JPWO2024195369A1 - - Google Patents

Info

Publication number
JPWO2024195369A1
JPWO2024195369A1 JP2025508221A JP2025508221A JPWO2024195369A1 JP WO2024195369 A1 JPWO2024195369 A1 JP WO2024195369A1 JP 2025508221 A JP2025508221 A JP 2025508221A JP 2025508221 A JP2025508221 A JP 2025508221A JP WO2024195369 A1 JPWO2024195369 A1 JP WO2024195369A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025508221A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024195369A1 publication Critical patent/JPWO2024195369A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2025508221A 2023-03-22 2024-02-14 Pending JPWO2024195369A1 (enrdf_load_stackoverflow)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023045170 2023-03-22
PCT/JP2024/005037 WO2024195369A1 (ja) 2023-03-22 2024-02-14 研磨パッド及びその製造方法

Publications (1)

Publication Number Publication Date
JPWO2024195369A1 true JPWO2024195369A1 (enrdf_load_stackoverflow) 2024-09-26

Family

ID=92841211

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025508221A Pending JPWO2024195369A1 (enrdf_load_stackoverflow) 2023-03-22 2024-02-14

Country Status (3)

Country Link
JP (1) JPWO2024195369A1 (enrdf_load_stackoverflow)
TW (1) TW202446851A (enrdf_load_stackoverflow)
WO (1) WO2024195369A1 (enrdf_load_stackoverflow)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3607159A (en) * 1967-05-12 1971-09-21 Norton Co Saturated, resilient, flexible and porous abrasive laminate
US6910951B2 (en) * 2003-02-24 2005-06-28 Dow Global Technologies, Inc. Materials and methods for chemical-mechanical planarization
JP5336699B2 (ja) * 2006-09-15 2013-11-06 株式会社ノリタケカンパニーリミテド 結晶材料の研磨加工方法
JP5172401B2 (ja) * 2008-03-11 2013-03-27 株式会社ノリタケカンパニーリミテド シート状研磨体の製造方法
JP5511266B2 (ja) * 2009-08-25 2014-06-04 株式会社ノリタケカンパニーリミテド 研磨体の製造方法

Also Published As

Publication number Publication date
TW202446851A (zh) 2024-12-01
WO2024195369A1 (ja) 2024-09-26

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20250415