TW202405609A - A heat exchanger for an electronic component of a server - Google Patents

Abstract

The disclosed heat exchanger is for an electronic component of a server. The heat exchanger comprising: (i) a body configured to be positioned adjacent to the electronic component; (ii) a heat pipe extending away from the body for conducting heat absorbed by the body from the electronic component; (iii) a plurality of disc-shaped fins located and spaced apart along the heat pipe, the plurality of disc-shaped fins being coaxial with the heat pipe; and (iv) a fan for driving air in between the plurality of disc-shaped fins.

Description

Heat exchanger for server electronic components

The technology relates generally to heat exchangers, and in particular, the technology relates to a heat exchanger for an electronic component of a server.

Heat exchangers for dissipating heat from a heat-generating electronic component are known in the art, and conventional heat exchangers typically include a group coupled to an element that is in good thermal contact with a heat exchanger plate, such as a heat sink. heat pipe. These conventional heat exchangers are passive devices with a large heat capacity and a large surface area relative to their volume. Heat pipes and heat exchanger plates are typically made from a metal with high thermal conductivity, such as aluminum or copper, and incorporate fins to increase surface area. Additionally, a fan is to be used to circulate air through the heat exchanger plates.

Typically, such conventional heat exchangers use heat pipes to quickly transfer heat from the processor (which is locked to the bottom of the structure) to a plurality of plate elements for further heat dissipation. Additionally, solutions can use multiple fans to increase airflow and therefore heat exchange with the environment.

However, even with the best heat exchanger architecture in terms of surface, using high quality materials in terms of electrical conductivity, it can still be very difficult to overcome heat dissipation beyond a certain limit. It is also very difficult to increase the fan speed repeatedly and infinitely to increase air circulation.

Typically, there are several heat exchangers used to cool electronic components. For example, "CN 106371535 A" discloses a parallel CPU cooling device, which includes a CPU, a semiconductor refrigeration slice, a heat transfer block, a plurality of first heat pipes, a plurality of second heat pipes and a cooling fan. The upper end of the CPU has a first thermal conductive adhesive layer. The cold end of the semiconductor refrigeration slice and the lower end of the thermal conductive block are fixed to the first thermal conductive adhesive layer. The semiconductor refrigeration slice and the thermal conductive block are arranged in parallel, and the cold end area of the semiconductor refrigeration slice is equal to The sum of the areas of the end surfaces of the lower end of the heat conduction block is equal to the area of the upper surface of the first heat conduction adhesive layer. The end face of the hot end of the semiconductor refrigeration slice and the end face of the upper end of the heat conduction block are covered with a second heat conduction adhesive layer. The second heat conduction adhesive layer located on the semiconductor refrigeration slice is connected to the cooling fan through the first heat pipe and is located on the heat conduction block. The second thermal conductive adhesive layer is connected to the cooling fan through the second heat pipe. Semiconductor refrigeration slices are further used to perform cooling when heat is transferred and dissipated through the heat conduction block to reduce the temperature rise range during the operation of the CPU, and thus improve the working efficiency of the CPU.

Accordingly, attention is directed to developing an efficient heat exchanger for an electronic component of a server.

Embodiments of the present technology have been developed based on the developer's understanding of at least one technical problem associated with prior technical solutions.

The developers of this technology have realized that conventional heat exchangers may underutilize heat-generating electronic components that require heat dissipation above a certain level. Furthermore, the plates associated with conventional heat exchangers having large dimensions have lower efficiency per unit surface area in terms of removing heat.

Thus, it can be said that in at least some embodiments of the technology, the developers of the technology have envisioned a heat exchanger for an electronic component of a server. In at least some embodiments, the heat exchanger may have a plurality of disc-shaped fins positioned and spaced along a heat pipe extending away from a body. The plurality of disc-shaped fins results in an increased airflow and more efficient removal of heat generated by the electronic components associated with the server compared to conventional heat exchangers.

According to a first broad aspect of the present technology, a heat exchanger for an electronic component of a server is provided, the heat exchanger including: a body configured to be positioned adjacent to the electronic component; A heat pipe extending away from the body for conducting heat absorbed by the body from the electronic component; a plurality of disc-shaped fins positioned and spaced along the heat pipe, the plurality of disc-shaped fins and the heat pipe Coaxial; and a fan used to drive the air between the plurality of disc-shaped fins.

In some embodiments of the heat exchanger, the inner diameter is between 3 mm and 6 mm and the outer diameter is between 15 mm and 26 mm.

In some embodiments of the heat exchanger, wherein the given fin from the plurality of disc-shaped fins has a surface area of between 296 mm ² and 1005 mm ² .

In some embodiments of the heat exchanger, the plurality of disc-shaped fins have a combined surface area between 207.2 m ² and 703.5 m ² .

In some embodiments of the heat exchanger, a distance between a pair of adjacent disc-shaped fins of the plurality of disc-shaped fins is between 1 mm and 30 mm.

In some embodiments of the heat exchanger, the plurality of disc-shaped fins along the heat pipe extend along respective parallel planes.

In some embodiments of the heat exchanger, wherein the heat pipe is a first heat pipe and the plurality of disc-shaped fins is a first plurality of disc-shaped fins, the heat exchanger further includes: a second a heat pipe extending away from the body for conducting heat absorbed by the body from the electronic component, the first heat pipe and the second heat pipe being substantially parallel; and a second plurality of disc-shaped fins extending along the The second heat pipe is positioned and spaced apart, and the second plurality of disc-shaped fins are coaxial with the second heat pipe.

In some embodiments of the heat exchanger, wherein a first disc-shaped fin from the first plurality of disc-shaped fins and a nearest disc-shaped fin from the second plurality of disc-shaped fins The distance between the fins is between 1 mm and 30 mm.

In some embodiments of the heat exchanger, wherein the fan is configured to generate an airflow around the first heat pipe and the second heat pipe, the first heat pipe and the second heat pipe are disposed on respective third sides facing the airflow. Part of a column of heat pipes.

In some embodiments of the heat exchanger, wherein the heat exchanger further includes another row of heat pipes, the row and the other row are arranged in a staggered configuration such that another heat pipe from the other row faces between the first heat pipe and the third heat pipe. A second part of the airflow passes between the two heat pipes.

In some embodiments of the heat exchanger, the electronic component is at least one of a central processing unit (CPU) of the server and a graphics processing unit (GPU) of the server.

In some embodiments of the heat exchanger, the electronic component has an operating temperature of 77 degrees Celsius.

In some embodiments of the heat exchanger, the server is located in a server rack.

According to a second broad aspect of the present technology, a heat exchanger for an electronic component of a server is provided, the heat exchanger including: a body configured to be positioned adjacent to the electronic component; plural heat pipes extending away from the body for conducting heat absorbed by the body from the electronic components, the heat pipes being substantially parallel, each of the heat pipes having a respective plurality of fins extending therefrom ; A fan, which is used to generate an airflow around the plurality of parallel heat pipes. The plurality of heat pipes are arranged in a row of heat pipes facing the airflow. One of the first rows and a second row of the rows are in a staggered structure. The arrangement is such that the first row faces a first portion of the airflow and the second row faces a second portion of the airflow, the second portions passing between adjacent heat pipes from the first row.

In some embodiments of the heat exchanger, wherein the body has two opposing walls, the first row and the second row extend from a given one of the two opposing walls, and one of the third rows A row and a fourth row extend from the other of the two opposing walls.

In some embodiments of the heat exchanger, a given intra-column pitch in a given column is a given fin of a given heat pipe in the given column relative to a given fin in the given column. A distance between the nearest fins of one of the adjacent heat pipes, the pitch of the first row of the first row is equal to the pitch of the second row of the second row, and the pitch of the third row of the third row is equal to The pitch is equal to the inner pitch of one of the fourth columns, and the inner pitch of the first column is different from the inner pitch of the second column.

In some embodiments of the heat exchanger, the respective plurality of fins of each of the plurality of heat pipes comprise disc-shaped fins.

In some embodiments of the heat exchanger, the electronic component is at least one of a central processing unit (CPU) of the server and a graphics processing unit (GPU) of the server.

In some embodiments of the heat exchanger, the electronic component has an operating temperature of 77 degrees Celsius.

In the context of this specification, a "server" is a computer program running on appropriate hardware and capable of receiving requests over a network (for example, from an electronic device) and executing or causing the execution of those requests. The hardware can be a physical computer or a physical computer system, but with respect to the present technology, neither need be the case. In this context, the use of the expression "at least one server" is not intended to mean that every task (such as an instruction or request received) or any particular task will be performed by the same server (i.e., the same software and/or hardware) Receiving, performing or causing to be performed; is intended to mean that any number of software elements or hardware devices may be involved in receiving/sending, performing or causing to be performed any task or request, or the result of any task or request; and all such software and hardware It can be one server or multiple servers, both servers being included in the expression "at least one server".

In the context of this specification, unless expressly stated otherwise, the words "first", "second", "third", etc. have been used only for the purpose of allowing the distinction between the mutually modified terms and not for the purpose of describing the same. It is used as an adjective for the purpose of any specific relationship between nouns. Thus, for example, it should be understood that use of the terms "first server" and "third server" is not intended to imply any specific order, type, chronology, hierarchy or ranking among servers (for example), their purpose (per se ) nor does it imply that any "secondary server" must exist in any given situation. Furthermore, as discussed in other contexts herein, reference to a "first" element and a "second" element does not exclude that the two elements are the same actual real-world element. Thus, for example, in some instances a "first" server and a "second" server may be the same software and/or hardware, and in other cases they may be different software and/or Hardware.

Embodiments of the present technology each have at least one of the above-mentioned purposes and/or aspects, but not necessarily all of them. It will be understood that some aspects of the technology derived from attempts to achieve the above-mentioned purposes may not satisfy such purposes and/or may satisfy other purposes not specifically enumerated herein.

Additional and/or alternative features, aspects, and advantages of embodiments of the technology will become apparent from the following description, drawings, and accompanying claims.

The examples and conditional language listed in this article are mainly intended to help readers understand the principles of this technology and do not limit its scope to these specifically listed examples and conditions. It will be understood that those skilled in the art can envision various configurations that, although not expressly described or shown herein, embody the principles of the technology and are included within its spirit and scope.

Additionally, to aid understanding, the following description may describe relatively simplified implementations of the technology. As those skilled in the art will understand, various implementations of the present technology may have greater complexity.

In some cases, it is believed that useful examples of modifications to current technology may also be described. This is only done to aid understanding, and as such does not define the scope of the technology or illustrate the boundaries of the technology. These modifications are not intended to be an exhaustive list, and those skilled in the art may make other modifications while remaining within the scope of the technology. Furthermore, in the absence of an example setting forth a proposed modification, it should not be construed that no modification is possible and/or that what is described is the only way to implement elements of the technology.

Furthermore, all statements reciting principles, aspects, and implementations of the technology, as well as specific examples thereof, are intended to encompass both structural and functional equivalents thereof, whether currently known or developed in the future. Thus, for example, those skilled in the art will understand that any block diagrams herein represent conceptual diagrams of illustrative circuit systems embodying the principles of the present technology. Similarly, it will be understood that any flowchart, flowchart, state transition diagram, pseudocode, and the like represents a program that can be substantially represented in a computer-readable medium and executed by a computer or processor, whether or not expressly shown so computer or processor.

The functionality of the various elements shown in the Figures (including any functional block labeled a "processor" or a "graphics processing unit") may be provided through the use of dedicated hardware and hardware capable of executing software associated with the appropriate software . When provided by a processor, the functionality may be provided by a single dedicated processor, by a single shared processor, or by a plurality of individual processors, some of which may be shared. In some embodiments of the present technology, the processor may be a general-purpose processor, such as a central processing unit (CPU), or a processor dedicated to a specific purpose, such as a graphics processing unit (GPU). Furthermore, explicit use of the terms "processor" or "controller" should not be construed to refer only to hardware capable of executing software, and may implicitly include (but not be limited to) digital signal processor (DSP) hardware. processors, network processors, application-specific integrated circuits (ASICs), field programmable gate arrays (FPGAs), read-only memory (ROM) for storing software, random access memory (RAM) and non-volatile sexual memory. Other hardware (custom and/or custom) may also be included.

Using these basic principles, we will now consider some non-limiting examples to illustrate various implementations of aspects of the present technology.

To make a heat exchanger more efficient, the area of the fins associated with the heat exchanger needs to be changed to allow more air volume to be pumped through the heat exchanger. A typical heat exchanger with a plate architecture allows a limited amount of air to pass through. This architecture is effective for normal electronic components with limited temperature limits of CPU/GPU.

However, when high temperatures are involved (closer to the constant temperature limits more specific to server operation in data centers), typical heat exchangers are less efficient as they face a lack of airflow. Accordingly, heat exchangers according to various non-limiting embodiments have higher air bandwidth.

Typically, the heat balance associated with a heat exchanger can be expressed as: q = α * (T1 - T2) * SW (1) where α can be the heat transfer coefficient (W/(m ²⁾ with respect to the type of coolant and its temperature * K)); pressure head temperature, type and flow pattern; regarding the state of the surface and the direction of flow; for air changes from 10 (W/(m ² * K) to 200 (W/(m ² * K)), ΔT = T1 - T2 can be a difference between the air temperature and the air exchanger surface (eg fins), and S can be the heat exchange surface (fin area) m ² .

The efficiency of the heat exchanger can be improved by increasing the surface-air component ΔT and by reducing the ineffective area of the S component. Therefore, pressure loss can be reduced and air flow can be increased.

More specifically, according to various non-limiting embodiments of the heat exchanger, the heat pipes may be covered with disc-shaped fins opposite the plates. Disc-shaped fins can be planted vertically on the heat pipe. This design allows more airflow through the heat exchanger allowing more heat to be removed.

Figure 1 depicts a perspective view of a heat exchanger 100 in accordance with various non-limiting embodiments of the present invention. As shown in the figure, the heat exchanger may include a body 102, a plurality of heat pipes 104-1, 104-2, 104-3...104-10, and a plurality of fins 106. It should be noted that heat exchanger 100 may contain additional components. However, these components have been omitted from Figure 1 for simplicity.

In certain non-limiting embodiments, body 102 may be made of a well conductive material such as aluminum or copper and may have any suitable shape, such as square, rectangular, or the like. The body 102 may be a heat conductive body. A base of the body 102 may be attached to or adjacent to an electronic component (not shown) to absorb heat therefrom. It should be noted that the electronic components may be associated with a server (not shown). Some non-limiting examples of electronic components may include CPUs, GPUs, DSPs, and the like associated with servers and servers may be stacked in a server rack.

In certain non-limiting embodiments, body 102 may be based on a liquid cooling block. For example, the body 102 may include a liquid inlet 108 and a liquid outlet 110 on a top surface of the body 102 . Cooling liquid can flow in from the liquid inlet 108 and can flow out from the liquid outlet 110 . The cooling liquid may be any suitable cooling liquid, such as water, dielectric or the like.

Additionally, in certain non-limiting embodiments, a plurality of heat pipes 104-1, 104-2, 104-3...104-10 may extend away from the body 102 to conduct heat absorbed by the body 102 from the electronic components. The plurality of heat pipes 104-1, 104-2...104-10 may be cylindrical and may be made of a well conductive material such as aluminum or copper.

The body 102 may have two opposing walls, some of the plurality of heat pipes 104-1, 104-2...104-5 extending away from one of the two opposing walls of the body 102 and a plurality of heating pipes 104-6, 104- 7...104-10 extend away from the other of the two opposing walls of body 102. Additionally, in certain non-limiting embodiments, a plurality of heat pipes 104-1, 104-2, 104-3...104-10 may be parallel.

In some non-limiting embodiments, a plurality of heat pipes 104-1, 104-2, 104-3...104-10 may be configured in a column. The columns may be configured to traverse the airflow generated by a fan (discussed later in this disclosure). For example, a plurality of heat pipes 104-1, 104-3 and 104-5 may be arranged in a first row and a plurality of heat pipes 104-2 and 104-4 may be arranged in a second row. The first row and the second row may be arranged in a staggered configuration on one of the two opposing walls of the body 102 .

In a similar manner, heat pipes 104-6, 104-8, and 104-10 may be arranged in a third column and heat pipes 104-7 and 104-9 may be arranged in a fourth column. The third and fourth columns may be arranged in a staggered configuration on the other of the two opposing walls of the body 102 .

In some non-limiting embodiments, the plurality of heat pipes 104-1, 104-2, 104-3...104-10 may be vertical relative to a top surface of the body 102. In other non-limiting embodiments, the plurality of heat pipes 104-1, 104-2, 104-3...104-10 may be at any suitable angle between 0 degrees and 90 degrees relative to the body 102.

In certain non-limiting embodiments, a plurality of fins 106 may be positioned along each of a plurality of heat pipes 104-1, 104-2, 104-3...104-10. A plurality of fins 106 may be positioned and spaced apart along a plurality of heat pipes 104-1, 104-2, 104-3...104-10. Additionally, the plurality of fins 106 may be coaxial with the associated plurality of heat pipes 104-1, 104-2, 104-3...104-10.

Figure 2 illustrates a top view 200 of the heat exchanger 100 in accordance with various non-limiting embodiments of the present invention. Referring to FIGS. 1 and 2 , the plurality of fins 106 may be disc-shaped fins. Additionally, each of the plurality of fins 106 may be a continuous surface. A given fin of the plurality of fins 106 may each have an inner diameter 202 and an outer diameter 204 . In addition, the plurality of heat pipes 104-1, 104-2, 104-3...104-10 may have a radius 206. In certain non-limiting embodiments, inner diameter 202 may be approximately equal to radius 206 .

As an example, the inner diameter 202 can be between 3 mm and 6 mm and the outer diameter 204 can be between 15 mm and 26 mm. Based on these dimensions, each of the plurality of fins 106 may have a surface area between 296 mm ² and 1005 mm ² . Additionally, the combined surface area of one of the plurality of fins 106 associated with each of the plurality of heat pipes 104-1, 104-2, 104-3...104-10 may be between 207.2 ^m2 and 703.5 ^m2 . The combined surface area may refer to the total surface area of the plurality of fins 106 associated with a given heat pipe of the plurality of heat pipes 104-1, 104-2, 104-3...104-10. As an example, if the number of fins in a given heat pipe of the plurality of heat pipes 104-1, 104-2, 104-3...104-10 is equal to 10, then the combined surface area may refer to ten fins. A total surface.

In certain non-limiting embodiments, a distance (e.g., 216, 222) from a center of a given fin (e.g., 104-1) to a center of another fin (e.g., 104-2) is between 31 mm and between 82 mm. Additionally, the pitch within a column (eg, 218, 224) between a given fin (eg, 104-4) and another fin (eg, 104-5) may be equal to 1 mm to 30 mm.

In certain non-limiting embodiments, one of a given heat pipe (e.g., 104-1) in a given column (e.g., first column) and a given fin in a given column (e.g., first column) A distance between the closest fins of adjacent heat pipes (eg, 104-3) may be referred to as an intra-row pitch.

The pitch within the first column 208 may be equal to the pitch within the second column 210 of the second column. In this case, the air flow 303 can be effectively distributed between the first and second columns to result in improved cooling efficiency of one of the heat exchangers 100 . In addition, the pitch 212 within the third column may be equal to the pitch 214 within the fourth column. In this case, the air flow 303 can be effectively distributed between the third and fourth columns to result in improved cooling efficiency of one of the heat exchangers 100 . In some non-limiting ways, the first column inner pitch 208 may be different than the third column inner pitch 212 . For example, the first row inner pitch 208 and the second row inner pitch 210 may be equal to 1 mm to 30 mm. Similarly, the inner pitch of the third column 212 and the inner pitch of the fourth column 214 may be equal to 1 mm to 30 mm.

It should be noted that the dimensions discussed above for heat exchanger 100 are only representative examples and the dimensions of heat exchanger 100 may be modified as desired without limiting the scope of the invention.

In certain non-limiting embodiments, a plurality of fins 106 along an associated heat pipe (eg, 104-3) may extend along respective parallel planes.

Figure 3 illustrates a top view 300 of the heat exchanger 100 in accordance with various non-limiting embodiments of the present invention. Referring to FIGS. 1-3 , in certain non-limiting embodiments, the heat exchanger 100 may further include a fan 302 . The fan 302 can be placed close to the plurality of heat pipes 104-1, 104-2, 104-3...104-10 and the body 102. With careful consideration, the fan 302 may have associated configurations that may assist in the functionality of the fan 302 . Such configurations may include electrical connections, a fan bracket, a fan guard positioned over the fan 302 to protect the fan 302 from contamination and damage during operation, or any other suitable configuration known in the art. For simplicity, these configurations have been omitted from Figure 3.

Fan 302 may be configured to drive air between fins 106 . In certain non-limiting embodiments, fan 302 may be configured to generate airflow 303 around a first heat pipe (eg, 104-1) and a second heat pipe (eg, 104-3). As discussed previously, a first heat pipe (eg, 104-1) and a second heat pipe (eg, 104-3) may be configured in the first row of heat pipes (104-1, 104-3, and 104-5). A first heat pipe (eg, 104 - 1 ) may face a respective first portion 304 - 1 of airflow 303 . Similarly, a second heat pipe (e.g., 104-3) in the first array of heat pipes (104-1, 104-3, and 104-5) may face one of the respective first portions 304-2 of the airflow 303 and the first array of heat pipes (104 The third heat pipe (eg 104-5) in -1, 104-3 and 104.5) may face one of the respective first portions 304-3 of the airflow 303.

It should be noted that the fan 302 pushing air through the heat exchanger 100 may have a height that may correspond to the height of the electronic components associated with the heat exchanger 100 .

In certain non-limiting embodiments, another heat pipe from the second column (e.g., 104-2) may face the passage between the first heat pipe (e.g., 104-1) and the second heat pipe (e.g., 104-3). One of the airflows 303 each has a second portion 306-1. Similarly, another heat pipe from the second column (e.g., 104-4) may face one of the airflows 303 passing between the second heat pipe (e.g., 104-3) and the third heat pipe (e.g., 104-5). Section 306-2. It should be noted that the first portions 304-1, 304-2 and 304-3 associated with the air flow 303 may be associated with the first row of heat pipes (104-1, 104-3 and 104-5). Second portions 306-1 and 304-2 associated with air flow 303 may be associated with a second row of heat pipes (104-2 and 104-4).

It can be said that the first column and the second column in the row can be arranged in a staggered configuration. In this case, the first row including heat pipes 104-1, 104-3 and 104-5 may face the first portions 304-1, 304-2 and 304-3 of the airflow 303 respectively and include the heat pipes 104-2 and 104- The second rows of 4 may face the second portions 306-1 and 306-2 of the airflow 303 respectively. The second portions 306-1 and 306-2 of the airflow 303 may pass between the adjacent heat pipes 104-1 and 104-3 and the adjacent heat pipes 104-3 and 104-5 from the first row.

In other words, the first portion 304-1, 304-2, and 304-3 of the airflow 303 may assist in removing the plurality of heat pipes associated with the first column (eg, 104-1, 104-3, and 104-5). The heat between the plurality of fins 106. The second portions 306-1 and 306-2 of the airflow 303 may help remove heat between the plurality of fins 106 associated with the second column of heat pipes (eg, 104-2 and 104-4).

In a similar manner, the third and fourth columns of the columns may be arranged in a staggered configuration. In this case, the heat pipes (eg, 104-6) in the third row of heat pipes (104-6, 104-8, and 104-10) may face a respective third portion 308-1 of the airflow 303. Similarly, the heat pipes (eg, 104-8) in the third row of heat pipes (104-6, 104-8, and 104-10) can face one of the respective third portions 308-2 of the airflow 303 and the third row of tubes (104-104-10). The heat pipes (eg 104-10) in 6, 104-8 and 104-10) may face one of the respective third portions 308-3 of the air flow 303.

In certain non-limiting embodiments, one of the heat pipes from the fourth column (e.g., 104-7) may face the airflow 303 passing between the heat pipe (e.g., 104-6) and another heat pipe (e.g., 104-8). 1. Part IV 310-1. Similarly, the heat pipes from the fourth column (e.g., 104-9) may face one of the respective fourth portions 310-2 of the airflow 303 passing between the heat pipe (e.g., 104-8) and another heat pipe (e.g., 104-10). . It should be noted that the third portions 308-1, 308-2 and 308-3 associated with the air flow 303 may be associated with the third row of heat pipes (104-6, 104-8 and 104-10). Fourth portions 310-1 and 310-2 associated with airflow 303 may be associated with a fourth column of heat pipes (104-7 and 104-9).

In certain non-limiting embodiments, the first portions 304-1, 304-2, and 304-3 of the airflow 303 may correspond to the third portions 308-1, 308-2, and 308-3 of the airflow 303. Additionally, the second portions 306-1 and 306-2 of the airflow 303 may correspond to the fourth portions 310-1 and 310-2 of the airflow 303.

The third portion 308-1, 308-2, and 308-3 of airflow 303 may facilitate removal of a plurality of heat pipes associated with the third column (eg, 104-6, 104-8, and 104-10). heat between the plurality of fins 106 . The fourth portions 310-1 and 310-2 of the airflow 303 may help remove heat between the plurality of fins 106 associated with the heat pipes associated with the fourth column (eg, 104-7 and 104-9).

With the design of heat exchanger 100 as discussed herein, certain operating parameters of heat exchanger 100 can be improved. Table 1 depicts a comparison of operating parameters of conventional heat exchangers and heat exchanger 100 (in accordance with at least some non-limiting embodiments of the present technology): Table 1 Operating parameters Conventional heat exchanger Heat exchanger 100 Pressure loss (Pa) 390 248 Airflow m ³ /hour 210 398 Surface area S, m ² 0.357 0.258 Power, W 400 700

As depicted in Table 1, the pressure loss of the heat exchanger 100 can be reduced, the air flow of the heat exchanger can be increased, the surface area of the heat exchanger can be reduced, and the heat exchanger 100 can be self-contained with an electronic component rated at 700 W. Remove from heat. In addition to the above benefits, one of the operating temperatures of the electronic components located near the heat exchanger 100 may be equal to 77 degrees Celsius. Notably, each and every of the above benefits need not be achieved in each and every non-limiting embodiment of the technology.

FIG. 4 illustrates a gas flow diagram 400 of the heat exchanger 100 according to various non-limiting embodiments. As shown in the figure, fan 302 may blow air toward heat exchanger 100 . With the plurality of disc-shaped fins 106 (as shown in Figure 1), an increased airflow between the plurality of heat pipes 104-1, 104-2, 104-3...104-10 is observed. Increased airflow may more efficiently remove heat generated by electronic components associated with the server than conventional heat exchangers. In addition to improving the heat removal capabilities of the heat exchanger 100, the plurality of fins 106 can have a significantly smaller area than conventional heat exchangers to make the heat exchanger 100 easier to use and install in connection with a server. near/around electronic components.

Furthermore, it should be noted that the plates associated with conventional heat exchangers with large dimensions are less efficient per unit surface area in removing heat, given that most of the heat is removed near the heat pipes. Because the plurality of fins 106 have a smaller size and are located near the heat pipes (eg, 104-1, 104-2...104-10), the plurality of fins 106 are smaller compared to conventional plates associated with conventional heat exchangers. Each fin 106 may have a better efficiency per unit surface area in removing heat.

It should also be understood that, although the embodiments presented herein have been described with reference to specific features and structures, it is apparent that various modifications and combinations may be made without departing from such techniques. Accordingly, the specification and drawings are to be considered merely illustrative of the embodiments or examples discussed and the principles defined by the appended claims, and are intended to cover any and all modifications, changes, changes, modifications, changes, etc. that fall within the scope of the present technology. Combinations or equivalents.

100:Heat exchanger 102:Ontology 104-1 to 104-10: Heat pipe 106:Fins 108:Liquid inlet 110:Liquid outlet 200:top view 202:Inner diameter 204:Outer diameter 206:radius 208: first column inner pitch 210: The inner pitch of the second column 212: The inner pitch of the third column 214: Fourth column inner pitch 216:distance 218: Intra-column pitch 222: Intra-column pitch 224: pitch within column 300:top view 302:Fan 304:Airflow 304-1:Part 1 304-2:Part 1 304-3:Part 1 306-1:Part 2 306-2:Part 2 308-1:Part 3 308-2:Part 3 308-3:Part Three 310-1:Part 4 310-2:Part 4 400: Airflow diagram

Further features and advantages of the present technology will become apparent from the following detailed description taken in conjunction with the accompanying drawings, in which:

Figure 1 depicts a perspective view of a heat exchanger according to various non-limiting embodiments of the present invention;

Figure 2 illustrates a top view of a heat exchanger according to various non-limiting embodiments of the present invention;

Figure 3 illustrates another top view of a heat exchanger according to various non-limiting embodiments of the present invention; and

Figure 4 illustrates an air flow diagram of a heat exchanger according to various non-limiting embodiments.

It should be understood that like features are identified by like reference numerals throughout the drawings and corresponding descriptions. Furthermore, it is also to be understood that the drawings and subsequent description are intended for illustrative purposes and that this technology does not provide a limitation on the scope of the claims.

100:Heat exchanger

102:Ontology

104-1 to 104-10: Heat pipe

106:Fins

108:Liquid inlet

110:Liquid outlet

Claims (20)

A heat exchanger for an electronic component of a server, the heat exchanger includes: a body configured to be positioned adjacent the electronic component; a heat pipe extending away from the body for conducting heat absorbed by the body from the electronic component; a plurality of disc-shaped fins positioned and spaced along the heat pipe, the plurality of disc-shaped fins being coaxial with the heat pipe; and A fan is used to drive air between the plurality of disc-shaped fins. The heat exchanger of claim 1, wherein a given fin from the plurality of disc-shaped fins has an inner diameter and an outer diameter, the heat pipe has another radius, and the inner diameter is equal to the other radius. The heat exchanger of claim 2, wherein the inner diameter is between 3 mm and 6 mm and the outer diameter is between 15 mm and 26 mm. The heat exchanger of claim 2, wherein the given fin from the plurality of disc-shaped fins has a surface area between 296 mm ² and 1005 mm ² . The heat exchanger of claim 1, wherein the plurality of disc-shaped fins has a combined surface area between 207.2 m ² and 703.5 m ² . The heat exchanger of claim 1, wherein a distance between a pair of adjacent disc-shaped fins of the plurality of disc-shaped fins is between 1 mm and 30 mm. The heat exchanger of claim 1, wherein the plurality of disc-shaped fins along the heat pipe extend along respective parallel planes. The heat exchanger of claim 1, wherein the heat pipe is a first heat pipe and the plurality of disc-shaped fins is a first plurality of disc-shaped fins, the heat exchanger further includes: a second heat pipe extending away from the body for conducting heat absorbed by the body from the electronic component, the first heat pipe and the second heat pipe being substantially parallel; and A second plurality of disc-shaped fins are positioned and spaced along the second heat pipe, and the second plurality of disc-shaped fins are coaxial with the second heat pipe. The heat exchanger of claim 8, wherein a first disc-shaped fin from the first plurality of disc-shaped fins and a nearest disc-shaped fin from the second plurality of disc-shaped fins A distance between 1 mm and 30 mm. The heat exchanger of claim 8, wherein the fan is configured to generate an air flow around the first heat pipe and the second heat pipe, the first heat pipe and the second heat pipe being disposed with respective first portions facing the air flow. in a row of heat pipes. The heat exchanger of claim 9, wherein the heat exchanger further includes another row of heat pipes, The row and the other row are arranged in a staggered configuration such that another heat pipe from the other row faces a second portion of the airflow passing between the first heat pipe and the second heat pipe. The heat exchanger of claim 1, wherein the electronic component is at least one of a central processing unit (CPU) of the server and a graphics processing unit (GPU) of the server. The heat exchanger of claim 1, wherein the electronic component has an operating temperature of 77 degrees Celsius. The heat exchanger of claim 1, wherein the server is located in a server rack. A heat exchanger for an electronic component of a server, the heat exchanger includes: a body configured to be positioned adjacent the electronic component; a plurality of heat pipes extending away from the body for conducting heat absorbed by the body from the electronic component, the plurality of heat pipes being substantially parallel, Each of the plurality of heat pipes has a respective plurality of fins extending therefrom; a fan for generating an airflow around the plurality of parallel heat pipes, The plurality of heat pipes are arranged in a heat pipe row facing the airflow, A first row and a second row of the rows are arranged in a staggered configuration such that the first row faces the first portion of the airflow and the second row faces the second portion of the airflow, the second portions in Pass between adjacent heat pipes from the first row. The heat exchanger of claim 15, wherein the body has two opposing walls, the first row and the second row extending from a given one of the two opposing walls, a third row of the rows and A fourth column extends from the other of the two opposing walls. The heat exchanger of claim 16, wherein the pitch within a given column of a given column is a given fin of a given heat pipe in the given column and an adjacent heat pipe of one of the given column a distance between the nearest fins, The inner pitch of the first column of the first column is equal to the inner pitch of the second column of the second column, and the inner pitch of the third column of the third column is equal to the inner pitch of the fourth column of the fourth column. The inner pitch of the first column is different from the inner pitch of the third column. The heat exchanger of claim 15, wherein the respective plurality of fins of each of the plurality of heat pipes comprise disc-shaped fins. The heat exchanger of claim 15, wherein the electronic component is at least one of a central processing unit (CPU) of the server and a graphics processing unit (GPU) of the server. The heat exchanger of claim 15, wherein the electronic component has an operating temperature of 77 degrees Celsius.