TW202419587A - 導電性膏、電極、電子零件及電子器材 - Google Patents

導電性膏、電極、電子零件及電子器材 Download PDF

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Publication number
TW202419587A
TW202419587A TW112132138A TW112132138A TW202419587A TW 202419587 A TW202419587 A TW 202419587A TW 112132138 A TW112132138 A TW 112132138A TW 112132138 A TW112132138 A TW 112132138A TW 202419587 A TW202419587 A TW 202419587A
Authority
TW
Taiwan
Prior art keywords
conductive paste
metal particles
electrode
particles
conductive
Prior art date
Application number
TW112132138A
Other languages
English (en)
Chinese (zh)
Inventor
吉井喜昭
森滉平
Original Assignee
日商納美仕有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商納美仕有限公司 filed Critical 日商納美仕有限公司
Publication of TW202419587A publication Critical patent/TW202419587A/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
TW112132138A 2022-08-26 2023-08-25 導電性膏、電極、電子零件及電子器材 TW202419587A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-134752 2022-08-26
JP2022134752 2022-08-26

Publications (1)

Publication Number Publication Date
TW202419587A true TW202419587A (zh) 2024-05-16

Family

ID=90013509

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112132138A TW202419587A (zh) 2022-08-26 2023-08-25 導電性膏、電極、電子零件及電子器材

Country Status (5)

Country Link
JP (1) JPWO2024043328A1 (https=)
KR (1) KR20250053046A (https=)
CN (1) CN119654687A (https=)
TW (1) TW202419587A (https=)
WO (1) WO2024043328A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07335402A (ja) 1994-06-06 1995-12-22 Sumitomo Metal Mining Co Ltd チップ抵抗器上面電極形成用ペースト
JP2004217952A (ja) * 2003-01-09 2004-08-05 Mitsui Mining & Smelting Co Ltd 表面処理銅粉並びにその表面処理銅粉の製造方法及びその表面処理銅粉を用いた導電性ペースト
JP5869538B2 (ja) * 2013-08-13 2016-02-24 Ｊｘ金属株式会社 表面処理された金属粉の製造方法
JP7687687B2 (ja) 2020-01-16 2025-06-03 ナミックス株式会社 導電性ペースト、電極及びチップ抵抗器
JP7594460B2 (ja) * 2020-03-27 2024-12-04 三井金属鉱業株式会社 表面処理粒子及びその製造方法、並びに表面処理粒子を含む導電性組成物

Also Published As

Publication number Publication date
JPWO2024043328A1 (https=) 2024-02-29
WO2024043328A1 (ja) 2024-02-29
KR20250053046A (ko) 2025-04-21
CN119654687A (zh) 2025-03-18

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