TW202447947A - 固態攝像裝置及電子機器 - Google Patents

固態攝像裝置及電子機器 Download PDF

Info

Publication number
TW202447947A
TW202447947A TW113113345A TW113113345A TW202447947A TW 202447947 A TW202447947 A TW 202447947A TW 113113345 A TW113113345 A TW 113113345A TW 113113345 A TW113113345 A TW 113113345A TW 202447947 A TW202447947 A TW 202447947A
Authority
TW
Taiwan
Prior art keywords
pixel
infrared light
state imaging
solid
imaging device
Prior art date
Application number
TW113113345A
Other languages
English (en)
Chinese (zh)
Inventor
小林秀樹
新田陽介
齋藤卓
藤井宣年
財前義史
浦田章紘
古瀬駿介
佐藤尚之
Original Assignee
日商索尼半導體解決方案公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商索尼半導體解決方案公司 filed Critical 日商索尼半導體解決方案公司
Publication of TW202447947A publication Critical patent/TW202447947A/zh

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/806Optical elements or arrangements associated with the image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/18Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/184Infrared image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/199Back-illuminated image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/802Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/805Coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/805Coatings
    • H10F39/8053Colour filters
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/805Coatings
    • H10F39/8057Optical shielding
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/809Constructional details of image sensors of hybrid image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/811Interconnections

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
TW113113345A 2023-04-28 2024-04-10 固態攝像裝置及電子機器 TW202447947A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023075177 2023-04-28
JP2023-075177 2023-04-28

Publications (1)

Publication Number Publication Date
TW202447947A true TW202447947A (zh) 2024-12-01

Family

ID=93256284

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113113345A TW202447947A (zh) 2023-04-28 2024-04-10 固態攝像裝置及電子機器

Country Status (6)

Country Link
EP (1) EP4704155A1 (https=)
JP (1) JPWO2024224980A1 (https=)
KR (1) KR20260002891A (https=)
CN (1) CN121128340A (https=)
TW (1) TW202447947A (https=)
WO (1) WO2024224980A1 (https=)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02299265A (ja) * 1989-05-15 1990-12-11 Fujitsu Ltd 赤外線検知素子の製造方法
JPH05347399A (ja) * 1992-06-12 1993-12-27 Japan Energy Corp 赤外線検出装置
JP2013070030A (ja) 2011-09-06 2013-04-18 Sony Corp 撮像素子、電子機器、並びに、情報処理装置
JP2017112169A (ja) * 2015-12-15 2017-06-22 ソニー株式会社 イメージセンサ、撮像システム及びイメージセンサの製造方法
WO2018154644A1 (ja) * 2017-02-22 2018-08-30 オリンパス株式会社 固体撮像装置、蛍光観察内視鏡装置、および固体撮像装置の製造方法
EP3886183B1 (en) * 2018-11-19 2023-06-14 Panasonic Intellectual Property Management Co., Ltd. Imaging device and imaging system
US10950638B2 (en) * 2019-03-29 2021-03-16 Toyota Motor Engineering & Manufacturing North America, Inc. Tunable imaging systems and methods thereof
DE112020002994T5 (de) * 2019-06-21 2022-03-17 Sony Semiconductor Solutions Corporation Fotoelektrisches umwandlungselement, fotodetektor, fotodetektionssystem,elektronische einrichtung und mobiler körper
WO2022130776A1 (ja) * 2020-12-16 2022-06-23 ソニーセミコンダクタソリューションズ株式会社 光検出装置、光検出システム、電子機器および移動体
WO2022131268A1 (ja) * 2020-12-16 2022-06-23 ソニーセミコンダクタソリューションズ株式会社 光電変換素子、光検出装置、光検出システム、電子機器および移動体

Also Published As

Publication number Publication date
CN121128340A (zh) 2025-12-12
EP4704155A1 (en) 2026-03-04
WO2024224980A1 (ja) 2024-10-31
KR20260002891A (ko) 2026-01-06
JPWO2024224980A1 (https=) 2024-10-31

Similar Documents

Publication Publication Date Title
KR102045352B1 (ko) 이미지 센서 디바이스 및 그 제조 방법
CN109768056B (zh) 图像传感装置的形成方法
TWI429067B (zh) 固態成像元件
TWI566389B (zh) 固態成像裝置及其製造方法
CN103779369B (zh) 摄像装置、其制造方法和照相机
CN102024831B (zh) 固体摄像装置及其制造方法
CN102637712B (zh) 半导体装置及其制造方法
CN109244092B (zh) 光电转换装置及其制造方法和包括光电转换装置的设备
KR102582669B1 (ko) 이미지 센서
JP7848431B2 (ja) イメージセンサー
US20120217558A1 (en) Imaging device, method of manufacturing the same, and electronic apparatus
CN102637708A (zh) 固态图像拾取装置、其制造方法和图像拾取系统
KR20170128731A (ko) 이미지 센서
CN104253137A (zh) 摄像装置及其制造方法
JP2014130890A (ja) 光電変換装置
US12080744B2 (en) Image sensor
CN102637706A (zh) 半导体装置制造方法
CN110571230A (zh) 图像传感器
JP6700811B2 (ja) 半導体装置および半導体装置の製造方法
TWI717795B (zh) 影像感測器及其形成方法
US20140159184A1 (en) Image sensor and method for fabricating the same
CN103985725B (zh) 半导体结构及其制备方法
JP6083572B2 (ja) 固体撮像装置及びその製造方法
TWI521685B (zh) 影像感測器及其製作方法
TW202447947A (zh) 固態攝像裝置及電子機器