) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005008909A (ja) * | 2003-06-16 | 2005-01-13 | Canon Inc | 構造体の製造方法 |
| JP2007072374A (ja) * | 2005-09-09 | 2007-03-22 | Tokyo Ohka Kogyo Co Ltd | ナノインプリント用の膜形成組成物およびパターン形成方法 |
| WO2018066203A1 (ja) * | 2016-10-05 | 2018-04-12 | 国立大学法人北陸先端科学技術大学院大学 | 複合部材及びその製造方法 |
-
2024
- 2024-04-12 JP JP2025529462A patent/JPWO2025004499A1/ja active Pending
- 2024-04-12 KR KR1020257042511A patent/KR20260030747A/ko active Pending
- 2024-04-12 WO PCT/JP2024/014762 patent/WO2025004499A1/ja not_active Ceased
- 2024-04-12 CN CN202480039547.4A patent/CN121368927A/zh active Pending
- 2024-05-02 TW TW113116371A patent/TW202504397A/zh unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005008909A (ja) * | 2003-06-16 | 2005-01-13 | Canon Inc | 構造体の製造方法 |
| JP2007072374A (ja) * | 2005-09-09 | 2007-03-22 | Tokyo Ohka Kogyo Co Ltd | ナノインプリント用の膜形成組成物およびパターン形成方法 |
| WO2018066203A1 (ja) * | 2016-10-05 | 2018-04-12 | 国立大学法人北陸先端科学技術大学院大学 | 複合部材及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202504397A (zh) | 2025-01-16 |
| KR20260030747A (ko) | 2026-03-06 |
| WO2025004499A1 (ja) | 2025-01-02 |
| CN121368927A (zh) | 2026-01-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250820 |
|
| A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20250820 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20251125 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20260123 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20260421 |