TW202413096A - 感光性轉印材料及其製造方法、樹脂圖案之製造方法、以及電路配線之製造方法 - Google Patents

感光性轉印材料及其製造方法、樹脂圖案之製造方法、以及電路配線之製造方法 Download PDF

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Publication number
TW202413096A
TW202413096A TW112128180A TW112128180A TW202413096A TW 202413096 A TW202413096 A TW 202413096A TW 112128180 A TW112128180 A TW 112128180A TW 112128180 A TW112128180 A TW 112128180A TW 202413096 A TW202413096 A TW 202413096A
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TW
Taiwan
Prior art keywords
layer
photosensitive
aforementioned
mass
transfer material
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TW112128180A
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English (en)
Chinese (zh)
Inventor
藤本進二
有冨隆志
佐藤守正
Original Assignee
日商富士軟片股份有限公司
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Application filed by 日商富士軟片股份有限公司 filed Critical 日商富士軟片股份有限公司
Publication of TW202413096A publication Critical patent/TW202413096A/zh

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/09Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW112128180A 2022-07-28 2023-07-27 感光性轉印材料及其製造方法、樹脂圖案之製造方法、以及電路配線之製造方法 TW202413096A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-120582 2022-07-28
JP2022120582 2022-07-28

Publications (1)

Publication Number Publication Date
TW202413096A true TW202413096A (zh) 2024-04-01

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TW112128180A TW202413096A (zh) 2022-07-28 2023-07-27 感光性轉印材料及其製造方法、樹脂圖案之製造方法、以及電路配線之製造方法

Country Status (3)

Country Link
JP (1) JPWO2024024864A1 (https=)
TW (1) TW202413096A (https=)
WO (1) WO2024024864A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017211555A (ja) * 2016-05-26 2017-11-30 日立化成株式会社 ドライフィルム及びレジストパターンの形成方法
JPWO2020261523A1 (https=) * 2019-06-27 2020-12-30
JP7514305B2 (ja) * 2020-05-27 2024-07-10 富士フイルム株式会社 転写フィルム、積層体の製造方法

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JPWO2024024864A1 (https=) 2024-02-01
WO2024024864A1 (ja) 2024-02-01

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