TW202502908A - 組成物、轉印膜、積層體之製造方法、積層體、半導體封裝體 - Google Patents

組成物、轉印膜、積層體之製造方法、積層體、半導體封裝體 Download PDF

Info

Publication number
TW202502908A
TW202502908A TW113118797A TW113118797A TW202502908A TW 202502908 A TW202502908 A TW 202502908A TW 113118797 A TW113118797 A TW 113118797A TW 113118797 A TW113118797 A TW 113118797A TW 202502908 A TW202502908 A TW 202502908A
Authority
TW
Taiwan
Prior art keywords
composition
group
resin
oxe
cpo
Prior art date
Application number
TW113118797A
Other languages
English (en)
Chinese (zh)
Inventor
山口圭吾
Original Assignee
日商富士軟片股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商富士軟片股份有限公司 filed Critical 日商富士軟片股份有限公司
Publication of TW202502908A publication Critical patent/TW202502908A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • C08F222/1025—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate of aromatic dialcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F285/00—Macromolecular compounds obtained by polymerising monomers on to preformed graft polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW113118797A 2023-05-31 2024-05-21 組成物、轉印膜、積層體之製造方法、積層體、半導體封裝體 TW202502908A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023090222 2023-05-31
JP2023-090222 2023-05-31

Publications (1)

Publication Number Publication Date
TW202502908A true TW202502908A (zh) 2025-01-16

Family

ID=93657306

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113118797A TW202502908A (zh) 2023-05-31 2024-05-21 組成物、轉印膜、積層體之製造方法、積層體、半導體封裝體

Country Status (4)

Country Link
JP (1) JPWO2024247628A1 (https=)
KR (1) KR20250168616A (https=)
TW (1) TW202502908A (https=)
WO (1) WO2024247628A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025205836A1 (ja) * 2024-03-28 2025-10-02 富士フイルム株式会社 転写フィルム、半導体パッケージ、半導体パッケージの製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3539772B2 (ja) * 1994-09-09 2004-07-07 新日鐵化学株式会社 結晶状エポキシ樹脂、その製造法、それを用いたエポキシ樹脂組成物および硬化物
CN101268418A (zh) * 2005-09-15 2008-09-17 日本化药株式会社 感光性树脂组合物及其固化物
JP2015000896A (ja) * 2013-06-14 2015-01-05 富士フイルム株式会社 組成物ならびにそれを用いたミクロ相分離構造膜およびその製造方法
WO2017057020A1 (ja) * 2015-09-30 2017-04-06 Dic株式会社 重合性組成物及びそれを用いた光学異方体
JP6296320B2 (ja) * 2015-10-01 2018-03-20 Dic株式会社 液晶表示素子及びその製造方法
JP2020118730A (ja) * 2019-01-18 2020-08-06 日東電工株式会社 配向液晶フィルムおよびその製造方法、ならびに画像表示装置
WO2021029021A1 (ja) 2019-08-14 2021-02-18 昭和電工マテリアルズ株式会社 感光性樹脂組成物、感光性樹脂フィルム、多層プリント配線板及び半導体パッケージ、並びに多層プリント配線板の製造方法

Also Published As

Publication number Publication date
KR20250168616A (ko) 2025-12-02
WO2024247628A1 (ja) 2024-12-05
JPWO2024247628A1 (https=) 2024-12-05

Similar Documents

Publication Publication Date Title
US20210011381A1 (en) Negative-type photosensitive resin composition, cured film, element and display apparatus that include cured film, production method for the same
CN114207520B (zh) 感光性树脂组合物、感光性片、固化膜、固化膜的制造方法、层间绝缘膜及电子部件
JP5417323B2 (ja) 感光性ポリイミド前駆体組成物、感光性ドライフィルム及びフレキシブルプリント配線基板
JP5497312B2 (ja) フレキシブルプリント配線基板
CN106462057A (zh) 树脂组合物、由其形成的固化膜和图案固化膜、以及它们的制造方法
KR20120009899A (ko) 폴리이미드 공중합체 및 이를 포함하는 감광성 수지 조성물
KR20200093077A (ko) 감광성 수지 조성물, 수지, 경화막, 적층체, 경화막의 제조 방법, 반도체 디바이스
US20250340695A1 (en) Composition, transfer film, method for manufacturing laminate, laminate, and cured film
TW202502908A (zh) 組成物、轉印膜、積層體之製造方法、積層體、半導體封裝體
TW202506860A (zh) 組成物、轉印薄膜、積層體之製造方法、積層體、半導體封裝體
TW202502548A (zh) 轉印膜、積層體之製造方法、積層體
JP5571431B2 (ja) 感光性樹脂組成物
KR102897691B1 (ko) 감광성 조성물, 전사 필름, 경화막, 반도체 패키지, 패턴 형성 방법, 반도체 패키지의 제조 방법
TW202511074A (zh) 轉印膜、圖案形成方法、積層體、半導體封裝
JP7666332B2 (ja) ポリイミド樹脂、感光性樹脂組成物、樹脂膜及び電子装置
JP2023111491A (ja) 感光性組成物、転写フィルム、硬化膜、半導体パッケージ、パターン形成方法、半導体パッケージの製造方法
TW202413097A (zh) 轉印膜、積層體的製造方法、積層體、半導體封裝的製造方法
KR20250011944A (ko) 조성물, 전사 필름, 적층체의 제조 방법, 적층체, 반도체 패키지의 제조 방법
JP2025145032A (ja) 転写フィルム、転写フィルムの製造方法、硬化層の製造方法、及び、半導体パッケージの製造方法
JP2025140623A (ja) 配線基板の製造方法
WO2025105281A1 (ja) 感光性組成物、転写フィルム、積層体の製造方法、積層体、半導体パッケージ
WO2024024820A1 (ja) 感光性組成物、転写フィルム、積層体の製造方法、積層体、半導体パッケージ
WO2024048317A1 (ja) 感光性組成物、転写フィルム、積層体の製造方法、積層体、半導体パッケージ
WO2024048296A1 (ja) 感光性組成物、転写フィルム、積層体の製造方法、積層体、半導体パッケージ、樹脂
TWI872020B (zh) 積層體之製造方法