JPWO2024111129A1 - - Google Patents
Info
- Publication number
- JPWO2024111129A1 JPWO2024111129A1 JP2024559834A JP2024559834A JPWO2024111129A1 JP WO2024111129 A1 JPWO2024111129 A1 JP WO2024111129A1 JP 2024559834 A JP2024559834 A JP 2024559834A JP 2024559834 A JP2024559834 A JP 2024559834A JP WO2024111129 A1 JPWO2024111129 A1 JP WO2024111129A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Materials For Photolithography (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/043634 WO2024111129A1 (ja) | 2022-11-25 | 2022-11-25 | ポリイミド前駆体の製造方法、ポリイミド前駆体、感光性樹脂組成物、硬化物、パターン硬化物の製造方法、及び電子部品 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024111129A1 true JPWO2024111129A1 (https=) | 2024-05-30 |
Family
ID=91196005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024559834A Pending JPWO2024111129A1 (https=) | 2022-11-25 | 2022-11-25 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2024111129A1 (https=) |
| TW (1) | TW202424056A (https=) |
| WO (1) | WO2024111129A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2026042732A1 (ja) * | 2024-08-23 | 2026-02-26 | Jsr株式会社 | レジスト下層膜形成用組成物、半導体基板の製造方法及び窒素含有化合物の製造方法 |
| CN121432805B (zh) * | 2025-12-30 | 2026-04-10 | 浙江奥首材料科技有限公司 | 高粘附性的负性光敏树脂组合物及制法与应用 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61254547A (ja) * | 1985-04-26 | 1986-11-12 | イ−・アイ・デユポン・ド・ネモア−ス・アンド・コンパニ− | 光重合可能な芳香族ポリアミツク酸誘導体の合成方法 |
| JP2005148611A (ja) * | 2003-11-19 | 2005-06-09 | Hitachi Chemical Dupont Microsystems Ltd | 感光性樹脂組成物及びそれを用いたパターンの製造方法、電子部品 |
| JP2010077192A (ja) * | 2008-09-24 | 2010-04-08 | Fujifilm Corp | 樹脂組成物、該樹脂組成物を用いた硬化物、フレキシブル銅張り積層板及びフレキシブルプリント基板 |
| JP2010260996A (ja) * | 2009-05-11 | 2010-11-18 | Fujifilm Corp | テトラカルボン酸二無水物、及び重合体 |
| WO2019193647A1 (ja) * | 2018-04-03 | 2019-10-10 | 日立化成デュポンマイクロシステムズ株式会社 | ポリイミド前駆体の製造方法、感光性樹脂組成物の製造方法、パターン硬化物の製造方法、層間絶縁膜、カバーコート層又は表面保護膜の製造方法、及び電子部品の製造方法 |
-
2022
- 2022-11-25 JP JP2024559834A patent/JPWO2024111129A1/ja active Pending
- 2022-11-25 WO PCT/JP2022/043634 patent/WO2024111129A1/ja not_active Ceased
-
2023
- 2023-11-14 TW TW112143936A patent/TW202424056A/zh unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61254547A (ja) * | 1985-04-26 | 1986-11-12 | イ−・アイ・デユポン・ド・ネモア−ス・アンド・コンパニ− | 光重合可能な芳香族ポリアミツク酸誘導体の合成方法 |
| JP2005148611A (ja) * | 2003-11-19 | 2005-06-09 | Hitachi Chemical Dupont Microsystems Ltd | 感光性樹脂組成物及びそれを用いたパターンの製造方法、電子部品 |
| JP2010077192A (ja) * | 2008-09-24 | 2010-04-08 | Fujifilm Corp | 樹脂組成物、該樹脂組成物を用いた硬化物、フレキシブル銅張り積層板及びフレキシブルプリント基板 |
| JP2010260996A (ja) * | 2009-05-11 | 2010-11-18 | Fujifilm Corp | テトラカルボン酸二無水物、及び重合体 |
| WO2019193647A1 (ja) * | 2018-04-03 | 2019-10-10 | 日立化成デュポンマイクロシステムズ株式会社 | ポリイミド前駆体の製造方法、感光性樹脂組成物の製造方法、パターン硬化物の製造方法、層間絶縁膜、カバーコート層又は表面保護膜の製造方法、及び電子部品の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202424056A (zh) | 2024-06-16 |
| WO2024111129A1 (ja) | 2024-05-30 |
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