TW202424056A - 聚醯亞胺前驅物的製造方法、聚醯亞胺前驅物、感光性樹脂組成物、硬化物、圖案硬化物的製造方法及電子零件 - Google Patents

聚醯亞胺前驅物的製造方法、聚醯亞胺前驅物、感光性樹脂組成物、硬化物、圖案硬化物的製造方法及電子零件 Download PDF

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Publication number
TW202424056A
TW202424056A TW112143936A TW112143936A TW202424056A TW 202424056 A TW202424056 A TW 202424056A TW 112143936 A TW112143936 A TW 112143936A TW 112143936 A TW112143936 A TW 112143936A TW 202424056 A TW202424056 A TW 202424056A
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TW
Taiwan
Prior art keywords
polyimide precursor
group
general formula
photosensitive resin
carbon atoms
Prior art date
Application number
TW112143936A
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English (en)
Chinese (zh)
Inventor
會田祥貴
大江匡之
Original Assignee
日商艾曲迪微系統股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 日商艾曲迪微系統股份有限公司 filed Critical 日商艾曲迪微系統股份有限公司
Publication of TW202424056A publication Critical patent/TW202424056A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
TW112143936A 2022-11-25 2023-11-14 聚醯亞胺前驅物的製造方法、聚醯亞胺前驅物、感光性樹脂組成物、硬化物、圖案硬化物的製造方法及電子零件 TW202424056A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2022/043634 WO2024111129A1 (ja) 2022-11-25 2022-11-25 ポリイミド前駆体の製造方法、ポリイミド前駆体、感光性樹脂組成物、硬化物、パターン硬化物の製造方法、及び電子部品
WOPCT/JP2022/043634 2022-11-25

Publications (1)

Publication Number Publication Date
TW202424056A true TW202424056A (zh) 2024-06-16

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW112143936A TW202424056A (zh) 2022-11-25 2023-11-14 聚醯亞胺前驅物的製造方法、聚醯亞胺前驅物、感光性樹脂組成物、硬化物、圖案硬化物的製造方法及電子零件

Country Status (3)

Country Link
JP (1) JPWO2024111129A1 (https=)
TW (1) TW202424056A (https=)
WO (1) WO2024111129A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026042732A1 (ja) * 2024-08-23 2026-02-26 Jsr株式会社 レジスト下層膜形成用組成物、半導体基板の製造方法及び窒素含有化合物の製造方法
CN121432805B (zh) * 2025-12-30 2026-04-10 浙江奥首材料科技有限公司 高粘附性的负性光敏树脂组合物及制法与应用

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4551522A (en) * 1985-04-26 1985-11-05 E. I. Du Pont De Nemours And Company Process for making photopolymerizable aromatic polyamic acid derivatives
JP2005148611A (ja) * 2003-11-19 2005-06-09 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物及びそれを用いたパターンの製造方法、電子部品
JP2010077192A (ja) * 2008-09-24 2010-04-08 Fujifilm Corp 樹脂組成物、該樹脂組成物を用いた硬化物、フレキシブル銅張り積層板及びフレキシブルプリント基板
JP2010260996A (ja) * 2009-05-11 2010-11-18 Fujifilm Corp テトラカルボン酸二無水物、及び重合体
US11807721B2 (en) * 2018-04-03 2023-11-07 Hd Microsystems, Ltd. Method for producing polyimide precursor, method for producing photosensitive resin composition, method for producing pattern cured product, method for producing interlayer insulating film, cover coat layer or surface protective film, and method for producing electronic component

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JPWO2024111129A1 (https=) 2024-05-30
WO2024111129A1 (ja) 2024-05-30

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