JPWO2024202735A1 - - Google Patents
Info
- Publication number
- JPWO2024202735A1 JPWO2024202735A1 JP2025509951A JP2025509951A JPWO2024202735A1 JP WO2024202735 A1 JPWO2024202735 A1 JP WO2024202735A1 JP 2025509951 A JP2025509951 A JP 2025509951A JP 2025509951 A JP2025509951 A JP 2025509951A JP WO2024202735 A1 JPWO2024202735 A1 JP WO2024202735A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B21/00—Nitrogen; Compounds thereof
- C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
- C01B21/068—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with silicon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2002/00—Crystal-structural characteristics
- C01P2002/70—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/12—Surface area
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Products (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023058618 | 2023-03-31 | ||
| PCT/JP2024/006300 WO2024202735A1 (ja) | 2023-03-31 | 2024-02-21 | 窒化ケイ素粉末およびそれを用いた樹脂組成物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024202735A1 true JPWO2024202735A1 (https=) | 2024-10-03 |
Family
ID=92905091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025509951A Pending JPWO2024202735A1 (https=) | 2023-03-31 | 2024-02-21 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2024202735A1 (https=) |
| KR (1) | KR20250165636A (https=) |
| CN (1) | CN120858072A (https=) |
| TW (1) | TW202500502A (https=) |
| WO (1) | WO2024202735A1 (https=) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05221617A (ja) * | 1992-02-14 | 1993-08-31 | Shin Etsu Chem Co Ltd | 窒化ケイ素粉末の製造方法 |
| JPH05230181A (ja) * | 1992-02-18 | 1993-09-07 | Toshiba Chem Corp | エポキシ樹脂組成物および半導体封止装置 |
| JP2786595B2 (ja) * | 1994-03-29 | 1998-08-13 | 日本碍子株式会社 | 窒化珪素粉末の製造方法、窒化珪素焼結体及びその製造方法 |
| JPH11166074A (ja) * | 1997-12-04 | 1999-06-22 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
| JP3986154B2 (ja) * | 1998-03-24 | 2007-10-03 | 電気化学工業株式会社 | 窒化珪素質充填材及び半導体封止用樹脂組成物 |
| JP6245602B2 (ja) * | 2013-10-21 | 2017-12-13 | 国立研究開発法人産業技術総合研究所 | 窒化ケイ素フィラー、樹脂複合物、絶縁基板、半導体封止材、窒化ケイ素フィラーの製造方法 |
| KR102643831B1 (ko) * | 2018-02-28 | 2024-03-07 | 가부시끼가이샤 도꾸야마 | 질화규소 분말의 제조 방법 |
| WO2020203695A1 (ja) | 2019-03-29 | 2020-10-08 | デンカ株式会社 | 窒化ケイ素粉末及びその製造方法、並びに窒化ケイ素焼結体の製造方法 |
| JP2022120792A (ja) * | 2021-02-05 | 2022-08-18 | 住友化学株式会社 | 硬化皮膜及び積層体 |
-
2024
- 2024-02-21 TW TW113106115A patent/TW202500502A/zh unknown
- 2024-02-21 WO PCT/JP2024/006300 patent/WO2024202735A1/ja not_active Ceased
- 2024-02-21 CN CN202480018109.XA patent/CN120858072A/zh active Pending
- 2024-02-21 KR KR1020257035321A patent/KR20250165636A/ko active Pending
- 2024-02-21 JP JP2025509951A patent/JPWO2024202735A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| KR20250165636A (ko) | 2025-11-26 |
| WO2024202735A1 (ja) | 2024-10-03 |
| TW202500502A (zh) | 2025-01-01 |
| CN120858072A (zh) | 2025-10-28 |