JPWO2024070808A1 - - Google Patents
Info
- Publication number
- JPWO2024070808A1 JPWO2024070808A1 JP2024550111A JP2024550111A JPWO2024070808A1 JP WO2024070808 A1 JPWO2024070808 A1 JP WO2024070808A1 JP 2024550111 A JP2024550111 A JP 2024550111A JP 2024550111 A JP2024550111 A JP 2024550111A JP WO2024070808 A1 JPWO2024070808 A1 JP WO2024070808A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
- C08F290/14—Polymers provided for in subclass C08G
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Physics & Mathematics (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022156955 | 2022-09-29 | ||
| PCT/JP2023/033909 WO2024070808A1 (ja) | 2022-09-29 | 2023-09-19 | 感光性フィルム及び感光性樹脂組成物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024070808A1 true JPWO2024070808A1 (https=) | 2024-04-04 |
Family
ID=90477537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024550111A Pending JPWO2024070808A1 (https=) | 2022-09-29 | 2023-09-19 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2024070808A1 (https=) |
| TW (1) | TW202433176A (https=) |
| WO (1) | WO2024070808A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3997487B2 (ja) * | 2001-05-30 | 2007-10-24 | 株式会社カネカ | 感光性樹脂組成物及びそれを用いた感光性ドライフィルムレジスト、感光性カバーレイフィルム |
| JP4328126B2 (ja) * | 2003-05-13 | 2009-09-09 | 三井化学株式会社 | ドライフィルム |
| JP2006169409A (ja) * | 2004-12-16 | 2006-06-29 | Kaneka Corp | ポリイミド前駆体およびそれを用いた感光性樹脂組成物 |
| JP2006193691A (ja) * | 2005-01-17 | 2006-07-27 | Nippon Kayaku Co Ltd | 感光性ポリアミド酸及びこれを含有する感光性組成物 |
| JP2021015296A (ja) * | 2020-10-30 | 2021-02-12 | 昭和電工マテリアルズ株式会社 | 感光性エレメント、レジストパターンの形成方法、及び、プリント配線板の製造方法 |
-
2023
- 2023-09-19 JP JP2024550111A patent/JPWO2024070808A1/ja active Pending
- 2023-09-19 WO PCT/JP2023/033909 patent/WO2024070808A1/ja not_active Ceased
- 2023-09-26 TW TW112136885A patent/TW202433176A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202433176A (zh) | 2024-08-16 |
| WO2024070808A1 (ja) | 2024-04-04 |