JPWO2024024864A1 - - Google Patents
Info
- Publication number
- JPWO2024024864A1 JPWO2024024864A1 JP2024537208A JP2024537208A JPWO2024024864A1 JP WO2024024864 A1 JPWO2024024864 A1 JP WO2024024864A1 JP 2024537208 A JP2024537208 A JP 2024537208A JP 2024537208 A JP2024537208 A JP 2024537208A JP WO2024024864 A1 JPWO2024024864 A1 JP WO2024024864A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials For Photolithography (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022120582 | 2022-07-28 | ||
| PCT/JP2023/027464 WO2024024864A1 (ja) | 2022-07-28 | 2023-07-26 | 感光性転写材料及びその製造方法、樹脂パターンの製造方法、並びに、回路配線の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024024864A1 true JPWO2024024864A1 (https=) | 2024-02-01 |
Family
ID=89706580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024537208A Pending JPWO2024024864A1 (https=) | 2022-07-28 | 2023-07-26 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2024024864A1 (https=) |
| TW (1) | TW202413096A (https=) |
| WO (1) | WO2024024864A1 (https=) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017211555A (ja) * | 2016-05-26 | 2017-11-30 | 日立化成株式会社 | ドライフィルム及びレジストパターンの形成方法 |
| JPWO2020261523A1 (https=) * | 2019-06-27 | 2020-12-30 | ||
| JP7514305B2 (ja) * | 2020-05-27 | 2024-07-10 | 富士フイルム株式会社 | 転写フィルム、積層体の製造方法 |
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2023
- 2023-07-26 WO PCT/JP2023/027464 patent/WO2024024864A1/ja not_active Ceased
- 2023-07-26 JP JP2024537208A patent/JPWO2024024864A1/ja active Pending
- 2023-07-27 TW TW112128180A patent/TW202413096A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202413096A (zh) | 2024-04-01 |
| WO2024024864A1 (ja) | 2024-02-01 |