TW202433176A - 感光性薄膜及感光性樹脂組成物 - Google Patents

感光性薄膜及感光性樹脂組成物 Download PDF

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Publication number
TW202433176A
TW202433176A TW112136885A TW112136885A TW202433176A TW 202433176 A TW202433176 A TW 202433176A TW 112136885 A TW112136885 A TW 112136885A TW 112136885 A TW112136885 A TW 112136885A TW 202433176 A TW202433176 A TW 202433176A
Authority
TW
Taiwan
Prior art keywords
structural unit
formula
resin composition
following formula
photosensitive resin
Prior art date
Application number
TW112136885A
Other languages
English (en)
Chinese (zh)
Inventor
宮仲健人
小椋一郎
Original Assignee
日商味之素股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商味之素股份有限公司 filed Critical 日商味之素股份有限公司
Publication of TW202433176A publication Critical patent/TW202433176A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Materials For Photolithography (AREA)
TW112136885A 2022-09-29 2023-09-26 感光性薄膜及感光性樹脂組成物 TW202433176A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-156955 2022-09-29
JP2022156955 2022-09-29

Publications (1)

Publication Number Publication Date
TW202433176A true TW202433176A (zh) 2024-08-16

Family

ID=90477537

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112136885A TW202433176A (zh) 2022-09-29 2023-09-26 感光性薄膜及感光性樹脂組成物

Country Status (3)

Country Link
JP (1) JPWO2024070808A1 (https=)
TW (1) TW202433176A (https=)
WO (1) WO2024070808A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3997487B2 (ja) * 2001-05-30 2007-10-24 株式会社カネカ 感光性樹脂組成物及びそれを用いた感光性ドライフィルムレジスト、感光性カバーレイフィルム
JP4328126B2 (ja) * 2003-05-13 2009-09-09 三井化学株式会社 ドライフィルム
JP2006169409A (ja) * 2004-12-16 2006-06-29 Kaneka Corp ポリイミド前駆体およびそれを用いた感光性樹脂組成物
JP2006193691A (ja) * 2005-01-17 2006-07-27 Nippon Kayaku Co Ltd 感光性ポリアミド酸及びこれを含有する感光性組成物
JP2021015296A (ja) * 2020-10-30 2021-02-12 昭和電工マテリアルズ株式会社 感光性エレメント、レジストパターンの形成方法、及び、プリント配線板の製造方法

Also Published As

Publication number Publication date
JPWO2024070808A1 (https=) 2024-04-04
WO2024070808A1 (ja) 2024-04-04

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