TW202420905A - Method for producing heat dissipation circuit board - Google Patents
Method for producing heat dissipation circuit board Download PDFInfo
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- TW202420905A TW202420905A TW111142491A TW111142491A TW202420905A TW 202420905 A TW202420905 A TW 202420905A TW 111142491 A TW111142491 A TW 111142491A TW 111142491 A TW111142491 A TW 111142491A TW 202420905 A TW202420905 A TW 202420905A
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 67
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 57
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 28
- 229910052802 copper Inorganic materials 0.000 claims abstract description 28
- 239000010949 copper Substances 0.000 claims abstract description 28
- 238000005553 drilling Methods 0.000 claims abstract description 12
- 238000009713 electroplating Methods 0.000 claims description 44
- 238000000034 method Methods 0.000 claims description 37
- 230000000737 periodic effect Effects 0.000 claims description 8
- 239000011159 matrix material Substances 0.000 claims description 4
- 238000007747 plating Methods 0.000 abstract description 8
- 238000002360 preparation method Methods 0.000 abstract 2
- 238000010586 diagram Methods 0.000 description 16
- 230000000694 effects Effects 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
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Abstract
Description
本發明涉及一種電路板的製造方法,特別是涉及一種散熱電路板的製造方法。The present invention relates to a method for manufacturing a circuit board, and in particular to a method for manufacturing a heat dissipation circuit board.
現有的電路板的製造方法中,一般是以雷射方式對內層電路板結構的兩個寬側面進行加工以形成多個通孔,因此在加工的過程中會對內層電路板結構進行翻轉,進而造成加工過程較為複雜。In the existing manufacturing method of the circuit board, two wide sides of the inner circuit board structure are generally processed by laser to form a plurality of through holes. Therefore, the inner circuit board structure is turned over during the processing, thereby making the processing process more complicated.
故,如何簡化現有的電路板的製造方法,來克服上述的缺陷,已成為該項事業所欲解決的重要課題之一。Therefore, how to simplify the existing circuit board manufacturing method to overcome the above-mentioned defects has become one of the important issues that the industry wants to solve.
本發明所要解決的技術問題在於,針對現有技術的不足提供一種散熱電路板的製造方法,其加工過程較為簡單,並且最終形成的散熱電路板能具有優異的散熱效果及可靠度。The technical problem to be solved by the present invention is to provide a method for manufacturing a heat dissipation circuit board in view of the shortcomings of the prior art. The manufacturing process is relatively simple, and the heat dissipation circuit board finally formed can have excellent heat dissipation effect and reliability.
為了解決上述的技術問題,本發明所採用的其中一技術方案是提供一種散熱電路板的製造方法,其包括:實施一前置步驟,其包含:提供一內層電路板結構,所述內層電路板結構具有彼此相反的兩個寬側面,各個所述寬側面定義有一中間區域及環繞所述中間區域的一周圍區域;實施一對位靶孔形成步驟,其包含:於所述內層電路板結構的所述周圍區域形成多個對位靶孔;實施一通孔形成步驟,其包含:以機械鑽孔方式於所述內層電路板結構的所述中間區域形成多個通孔;實施一電鍍步驟,其包含:以電鍍方式於多個所述通孔中形成多個銅柱;以及實施一外層曝光步驟,其包含:對所內層電路板結構進行外層曝光以形成為一散熱電路板。In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a method for manufacturing a heat dissipation circuit board, which includes: implementing a pre-step, which includes: providing an inner circuit board structure, the inner circuit board structure has two wide sides opposite to each other, each of the wide sides defines a middle area and a surrounding area surrounding the middle area; implementing a positioning target hole forming step, which includes: A plurality of alignment target holes are formed in the surrounding area of the inner circuit board structure; a through-hole forming step is performed, which includes: forming a plurality of through-holes in the middle area of the inner circuit board structure by mechanical drilling; a plating step is performed, which includes: forming a plurality of copper pillars in the plurality of through-holes by plating; and an outer layer exposure step is performed, which includes: performing outer layer exposure on the inner circuit board structure to form a heat dissipation circuit board.
優選地,於所述對位靶孔形成步驟中,形成有四個所述對位靶孔,並且四個所述對位靶孔是形成於所述內層電路板結構的四個角落。Preferably, in the alignment target hole forming step, four alignment target holes are formed, and the four alignment target holes are formed at four corners of the inner layer circuit board structure.
優選地,各個所述通孔的直徑是介於0.15毫米至0.25毫米之間。Preferably, the diameter of each of the through holes is between 0.15 mm and 0.25 mm.
優選地,於所述通孔步驟中,是在不翻轉所述內層電路板結構的情況下,僅從其中一個所述寬側面進行機械鑽孔而形成多個所述通孔。Preferably, in the through-hole step, mechanical drilling is performed only from one of the wide sides to form a plurality of through-holes without flipping the inner circuit board structure.
優選地,於所述通孔形成步驟中,多個所述通孔的數量是介於20個至40個之間。多個所述通孔呈矩陣排列,並且任兩個相鄰的所述通孔之間的距離是介於0.15毫米至0.25毫米之間。Preferably, in the through-hole forming step, the number of the through-holes is between 20 and 40. The through-holes are arranged in a matrix, and the distance between any two adjacent through-holes is between 0.15 mm and 0.25 mm.
優選地,於所述電鍍步驟中,是以週期式脈衝電鍍方式於多個所述通孔中形成多個所述銅柱。Preferably, in the electroplating step, a plurality of the copper pillars are formed in the plurality of the through holes by periodic pulse electroplating.
優選地,於所述電鍍步驟中,週期式脈衝電鍍的頻率是介於3:1至6:1之間。Preferably, in the electroplating step, the frequency of the periodic pulse electroplating is between 3:1 and 6:1.
優選地,於所述通孔形成步驟後且於所述電鍍步驟前,所述散熱電路板的製造方法還包含一盲槽形成步驟,對所述內層電路板結構的所述周圍區域進行雷射而形成至少一盲槽。於所述電鍍步驟中,還通過電鍍以於所述盲槽中形成一銅層。Preferably, after the through hole forming step and before the electroplating step, the manufacturing method of the heat sink circuit board further includes a blind groove forming step, wherein the surrounding area of the inner layer circuit board structure is lasered to form at least one blind groove. In the electroplating step, a copper layer is formed in the blind groove by electroplating.
優選地,於所述盲槽形成步驟中,是以能量介於8毫焦至10毫焦之間且脈衝寬度介於4微秒至8微秒之間的雷射於所述周圍區域形成所述盲槽。Preferably, in the blind groove forming step, the blind groove is formed in the surrounding area by using a laser having an energy between 8 mJ and 10 mJ and a pulse width between 4 μs and 8 μs.
優選地,所述盲槽的長度是介於4毫米至6毫米之間,並且所述盲槽的寬度是介於0.05毫米至0.1毫米之間。所述銅層的厚度是介於22微米至28微米之間。Preferably, the length of the blind groove is between 4 mm and 6 mm, and the width of the blind groove is between 0.05 mm and 0.1 mm. The thickness of the copper layer is between 22 μm and 28 μm.
本發明的其中一有益效果在於,本發明所提供的散熱電路板的製造方法,其能通過“實施一通孔形成步驟,其包含:以機械鑽孔方式於所述內層電路板結構的所述中間區域形成多個通孔”以及“實施一電鍍步驟,其包含:以電鍍方式於多個所述通孔中形成多個銅柱”的技術方案,以簡化散熱電路板的製造方法的加工過程,並且使得最終形成的散熱電路板能具有優異的散熱效果及可靠度。One of the beneficial effects of the present invention is that the manufacturing method of the heat dissipation circuit board provided by the present invention can simplify the processing process of the manufacturing method of the heat dissipation circuit board through the technical solutions of "implementing a through hole forming step, which includes: forming a plurality of through holes in the middle area of the inner layer circuit board structure by mechanical drilling" and "implementing a plating step, which includes: forming a plurality of copper pillars in the plurality of through holes by electroplating". The heat dissipation circuit board finally formed can have excellent heat dissipation effect and reliability.
為使能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與圖式,然而所提供的圖式僅用於提供參考與說明,並非用來對本發明加以限制。To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only used for reference and description and are not used to limit the present invention.
以下是通過特定的具體實施例來說明本發明所公開有關“散熱電路板的製造方法”的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不悖離本發明的構思下進行各種修改與變更。另外,本發明的附圖僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的保護範圍。The following is a specific embodiment to illustrate the implementation of the "method for manufacturing a heat dissipation circuit board" disclosed in the present invention. The technical personnel in this field can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without deviating from the concept of the present invention. In addition, the drawings of the present invention are only for simple schematic illustrations and are not depicted according to actual sizes. Please note in advance. The following implementation will further explain the relevant technical content of the present invention in detail, but the disclosed content is not used to limit the scope of protection of the present invention.
應當可以理解的是,雖然本文中可能會使用到“第一”、“第二”、“第三”等術語來描述各種元件或者信號,但這些元件或者信號不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件,或者一信號與另一信號。另外,本文中所使用的術語“或”,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。It should be understood that, although the terms "first", "second", "third", etc. may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used in this document may include any one or more combinations of the related listed items depending on the actual situation.
[第一實施例][First embodiment]
參閱圖1至圖5所示,圖1為本發明第一實施例的散熱電路板的製造方法的流程圖,圖2為本發明第一實施例的散熱電路板的製造方法的前置步驟的示意圖,圖3為本發明第一實施例的散熱電路板的製造方法的對位靶孔形成步驟的示意圖,圖4為本發明第一實施例的散熱電路板的製造方法的通孔形成步驟的示意圖,並且圖5為本發明第一實施例的散熱電路板的製造方法的電鍍步驟的示意圖。Referring to Figures 1 to 5, Figure 1 is a flow chart of the method for manufacturing a heat dissipation circuit board of the first embodiment of the present invention, Figure 2 is a schematic diagram of the pre-step of the method for manufacturing a heat dissipation circuit board of the first embodiment of the present invention, Figure 3 is a schematic diagram of the alignment target hole forming step of the method for manufacturing a heat dissipation circuit board of the first embodiment of the present invention, Figure 4 is a schematic diagram of the through hole forming step of the method for manufacturing a heat dissipation circuit board of the first embodiment of the present invention, and Figure 5 is a schematic diagram of the electroplating step of the method for manufacturing a heat dissipation circuit board of the first embodiment of the present invention.
本發明第一實施例提供一種散熱的電路板的製造方法。由所述散熱電路板的製造方法所製得的散熱電路板100能具有優異的散熱效果。所述散熱電路板的製造方法包含一前置步驟S110、一對位靶孔形成步驟S120、一通孔形成步驟S130、一電鍍步驟S140及一外層曝光步驟S150。The first embodiment of the present invention provides a method for manufacturing a heat dissipating circuit board. The heat
於所述前置步驟S110中,提供一內層電路板結構1,所述內層電路板結構1具有彼此相反的兩個寬側面11,各個所述寬側面11定義有一中間區域11a及環繞所述中間區域11a的一周圍區域11b。In the preceding step S110, an inner circuit board structure 1 is provided. The inner circuit board structure 1 has two opposite
於所述對位靶孔形成步驟S120中,於所述內層電路板結構1的所述周圍區域11b形成多個對位靶孔2。於本實施例的所述對位靶孔形成步驟S120中,是形成有四個所述對位靶孔2,並且四個所述對位靶孔2是形成於所述內層電路板結構1的四個角落。另外,多個所述對位靶孔2可以是通過機械鑽孔方式或雷射方式形成,但多個所述對位靶孔2也可以是通過其他方式形成,本發明於此不加以限制。In the alignment target hole forming step S120, a plurality of
值得一提的是,所述對位靶孔2的數量及形成的位置均可以依據需求變化。舉例來說,於本發明未繪示的其他實施例中,所述對位靶孔2的數量可以為兩個,並且兩個所述對位靶孔2可以是形成於所述內層電路板結構1的互不相鄰的兩個角落。It is worth mentioning that the number and position of the
於所述通孔形成步驟S130中,以機械鑽孔方式於所述內層電路板結構1的所述中間區域11a形成多個通孔3。進一步來說,於所述通孔形成步驟S130中,可以是依據多個所述對位靶孔的位置而對所述內層電路板結構1進行機械鑽孔。In the through hole forming step S130, a plurality of through
於本實施例中,各個所述通孔3的直徑是介於0.15毫米至0.25毫米之間,更佳地,各個所述通孔3的直徑是介於0.18毫米至0.22毫米之間,但本發明不受限於此。值得一提的是,若所述通孔3的直徑高於上限值(如0.25毫米),則於後續的電鍍步驟S140中可能會有無法填滿所述通孔3的問題,相反地,若所述通孔3的直徑低於下限值(如0.15毫米),則最終形成的散熱電路板100可能會有可靠性不佳的問題。In this embodiment, the diameter of each through
進一步來說,於本實施例的所述通孔形成步驟S130中,是在不翻轉所述內層電路板結構1的情況下,僅從其中一個所述寬側面11進行機械鑽孔而形成多個所述通孔3。此外,於所述通孔形成步驟S130中,可以是限制為排除使用雷射方式以形成所述通孔3。換句話說,以雷射方式所形成的通孔3不適合用以對比至本案中以機械鑽孔所形成的所述通孔3。Furthermore, in the through hole forming step S130 of the present embodiment, the plurality of through
現有的電路板的製造方法中,一般是以雷射方式對內層電路板結構的兩個寬側面進行加工以形成多個通孔,因此在加工的過程中會對內層電路板結構進行翻轉,進而造成加工過程較為複雜。In the existing manufacturing method of the circuit board, two wide sides of the inner circuit board structure are generally processed by laser to form a plurality of through holes. Therefore, the inner circuit board structure is turned over during the processing, thereby making the processing process more complicated.
相對地,本實施例中的多個所述通孔3是在不需對所述內層電路板結構1進行翻轉的情況下形成,因此加工過程是較為簡單的。此外,由於本發明中的所述通孔3是通過機械鑽孔方式形成,因此相較於一般電路板的製造方法中以雷射方式形成的通孔,本案的所述通孔3能具有較大的直徑,進而增加最終形成的所述散熱電路板100的信賴性及可靠度。In contrast, the plurality of through
此外,於本實施例的所述通孔形成步驟S130中,多個所述通孔3的數量是介於20個至40個之間,多個所述通孔3呈矩陣排列,並且任兩個相鄰的所述通孔3之間的距離D是介於0.15毫米至0.25毫米之間。值得一提的是,所述通孔3的排列及數量皆可以依據實際需求變化,本發明不對所述通孔3的排列及數量加以限制。In addition, in the through hole forming step S130 of the present embodiment, the number of the through
於所述電鍍步驟S140中,以電鍍方式於多個所述通孔3中形成多個銅柱4。於本實施例的所述電鍍步驟S140中,是以週期式脈衝電鍍方式於多個所述通孔3中形成多個所述銅柱4,並且週期式脈衝電鍍的頻率是介於3:1至6:1之間。具體來說,週期式脈衝電鍍是使電鍍迴路週期性地接通和斷開,以使得所述銅柱4較為緻密且具有低的孔隙率,尤其是在所述通孔3的內側壁不平整的情況下。In the electroplating step S140, a plurality of
於所述外層曝光步驟S150中,對所述內層電路板結構1進行外層曝光以形成為所述散熱電路板100。In the outer layer exposure step S150 , the inner layer circuit board structure 1 is exposed to an outer layer to form the heat
[第二實施例][Second embodiment]
請參閱圖6至圖8所示,圖6為本發明第二實施例的散熱電路板的製造方法的流程圖,圖7為本發明第二實施例的散熱電路板的製造方法的盲槽形成步驟的示意圖,並且圖8為本發明第二實施例的散熱電路板的製造方法的電鍍步驟的示意圖。Please refer to Figures 6 to 8, Figure 6 is a flow chart of the manufacturing method of the heat dissipation circuit board of the second embodiment of the present invention, Figure 7 is a schematic diagram of the blind groove forming step of the manufacturing method of the heat dissipation circuit board of the second embodiment of the present invention, and Figure 8 is a schematic diagram of the electroplating step of the manufacturing method of the heat dissipation circuit board of the second embodiment of the present invention.
本實施例類似於上述第一實施例,所以兩個實施例的相同處則不再加以贅述,而兩個實施例的差異處大致說明如下:This embodiment is similar to the first embodiment described above, so the similarities between the two embodiments will not be described in detail, and the differences between the two embodiments are roughly described as follows:
於本實施例中,於所述通孔形成步驟S130後且於所述電鍍步驟S140前,所述散熱電路板的製造方法還包含一盲槽形成步驟S131,對所述內層電路板結構1的所述周圍區域11b進行雷射而形成至少一盲槽5,並且於所述電鍍步驟S140中,還通過電鍍以於所述盲槽5中形成一銅層6。此外,上述實施例的於所述電鍍步驟S140中,可以所述寬側面11上形成有所述銅層6。In this embodiment, after the through hole forming step S130 and before the electroplating step S140, the manufacturing method of the heat dissipation circuit board further includes a blind groove forming step S131, laser irradiation is performed on the surrounding
於本實施例的所述盲槽形成步驟S131中,是以能量介於8毫焦至10毫焦之間且脈衝寬度介於4微秒至8微秒之間的雷射於所述周圍區域11b形成所述盲槽5。然而,用以形成所述盲槽5的雷射的能量及脈衝寬度可以依據實際需求變化,本發明於此不加以限制。於本實施例中,所述盲槽5的長度是介於4毫米至6毫米之間,所述盲槽5的寬度是介於0.05毫米至0.1毫米之間,並且所述盲槽5的深度是介於25毫米至75毫米之間,但本發明不受限於此。較佳地,所述盲槽5的深度是介於35毫米至65毫米之間,更佳地,所述盲槽5的深度是介於45毫米至55毫米之間。In the blind groove forming step S131 of the present embodiment, the
也就是說,本實施例中的所述盲槽5大致呈長條型。然而,本發明不對所述盲槽5的外形加以限制,舉例來說,於本發明未繪示的其他實施例中,所述盲槽5可以呈L型或V型。That is to say, the
於本實施例中,所述銅層6的厚度較佳是介於22微米至28微米之間,以使得所述銅層6搭配於所述盲槽5能提供優異的散熱效果。更佳地,所述銅層6的厚度較佳是介於24微米至26微米之間。具體來說,由於所述銅層6是沿所述盲槽5的側壁形成於所述盲槽5中,因此相較於不具有盲槽的電路板或是僅具有盲孔的電路板,本發明中的所述銅層6的表面積是相對較大的,進而得以提供優異的散熱效果。In this embodiment, the thickness of the
[第三實施例][Third Embodiment]
請參閱圖9至圖11所示,圖9為本發明第三實施例的散熱電路板的製造方法的流程圖,圖10為本發明第三實施例的散熱電路板的製造方法的盲孔步驟的示意圖,並且圖11為本發明第三實施例的散熱電路板的製造方法的電鍍步驟的示意圖。Please refer to Figures 9 to 11, Figure 9 is a flow chart of the manufacturing method of the heat dissipation circuit board of the third embodiment of the present invention, Figure 10 is a schematic diagram of the blind hole step of the manufacturing method of the heat dissipation circuit board of the third embodiment of the present invention, and Figure 11 is a schematic diagram of the electroplating step of the manufacturing method of the heat dissipation circuit board of the third embodiment of the present invention.
本實施例類似於上述第一實施例,所以兩個實施例的相同處則不再加以贅述,而兩個實施例的差異處大致說明如下:This embodiment is similar to the first embodiment described above, so the similarities between the two embodiments will not be described in detail, and the differences between the two embodiments are roughly described as follows:
在本實施例中,於所述盲槽形成步驟S131後且於所述電鍍步驟S140前,所述散熱電路板的製造方法還包含一盲孔形成步驟S132,對所述內層電路板結構1的所述周圍區域11b進行雷射以形成至少一盲孔7。此外,於本實施例的所述電鍍步驟S130中,還通過電鍍以於所述盲孔7中形成所述銅層6。In this embodiment, after the blind groove forming step S131 and before the electroplating step S140, the manufacturing method of the heat sink circuit board further includes a blind hole forming step S132, in which the surrounding
於本實施例中,所述盲孔7的直徑大致為介於0.05毫米至0.1毫米之間,並且所述盲孔7的深度是介於25毫米至75毫米之間,但本發明不受限於此。較佳地,盲孔7的深度是介於35毫米至65毫米之間,更佳地,盲孔7的深度是介於45毫米至55毫米之間。In this embodiment, the diameter of the blind hole 7 is approximately between 0.05 mm and 0.1 mm, and the depth of the blind hole 7 is between 25 mm and 75 mm, but the present invention is not limited thereto. Preferably, the depth of the blind hole 7 is between 35 mm and 65 mm, and more preferably, the depth of the blind hole 7 is between 45 mm and 55 mm.
於所述盲孔形成步驟S132中,是以能量介於12毫焦至15毫焦之間且脈衝寬度介於8微秒至15微秒的雷射於所述周圍區域11b形成所述盲孔7。值得一提的是,於所述盲孔形成步驟S132中所使用的雷射的能量及脈衝寬度是分別大於所述盲槽形成步驟S131中所使用的雷射的能量及脈衝寬度,其原因在於,於本實施例中的所述盲槽5可以是通過重疊所述盲孔7而形成。In the blind hole forming step S132, the blind hole 7 is formed in the surrounding
此外,於所述盲槽形成步驟S131中,可以是僅通過單一發雷射而形成所述盲槽5,於所述盲孔形成步驟S132中,可以是通過三發雷射而形成所述盲孔7。用以形成所述盲孔7的三發雷射中,第一發雷射是用以於所述周圍區域11b進行開窗,而其餘兩發雷射是用以對上述開窗的位置進行修飾以形成所述盲孔7。In addition, in the blind groove forming step S131, the
本實施例通過所述盲孔形成步驟S132於所述周圍區域11b形成所述盲孔7以進一步提升散熱效果。具體來說,所述周圍區域11b可能會有部分面積過小而不利於形成所述盲槽5的情形,此時,可以通過所述盲孔形成步驟S132而於上述部分區域形成所述盲孔7,以避免因無法形成盲槽5而導致散熱效果不佳。In this embodiment, the blind hole 7 is formed in the surrounding
[散熱電路板][Heat dissipation circuit board]
本發明還提供一種散熱電路板100,所述散熱電路板100可以是通過上述散熱電路板製造方法所形成。值得一提的是,所述散熱電路板100也可以是通過其他方式所形成,本發明於此不加以限制。The present invention also provides a heat
所述散熱電路板100包含有一內層電路板結構1、多個對位靶孔2、多個通孔3及多個銅柱4。此外,所述散熱電路板100還可以包含一外層(圖未示),所述外層可以是通過外層曝光而形成於所述內層電路板結構1,但所述散熱電路板100不限制為包含所述外層。The heat
所述內層電路板結構1具有彼此相反的兩個寬側面11,各個所述寬側面11定義有一中間區域11a及環繞所述中間區域11a的一周圍區域11b。The inner circuit board structure 1 has two opposite
於本實施例中,所述散熱電路板100包含有四個所述對位靶孔2,並且四個所述對位靶孔2是形成於所述內層電路板結構1的四個角落。In this embodiment, the heat
多個所述通孔3是以機械鑽孔方式於所述內層電路板結構1的所述中間區域11a。於本實施例中,各個所述通孔3的直徑是介於0.15毫米至0.25毫米之間,更佳地,各個所述通孔3的直徑是介於0.18毫米至0.22毫米之間,但本發明不受限於此。The plurality of through
此外,於本實施例中,多個所述通孔3的數量是介於20個至40個之間,多個所述通孔3呈矩陣排列,並且任兩個相鄰的所述通孔3之間的距離是介於0.15毫米至0.25毫米之間。多個所述銅柱4是以電鍍方式形成於多個所述通孔3中。In addition, in this embodiment, the number of the plurality of through
[實施例的有益效果][Beneficial Effects of the Embodiments]
本發明的其中一有益效果在於,本發明所提供的散熱電路板的製造方法,其能通過“實施一通孔形成步驟,其包含:以機械鑽孔方式於所述內層電路板結構的所述中間區域形成多個通孔”以及“實施一電鍍步驟,其包含:以電鍍方式於多個所述通孔中形成多個銅柱”的技術方案,以簡化散熱電路板的製造方法的加工過程,並且使得最終形成的散熱電路板能具有優異的散熱效果及可靠度。One of the beneficial effects of the present invention is that the manufacturing method of the heat dissipation circuit board provided by the present invention can simplify the processing process of the manufacturing method of the heat dissipation circuit board through the technical solutions of "implementing a through hole forming step, which includes: forming a plurality of through holes in the middle area of the inner layer circuit board structure by mechanical drilling" and "implementing a plating step, which includes: forming a plurality of copper pillars in the plurality of through holes by electroplating". The heat dissipation circuit board finally formed can have excellent heat dissipation effect and reliability.
進一步地,於所述電鍍步驟中,是以週期式脈衝電鍍方式於多個所述通孔中形成多個所述銅柱,進而使得形成的所述銅柱較為緻密且具有低的孔隙率。Furthermore, in the electroplating step, a plurality of the copper pillars are formed in the plurality of the through holes by periodic pulse electroplating, so that the formed copper pillars are denser and have a lower porosity.
以上所公開的內容僅為本發明的優選可行實施例,並非因此侷限本發明的申請專利範圍,所以凡是運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的申請專利範圍內。The contents disclosed above are only preferred feasible embodiments of the present invention and are not intended to limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the contents of the specification and drawings of the present invention are included in the scope of the patent application of the present invention.
100:散熱電路板
1:內層電路板結構
11:寬側面
11a:中間區域
11b:周圍區域
2:對位靶孔
3:通孔
4:銅柱
5:盲槽
6:銅層
7:盲孔
D:距離
S110:前置步驟
S120:對位靶孔形成步驟
S130:通孔形成步驟
S131:盲槽形成步驟
S132:盲孔形成步驟
S140:電鍍步驟
S150:外層曝光步驟
100: Heat dissipation circuit board
1: Inner circuit board structure
11:
圖1為本發明第一實施例的散熱電路板的製造方法的流程圖。FIG. 1 is a flow chart of a method for manufacturing a heat dissipation circuit board according to a first embodiment of the present invention.
圖2為本發明第一實施例的散熱電路板的製造方法的前置步驟的示意圖。FIG. 2 is a schematic diagram of the pre-step of the manufacturing method of the heat dissipation circuit board of the first embodiment of the present invention.
圖3為本發明第一實施例的散熱電路板的製造方法的對位靶孔形成步驟的示意圖。FIG. 3 is a schematic diagram of a step of forming a positioning target hole in a method for manufacturing a heat dissipation circuit board according to the first embodiment of the present invention.
圖4為本發明第一實施例的散熱電路板的製造方法的通孔形成步驟的示意圖。FIG. 4 is a schematic diagram of a through-hole forming step of a method for manufacturing a heat dissipation circuit board according to the first embodiment of the present invention.
圖5為本發明第一實施例的散熱電路板的製造方法的電鍍步驟的示意圖。FIG. 5 is a schematic diagram of the electroplating step of the method for manufacturing the heat dissipation circuit board of the first embodiment of the present invention.
圖6為本發明第二實施例的散熱電路板的製造方法的流程圖。FIG6 is a flow chart of a method for manufacturing a heat dissipation circuit board according to a second embodiment of the present invention.
圖7為本發明第二實施例的散熱電路板的製造方法的盲槽形成步驟的示意圖。FIG. 7 is a schematic diagram of a blind groove forming step of a method for manufacturing a heat dissipation circuit board according to a second embodiment of the present invention.
圖8為本發明第二實施例的散熱電路板的製造方法的電鍍步驟的示意圖。FIG. 8 is a schematic diagram of the electroplating step of the manufacturing method of the heat dissipation circuit board of the second embodiment of the present invention.
圖9為本發明第三實施例的散熱電路板的製造方法的流程圖。FIG. 9 is a flow chart of a method for manufacturing a heat dissipation circuit board according to a third embodiment of the present invention.
圖10為本發明第三實施例的散熱電路板的製造方法的盲孔步驟的示意圖。FIG. 10 is a schematic diagram of a blind hole step of a method for manufacturing a heat dissipation circuit board according to a third embodiment of the present invention.
圖11為本發明第三實施例的散熱電路板的製造方法的電鍍步驟的示意圖。FIG. 11 is a schematic diagram of the electroplating step of the method for manufacturing a heat dissipation circuit board according to the third embodiment of the present invention.
S110:前置步驟 S110: Preliminary steps
S120:對位靶孔形成步驟 S120: Alignment target hole formation step
S130:通孔形成步驟 S130: Through hole formation step
S140:電鍍步驟 S140: Electroplating step
S150:外層曝光步驟 S150: External layer exposure step
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