TW202409313A - 蒸鍍罩、附框架之蒸鍍罩、蒸鍍罩之製造方法、有機裝置之製造方法及附框架之蒸鍍罩之製造方法 - Google Patents

蒸鍍罩、附框架之蒸鍍罩、蒸鍍罩之製造方法、有機裝置之製造方法及附框架之蒸鍍罩之製造方法 Download PDF

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Publication number
TW202409313A
TW202409313A TW112103327A TW112103327A TW202409313A TW 202409313 A TW202409313 A TW 202409313A TW 112103327 A TW112103327 A TW 112103327A TW 112103327 A TW112103327 A TW 112103327A TW 202409313 A TW202409313 A TW 202409313A
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Taiwan
Prior art keywords
cover
layer
substrate
mentioned
evaporation
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TW112103327A
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English (en)
Chinese (zh)
Inventor
池永知加雄
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日商大日本印刷股份有限公司
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Publication of TW202409313A publication Critical patent/TW202409313A/zh

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
TW112103327A 2022-01-31 2023-01-31 蒸鍍罩、附框架之蒸鍍罩、蒸鍍罩之製造方法、有機裝置之製造方法及附框架之蒸鍍罩之製造方法 TW202409313A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-013734 2022-01-31
JP2022013734 2022-01-31

Publications (1)

Publication Number Publication Date
TW202409313A true TW202409313A (zh) 2024-03-01

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TW112103327A TW202409313A (zh) 2022-01-31 2023-01-31 蒸鍍罩、附框架之蒸鍍罩、蒸鍍罩之製造方法、有機裝置之製造方法及附框架之蒸鍍罩之製造方法

Country Status (7)

Country Link
US (1) US20250122606A1 (https=)
EP (1) EP4474523A1 (https=)
JP (3) JP7589838B2 (https=)
KR (1) KR20240140156A (https=)
CN (1) CN118613602A (https=)
TW (1) TW202409313A (https=)
WO (1) WO2023145951A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN121263548A (zh) * 2023-08-10 2026-01-02 凸版控股株式会社 蒸镀掩模以及电子器件的制造方法
KR20250078513A (ko) * 2023-08-10 2025-06-02 도판 홀딩스 가부시키가이샤 증착 마스크, 및 전자 디바이스의 제조 방법
KR20250111176A (ko) * 2023-08-10 2025-07-22 도판 홀딩스 가부시키가이샤 증착 마스크, 및 전자 디바이스의 제조 방법
JP2025034168A (ja) * 2023-08-30 2025-03-13 大日本印刷株式会社 マスク及びマスクの製造方法
KR102776647B1 (ko) * 2023-10-27 2025-03-06 주식회사 에이디에스 유기 발광소자 제조를 위한 파인 메탈 마스크 및 그 제조방법
WO2025110105A1 (ja) * 2023-11-22 2025-05-30 大日本印刷株式会社 マスク及びマスクの製造方法
JP2025137443A (ja) * 2024-03-07 2025-09-19 大日本印刷株式会社 マスク装置、マスク積層体、フレーム積層体、マスクの交換方法、及び、有機デバイスの製造方法
JP7773717B1 (ja) * 2024-05-24 2025-11-20 大日本印刷株式会社 マスク及び有機デバイスの製造方法
JP2025177938A (ja) * 2024-05-24 2025-12-05 大日本印刷株式会社 マスク及び有機デバイスの製造方法
JP7730479B1 (ja) * 2024-05-24 2025-08-28 大日本印刷株式会社 マスク、蒸着方法及びデバイスの製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5612503Y2 (https=) 1976-12-08 1981-03-23
JP3554009B2 (ja) * 1994-02-22 2004-08-11 大日本印刷株式会社 微細パターン形成用マスク板およびその製造方法
JP2010116579A (ja) 2008-11-11 2010-05-27 Seiko Epson Corp 蒸着マスク、蒸着マスクの製造方法ならびに有機エレクトロルミネッセンス装置
JP5288074B2 (ja) 2012-01-12 2013-09-11 大日本印刷株式会社 多面付け蒸着マスクの製造方法及びこれにより得られる多面付け蒸着マスク並びに有機半導体素子の製造方法
JP5382259B1 (ja) 2013-01-10 2014-01-08 大日本印刷株式会社 金属板、金属板の製造方法、および金属板を用いて蒸着マスクを製造する方法
KR102616578B1 (ko) 2016-06-24 2023-12-22 삼성디스플레이 주식회사 박막 증착용 마스크 어셈블리와, 이의 제조 방법
KR101812772B1 (ko) 2016-10-12 2017-12-27 이현애 유기 발광 소자용 마스크, 그 제조 방법 및 이를 포함하는 증착장치
CN108624841B (zh) 2018-05-03 2020-10-13 中芯集成电路（宁波）有限公司 掩膜版及其制作方法
JP2020100873A (ja) 2018-12-21 2020-07-02 日鉄ケミカル＆マテリアル株式会社 蒸着マスク、それに用いる金属張積層体及び液晶ポリマーフィルム
JP2021165424A (ja) 2020-04-08 2021-10-14 株式会社ブイ・テクノロジー 蒸着マスク用フレーム、フレーム付き蒸着マスク、及び蒸着方法
JP7549794B2 (ja) 2020-05-18 2024-09-12 大日本印刷株式会社 蒸着マスク、蒸着マスクの製造方法、蒸着方法、有機半導体素子の製造方法及び有機ｅｌ表示装置の製造方法

Also Published As

Publication number Publication date
WO2023145951A1 (ja) 2023-08-03
CN118613602A (zh) 2024-09-06
KR20240140156A (ko) 2024-09-24
CN120555945A (zh) 2025-08-29
JP7589838B2 (ja) 2024-11-26
JP7656271B2 (ja) 2025-04-03
JPWO2023145951A1 (https=) 2023-08-03
JP2025094162A (ja) 2025-06-24
EP4474523A1 (en) 2024-12-11
JP2024164239A (ja) 2024-11-26
US20250122606A1 (en) 2025-04-17

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