CN215988667U

CN215988667U - Film sticking table of wafer film sticking machine

Info

Publication number: CN215988667U
Application number: CN202121951167.8U
Authority: CN
Inventors: 锁珍
Original assignee: Suzhou Bazhu Laser Technology Co ltd
Current assignee: Suzhou Bazhu Laser Technology Co ltd
Priority date: 2021-08-19
Filing date: 2021-08-19
Publication date: 2022-03-08
Anticipated expiration: 2031-08-19

Abstract

The utility model discloses a film sticking table of a wafer film sticking machine, wherein a limiting belt is arranged on the table body and positioned at the outer side of a film sticking ring positioning area, a bottom ring is arranged on the table body, the side wall of the bottom ring is abutted against the limiting belt and then positioned on the table body, the bottom ring covers at least part of the upper space of a finger groove, a concave table is arranged on one side of the bottom ring, which is far away from the outer wall of the bottom ring, a top ring is arranged on the concave table, the top ring and a wafer placed in a wafer placing area are jointly stuck with a blue film, and a gap is formed between the top ring and the bottom ring and used for guiding a blade to cut the blue film. According to the utility model, the bottom ring is arranged and positioned, the bottom ring traverses the upper space of the finger groove, the top ring is placed in the concave table, the blue film is cut along the gap by the blade after the film pasting is finished, and then the top ring and the wafer which is jointly pasted with the blue film are taken down, so that the wafer pasting required by a customer can be finished.

Description

Film sticking table of wafer film sticking machine

Technical Field

The utility model relates to the technical field of evaporation kettle devices, in particular to a film sticking table of a wafer film sticking machine.

Background

The wafer is a silicon chip used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because it has a circular shape. The requirement on the smoothness of the surface of the wafer is high, and the wafer needs to be scribed in the processing process, but the silicon wafer is easy to pop up during mechanical processing, so that the damage is caused, and the performance is influenced. Therefore, the surface of the wafer needs to be covered with a protective blue film during the circulation process, so as to place the chip for ejection when the processes such as slicing are performed.

The existing film sticking and laminating mode can be carried out manually by a wafer film sticking machine, a wafer and a film sticking ring are placed at the designated position of a film sticking table, and the actions of film sticking, cutting and the like are finished after a machine is started.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a film sticking table of a wafer film sticking machine, which is characterized in that a bottom ring is arranged and positioned, the bottom ring traverses the upper space of a finger groove, a top ring is placed in a concave table, a blade is used for cutting a blue film along a gap after film sticking is finished, and then the top ring and a wafer which is stuck with the blue film together are taken down, so that the wafer film sticking required by a customer can be finished.

In order to achieve the purpose, the utility model adopts the technical scheme that: the utility model provides a pad pasting platform of wafer sticking film machine, includes the stage body, the up end middle part of stage body forms the wafer and places the district, and the side that the district was placed to the wafer that lies in on this stage body is equipped with pad pasting ring locating area, and is equipped with at least one finger groove with pad pasting ring locating area intercommunication on the stage body, the outside that lies in pad pasting ring locating area on the stage body is equipped with the spacing area, has placed the bottom ring on this stage body, the lateral wall of bottom ring with be located on the stage body behind the spacing area butt, and this bottom ring covers the top space in at least part finger groove, one side of keeping away from its outer wall on the bottom ring is equipped with the concave station, placed the apical ring on the concave station, the apical ring laminates the blue membrane with the wafer of placing the district jointly with placing, forms the clearance between this apical ring and the bottom ring and is used for the direction blade to cut blue membrane.

As a further optimization, the end of the finger groove far away from one end of the positioning area of the film sticking ring is not covered by the bottom ring.

As a further optimization, the number of the finger grooves is two.

As a further optimization, the limiting belts comprise four limiting belts, the four limiting belts are respectively positioned on the outer sides of the film sticking ring positioning areas, and one limiting belt is positioned between the pair of finger grooves.

As a further optimization, the limiting belt is formed by forming a concave shape on the upper end face of the bottom ring pressing table body.

As a further optimization, the limiting belt is formed by bonding a hard thin block on the upper end face of the table body.

As a further optimization, the upper end faces of the top ring and the bottom ring are flush after the top ring and the bottom ring are embedded.

As a further optimization, the bottom ring and the top ring are both made of metal materials.

Compared with the prior art, the utility model has the following beneficial effects:

1. through setting up the end ring and fixing a position it, the end ring traverses the upper portion space in finger groove, puts into the concave station with the apical ring, cuts blue membrane along the clearance with the blade after the pad pasting is accomplished, then takes off apical ring and the wafer of laminating blue membrane jointly with it, can accomplish the wafer pad pasting of customer customization demand, can avoid because the existence of finger groove leads to the situation that can't process.

2. The bottom ring is made of metal materials, and the bottom ring can be prevented from being scratched when the blade stretches into the gap to cut the blue film.

Drawings

FIG. 1 is a block diagram of the present invention.

Fig. 2 is an enlarged view of a point a in fig. 1.

FIG. 3 is a schematic view of the top ring and the bottom ring of the present invention.

Fig. 4 is a schematic structural diagram of a conventional film laminating station.

Detailed Description

The following are specific embodiments of the present invention and are further described with reference to the drawings, but the present invention is not limited to these embodiments.

As shown in fig. 1 to 4, a film pasting table of a wafer film pasting machine comprises a table body 10, a wafer placing area 101 is formed in the middle of the upper end surface of the table body 10, a film pasting ring positioning area 102 is arranged on the table body 10 at the side of the wafer placing area 101, and two finger grooves 11 communicated with the film pasting ring positioning area 102 are arranged on the table body 10, as shown in fig. 4; in the utility model, four limiting belts are arranged on the table body 10 and positioned at the outer side of the film sticking ring positioning area 102, the four limiting belts are respectively positioned at the outer side of the film sticking ring positioning area, and specifically comprise a pair of symmetrically arranged long limiting belts 122 and a pair of symmetrically arranged short limiting belts 121, and one short limiting belt 121 is positioned between a pair of finger grooves 11; placed end ring 13 on the stage body 10, the lateral wall of end ring 13 is fixed a position on stage body 10 after long spacing area 122 and short spacing area 121 butt respectively, and this end ring 13 covers the top space of at least part finger groove 11, one side of keeping away from its outer wall on the end ring 13 is equipped with concave station 131, placed apical ring 14 on the concave station 131, apical ring 14 and the joint blue membrane of placing the wafer in wafer placement area 101 jointly, it is used for the direction blade to cut blue membrane to form clearance 130 between this apical ring 14 and the end ring 13.

The utility model is applied to a conventional manual wafer film sticking machine, and for a customer with special requirements, namely the customer needs to stick a blue film according to a given film sticking ring (namely a top ring 14), which exceeds the size of the conventional film sticking ring, a bottom ring is arranged, the bottom ring is positioned through a limiting belt, and the top ring is placed in a concave table, so that the wafer can be ensured to be positioned at the relative position in the top ring, then the blue film is stuck through the film sticking machine, after the film sticking action is finished, the film sticking machine is opened, the blue film is cut by a blade along a gap, redundant blue film is removed from the bottom ring, then the top ring and the wafer together stuck with the blue film are taken down, the wafer film sticking required by the customer can be finished, and the situation that the processing cannot be carried out due to the existence of a finger groove can be avoided. In the utility model, the bottom ring 13 and the top ring 14 are both made of metal, and the bottom ring is made of metal, so that the bottom ring is prevented from being scratched when a blade extends into a gap to cut a blue film.

The end part of the finger groove 11, which is far away from one end of the film sticking ring positioning area 102, is not covered by the bottom ring 13, and the top ring stuck with the blue film can be ejected out after a finger extends into a notch at the end of the finger groove, so that a film sticking table can be taken out conveniently by a wafer stuck with the film.

In an embodiment of the utility model, the limiting belt is formed by pressing the bottom ring 13 down on the upper end surface of the table body 10 to form a concave shape, and when the upper end surface of the film pasting table is made of a non-hard material, the natural limiting belt can be formed on the upper end surface of the table body by repeatedly pressing down the bottom ring.

In an embodiment of the present invention, the position-limiting band is formed by adhering a hard thin block to the upper end surface of the table body 10.

After the top ring 14 is embedded into the bottom ring 13, the upper end surfaces of the top ring and the bottom ring are flush with each other, so that the accuracy of blue film lamination is ensured.

The specific embodiments described herein are merely illustrative of the spirit of the utility model. Various modifications or additions may be made to the described embodiments or alternatives may be employed by those skilled in the art without departing from the spirit or ambit of the utility model as defined in the appended claims.

Claims

1. The utility model provides a pad pasting platform of wafer sticking film machine, includes the stage body, the up end middle part of stage body forms the wafer and places the district, and the side that the district was placed to the wafer that lies in on this stage body is equipped with pad pasting ring locating area, and is equipped with at least one finger groove with pad pasting ring locating area intercommunication on the stage body, its characterized in that, the outside that lies in pad pasting ring locating area on the stage body is equipped with the spacing area, has placed the bottom ring on this stage body, the lateral wall of bottom ring with be located on the stage body behind the spacing area butt, and this bottom ring covers the top space in at least part finger groove, one side of keeping away from its outer wall on the bottom ring is equipped with the concave station, the apical ring has been placed on the concave station, the apical ring laminates blue membrane with the wafer of placing in the district jointly with placing, forms the clearance between this apical ring and the bottom ring and is used for the direction blade to cut blue membrane.

2. The film sticking table of the wafer film sticking machine according to claim 1, wherein an end of the finger groove far from one end of the film sticking ring positioning area is not covered by the bottom ring.

3. The film sticking table of the wafer film sticking machine according to claim 1 or 2, wherein the number of the finger grooves is two.

4. The film sticking table of the wafer film sticking machine according to claim 3, wherein the number of the limiting belts is four, the four limiting belts are respectively located at the outer side of the film sticking ring locating area, and one limiting belt is located between a pair of the finger grooves.

5. The film sticking table of the wafer film sticking machine according to claim 1, wherein the limiting belt is formed by forming a concave shape on the upper end surface of the pressing table body of the bottom ring.

6. The film sticking table of the wafer film sticking machine according to claim 1, wherein the limiting belt is formed by adhering a hard thin block on the upper end surface of the table body.

7. The film sticking table of the wafer film sticking machine as claimed in claim 1, wherein the top ring and the bottom ring are flush in upper end surface after being embedded in the bottom ring.

8. The film sticking table of the wafer film sticking machine according to claim 1, wherein the bottom ring and the top ring are made of metal.