TW202438600A - 硬化性組成物、密封劑、框密封劑、顯示面板及其製造方法 - Google Patents

硬化性組成物、密封劑、框密封劑、顯示面板及其製造方法 Download PDF

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Publication number
TW202438600A
TW202438600A TW113111624A TW113111624A TW202438600A TW 202438600 A TW202438600 A TW 202438600A TW 113111624 A TW113111624 A TW 113111624A TW 113111624 A TW113111624 A TW 113111624A TW 202438600 A TW202438600 A TW 202438600A
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TW
Taiwan
Prior art keywords
sealant
mass
curable composition
parts
tertiary amine
Prior art date
Application number
TW113111624A
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English (en)
Chinese (zh)
Inventor
永田桂
Original Assignee
日商三井化學股份有限公司
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Application filed by 日商三井化學股份有限公司 filed Critical 日商三井化學股份有限公司
Publication of TW202438600A publication Critical patent/TW202438600A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3432—Six-membered rings
    • C08K5/3435—Piperidines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
  • Sealing Material Composition (AREA)
  • Catalysts (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW113111624A 2023-03-29 2024-03-28 硬化性組成物、密封劑、框密封劑、顯示面板及其製造方法 TW202438600A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023054118 2023-03-29
JP2023-054118 2023-03-29

Publications (1)

Publication Number Publication Date
TW202438600A true TW202438600A (zh) 2024-10-01

Family

ID=92905513

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113111624A TW202438600A (zh) 2023-03-29 2024-03-28 硬化性組成物、密封劑、框密封劑、顯示面板及其製造方法

Country Status (4)

Country Link
JP (1) JPWO2024204248A1 (https=)
CN (1) CN120813624A (https=)
TW (1) TW202438600A (https=)
WO (1) WO2024204248A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004099775A (ja) * 2002-09-10 2004-04-02 Fuji Photo Film Co Ltd セルロースアシレートフィルム、並びに該フィルムを用いた光学フィルム、液晶表示装置及びハロゲン化銀写真感光材料
JP2004238456A (ja) * 2003-02-05 2004-08-26 Konica Minolta Holdings Inc インク、画像形成方法、印刷物及び記録装置
JP2006160802A (ja) * 2004-12-03 2006-06-22 Mitsubishi Chemicals Corp 耐汚染性付与剤、硬化物および物品
JP2009275080A (ja) * 2008-05-13 2009-11-26 Konica Minolta Ij Technologies Inc 活性エネルギー線硬化性組成物及びインクジェット用インク
TWI480308B (zh) * 2010-11-05 2015-04-11 Nippon Catalytic Chem Ind Cationic hardening resin composition
CN114008163A (zh) * 2019-07-05 2022-02-01 三井化学株式会社 有机el显示元件用密封剂及有机el显示装置
CN110885619A (zh) * 2019-12-12 2020-03-17 上海华谊精细化工有限公司 一种辐照固化抗污卷材涂料及其制备方法
JPWO2023153387A1 (https=) * 2022-02-08 2023-08-17

Also Published As

Publication number Publication date
CN120813624A (zh) 2025-10-17
WO2024204248A1 (ja) 2024-10-03
JPWO2024204248A1 (https=) 2024-10-03

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