TW202500502A - 氮化矽粉末及使用其的樹脂組成物 - Google Patents

氮化矽粉末及使用其的樹脂組成物 Download PDF

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Publication number
TW202500502A
TW202500502A TW113106115A TW113106115A TW202500502A TW 202500502 A TW202500502 A TW 202500502A TW 113106115 A TW113106115 A TW 113106115A TW 113106115 A TW113106115 A TW 113106115A TW 202500502 A TW202500502 A TW 202500502A
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TW
Taiwan
Prior art keywords
silicon nitride
nitride powder
powder
atomic
mass
Prior art date
Application number
TW113106115A
Other languages
English (en)
Chinese (zh)
Inventor
大門(上原)滿
中田邦彦
原田和人
鏡好晴
Original Assignee
日商住友化學股份有限公司
日商燃燒合成股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商住友化學股份有限公司, 日商燃燒合成股份有限公司 filed Critical 日商住友化學股份有限公司
Publication of TW202500502A publication Critical patent/TW202500502A/zh

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    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/068—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/70—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Products (AREA)
TW113106115A 2023-03-31 2024-02-21 氮化矽粉末及使用其的樹脂組成物 TW202500502A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-058618 2023-03-31
JP2023058618 2023-03-31

Publications (1)

Publication Number Publication Date
TW202500502A true TW202500502A (zh) 2025-01-01

Family

ID=92905091

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113106115A TW202500502A (zh) 2023-03-31 2024-02-21 氮化矽粉末及使用其的樹脂組成物

Country Status (5)

Country Link
JP (1) JPWO2024202735A1 (https=)
KR (1) KR20250165636A (https=)
CN (1) CN120858072A (https=)
TW (1) TW202500502A (https=)
WO (1) WO2024202735A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05221617A (ja) * 1992-02-14 1993-08-31 Shin Etsu Chem Co Ltd 窒化ケイ素粉末の製造方法
JPH05230181A (ja) * 1992-02-18 1993-09-07 Toshiba Chem Corp エポキシ樹脂組成物および半導体封止装置
JP2786595B2 (ja) * 1994-03-29 1998-08-13 日本碍子株式会社 窒化珪素粉末の製造方法、窒化珪素焼結体及びその製造方法
JPH11166074A (ja) * 1997-12-04 1999-06-22 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JP3986154B2 (ja) * 1998-03-24 2007-10-03 電気化学工業株式会社 窒化珪素質充填材及び半導体封止用樹脂組成物
JP6245602B2 (ja) * 2013-10-21 2017-12-13 国立研究開発法人産業技術総合研究所 窒化ケイ素フィラー、樹脂複合物、絶縁基板、半導体封止材、窒化ケイ素フィラーの製造方法
KR102643831B1 (ko) * 2018-02-28 2024-03-07 가부시끼가이샤 도꾸야마 질화규소 분말의 제조 방법
WO2020203695A1 (ja) 2019-03-29 2020-10-08 デンカ株式会社 窒化ケイ素粉末及びその製造方法、並びに窒化ケイ素焼結体の製造方法
JP2022120792A (ja) * 2021-02-05 2022-08-18 住友化学株式会社 硬化皮膜及び積層体

Also Published As

Publication number Publication date
JPWO2024202735A1 (https=) 2024-10-03
KR20250165636A (ko) 2025-11-26
WO2024202735A1 (ja) 2024-10-03
CN120858072A (zh) 2025-10-28

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