JP7806285B2 - 絶縁層を備えるプリント配線板の製造方法 - Google Patents

絶縁層を備えるプリント配線板の製造方法

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Publication number
JP7806285B2
JP7806285B2 JP2024553127A JP2024553127A JP7806285B2 JP 7806285 B2 JP7806285 B2 JP 7806285B2 JP 2024553127 A JP2024553127 A JP 2024553127A JP 2024553127 A JP2024553127 A JP 2024553127A JP 7806285 B2 JP7806285 B2 JP 7806285B2
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JP
Japan
Prior art keywords
resin composition
photosensitive resin
layer
laminate
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024553127A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024090510A1 (https=
JPWO2024090510A5 (https=
Inventor
郁弥 小笠原
大地 岡本
優之 志村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Holdings Co Ltd
Original Assignee
Taiyo Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Holdings Co Ltd filed Critical Taiyo Holdings Co Ltd
Publication of JPWO2024090510A1 publication Critical patent/JPWO2024090510A1/ja
Publication of JPWO2024090510A5 publication Critical patent/JPWO2024090510A5/ja
Application granted granted Critical
Publication of JP7806285B2 publication Critical patent/JP7806285B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Materials For Photolithography (AREA)
JP2024553127A 2022-10-28 2023-10-26 絶縁層を備えるプリント配線板の製造方法 Active JP7806285B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022173663 2022-10-28
JP2022173663 2022-10-28
PCT/JP2023/038648 WO2024090510A1 (ja) 2022-10-28 2023-10-26 積層体、硬化物、該硬化物を備えるプリント配線板およびその製造方法

Publications (3)

Publication Number Publication Date
JPWO2024090510A1 JPWO2024090510A1 (https=) 2024-05-02
JPWO2024090510A5 JPWO2024090510A5 (https=) 2025-06-17
JP7806285B2 true JP7806285B2 (ja) 2026-01-26

Family

ID=90830812

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024553127A Active JP7806285B2 (ja) 2022-10-28 2023-10-26 絶縁層を備えるプリント配線板の製造方法

Country Status (4)

Country Link
JP (1) JP7806285B2 (https=)
CN (1) CN120112858A (https=)
TW (1) TW202428447A (https=)
WO (1) WO2024090510A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006047658A (ja) 2004-08-04 2006-02-16 Asahi Kasei Electronics Co Ltd サンドブラスト用感光性樹脂積層体
JP2015090380A (ja) 2013-11-05 2015-05-11 ソニー株式会社 ドライフィルムフォトレジスト、ドライフィルムフォトレジストの製造方法、金属パターン形成方法及び電子部品
JP2017211555A (ja) 2016-05-26 2017-11-30 日立化成株式会社 ドライフィルム及びレジストパターンの形成方法
JP2018087832A (ja) 2015-03-27 2018-06-07 日立化成株式会社 ドライフィルム、硬化物、積層体及びレジストパターンの形成方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006047658A (ja) 2004-08-04 2006-02-16 Asahi Kasei Electronics Co Ltd サンドブラスト用感光性樹脂積層体
JP2015090380A (ja) 2013-11-05 2015-05-11 ソニー株式会社 ドライフィルムフォトレジスト、ドライフィルムフォトレジストの製造方法、金属パターン形成方法及び電子部品
JP2018087832A (ja) 2015-03-27 2018-06-07 日立化成株式会社 ドライフィルム、硬化物、積層体及びレジストパターンの形成方法
JP2017211555A (ja) 2016-05-26 2017-11-30 日立化成株式会社 ドライフィルム及びレジストパターンの形成方法

Also Published As

Publication number Publication date
TW202428447A (zh) 2024-07-16
JPWO2024090510A1 (https=) 2024-05-02
WO2024090510A1 (ja) 2024-05-02
CN120112858A (zh) 2025-06-06

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