TW202428447A - 積層體、硬化物，包含該硬化物之印刷線路板及其製造方法 - Google Patents

積層體、硬化物，包含該硬化物之印刷線路板及其製造方法 Download PDF

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Publication number
TW202428447A
TW202428447A TW112141000A TW112141000A TW202428447A TW 202428447 A TW202428447 A TW 202428447A TW 112141000 A TW112141000 A TW 112141000A TW 112141000 A TW112141000 A TW 112141000A TW 202428447 A TW202428447 A TW 202428447A
Authority
TW
Taiwan
Prior art keywords
resin composition
photosensitive resin
composition layer
laminate
layer
Prior art date
Application number
TW112141000A
Other languages
English (en)
Chinese (zh)
Inventor
小笠原郁弥
岡本大地
志村優之
Original Assignee
日商太陽控股股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商太陽控股股份有限公司 filed Critical 日商太陽控股股份有限公司
Publication of TW202428447A publication Critical patent/TW202428447A/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Materials For Photolithography (AREA)
TW112141000A 2022-10-28 2023-10-26 積層體、硬化物，包含該硬化物之印刷線路板及其製造方法 TW202428447A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-173663 2022-10-28
JP2022173663 2022-10-28

Publications (1)

Publication Number Publication Date
TW202428447A true TW202428447A (zh) 2024-07-16

Family

ID=90830812

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112141000A TW202428447A (zh) 2022-10-28 2023-10-26 積層體、硬化物，包含該硬化物之印刷線路板及其製造方法

Country Status (4)

Country Link
JP (1) JP7806285B2 (https=)
CN (1) CN120112858A (https=)
TW (1) TW202428447A (https=)
WO (1) WO2024090510A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006047658A (ja) * 2004-08-04 2006-02-16 Asahi Kasei Electronics Co Ltd サンドブラスト用感光性樹脂積層体
JP2015090380A (ja) * 2013-11-05 2015-05-11 ソニー株式会社 ドライフィルムフォトレジスト、ドライフィルムフォトレジストの製造方法、金属パターン形成方法及び電子部品
JP2018087832A (ja) * 2015-03-27 2018-06-07 日立化成株式会社 ドライフィルム、硬化物、積層体及びレジストパターンの形成方法
JP2017211555A (ja) * 2016-05-26 2017-11-30 日立化成株式会社 ドライフィルム及びレジストパターンの形成方法

Also Published As

Publication number Publication date
JP7806285B2 (ja) 2026-01-26
JPWO2024090510A1 (https=) 2024-05-02
WO2024090510A1 (ja) 2024-05-02
CN120112858A (zh) 2025-06-06

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