JPWO2024090510A1 - - Google Patents
Info
- Publication number
- JPWO2024090510A1 JPWO2024090510A1 JP2024553127A JP2024553127A JPWO2024090510A1 JP WO2024090510 A1 JPWO2024090510 A1 JP WO2024090510A1 JP 2024553127 A JP2024553127 A JP 2024553127A JP 2024553127 A JP2024553127 A JP 2024553127A JP WO2024090510 A1 JPWO2024090510 A1 JP WO2024090510A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Laminated Bodies (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022173663 | 2022-10-28 | ||
| JP2022173663 | 2022-10-28 | ||
| PCT/JP2023/038648 WO2024090510A1 (ja) | 2022-10-28 | 2023-10-26 | 積層体、硬化物、該硬化物を備えるプリント配線板およびその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024090510A1 true JPWO2024090510A1 (https=) | 2024-05-02 |
| JPWO2024090510A5 JPWO2024090510A5 (https=) | 2025-06-17 |
| JP7806285B2 JP7806285B2 (ja) | 2026-01-26 |
Family
ID=90830812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024553127A Active JP7806285B2 (ja) | 2022-10-28 | 2023-10-26 | 絶縁層を備えるプリント配線板の製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7806285B2 (https=) |
| CN (1) | CN120112858A (https=) |
| TW (1) | TW202428447A (https=) |
| WO (1) | WO2024090510A1 (https=) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006047658A (ja) * | 2004-08-04 | 2006-02-16 | Asahi Kasei Electronics Co Ltd | サンドブラスト用感光性樹脂積層体 |
| JP2015090380A (ja) * | 2013-11-05 | 2015-05-11 | ソニー株式会社 | ドライフィルムフォトレジスト、ドライフィルムフォトレジストの製造方法、金属パターン形成方法及び電子部品 |
| JP2017211555A (ja) * | 2016-05-26 | 2017-11-30 | 日立化成株式会社 | ドライフィルム及びレジストパターンの形成方法 |
| JP2018087832A (ja) * | 2015-03-27 | 2018-06-07 | 日立化成株式会社 | ドライフィルム、硬化物、積層体及びレジストパターンの形成方法 |
-
2023
- 2023-10-26 JP JP2024553127A patent/JP7806285B2/ja active Active
- 2023-10-26 CN CN202380075032.5A patent/CN120112858A/zh active Pending
- 2023-10-26 WO PCT/JP2023/038648 patent/WO2024090510A1/ja not_active Ceased
- 2023-10-26 TW TW112141000A patent/TW202428447A/zh unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006047658A (ja) * | 2004-08-04 | 2006-02-16 | Asahi Kasei Electronics Co Ltd | サンドブラスト用感光性樹脂積層体 |
| JP2015090380A (ja) * | 2013-11-05 | 2015-05-11 | ソニー株式会社 | ドライフィルムフォトレジスト、ドライフィルムフォトレジストの製造方法、金属パターン形成方法及び電子部品 |
| JP2018087832A (ja) * | 2015-03-27 | 2018-06-07 | 日立化成株式会社 | ドライフィルム、硬化物、積層体及びレジストパターンの形成方法 |
| JP2017211555A (ja) * | 2016-05-26 | 2017-11-30 | 日立化成株式会社 | ドライフィルム及びレジストパターンの形成方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7806285B2 (ja) | 2026-01-26 |
| TW202428447A (zh) | 2024-07-16 |
| WO2024090510A1 (ja) | 2024-05-02 |
| CN120112858A (zh) | 2025-06-06 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250407 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250407 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20251219 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20260114 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 7806285 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |