TW202406443A - Printed circuit and method thereof - Google Patents

Abstract

A printed circuit includes a first electronic component, a solidified liquid metal composite layer, a circuit structure and a second electronic component. The solidified liquid metal composite layer wraps the first electronic component and covers an upper surface and lateral surfaces of the first electronic component. The circuit structure surrounds the first electronic component and the solidified liquid metal composite layer. The second electronic component is disposed on the upper surface of the first electronic component and electrically connected to the first electronic component via the solidified liquid metal composite layer. A method of manufacturing a printed circuit is further provided.

Description

Circuit board and method of making the same

This application relates to circuit boards and methods of making them.

High density and high reliability are the development trends of circuit boards. Therefore, embedded electronic component technology is increasingly favored by the industry. It can not only reduce the size, but also shorten the line length, reduce parasitic inductance, and improve the density and electrical power of the circuit board. Sexual connection efficacy.

However, with the increasingly dense component configuration, how to improve the heat dissipation efficiency of electronic components, improve the quality of electrical connections and structural reliability are problems that need to be solved.

According to some embodiments of the present application, a circuit board includes a first electronic component, a solidified liquid metal composite layer, a circuit structure, and a second electronic component. The first electronic component has an upper surface, a lower surface opposite to the upper surface, and a plurality of side surfaces connecting the upper surface and the lower surface. The solidified liquid metal composite layer covers the first electronic component and covers the upper surface and side surfaces of the first electronic component. The circuit structure surrounds the first electronic component and the solidified liquid metal composite layer. The second electronic component is disposed on the upper surface of the first electronic component and is electrically connected to the first electronic component through the solidified liquid metal composite layer.

In some embodiments, the material of the solidified liquid metal composite layer includes liquid metal and high molecular polymer.

In some embodiments, the solidified liquid metal composite layer includes a first portion, a second portion, and a third portion. The first portion completely covers the side surface of the first electronic component and extends to cover the upper surface of the portion. The second part is disposed on the upper surface of the first electronic component and electrically connects the first electronic component and the second electronic component. The third part is disposed under the lower surface of the first electronic component, wherein the first part, the second part and the third part are spaced apart from each other.

In some embodiments, the circuit board further includes a conductive bonding structure and a third electronic component. The conductive bonding structure is disposed under the first electronic component. The third electronic component is disposed under the first electronic component and is electrically connected to the first electronic component through the conductive bonding structure.

In some embodiments, the conductive bonding structure includes a first conductive member and a second conductive member having a plurality of grooves. A first conductive member having a plurality of grooves, including a third portion of the solidified liquid metal composite layer, a plurality of conductive pads disposed under the third portion and spaced apart from each other via the grooves; and a plurality of conductive pads disposed under and extending from the conductive pads. A conductive layer covering the grooves. The second conductive member includes vertically extending conductive posts and transversely extending pads, wherein the pads contact the conductive posts with a first surface, and contact the third electronic component with a second surface opposite to the first surface, wherein the conductive posts are inserted into disposed in the groove of the first conductive member.

According to some embodiments of the present application, a method of manufacturing a circuit board includes providing a substrate, wherein the substrate includes a base material and a first conductive layer disposed on the base material; arranging a circuit structure surrounding the substrate; arranging a first electronic component on the first conductive layer; on a conductive layer, wherein the first electronic component has an upper surface and a lower surface relative to the upper surface; filling the liquid metal composite on the first conductive layer until the top surface of the liquid metal composite is higher than the upper surface of the first electronic component surface; solidifying the liquid metal composite; and disposing a second electronic component on the solidified liquid metal composite layer.

In some embodiments, after the step of forming the solidified liquid metal composite layer, it further includes: forming a first opening in the solidified liquid metal composite layer on the upper surface; disposing an insulating layer on the solidified liquid metal composite layer on the upper surface, and fill the first opening; form a second opening extending to the insulating layer and expose the solidified liquid metal composite layer; fill the second opening with the liquid metal composite and cover part of the insulating layer; and solidify and fill the second opening with the A liquid metal compound that covers part of the insulation.

In some embodiments, the method further includes: arranging a portion of the solidified liquid metal composite layer under the lower surface of the first electronic component to connect the first conductive layer and the first electronic component; removing the substrate; and arranging a third electron The component is under the first electronic component, so that the third electronic component is electrically connected to the first electronic component through the conductive joint structure, wherein the conductive joint structure includes a portion of the solidified liquid metal composite layer.

In some embodiments, the step of arranging the third electronic component under the first electronic component includes: removing a portion of the first conductive layer to form a plurality of conductive pad layers under portions of the solidified liquid metal composite layer, and conducting electricity The pad layers are spaced apart from each other via a plurality of first grooves; a second conductive layer is disposed under the conductive pad layer and extends conformally to cover the first grooves, forming a plurality of second grooves, so that the second conductive layer and the conductive pad layer A first conductive member having a second groove is formed together with a portion of the solidified liquid metal composite layer; a third electronic component and a second conductive member disposed on the third electronic component are provided, wherein the second conductive member includes a vertically extending conductive pillars and laterally extending pads, the pads contact the conductive pillars with a first surface, and contact the third electronic component with a second surface opposite to the first surface; and dispose the third electronic component under the first electronic component, so that The conductive post of the second conductive member is inserted into the second groove of the first conductive member.

In some embodiments, the step of solidifying the liquid metal composite includes heating the liquid metal composite at a temperature of 60°C to 200°C.

Embodiments of the present application provide circuit boards and manufacturing methods thereof. By using the solidified liquid metal composite layer, better electrical connection quality can be achieved for electronic components (such as the first electronic component), and the structural reliability of the circuit board and the heat dissipation efficiency of the electronic components can be improved.

When an element such as a layer, film, region or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element, or intervening elements Can and exist. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to physical and/or electrical connection. Furthermore, "electrical connection" or "coupling" can mean the presence of other components between two components.

Additionally, relative terms, such as "lower" or "bottom" and "upper" or "top," may be used herein to describe one element's relationship to another element as illustrated in the Figures. It will be understood that relative terms are intended to encompass different orientations of the device in addition to the orientation illustrated in the figures. For example, if the device in one of the figures is turned over, elements described as "below" other elements would then be oriented "above" the other elements. Thus, the exemplary term "lower" may include both "lower" and "upper" orientations, depending on the particular orientation of the drawing. Similarly, if the device in one of the figures is turned over, elements described as "below" or "beneath" other elements would then be oriented "above" the other elements. Thus, the exemplary terms "below" or "lower" may include both superior and inferior orientations.

As used herein, "about," "approximately," or "substantially" includes the stated value and an average within an acceptable range of deviations from the particular value as determined by one of ordinary skill in the art, taking into account the measurements in question and the A specific amount of error associated with a measurement (i.e., the limitations of the measurement system). For example, "about" may mean within one or more standard deviations of the stated value.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be construed to have meanings consistent with their meanings in the context of the relevant art and the present application, and will not be construed as idealistic or excessive Formal meaning, unless expressly defined as such herein.

It should be noted that, unless otherwise specified, when the following embodiments are illustrated or described as a series of operations or events, the order of description of these operations or events should not be limited. For example, some operations or events may be performed in a different order than in this application, some operations or events may occur simultaneously, some operations or events may not be used, and/or some operations or events may be repeated. Furthermore, the actual process may require additional operations before, during, or after each step to completely form the circuit board. Therefore, this application may briefly describe some of these additional operations.

Please refer to Figure 1A. First, a substrate 110 is provided, wherein the substrate 110 includes a base material 112 and a conductive layer 114 disposed on the base material 112 .

In some embodiments, the material of the substrate 112 may include liquid crystal polymer (LCP), bismaleimide-triazine (BT), resin containing inorganic fillers (eg, , ABF (Ajinomoto Build-up Film) resin or epoxy resin (epoxy)), polyimide (PI, such as thermoplastic polyimide (TPI)), polyethylene terephthalate Polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyurethane (PU, such as thermoplastic polyurethane (TPU)), other suitable materials, derivatives of the above, or Any combination of the above materials. In some embodiments, the conductive layer 114 is made of gold, silver, copper, nickel, tin, other suitable metals, or any combination of the above materials.

Next, please refer to Figure 1B. A portion of the conductive layer 114 is removed to form an opening H0 and a remaining portion 114P of the conductive layer 114 on the substrate 112 , and the remaining portions 114P are spaced apart from each other via the opening H0 . In some embodiments, removing a portion of the conductive layer 114 may include routing, drilling (such as laser drilling or mechanical drilling), etching, peeling, other suitable methods, or A combination of the above. In one embodiment, a portion of the conductive layer 114 is removed through etching, wherein the etching rate of the conductive layer 114 using an etchant is faster than the etching rate of the substrate 112 . Therefore, the substrate 112 is substantially unaffected by etching.

Next, please refer to Figure 1C. The insulating layer 122 is disposed on the base material 112 and surrounds the remaining portion 114P. Next, the circuit structure CL is disposed on the insulating layer 122 and also surrounds the remaining portion 114P.

In some embodiments, the material of the insulating layer 122 may include high molecular polymers, such as epoxy, polyimide (PI, such as thermoplastic polyimide (TPI)), polyethylene terephthalate Glycol ester (PET), polyethylene naphthalate (PEN), polyurethane (PU, for example, thermoplastic polyurethane (TPU)), other suitable materials, derivatives of the above, or any combination of the above materials.

In some embodiments, both the insulating layer 122 and the line structure CL are spaced apart from the remaining portion 114P via the opening H1. In some embodiments, the circuit structure CL is a multi-layer circuit structure obtained through build-up. For example (not shown in the following figures), a base material (such as the base material 112), a conductive layer (such as the conductive layer 114), and a metal layer (such as a copper layer) can be formed in sequence. After obtaining the first circuit structure, further , and then form a second circuit structure on the first circuit structure, and the first circuit structure and the second circuit structure are separated by an insulating layer, and so on, thereby forming a multi-layer circuit structure.

Next, please refer to Figure 1D. The filling layer 132 is provided in the opening H0 and the opening H1. Next, the first electronic component E1 is disposed on the remaining portion 114P of the conductive layer 114 . In some embodiments, the material of the filling layer 132 includes a dielectric material, such as a photo imageable dielectric material (PID).

In some embodiments, the first electronic component E1 may be a passive component (such as a resistor, a capacitor, and an inductor) or an active component (such as a transistor). Alternatively, the first electronic component E1 may include active components and passive components, such as an integrated circuit (IC) having active components and passive components, but the application is not limited thereto.

In some embodiments, the filling layer 132 fills all the openings H0 and H1 , and the upper surface 132 a of the filling layer 132 and the upper surface 122 a of the insulating layer 122 may be flush. In some embodiments, the first electronic component E1 may include a plurality of metal pads M1, wherein the metal pads M1 may be located on the upper surface E1a and below the lower surface E1b of the first electronic component E1.

The metal pad M1 disposed under the lower surface E1b can prevent the lower surface E1b of the first electronic component E1 from directly contacting the retained portion 114P, leaving a gap between the lower surface E1b and the retained portion 114P, and providing space for subsequent liquid metal compounding. objects, leaving space for filling. In some embodiments, the first electronic component E1 is electrically connected to the circuit structure CL (not shown). In addition, the material of the metal pad M1 may be gold, silver, copper, nickel, tin, other suitable metals, or any combination of the above materials.

Next, please refer to Figure 1E. The liquid metal composite is filled on the remaining portion 114P of the conductive layer 114 until the top surface (liquid level) of the liquid metal composite is higher than the upper surface E1a of the first electronic component E1. Next, the liquid metal composite is solidified to form the solidified liquid metal composite layer 140 .

In some embodiments, the material of the liquid metal composite includes liquid metal (amorphous metal, or metallic glass) and high molecular polymer. In some embodiments, the liquid metal composite is fluid and is obtained by mixing individual or multiple metal particles and polymers in a specific ratio, and using low-temperature smelting to fully fuse the additives. Metal composites in which metal particles are in an amorphous state (commonly known as liquid metal). In some embodiments, the liquid metal can be copper or copper alloy, and the high molecular polymer can be gel, resin or a combination thereof.

In some embodiments, the liquid metal composite may also include a binder or diluent to improve adhesion or fluidity, or may further include wax powder, spherical graphite, dispersant, foaming agent, or leveling agent. Agents, etc., to improve the dispersion of metal particles in the liquid metal composite.

In some embodiments, during the process of filling the liquid metal composite on the reserved portion 114P, the circuit structure CL can be used as a barrier, and the liquid metal composite is filled in the space surrounded by the circuit structure CL, so that the liquid metal composite located in the reserved portion 114P can be filled with the liquid metal composite in the space surrounded by the circuit structure CL. 114P, the liquid metal composite on the filling layer 132 and the insulating layer 122 can directly contact all surfaces of the first electronic component E1 (including the upper surface E1a, the lower surface E1b and the side surface E1c) and the sidewalls CLs of the circuit structure CL. In some embodiments, the liquid metal composite covers the entire side surface E1c and covers the entire upper surface E1a that is not in contact with the metal pad M1 and the entire lower surface E1b, thereby covering the entire first electronic component E1 and connecting the remaining portion 114P and The first electronic component E1.

Afterwards, the liquid metal composite can be solidified. In the step of forming the solidified liquid metal composite layer 140, the liquid metal composite is heated at a temperature of 60°C to 200°C (for example, 60°C, 100°C, 150°C, 200°C or any of the foregoing ranges). temperature), so that the polymer in the liquid metal composite is completely solidified to form the solidified liquid metal composite layer 140. In some embodiments, the liquid metal composite can be solidified through staged heating and baking, for example, baking the liquid metal composite by raising the temperature by 20°C every half hour, so that the liquid metal composite is evenly heated. Improve the curing effect of liquid metal composites.

It is worth emphasizing that the solidified liquid metal composite layer 140 is light, strong, and bright, and has better ductility, corrosion resistance, and wear resistance than conventional metals.

Next, please refer to Figure 1F. The portion of the solidified liquid metal composite layer 140 located on the upper surface E1a is removed. Next, the insulating layer 124 is placed on the solidified liquid metal composite layer 140, and layers are added on the insulating layer 124 to sequentially form the base material 116 and the conductive layer 118 on the insulating layer 124. In some embodiments, the material of the insulating layer 124 may be the same as or similar to the insulating layer 122 (please refer to FIG. 1C ), which will not be described again here.

In some embodiments, the step of removing the portion of the solidified liquid metal composite layer 140 located on the upper surface E1a includes forming openings H2 in the solidified liquid metal composite layer 140 such that a plurality of portions of the solidified liquid metal composite layer 140 remain. Portion 142 and other portions 144 may be spaced apart from each other via opening H2. In some embodiments, a laser may be used to remove a portion of the solidified liquid metal composite layer 140 on the upper surface E1a to form the opening H2.

In some embodiments, the step of disposing the insulating layer 124 on the solidified liquid metal composite layer 140 includes disposing the insulating layer 124 on the portion 142 and other portions 144 of the solidified liquid metal composite layer 140 and filling the opening H2.

Next, please refer to Figure 1G (please refer to Figure 1F for assistance). The substrate 112 underneath the remaining portion 114P is removed. Specifically, the step of removing the substrate 112 under the remaining portion 114P includes removing the entire substrate 112 , thereby exposing the insulating layer 122 , the filling layer 132 and the remaining portion 114P.

Next, please refer to Figure 1H. A portion of the remaining portion 114P is removed (please refer to FIG. 1G for assistance) to form a plurality of conductive pad layers CP under other portions 144 of the solidified liquid metal composite layer 140, and the conductive pad layers CP are spaced apart from each other via the grooves A0. Next, the conductive layer 150 is disposed under the plurality of conductive pad layers CP and extends to cover the plurality of grooves A0.

In some embodiments, the conductive layer 150 is made of gold, silver, copper, nickel, tin, other suitable metals, or alloys of combinations of the above materials. In some embodiments, the conductive pad layer CP and the metal pad M1 use the same material, but the metal pad M1 and the conductive layer 150 are made of different materials. For example, the conductive pad layer CP and the metal pad M1 are made of copper, and the conductive layer 150 is made of copper. The material is gold.

In some embodiments, the conductive pad layer CP directly contacts the lower surface 144b of the other portion 144, and the lower surface CPb of the conductive pad layer CP is higher than the lower surface 132b of the filling layer 132. In some embodiments, the conductive layer 150 is conformally disposed from the conductive pad layer CP along the groove A0, thereby further forming the groove A1 at the groove A0.

Next, please refer to Figure 1I. The conductive layer 118, the substrate 116, and the insulating layer 124 above the other portions 144 of the solidified liquid metal composite layer 140 are removed to form opening H3. In addition, the filling layer 132 and other parts 144 located above the filling layer 132 and in direct contact with the filling layer 132 (please refer to FIG. 1H for assistance) are removed to form an opening H4, so that the other parts 144 are separated by the opening H4 to completely cover the first part. A portion 144A of the side surface E1c of an electronic component E1 extends to cover part of the upper surface E1a, and a portion 144B disposed under the lower surface E1b of the first electronic component E1. Therefore, the portion 144B, the metal pad M1, the conductive pad layer CP and the conductive layer 150 together form the conductive member CU1 having the groove A1.

In some embodiments, the solidified liquid metal composite layer 140 (portion 142, portion 144A, and portion 144B) covers at least 80% of the surface area of the first electronic component E1 (i.e., the upper surface E1a, the lower surface E1b, and the side surfaces The total surface area of E1c) can better shield and protect the first electronic component E1.

In some embodiments, a laser is used to remove the conductive layer 118 , the substrate 116 , and the insulating layer 124 over the other portions 144 of the solidified liquid metal composite layer 140 , and to remove the fill layer 132 and above and with the fill layer 132 . The filling layer 132 is in direct contact with other portions 144 .

Next, please refer to Figure 1J. The metal layer ML is disposed in the opening H3 so that the metal layer ML directly contacts the portion 144A, and the filling layer 134 is disposed on the conductive layer 118 . The metal layer ML is connected to the portion 144A of the solidified liquid metal composite layer 140, which can assist in transferring the heat of the first electronic component E1, improve the heat dissipation effect of the first electronic component E1, and assist in electrically connecting the first electronic component E1 with other circuit structures. (not shown).

In some embodiments, the metal layer ML extends over the conductive layer 118 . In some embodiments, the metal layer ML and the filling layer 134 are separated by a gap SP and are not in direct contact. In some embodiments, the step of disposing the filling layer 134 on the conductive layer 118 includes forming an opening H4 in the conductive layer 118 and disposing the filling layer 134 to fill the opening H4 so that the filling layer 134 is in direct contact with the substrate 116 and extends Covered on the conductive layer 118. In some embodiments, the opening H4 is substantially aligned with the opening H2 in the vertical direction (Z-axis), such that the conductive layer 118 adjacent the opening H4 is substantially aligned with the portion 142 in the vertical direction (Z-axis) to lift Precision in subsequent opening settings and line connections.

Next, please refer to Figure 1K. Opening H5 is formed, wherein opening H5 extends to filling layer 134 , conductive layer 118 , substrate 116 , and insulating layer 124 , exposing portion 142 of solidified liquid metal composite layer 140 . Next, the liquid metal composite fills the opening H5 and covers the filling layer 134 . Next, the liquid metal composite is solidified to form the portion 146 of the solidified liquid metal composite layer 140 (for example, using a curing method similar to that shown in FIG. 1E ). Therefore, the portion 146 is in direct contact with the portion 142 . Next, a metal pad M2 is disposed on the lower surface E2b of the second electronic component E2, and the second electronic component E2 is disposed on the portion 146 in such a manner that the metal pad M2 is in direct contact with the portion 146. Therefore, the first electronic component E1 is in direct contact with the portion 146. The two electronic components E2 are electrically connected through the metal pad M1, the portion 142, the portion 146, and the metal pad M2.

It is worth emphasizing that compared with the conventional steps of forming via holes, which require at least hole pre-processing, hole surface metallization, and through-hole electroplating or blind hole electroplating, this application directly fills the opening with a liquid metal compound. In H5, the method of solidifying the part 146 of the liquid metal composite layer 140 is relatively simple, and the number of components can be simplified, thereby improving the accuracy and density of packaging. In addition, the material of the solidified liquid metal composite layer 140 of the present application has better ductility, corrosion resistance, and wear resistance than conventional metals.

On the other hand, compared to the method of directly contacting the part 142 with a conventional metal (such as copper) (for example, forming a conventional via hole on the part 142), the part 142 and the part 146 of the present application are in direct contact through the same material. The design can achieve better electrical connection quality.

In some embodiments, the step of forming the portion 146 of the solidified liquid metal composite layer 140 includes removing a portion of the portion 146 covering the filling layer 134 to form a plurality of metal pillars 146A spaced apart from each other, thereby reducing the distance between the portion 146 and the filling layer 146 . Layer 134 contacts the surface area to reduce parasitic capacitance. In some embodiments, the projected area of the upper surface 146Aa of the metal pillar 146A in contact with the metal pad M2 along the vertical direction (Z axis) on the X-Y cross-section is larger than the lower surface M2b of the metal pad M2 in contact with the portion 146 along the vertical direction (Z-axis). Z axis) The projected area projected on the X-Y cross section can improve the accuracy of docking and the convenience of operation, thus improving the reliability of the connection. In some embodiments, the second electronic component E2 may be the same or similar component as the first electronic component E1, but the application is not limited thereto.

Next, please refer to Figure 1L. A third electronic component E3 and a conductive element CU2 disposed on the third electronic component E3 are provided. Next, the third electronic component E3 is disposed under the first electronic component E1 so that the third electronic component E3 is electrically connected to the first electronic component E1 through the conductive bonding structure CS (conductive element CU1 and conductive element CU2).

In some embodiments, the conductive element CU2 includes a conductive pillar CU2A extending vertically (along the Z-axis direction) and a pad CU2B extending transversely (along the Y-axis direction). The pad CU2B is in contact with the first surface CU2Ba (dotted line) The conductive pillar CU2A contacts the third electronic component E3 with the second surface CU2Bb relative to the first surface CU2Ba. That is, in the Y-Z cross section, the conductive member CU2 has a T-shape. In some embodiments, the step of arranging the third electronic component E3 under the first electronic component E1 includes inserting the conductive post CU2A of the conductive component CU2 into the groove A1 formed by the conductive layer 150 of the conductive component CU1. In some embodiments, the conductive pillar CU2A and the pad CU2B are integrally formed.

It is worth noting that through the design of the conductive element CU2 being T-shaped in the Y-Z cross section, and the conductive pillar CU2A being inserted into the groove A1 in the conductive layer 150, the contact area of the conductive element CU2 and the conductive element CU1 is increased, and The structural stability between the conductive part CU1 and the conductive part CU2 is improved, thereby improving the efficiency of current transmission and the reliability of the package.

In some embodiments, the conductive element CU2 and the conductive layer 150 are connected to each other via the conductive material 160 . In some embodiments, the conductive material 160 may be solder, conductive paste, or conductive colloid, where the conductive colloid is, for example, anisotropic conductive film (ACF).

Next, please refer to Figure 1M. The insulating layer 126A is provided to fill the space between the second electronic component E2 and the conductive layer 118 , and the insulating layer 126B is provided to fill the space between the first electronic component E1 and the third electronic component E3 , thereby completing the circuit board 100 . In some embodiments, the material of the insulating layer 126A or the insulating layer 126B includes a dielectric material, such as a photo-imaging dielectric material.

Specifically, the insulating layer 126A can directly contact the conductive layer 118, the filling layer 134, the portion 146 of the solidified liquid metal composite layer 140, the metal pad M2 and the second electronic component E2, and covers the filling layer 134, the portion 146 and the metal pad M2, and covers the entire upper surface 118a of the conductive layer 118. Therefore, the filling layer 134, the portion 146, the metal pad M2, and the conductive layer 118 are not exposed to the outside.

On the other hand, the insulating layer 126B is in direct contact with the first electronic component E1, the third electronic component E3, and the conductive joint structure CS, covering the entire conductive joint structure CS, and covering the entire upper surface E3a of the third electronic component E3. Therefore, the insulating layer 126A and the insulating layer 126B respectively cover the component (such as the metal pad M2) between the first electronic component E1 and the conductive layer 118, and cover the component between the first electronic component E1 and the third electronic component E3. Components (such as the conductive bonding structure CS) are prevented from being exposed and damaged by external forces or affected by the external environment (such as moisture), thereby improving the structural reliability of the circuit board 100 .

In summary, embodiments of the present application provide a circuit board and a method for manufacturing the circuit board. By using a solidified liquid metal composite layer to cover the upper surface and side surface of the first electronic component, the first electronic component can be shielded and protected, and improve the performance of the circuit board. The heat dissipation efficiency of the first electronic component. In addition, by using the solidified liquid metal composite layer to connect the first electronic component and the second electronic component, instead of conventional through-hole plating and blind hole plating, the process and the number of components can be simplified, and the accuracy and density of packaging can be improved. It is also worth mentioning that, compared with conventional metals, the solidified liquid metal composite layer has better ductility, corrosion resistance, and wear resistance. Therefore, the application of the aforementioned solidified liquid metal composite layer can simultaneously improve Structural reliability of circuit boards.

The above has briefly described the features of several embodiments of the present application, making it easier for those with ordinary knowledge in the art to understand the present application. Anyone with ordinary skill in the art should understand that this description can be easily used as a basis for modification or design of other structures or processes to achieve the same purposes and/or obtain the same advantages as the embodiments of the present application. Anyone with ordinary skill in the art will also understand that structures equivalent to the above do not deviate from the spirit and scope of the present application, and that changes, substitutions and modifications can be made without departing from the spirit and scope of the present application.

100:Circuit board 110:Substrate 112:Substrate 114: Conductive layer 114P:Reserved part 116:Substrate 118: Conductive layer 118a: Upper surface 122, 124, 126A, 126B: Insulation layer 122a: Upper surface 132, 134: filling layer 132a: Upper surface 132b: Lower surface 140: Solidified liquid metal composite layer 142, 144A, 144B, 146: Part 144:Other parts 144b: Lower surface 146A:Metal column 146Aa: Upper surface 150:Conductive layer 160: Conductive materials E1: The first electronic component E1a: upper surface E1b: lower surface E1c: side surface E2: Second electronic component E2b: lower surface E3: The third electronic component E3a: upper surface A0, A1: Groove H0, H1, H2, H3, H4, H5: opening M1, M2: metal pad M2b: lower surface CL: line structure CLs: side walls CP: conductive cushion CPb: lower surface CS: conductive bonding structure CU1, CU2: conductive parts CU2A: conductive pillar CU2B: pad CU2Ba: first surface CU2Bb: Second surface ML: metal layer SP: gap

When reading the following implementation methods, please refer to the accompanying drawings to clearly understand the concepts of this application. It should be noted that, consistent with standard industry practice, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily expanded or reduced for clarity of discussion. Again, the same reference numerals refer to the same elements. Figures 1A to 1M are cross-sectional views illustrating circuit boards at various manufacturing stages according to some embodiments of the present application.

Domestic storage information (please note in order of storage institution, date and number) without Overseas storage information (please note in order of storage country, institution, date, and number) without

100:Circuit board

116:Substrate

118: Conductive layer

118a: Upper surface

126A, 126B: Insulating layer

134:Filling layer

140: Solidified liquid metal composite layer

146:Part

E1: The first electronic component

E2: Second electronic component

E3: The third electronic component

E3a: upper surface

M2: metal pad

CS: conductive bonding structure

Claims (10)

A circuit board including: A first electronic component having an upper surface, a lower surface relative to the upper surface, and a plurality of side surfaces connecting the upper surface and the lower surface; A solidified liquid metal composite layer covers the first electronic component and covers the upper surface and the side surface of the first electronic component; a circuit structure surrounding the first electronic component and the solidified liquid metal composite layer; and A second electronic component is disposed on the upper surface of the first electronic component and is electrically connected to the first electronic component through the solidified liquid metal composite layer. The circuit board according to claim 1, wherein the material of the solidified liquid metal composite layer includes liquid metal and high molecular polymer. The circuit board of claim 1, wherein the solidified liquid metal composite layer includes; a first portion that completely covers the side surface of the first electronic component and extends to cover part of the upper surface; a second part disposed on the upper surface of the first electronic component and electrically connected to the first electronic component and the second electronic component; and a third part disposed under the lower surface of the first electronic component, The first part, the second part, and the third part are spaced apart from each other. The circuit board as described in request item 3 further includes: a conductive bonding structure disposed under the first electronic component; and A third electronic component is disposed under the first electronic component and is electrically connected to the first electronic component via the conductive bonding structure. The circuit board of claim 4, wherein the conductive bonding structure includes: A first conductive member having a plurality of grooves, including: said third portion of said solidified liquid metal composite layer; a plurality of conductive pad layers disposed under the third portion and spaced apart from each other via the groove; and a conductive layer disposed under the conductive pad layer and extending to cover the groove; and The second conductive member includes a vertically extending conductive post and a transversely extending pad, wherein the pad contacts the conductive post with a first surface and contacts the conductive post with a second surface relative to the first surface. Third electronic component, The conductive post is inserted into the groove of the first conductive member. A method of manufacturing a circuit board, comprising: A substrate is provided, wherein the substrate includes a base material and a first conductive layer disposed on the base material; Providing a circuit structure surrounding the substrate; disposing a first electronic component on the first conductive layer, wherein the first electronic component has an upper surface and a lower surface relative to the upper surface; Filling the liquid metal composite on the first conductive layer until the top surface of the liquid metal composite is higher than the upper surface of the first electronic component; solidifying the liquid metal composite to form a solidified liquid metal composite layer; and A second electronic component is disposed on the solidified liquid metal composite layer. The method of claim 6, wherein after the step of forming the solidified liquid metal composite layer, it further includes: forming a first opening in the solidified liquid metal composite layer on the upper surface; disposing an insulating layer on the solidified liquid metal composite layer on the upper surface and filling the first opening; forming a second opening extending to the insulating layer and exposing the solidified liquid metal composite layer; Fill the second opening with the liquid metal composite and cover part of the insulating layer; and The liquid metal composite filling the second opening and covering the portion of the insulating layer is solidified. The method described in request item 6 further includes: disposing a portion of the solidified liquid metal composite layer under the lower surface of the first electronic component to connect the first conductive layer and the first electronic component; removing the substrate; and A third electronic component is disposed under the first electronic component so that the third electronic component is electrically connected to the first electronic component via a conductive joint structure, wherein the conductive joint structure includes the solidified liquid metal composite layer of said part. The method of claim 8, wherein the step of arranging the third electronic component under the first electronic component includes: removing a portion of the first conductive layer to form a plurality of conductive underlayers under the portion of the solidified liquid metal composite layer, and the conductive underlayers are spaced apart from each other via a plurality of first grooves; A second conductive layer is disposed under the conductive pad layer and extends to conformally cover the first groove to form a plurality of second grooves, so that the second conductive layer, the conductive pad layer and the cured said portions of the liquid metal composite layer collectively form a first conductive member having said second groove; A third electronic component and a second conductive member disposed on the third electronic component are provided, wherein the second conductive member includes vertically extending conductive pillars and transversely extending pads, and the pads are formed on a first surface contacting the conductive post and contacting the third electronic component with a second surface relative to the first surface; and The third electronic component is disposed under the first electronic component so that the conductive pillar of the second conductive component is inserted into the second groove of the first conductive component. The method of claim 6, wherein the step of solidifying the liquid metal composite includes heating the liquid metal composite at a temperature of 60°C to 200°C.

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