TW202415515A - Object cutting-sucking mechanism and object cutting-sucking system - Google Patents

Object cutting-sucking mechanism and object cutting-sucking system Download PDF

Info

Publication number
TW202415515A
TW202415515A TW111137987A TW111137987A TW202415515A TW 202415515 A TW202415515 A TW 202415515A TW 111137987 A TW111137987 A TW 111137987A TW 111137987 A TW111137987 A TW 111137987A TW 202415515 A TW202415515 A TW 202415515A
Authority
TW
Taiwan
Prior art keywords
cutting
sucking
suction
disposed
base
Prior art date
Application number
TW111137987A
Other languages
Chinese (zh)
Other versions
TWI813463B (en
Inventor
李崇維
鍾亞倫
丁冠彰
Original Assignee
啟碁科技股份有限公司
Filing date
Publication date
Application filed by 啟碁科技股份有限公司 filed Critical 啟碁科技股份有限公司
Priority to TW111137987A priority Critical patent/TWI813463B/en
Priority claimed from TW111137987A external-priority patent/TWI813463B/en
Application granted granted Critical
Publication of TWI813463B publication Critical patent/TWI813463B/en
Publication of TW202415515A publication Critical patent/TW202415515A/en

Links

Images

Abstract

The present disclosure provides an object cutting-sucking system and an object cutting-sucking mechanism. The object cutting-sucking system uses a robot arm to drive the object cutting-sucking mechanism. The object cutting-sucking mechanism includes a base, a die, a moving element, and a suction device. The die and the moving element are mounted on the base. The suction device is mounted on the moving element and is configured to be inserted into and penetrate through the die. The moving element drives the suction device to move relative to the die. When the die cuts an object, at the same time, the suction device sucks the object in a vacuum. When the object is to be attached, the moving element drives the suction device to detach the object from the die. After the object is attached, the suction device breaks the vacuum to detach the object from the suction device.

Description

物件裁切吸取機構與物件裁切吸取系統Object cutting and absorbing mechanism and object cutting and absorbing system

本揭露是有關於一種裁切吸取技術,且特別是有關於一種物件裁切吸取機構與物件裁切吸取系統。The present disclosure relates to a cutting and absorbing technology, and in particular to an object cutting and absorbing mechanism and an object cutting and absorbing system.

目前進行貼附作業的物件大多是預先裁切,再由人工或自動化設備進行拿取並貼附的動作。Currently, most objects that are subjected to the pasting operation are pre-cut and then picked up and pasted by manual or automated equipment.

以散熱墊為例,將所需尺寸的散熱墊預先裁切完成後,再利用作業員人工拿取散熱墊,並將散熱墊貼附於待貼附件上。或者,利用自動化設備拿取散熱墊,再將散熱墊貼附於待貼附件上。For example, a heat sink is cut to the required size in advance, and then the worker manually takes the heat sink and attaches it to the attachment to be attached. Alternatively, an automated device takes the heat sink and attaches it to the attachment to be attached.

然而預先裁切好的散熱墊大都採堆疊式包裝,因為堆疊重量的擠壓,導致下層的散熱墊容易沾黏,使得自動化生產發生的異常率過高,導致產能損失。However, most pre-cut heat sinks are packed in stacks. Due to the compression of the stacking weight, the heat sinks on the bottom layer are prone to sticking, which increases the abnormality rate in automated production and leads to production capacity loss.

為了改善沾黏問題而採用工作盤,將散熱墊放置於工作盤上,以利用工作盤將散熱墊分隔,而可有效改善沾黏。但是工作盤的使用,導致成本提高,仍不理想。In order to improve the sticking problem, a work plate is used, and the heat sink is placed on the work plate, so that the heat sink is separated by the work plate, which can effectively improve the sticking. However, the use of the work plate leads to increased costs, which is still not ideal.

因此,本揭露之一目的就是在提供一種物件裁切吸取機構與物件裁切吸取系統,可改善以往預先裁切物件後,物件採堆疊放置而易沾黏的問題,以及物件採用工作盤分隔而成本高的問題。Therefore, one of the purposes of the present disclosure is to provide an object cutting and sucking mechanism and an object cutting and sucking system, which can improve the problem that objects are stacked and easily stick together after being pre-cut, and the problem that objects are separated by working plates and the cost is high.

根據本揭露之上述目的,提出一種物件裁切吸取機構。物件裁切吸取機構包含座體、刀模、移動件及吸取裝置。刀模與移動件皆設置於座體上。吸取裝置設置於移動件上並伸入刀模。吸取裝置利用移動件而相對刀模移動。其中吸取裝置連接真空供應件。在刀模裁切出物件的同時,吸取裝置真空吸附物件。According to the above-mentioned purpose of the present disclosure, a kind of object cutting and sucking mechanism is proposed. The object cutting and sucking mechanism comprises a base, a cutting die, a moving part and a sucking device. The cutting die and the moving part are both arranged on the base. The sucking device is arranged on the moving part and extends into the cutting die. The sucking device moves relative to the cutting die by the moving part. The sucking device is connected to a vacuum supply part. While the cutting die cuts out the object, the sucking device vacuum absorbs the object.

依據本揭露之一實施例,刀模包含基板、刀頭及定位柱。基板設置於座體上。基板具有相對的第一表面及第二表面。其中第一表面面向座體。刀頭設置於基板的第二表面上。其中刀頭的一端形成穿孔及刀刃。穿孔貫穿刀頭並延伸至基板的第一表面。刀刃環繞穿孔。定位柱設置於基板並伸入座體。According to one embodiment of the present disclosure, the knife mold includes a substrate, a knife head and a positioning column. The substrate is arranged on the base. The substrate has a first surface and a second surface opposite to each other. The first surface faces the base. The knife head is arranged on the second surface of the substrate. A through hole and a blade are formed at one end of the knife head. The through hole penetrates the knife head and extends to the first surface of the substrate. The blade surrounds the through hole. The positioning column is arranged on the substrate and extends into the base.

依據本揭露之一實施例,吸取裝置包含吸取頭與流道。吸取頭與該穿孔滑動配合。其中吸取頭的末端面形成通孔。流道形成於吸取裝置中。其中流道連通真空供應件與通孔。According to an embodiment of the present disclosure, the suction device includes a suction head and a flow channel. The suction head is slidably matched with the perforation. The end surface of the suction head forms a through hole. The flow channel is formed in the suction device. The flow channel connects the vacuum supply part and the through hole.

依據本揭露之一實施例,吸取頭包含凸塊、溝槽與環牆。凸塊形成於吸取頭的末端面且彼此間隔排列。溝槽形成於吸取頭的末端面。其中溝槽環繞凸塊並連通通孔。環牆形成於吸取頭的末端面並環繞溝槽,且環牆與凸塊齊平。According to one embodiment of the present disclosure, the suction head includes a bump, a groove and a ring wall. The bump is formed on the end surface of the suction head and is arranged at intervals. The groove is formed on the end surface of the suction head. The groove surrounds the bump and is connected to the through hole. The ring wall is formed on the end surface of the suction head and surrounds the groove, and the ring wall is flush with the bump.

依據本揭露之一實施例,物件是散熱墊,移動件是氣缸。According to one embodiment of the present disclosure, the object is a heat sink and the moving part is a cylinder.

依據本揭露之一實施例,移動件包含缸體、缸心與移動座。缸體固設於座體。缸心設置於缸體並能相對缸體移動。移動座設置於缸心中伸出缸體的一端。其中吸取裝置設置於移動座,利用移動座的帶動,讓吸取頭沿著穿孔移動。According to an embodiment of the present disclosure, the moving member includes a cylinder body, a cylinder core and a moving seat. The cylinder body is fixed to the seat. The cylinder core is arranged in the cylinder body and can move relative to the cylinder body. The moving seat is arranged in the cylinder core and extends out of the cylinder body. The suction device is arranged on the moving seat, and the suction head is moved along the perforation by the driving of the moving seat.

依據本揭露之一實施例,移動座呈L型。移動座包含裝配部及導引臂。裝配部設置於缸心上。其中裝配部位於缸體與吸取裝置之間,且吸取裝置設置於裝配部上。導引臂設置於裝配部上。其中導引臂於面向缸體的側面上形成凸部。凸部接觸缸體。According to one embodiment of the present disclosure, the moving seat is L-shaped. The moving seat includes a mounting portion and a guide arm. The mounting portion is disposed on the cylinder core. The mounting portion is between the cylinder body and the suction device, and the suction device is disposed on the mounting portion. The guide arm is disposed on the mounting portion. The guide arm forms a convex portion on the side surface facing the cylinder body. The convex portion contacts the cylinder body.

依據本揭露之一實施例,座體包含安裝板部及安裝腳部。移動件設置於安裝板部。安裝腳部設置於安裝板部的端面。安裝腳部彼此間隔。其中移動件設置於安裝板部的外側面。吸取裝置位於安裝腳部之間。刀模跨設於安裝腳部。According to an embodiment of the present disclosure, the base includes a mounting plate and mounting feet. The moving member is disposed on the mounting plate. The mounting feet are disposed on the end surface of the mounting plate. The mounting feet are spaced apart from each other. The moving member is disposed on the outer side surface of the mounting plate. The suction device is located between the mounting feet. The knife mold is disposed across the mounting feet.

依據本揭露之一實施例,刀模的定位柱分別伸入安裝腳部。According to one embodiment of the present disclosure, the positioning posts of the cutting die extend into the mounting feet respectively.

根據本揭露之上述目的,提出一種物件裁切吸取系統。物件裁切吸取系統包含機器手臂與上述的物件裁切吸取機構。物件裁切吸取機構設置於機器手臂上。其中機器手臂帶動物件裁切吸取機構移動,利用刀模裁切出物件,同時吸取裝置真空吸附物件。接著機器手臂移動物件裁切吸取機構移動至待貼附件上。移動件帶動吸取裝置,使物件脫離刀模,讓物件貼附於待貼附件上,同時吸取裝置破真空,使物件脫離吸取裝置。According to the above-mentioned purpose of the present disclosure, an object cutting and sucking system is proposed. The object cutting and sucking system includes a robot arm and the above-mentioned object cutting and sucking mechanism. The object cutting and sucking mechanism is arranged on the robot arm. The robot arm drives the object cutting and sucking mechanism to move, and uses the cutting die to cut out the object, and at the same time the suction device vacuum absorbs the object. Then the robot arm moves the object cutting and sucking mechanism to the attachment to be attached. The moving part drives the suction device to make the object separate from the cutting die, so that the object is attached to the attachment to be attached, and at the same time the suction device breaks the vacuum to make the object separate from the suction device.

本揭露之物件裁切吸取系統的機器手臂可帶動物件裁切吸取機構,讓刀模執行裁切的動作。在刀模裁切出物件的同時,吸取裝置真空吸附物件。接著將物件貼附於待貼附件上。所以不需要預先裁切後備料放置,可有效防止物件堆疊沾黏的情形,進而可降低異常率並提高整體稼動率。此外,也不需要工作盤提供備料放置,進而可降低成本。The mechanical arm of the object cutting and suction system disclosed in the present invention can drive the object cutting and suction mechanism to allow the die cutter to perform the cutting action. While the die cuts the object, the suction device vacuum absorbs the object. Then the object is attached to the attachment to be attached. Therefore, there is no need to prepare and place the material before cutting, which can effectively prevent the objects from stacking and sticking, thereby reducing the abnormal rate and improving the overall utilization rate. In addition, there is no need to provide a work plate for material placement, thereby reducing costs.

請參閱圖1A、圖1B與圖1C,其係分別繪示依照本揭露之一實施方式的一種物件裁切吸取機構100的立體示意圖、側視示意圖與下視示意圖。本揭露之物件裁切吸取機構100包含座體110、刀模120、移動件130及吸取裝置140。如圖6A與圖6B,物件裁切吸取機構100用以在刀模120裁切出物件150的同時,吸取裝置140配合真空供應件(圖未示)來真空吸附物件150。其中,物件150可為散熱墊。Please refer to FIG. 1A, FIG. 1B and FIG. 1C, which are three-dimensional schematic diagrams, side schematic diagrams and bottom schematic diagrams of an object cutting and sucking mechanism 100 according to one embodiment of the present disclosure. The object cutting and sucking mechanism 100 disclosed in the present disclosure includes a base 110, a cutting die 120, a moving part 130 and a sucking device 140. As shown in FIG. 6A and FIG. 6B, the object cutting and sucking mechanism 100 is used to vacuum absorb the object 150 while the cutting die 120 cuts out the object 150. The sucking device 140 cooperates with a vacuum supply part (not shown) to vacuum absorb the object 150. Among them, the object 150 can be a heat sink.

如圖1A、圖1B與圖1C,座體110包含安裝板部111及數個安裝腳部112。安裝腳部112彼此間隔,並且安裝腳部112設置於安裝板部111的端面上。請參閱圖1A所示,座體110的側視外輪廓概呈L型。其中,安裝板部111包含彼此相對的前側面與後側面。安裝腳部112設置於安裝板部111的底端面,並且安裝腳部112朝後延伸,亦即安裝腳部112凸出安裝板部111的後側面。請一併參閱圖2,安裝腳部112的底面形成定位孔113。As shown in Figures 1A, 1B and 1C, the base 110 includes a mounting plate 111 and a plurality of mounting feet 112. The mounting feet 112 are spaced apart from each other, and the mounting feet 112 are disposed on the end surface of the mounting plate 111. Referring to Figure 1A, the side profile of the base 110 is generally L-shaped. Among them, the mounting plate 111 includes a front side surface and a rear side surface opposite to each other. The mounting feet 112 are disposed on the bottom end surface of the mounting plate 111, and the mounting feet 112 extend rearward, that is, the mounting feet 112 protrude from the rear side surface of the mounting plate 111. Please also refer to Figure 2, a positioning hole 113 is formed on the bottom surface of the mounting foot 112.

如圖1A、圖1B與圖1C所示,刀模120設置於座體110上,其中刀模120跨設於座體110的安裝腳部112。如圖1C所示,刀模120利用鎖固件160鎖組於座體110,其中鎖固件160可為螺絲。如圖1B、圖1C與圖2所示,刀模120包含基板121、刀頭122及定位柱123。As shown in FIG. 1A , FIG. 1B and FIG. 1C , the cutting die 120 is disposed on the base 110 , wherein the cutting die 120 is disposed across the mounting foot 112 of the base 110 . As shown in FIG. 1C , the cutting die 120 is locked to the base 110 by a locking member 160 , wherein the locking member 160 may be a screw. As shown in FIG. 1B , FIG. 1C and FIG. 2 , the cutting die 120 includes a base 121 , a cutting head 122 and a positioning column 123 .

如圖1B與圖2所示,基板121跨設於座體110的安裝腳部112,並位於安裝板部111的下方。基板121具有彼此相對的第一表面121f與第二表面121s。基板121的第一表面121f面向座體110的安裝腳部112。As shown in FIG. 1B and FIG. 2 , the substrate 121 is disposed across the mounting foot 112 of the base 110 and is located below the mounting plate 111 . The substrate 121 has a first surface 121f and a second surface 121s facing each other. The first surface 121f of the substrate 121 faces the mounting foot 112 of the base 110 .

如圖2所示,刀頭122設置於基板121下並凸出基板121的第二表面121s。刀頭122中凸出第二表面121s的一端形成穿孔122h與刀刃122b。穿孔122h貫穿刀頭122並延伸至基板121的第一表面121f,即穿孔122h貫穿刀頭122且進一步貫穿基板121。如圖1C所示,穿孔122h的仰視輪廓形狀可為四邊形、正方形,也可為圓形,形狀不以此為限。如圖1C所示,刀刃122b環繞穿孔122h。刀刃122b的仰視內輪廓形狀也可為四邊形、正方形,也可為圓形,形狀不以此為限。在一例子中,刀刃122b的仰視外輪廓形狀可匹配穿孔122h的仰視輪廓形狀,即穿孔122h的仰視輪廓形狀為四邊形時,刀刃122b的仰視外輪廓形狀也為四邊形。利用形狀的匹配,可輔助確保真空吸附的確實度與穩定性。As shown in FIG2 , the blade 122 is disposed under the substrate 121 and protrudes from the second surface 121s of the substrate 121. A through hole 122h and a blade 122b are formed at one end of the blade 122 protruding from the second surface 121s. The through hole 122h penetrates the blade 122 and extends to the first surface 121f of the substrate 121, that is, the through hole 122h penetrates the blade 122 and further penetrates the substrate 121. As shown in FIG1C , the outline shape of the through hole 122h when viewed from above may be a quadrilateral, a square, or a circle, and the shape is not limited thereto. As shown in FIG1C , the blade 122b surrounds the through hole 122h. The inner outline shape of the blade 122b when viewed from above may also be a quadrilateral, a square, or a circle, and the shape is not limited thereto. In one example, the outer contour shape of the blade 122b when viewed from below can match the outer contour shape of the through hole 122h when viewed from below, that is, when the outer contour shape of the through hole 122h when viewed from below is a quadrilateral, the outer contour shape of the blade 122b when viewed from below is also a quadrilateral. The shape matching can help ensure the accuracy and stability of vacuum adsorption.

如圖2所示,定位柱123設置於基板121中並凸出基板121的第一表面121f,且定位柱123伸入座體110的安裝腳部112的定位孔113。在拆卸或更換刀模120時,利用定位柱123與定位孔113的配合,使刀模120可快速定位,提高組裝便利性。As shown in FIG. 2 , the positioning post 123 is disposed in the substrate 121 and protrudes from the first surface 121f of the substrate 121, and the positioning post 123 extends into the positioning hole 113 of the mounting foot 112 of the base 110. When the cutting die 120 is disassembled or replaced, the cooperation between the positioning post 123 and the positioning hole 113 allows the cutting die 120 to be quickly positioned, thereby improving assembly convenience.

如圖1A所示,移動件130設置於座體110上,在一例子中,移動件130設置於安裝板部111的前側面上。在一例子中,移動件130可採用氣缸。如圖1A與圖1B所示,移動件130包含缸體131、缸心132及移動座133。缸體131固設於座體110。在一例子中,缸體131固設於安裝板部111的前側面上。如圖1A所示,缸心132設置於缸體131,且缸心132的一端伸出缸體131。其中,利用氣體進出缸體131的方向改變,讓缸心132相對缸體131移動,即如圖1A所示的方位觀之,缸心132可相對缸體131上下移動。As shown in FIG1A , the moving member 130 is disposed on the base 110. In one example, the moving member 130 is disposed on the front side surface of the mounting plate portion 111. In one example, the moving member 130 can be a cylinder. As shown in FIG1A and FIG1B , the moving member 130 includes a cylinder body 131, a cylinder core 132, and a moving base 133. The cylinder body 131 is fixedly disposed on the base 110. In one example, the cylinder body 131 is fixedly disposed on the front side surface of the mounting plate portion 111. As shown in FIG1A , the cylinder core 132 is disposed on the cylinder body 131, and one end of the cylinder core 132 extends out of the cylinder body 131. The cylinder core 132 is moved relative to the cylinder body 131 by utilizing the change in the direction of gas entering and exiting the cylinder body 131, that is, the cylinder core 132 can move up and down relative to the cylinder body 131 when viewed from the orientation shown in FIG1A .

如圖1A與圖1B所示,移動座133設置在缸心132的底端,即移動座133設置在缸心132中且伸出缸體131的一端。移動座133隨缸心132移動。換言之,移動座133與缸心132同動。因此缸心132相對缸體131移動時,移動座133也相對缸體131移動。在一例子中,移動座133可呈L型。移動座133包含裝配部1331與導引臂1332。裝配部1331設置在缸心132中且伸出缸體131的一端。如圖1A所示,裝配部1331設在缸心132的底端,且裝配部1331位在缸體131下方。導引臂1332設置在裝配部1331上。如圖1A,導引臂1332設置在裝配部1331的左側端緣,且導引臂1332往上延伸。導引臂1332的內側面形成凸部1332p,凸部1332p面向並接觸缸體131。凸部1332p可輔助提高移動座133上下移動的穩定性。As shown in Figures 1A and 1B, the moving seat 133 is disposed at the bottom end of the cylinder core 132, that is, the moving seat 133 is disposed in the cylinder core 132 and extends out of one end of the cylinder body 131. The moving seat 133 moves with the cylinder core 132. In other words, the moving seat 133 moves with the cylinder core 132. Therefore, when the cylinder core 132 moves relative to the cylinder body 131, the moving seat 133 also moves relative to the cylinder body 131. In one example, the moving seat 133 may be L-shaped. The moving seat 133 includes an assembly portion 1331 and a guide arm 1332. The assembly portion 1331 is disposed in the cylinder core 132 and extends out of one end of the cylinder body 131. As shown in Figure 1A, the assembly portion 1331 is disposed at the bottom end of the cylinder core 132, and the assembly portion 1331 is located below the cylinder body 131. The guide arm 1332 is disposed on the assembly portion 1331. As shown in FIG. 1A, the guide arm 1332 is disposed at the left edge of the assembly portion 1331, and the guide arm 1332 extends upward. The inner side surface of the guide arm 1332 forms a convex portion 1332p, and the convex portion 1332p faces and contacts the cylinder body 131. The convex portion 1332p can help improve the stability of the moving seat 133 moving up and down.

如圖1A與圖1C所示,吸取裝置140設置於移動件130上。即,吸取裝置140設置於移動座133的裝配部1331中相對缸心132的側面上,裝配部1331位於缸體131與吸取裝置140之間。吸取裝置140伸入刀模120,且吸取裝置140利用移動件130而相對刀模120移動。即,吸取裝置140與移動座133同動,而吸取裝置140中伸入刀模120的部分,且能沿著穿孔122h移動。吸取裝置140可連接真空供應件,配合真空供應件進行真空吸附的操作。真空供應件可例如為真空泵。吸取裝置140進一步可進行破真空的操作。如圖1A、圖2與圖3所示,吸取裝置140包含連接座141、連接頭142、吸取頭143及流道144。As shown in FIG. 1A and FIG. 1C , the suction device 140 is disposed on the moving member 130. That is, the suction device 140 is disposed on the side surface of the assembly portion 1331 of the moving seat 133 relative to the cylinder core 132, and the assembly portion 1331 is located between the cylinder body 131 and the suction device 140. The suction device 140 extends into the cutting die 120, and the suction device 140 moves relative to the cutting die 120 using the moving member 130. That is, the suction device 140 moves with the moving seat 133, and the portion of the suction device 140 that extends into the cutting die 120 can move along the through hole 122h. The suction device 140 can be connected to a vacuum supply component and cooperate with the vacuum supply component to perform a vacuum adsorption operation. The vacuum supply component can be, for example, a vacuum pump. The suction device 140 can further perform a vacuum breaking operation. As shown in FIG. 1A , FIG. 2 and FIG. 3 , the suction device 140 includes a connection seat 141 , a connection head 142 , a suction head 143 and a flow channel 144 .

連接座141設置於移動座133,且連接座141與移動座133同動。如圖1B所示,缸心132帶動移動座133上下移動時,連接座141也隨移動座133上下移動。換言之,移動件130可帶動吸取裝置140的連接座141。另外,連接座141位於安裝腳部112之間,且連接座141位在安裝板部111與刀模120之間。連接座141中側向伸出安裝板部111的部分與移動座133固設,以便於連接座141拆裝於移動座133的操作。The connecting seat 141 is disposed on the moving seat 133, and the connecting seat 141 moves together with the moving seat 133. As shown in FIG1B , when the cylinder core 132 drives the moving seat 133 to move up and down, the connecting seat 141 also moves up and down with the moving seat 133. In other words, the moving member 130 can drive the connecting seat 141 of the suction device 140. In addition, the connecting seat 141 is located between the mounting feet 112, and the connecting seat 141 is located between the mounting plate 111 and the cutting die 120. The portion of the connecting seat 141 that extends laterally from the mounting plate 111 is fixed to the moving seat 133 to facilitate the operation of disassembling the connecting seat 141 from the moving seat 133.

連接頭142設置於連接座141並連接真空供應件。如圖1A所示,連接頭142設置於連接座141中側向伸出安裝板部111的部分,即連接頭142設置於連接座141的前端面。The connector 142 is disposed on the connector base 141 and connected to the vacuum supply. As shown in FIG. 1A , the connector 142 is disposed on a portion of the connector base 141 that extends laterally out of the mounting plate 111 , that is, the connector 142 is disposed on the front end surface of the connector base 141 .

如圖1C、圖2與圖3所示,吸取頭143與穿孔122h滑動配合,即吸取頭143在穿孔122h中,沿刀模120的一軸向方向順利移動的配合程度。如圖1C與圖4所示,吸取頭143的末端面形成通孔143h,即吸取頭143中鄰近刀刃122b的末端面處形成通孔143h。在一例子中,通孔143h矩陣排列地布設於吸取頭143的末端面。在一例子中,部分通孔143h鄰近吸取頭143的外緣且彼此間隔排列,進一步圈圍出區域。其餘通孔143h位於此區域中,且鄰近吸取頭143的末端面的中央處。利用通孔143h的分布配置,使真空吸附力更為均勻分布。As shown in FIG. 1C , FIG. 2 and FIG. 3 , the suction head 143 is slidably matched with the perforation 122h, that is, the degree of match that the suction head 143 moves smoothly in the perforation 122h along an axial direction of the cutting die 120. As shown in FIG. 1C and FIG. 4 , a through hole 143h is formed on the end face of the suction head 143, that is, a through hole 143h is formed at the end face of the suction head 143 adjacent to the blade 122b. In one example, the through holes 143h are arranged in a matrix on the end face of the suction head 143. In one example, some of the through holes 143h are adjacent to the outer edge of the suction head 143 and are arranged at intervals from each other to further enclose an area. The remaining through holes 143h are located in this area and are adjacent to the center of the end face of the suction head 143. The distribution configuration of the through holes 143h makes the vacuum adsorption force more evenly distributed.

如圖4所示,吸取頭143進一步包含數個凸塊143p、數個溝槽143g與環牆143w。這些凸塊143p形成於吸取頭143的末端面且彼此間隔排列。其中,這些凸塊143p的大小可以相同或相異。溝槽143g形成於吸取頭143的末端面,其中這些溝槽143g環繞凸塊143p並連通通孔143h。環牆143w形成於吸取頭143的末端面並環繞溝槽143g。環牆143w與凸塊143p齊平,即環牆143w的末端面與凸塊143p的末端面齊平。利用溝槽143g與凸塊143p的配置,可以減少吸取頭143與物件150的接觸面積,進而減少物件150與吸取頭143之間的黏附強度。在一例子中,吸取頭143可為聚醚醚酮材料製成的構件。利用適當材料的選用,可降低物件150沾黏於吸取頭143的黏附強度。As shown in FIG4 , the suction head 143 further includes a plurality of bumps 143p, a plurality of grooves 143g and a ring wall 143w. The bumps 143p are formed on the end surface of the suction head 143 and are arranged at intervals from each other. The sizes of the bumps 143p may be the same or different. The grooves 143g are formed on the end surface of the suction head 143, wherein the grooves 143g surround the bumps 143p and are connected to the through holes 143h. The ring wall 143w is formed on the end surface of the suction head 143 and surrounds the grooves 143g. The ring wall 143w is flush with the bumps 143p, that is, the end surface of the ring wall 143w is flush with the end surface of the bump 143p. By configuring the groove 143g and the protrusion 143p, the contact area between the suction head 143 and the object 150 can be reduced, thereby reducing the adhesion strength between the object 150 and the suction head 143. In one example, the suction head 143 can be a component made of polyetheretherketone material. By selecting appropriate materials, the adhesion strength of the object 150 adhering to the suction head 143 can be reduced.

流道144形成於吸取裝置140中。其中流道144延伸連接頭142與連接座141,且流道144連通真空供應件與通孔143h。流道144的內徑可為等徑或不等徑。The flow channel 144 is formed in the suction device 140. The flow channel 144 extends the connection head 142 and the connection seat 141, and the flow channel 144 connects the vacuum supply part and the through hole 143h. The inner diameter of the flow channel 144 can be uniform or unequal.

依據欲裁切之物件150的尺寸,可拆換適當尺寸的刀模120,且配合刀模120的吸取裝置140也一同拆換。在拆換作業中,先將鎖固件160取下,將刀模120自安裝腳部112上取下。接著將吸取裝置140自移動件130上拆卸下來。再將欲安裝的吸取裝置140設置於移動座133的裝配部1331上。欲安裝的刀模120利用定位柱123伸入安裝腳部112的定位孔113,使刀模120先定位於安裝腳部112,再鎖入鎖固件160,以利用鎖固件160將刀模120固定於安裝腳部112。由於移動件130固設於安裝板部111的前側面上,可提供較大的操作空間,以便於拆換吸取裝置140。According to the size of the object 150 to be cut, the appropriate size of the cutting die 120 can be replaced, and the suction device 140 that matches the cutting die 120 can also be replaced together. During the removal operation, the locking piece 160 is first removed, and the cutting die 120 is removed from the mounting foot 112. Then the suction device 140 is removed from the moving part 130. Then the suction device 140 to be installed is set on the assembly part 1331 of the moving seat 133. The cutting die 120 to be installed uses the positioning column 123 to extend into the positioning hole 113 of the mounting foot 112, so that the cutting die 120 is first positioned on the mounting foot 112, and then the locking piece 160 is locked, so that the cutting die 120 is fixed to the mounting foot 112 by the locking piece 160. Since the moving member 130 is fixedly mounted on the front side of the mounting plate 111 , a larger operating space can be provided to facilitate the removal and replacement of the suction device 140 .

請參閱圖5,其係繪示依照本揭露之一實施方式的一種物件裁切吸取系統200的立體示意圖。物件裁切吸取系統200包括機器手臂210與上述的物件裁切吸取機構100。物件裁切吸取機構100的安裝板部111設置於機器手臂210上。可依據欲裁切之物件150的尺寸而選用適當的物件裁切吸取機構100。機器手臂210上設置的物件裁切吸取機構100的數量可為一個或複數個。Please refer to FIG. 5, which is a three-dimensional schematic diagram of an object cutting and sucking system 200 according to one embodiment of the present disclosure. The object cutting and sucking system 200 includes a robot arm 210 and the above-mentioned object cutting and sucking mechanism 100. The mounting plate portion 111 of the object cutting and sucking mechanism 100 is disposed on the robot arm 210. An appropriate object cutting and sucking mechanism 100 can be selected according to the size of the object 150 to be cut. The number of object cutting and sucking mechanisms 100 disposed on the robot arm 210 can be one or more.

上述中,機器手臂210帶動物件裁切吸取機構100移動,如圖6A所示,利用刀模120在片料220上裁切出物件150,同時吸取裝置140真空吸附物件150。接著機器手臂210移動物件裁切吸取機構100,如圖6B所示,物件裁切吸取機構100移動至待貼附件230上。如圖6C所示,接著移動件130帶動吸取裝置140,使物件150脫離刀模120。換言之,吸取裝置140保持真空吸附狀態下,移動件130帶動吸取頭143沿著刀模120的穿孔122h移動,使吸取頭143連同物件150移動凸出穿孔122h,讓物件150不會沾黏於刀模120。再將物件150貼附於待貼附件230上。如圖6C所示,在吸取頭143上的物件150貼附於待貼附件230時,同時吸取裝置140破真空,使物件150脫離吸取裝置140。In the above, the robot arm 210 drives the object cutting and sucking mechanism 100 to move, as shown in FIG6A, and uses the cutting die 120 to cut out the object 150 on the sheet 220, while the sucking device 140 vacuum absorbs the object 150. Then the robot arm 210 moves the object cutting and sucking mechanism 100, as shown in FIG6B, and the object cutting and sucking mechanism 100 moves to the attachment 230 to be attached. As shown in FIG6C, the moving member 130 then drives the sucking device 140 to separate the object 150 from the cutting die 120. In other words, the sucking device 140 maintains a vacuum absorption state, and the moving member 130 drives the sucking head 143 to move along the through hole 122h of the cutting die 120, so that the sucking head 143 and the object 150 move and protrude from the through hole 122h, so that the object 150 will not stick to the cutting die 120. Then the object 150 is attached to the attachment to be attached 230. As shown in FIG6C, when the object 150 on the suction head 143 is attached to the attachment to be attached 230, the suction device 140 breaks the vacuum at the same time, so that the object 150 is separated from the suction device 140.

由上述之實施方式可知,本揭露之一優點就是因為本揭露之物件裁切機構具有刀模與吸取裝置,在刀模裁切出物件時,吸取裝置同時真空吸附物件,接著將物件貼附於待貼附件時,吸取裝置可破真空,確保物件不會沾黏在吸取頭上。因此不需要預先裁切物件後備料放置,可有效防止物件堆疊沾黏的情形。所以,可降低異常率並提高整體稼動率。此外,也因為不需要欲先裁切物件後備料放置,所以不需要工作盤提供備料放置,故可降低成本。From the above implementation method, it can be known that one of the advantages of the present disclosure is that because the object cutting mechanism of the present disclosure has a cutting die and a suction device, when the cutting die cuts out the object, the suction device simultaneously vacuum absorbs the object, and then when the object is attached to the attachment to be attached, the suction device can break the vacuum to ensure that the object will not stick to the suction head. Therefore, there is no need to pre-cut the object and then prepare the material for placement, which can effectively prevent the objects from piling up and sticking. Therefore, the abnormal rate can be reduced and the overall utilization rate can be improved. In addition, because there is no need to pre-cut the object and then prepare the material for placement, there is no need for a work plate to provide preparation for placement, which can reduce costs.

雖然本揭露已以實施例揭示如上,然其並非用以限定本揭露,任何在此技術領域中具有通常知識者,在不脫離本揭露之精神和範圍內,當可作各種之更動與潤飾,因此本揭露之保護範圍當視後附之申請專利範圍所界定者為準。Although the present disclosure has been disclosed as above by way of embodiments, it is not intended to limit the present disclosure. Anyone with ordinary knowledge in this technical field may make various changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the definition of the attached patent application scope.

100:物件裁切吸取機構 110:座體 111:安裝板部 112:安裝腳部 113:定位孔 120:刀模 121:基板 121f:第一表面 121s:第二表面 122:刀頭 122h:穿孔 122b:刀刃 123:定位柱 130:移動件 131:缸體 132:缸心 133:移動座 140:吸取裝置 141:連接座 142:連接頭 143:吸取頭 143g:溝槽 143h:通孔 143p:凸塊 143w:環牆 144:流道 150:物件 160:鎖固件 200:物件裁切吸取系統 210:機器手臂 220:片料 230:待貼附件 1331:裝配部 1332:導引臂 1332p:凸部 100: object cutting and suction mechanism 110: seat 111: mounting plate 112: mounting foot 113: positioning hole 120: knife die 121: substrate 121f: first surface 121s: second surface 122: knife head 122h: perforation 122b: blade 123: positioning column 130: moving part 131: cylinder body 132: cylinder core 133: moving seat 140: suction device 141: connecting seat 142: connecting head 143: suction head 143g: groove 143h: through hole 143p: bump 143w: ring wall 144: flow channel 150: object 160: Locking device 200: Object cutting and suction system 210: Machine arm 220: Sheet material 230: Accessories to be attached 1331: Assembly part 1332: Guide arm 1332p: Protrusion

為讓本揭露之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之說明如下。 [圖1A]、[圖1B]與[圖1C]係分別繪示依照本揭露之一實施方式的一種物件裁切吸取機構的立體示意圖、側視示意圖與下視示意圖。 [圖2]係繪示依照本揭露之一實施方式的座體、刀模與吸取裝置組合的局部放大剖面示意圖。 [圖3]係繪示依照本揭露之一實施方式的刀模與吸取裝置組合的局部放大剖面示意圖。 [圖4]係繪示依照本揭露之一實施方式的吸取頭的立體示意圖。 [圖5]係繪示依照本揭露之一實施方式的一種物件裁切吸取系統的立體示意圖。 [圖6A]、[圖6B]與[圖6C]係繪示依照本揭露之一實施方式的物件裁切吸取機構的操作示意圖。 In order to make the above and other purposes, features, advantages and embodiments of the present disclosure more clearly understandable, the attached drawings are described as follows. [Figure 1A], [Figure 1B] and [Figure 1C] are respectively a three-dimensional schematic diagram, a side view schematic diagram and a bottom view schematic diagram of an object cutting and sucking mechanism according to one embodiment of the present disclosure. [Figure 2] is a partial enlarged cross-sectional schematic diagram of a base, a knife die and a suction device combination according to one embodiment of the present disclosure. [Figure 3] is a partial enlarged cross-sectional schematic diagram of a knife die and a suction device combination according to one embodiment of the present disclosure. [Figure 4] is a three-dimensional schematic diagram of a suction head according to one embodiment of the present disclosure. [Figure 5] is a three-dimensional schematic diagram of an object cutting and sucking system according to one embodiment of the present disclosure. [Figure 6A], [Figure 6B] and [Figure 6C] are schematic diagrams showing the operation of the object cutting and sucking mechanism according to one embodiment of the present disclosure.

國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無 Domestic storage information (please note in the order of storage institution, date, and number) None Foreign storage information (please note in the order of storage country, institution, date, and number) None

100:物件裁切吸取機構 100: Object cutting and suction mechanism

110:座體 110: Seat

111:安裝板部 111: Mounting plate

112:安裝腳部 112: Install the feet

120:刀模 120: Knife mold

121:基板 121: Substrate

121f:第一表面 121f: First surface

121s:第二表面 121s: Second surface

122:刀頭 122: Blade head

122b:刀刃 122b: Blade

130:移動件 130: Moving parts

131:缸體 131: Cylinder body

132:缸心 132: Cylinder core

133:移動座 133: Mobile seat

140:吸取裝置 140: Suction device

142:連接頭 142: Connector

143:吸取頭 143: Suction head

144:流道 144: Runner

1331:裝配部 1331: Assembly Department

1332:導引臂 1332:Guide arm

Claims (10)

一種物件裁切吸取機構,包括: 一座體; 一刀模,設置於該座體上; 一移動件,設置於該座體上;以及 一吸取裝置,設置於該移動件上並伸入該刀模,該吸取裝置利用該移動件而相對該刀模移動; 其中,該吸取裝置連接一真空供應件,在該刀模裁切出一物件的同時,該吸取裝置真空吸附該物件。 An object cutting and sucking mechanism comprises: a base; a cutting die, arranged on the base; a moving part, arranged on the base; and a sucking device, arranged on the moving part and extending into the cutting die, the sucking device moves relative to the cutting die by means of the moving part; wherein the sucking device is connected to a vacuum supply part, and when the cutting die cuts an object, the sucking device vacuum absorbs the object. 如請求項1所述之物件裁切吸取機構,其中該刀模包含: 一基板,設置於該座體上,該基板具有相對的一第一表面及一第二表面,其中該第一表面面向該座體; 一刀頭,設置於該基板的該第二表面上,其中該刀頭的一端形成一穿孔及一刀刃,該穿孔貫穿該刀頭並延伸至該基板的該第一表面,該刀刃環繞該穿孔;以及 複數個定位柱,設置於該基板並伸入該座體。 The object cutting and suction mechanism as described in claim 1, wherein the cutting die comprises: A substrate, disposed on the base, the substrate having a first surface and a second surface opposite to each other, wherein the first surface faces the base; A cutting head, disposed on the second surface of the substrate, wherein one end of the cutting head forms a through hole and a cutting edge, the through hole passes through the cutting head and extends to the first surface of the substrate, and the cutting edge surrounds the through hole; and A plurality of positioning posts, disposed on the substrate and extending into the base. 如請求項2所述之物件裁切吸取機構,其中該吸取裝置包含: 一吸取頭,與該穿孔滑動配合,其中該吸取頭的一末端面形成複數個通孔;以及 一流道,形成於該吸取裝置中,其中該流道連通該真空供應件與該些通孔。 The object cutting and suction mechanism as described in claim 2, wherein the suction device comprises: a suction head, which is slidably matched with the perforation, wherein a plurality of through holes are formed on a terminal surface of the suction head; and a flow channel, which is formed in the suction device, wherein the flow channel connects the vacuum supply part and the through holes. 如請求項3所述之物件裁切吸取機構,其中該吸取頭包含: 複數個凸塊,形成於該吸取頭的該末端面且彼此間隔排列; 一溝槽,形成於該吸取頭的該末端面,其中該溝槽環繞該些凸塊並連通該些通孔;以及 一環牆,形成於該吸取頭的該末端面並環繞該溝槽,且該環牆與該些凸塊齊平。 The object cutting suction mechanism as described in claim 3, wherein the suction head comprises: a plurality of bumps formed on the end surface of the suction head and arranged at intervals from each other; a groove formed on the end surface of the suction head, wherein the groove surrounds the bumps and connects the through holes; and a ring wall formed on the end surface of the suction head and surrounds the groove, and the ring wall is flush with the bumps. 如請求項1所述之物件裁切吸取機構,其中該移動件係一氣缸,該物件係一散熱墊。An object cutting and suction mechanism as described in claim 1, wherein the moving part is a cylinder and the object is a heat sink. 如請求項2所述之物件裁切吸取機構,其中該移動件包含: 一缸體,固設於該座體; 一缸心,設置於該缸體並能相對該缸體移動;以及 一移動座,設置於該缸心中伸出該缸體的一端,其中該吸取裝置設置於該移動座,利用該移動座的帶動,讓該吸取頭沿著該穿孔移動。 The object cutting and sucking mechanism as described in claim 2, wherein the moving part comprises: a cylinder body fixed to the base body; a cylinder core disposed in the cylinder body and capable of moving relative to the cylinder body; and a moving base disposed in the cylinder core and extending out of the cylinder body at one end, wherein the sucking device is disposed on the moving base, and the sucking head is moved along the perforation by the driving of the moving base. 如請求項6所述之物件裁切吸取機構,其中該移動座呈L型,該移動座包含: 一裝配部,設置於該缸心上,其中該裝配部位於該缸體與該吸取裝置之間,且該吸取裝置設置於該裝配部上;以及 一導引臂,設置於該裝配部上,其中該導引臂於面向該缸體的一側面上形成一凸部,該凸部接觸該缸體。 The object cutting and suction mechanism as described in claim 6, wherein the moving seat is L-shaped, and the moving seat comprises: a mounting portion, arranged on the cylinder core, wherein the mounting portion is between the cylinder body and the suction device, and the suction device is arranged on the mounting portion; and a guide arm, arranged on the mounting portion, wherein the guide arm forms a convex portion on a side surface facing the cylinder body, and the convex portion contacts the cylinder body. 如請求項1所述之物件裁切吸取機構,其中該座體包含: 一安裝板部,其中該移動件設置於該安裝板部;以及 二安裝腳部,設置於該安裝板部的一端面,該些安裝腳部彼此間隔,其中該移動件設置於該安裝板部的一外側面,該吸取裝置位於該些安裝腳部之間,該刀模跨設於該些安裝腳部。 The object cutting and suction mechanism as described in claim 1, wherein the base comprises: a mounting plate, wherein the moving member is disposed on the mounting plate; and two mounting feet, disposed on an end surface of the mounting plate, the mounting feet being spaced apart from each other, wherein the moving member is disposed on an outer side surface of the mounting plate, the suction device is located between the mounting feet, and the cutting die is disposed across the mounting feet. 如請求項8所述之物件裁切吸取機構,其中該刀模包含複數個定位柱,該些定位柱分別伸入該些安裝腳部。An object cutting and suction mechanism as described in claim 8, wherein the cutting die includes a plurality of positioning pins, and the positioning pins extend into the mounting feet respectively. 一種物件裁切吸取系統,包括: 一機器手臂;以及 至少一如請求項1所述之物件裁切吸取機構,設置於該機器手臂上; 其中該機器手臂帶動該至少一物件裁切吸取機構移動,利用該刀模裁切出該物件,同時該吸取裝置真空吸附該物件,接著該機器手臂移動該至少一物件裁切吸取機構移動至一待貼附件上,該移動件帶動該吸取裝置,使該物件脫離該刀模,讓該物件貼附於該待貼附件上,同時該吸取裝置破真空,使該物件脫離該吸取裝置。 An object cutting and sucking system, comprising: a machine arm; and at least one object cutting and sucking mechanism as described in claim 1, arranged on the machine arm; wherein the machine arm drives the at least one object cutting and sucking mechanism to move, uses the cutting die to cut out the object, and at the same time the sucking device vacuum absorbs the object, then the machine arm moves the at least one object cutting and sucking mechanism to an attachment to be attached, the moving part drives the sucking device to separate the object from the cutting die, and allows the object to be attached to the attachment to be attached, and at the same time the sucking device breaks the vacuum to separate the object from the sucking device.
TW111137987A 2022-10-06 2022-10-06 Object cutting-sucking mechanism and object cutting-sucking system TWI813463B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW111137987A TWI813463B (en) 2022-10-06 2022-10-06 Object cutting-sucking mechanism and object cutting-sucking system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW111137987A TWI813463B (en) 2022-10-06 2022-10-06 Object cutting-sucking mechanism and object cutting-sucking system

Publications (2)

Publication Number Publication Date
TWI813463B TWI813463B (en) 2023-08-21
TW202415515A true TW202415515A (en) 2024-04-16

Family

ID=88586071

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111137987A TWI813463B (en) 2022-10-06 2022-10-06 Object cutting-sucking mechanism and object cutting-sucking system

Country Status (1)

Country Link
TW (1) TWI813463B (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030159558A1 (en) * 2001-03-02 2003-08-28 Hiroshi Takayama Cut and removal apparatus and method
CN213197885U (en) * 2020-05-21 2021-05-14 广东鸿钢智能装备有限公司 Full-automatic cutting equipment for paper-plastic lunch box
CN214324165U (en) * 2020-11-09 2021-10-01 苏州领裕电子科技有限公司 Positioning and shaping mechanism
CN214490623U (en) * 2020-12-18 2021-10-26 盐城市旭远机械制造有限公司 Manipulator for multifunctional cutting machine
CN217433796U (en) * 2021-12-28 2022-09-16 领益智造科技(东莞)有限公司 CNC board is with transplanting mechanism and having its CNC equipment

Similar Documents

Publication Publication Date Title
EP0306255B1 (en) Boring apparatus for a laminated plate and boring cutter
KR100901934B1 (en) Method of cutting a protective tape and protective tape applying apparatus using the same method
KR20120112010A (en) Substrate transfer method and substrate transfer apparatus
JPWO2008004270A1 (en) Pickup method and pickup device
JP4639520B2 (en) Manufacturing method of nitride semiconductor chip
TW202415515A (en) Object cutting-sucking mechanism and object cutting-sucking system
JP4850916B2 (en) Pickup method and pickup device
US20040208718A1 (en) Machine for processing electrodes formed on a plate-like workpiece
TWI813463B (en) Object cutting-sucking mechanism and object cutting-sucking system
JP2019107779A (en) Pickup unit
JP7395874B2 (en) Gate breaking method and gate breaking device
CN117963613A (en) Object cutting and sucking mechanism and object cutting and sucking system
KR20100039690A (en) Method of wafer sawing
KR200151979Y1 (en) Chip ejecting apparatus of chip bonder
JP5175692B2 (en) Support apparatus, support method, dicing apparatus, and dicing method
JP2564084B2 (en) Method of collecting semiconductor wafers
JP2003236795A (en) Punching device and punching method
CN215988667U (en) Film sticking table of wafer film sticking machine
CN213459780U (en) Metal plate and light emitting diode packaging support manufactured by using same
JP5214739B2 (en) Chip peeling method, semiconductor device manufacturing method, and chip peeling apparatus
CN219371005U (en) Workpiece carrying table
CN220547682U (en) Integral diamond forming cutter for oil circuit board
CN210308206U (en) Long-life film blank laminating device
US20220336283A1 (en) Wafer adaptors, including systems and methods, for adapting different sized wafers
CN218585958U (en) Wafer processing platform