TW202446851A - 研磨墊及其製造方法 - Google Patents

研磨墊及其製造方法 Download PDF

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Publication number
TW202446851A
TW202446851A TW113107807A TW113107807A TW202446851A TW 202446851 A TW202446851 A TW 202446851A TW 113107807 A TW113107807 A TW 113107807A TW 113107807 A TW113107807 A TW 113107807A TW 202446851 A TW202446851 A TW 202446851A
Authority
TW
Taiwan
Prior art keywords
polishing
polished
polishing pad
mentioned
abrasive particles
Prior art date
Application number
TW113107807A
Other languages
English (en)
Chinese (zh)
Inventor
佐藤誠
後藤崇將
阿部規之
岸本正俊
伊藤綾真
黑部久德
上野敬
Original Assignee
日商則武股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商則武股份有限公司 filed Critical 日商則武股份有限公司
Publication of TW202446851A publication Critical patent/TW202446851A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW113107807A 2023-03-22 2024-03-05 研磨墊及其製造方法 TW202446851A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023045170 2023-03-22
JP2023-045170 2023-03-22

Publications (1)

Publication Number Publication Date
TW202446851A true TW202446851A (zh) 2024-12-01

Family

ID=92841211

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113107807A TW202446851A (zh) 2023-03-22 2024-03-05 研磨墊及其製造方法

Country Status (3)

Country Link
JP (1) JPWO2024195369A1 (enrdf_load_stackoverflow)
TW (1) TW202446851A (enrdf_load_stackoverflow)
WO (1) WO2024195369A1 (enrdf_load_stackoverflow)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3607159A (en) * 1967-05-12 1971-09-21 Norton Co Saturated, resilient, flexible and porous abrasive laminate
US6910951B2 (en) * 2003-02-24 2005-06-28 Dow Global Technologies, Inc. Materials and methods for chemical-mechanical planarization
JP5336699B2 (ja) * 2006-09-15 2013-11-06 株式会社ノリタケカンパニーリミテド 結晶材料の研磨加工方法
JP5172401B2 (ja) * 2008-03-11 2013-03-27 株式会社ノリタケカンパニーリミテド シート状研磨体の製造方法
JP5511266B2 (ja) * 2009-08-25 2014-06-04 株式会社ノリタケカンパニーリミテド 研磨体の製造方法

Also Published As

Publication number Publication date
JPWO2024195369A1 (enrdf_load_stackoverflow) 2024-09-26
WO2024195369A1 (ja) 2024-09-26

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