TW202403256A - Heat diffusion device and electronic appliance - Google Patents
Heat diffusion device and electronic appliance Download PDFInfo
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- TW202403256A TW202403256A TW112119512A TW112119512A TW202403256A TW 202403256 A TW202403256 A TW 202403256A TW 112119512 A TW112119512 A TW 112119512A TW 112119512 A TW112119512 A TW 112119512A TW 202403256 A TW202403256 A TW 202403256A
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- 238000009792 diffusion process Methods 0.000 title claims abstract description 88
- 239000000463 material Substances 0.000 claims description 32
- 230000000149 penetrating effect Effects 0.000 claims description 9
- 238000013459 approach Methods 0.000 abstract description 12
- 239000012530 fluid Substances 0.000 abstract description 9
- 238000004080 punching Methods 0.000 description 40
- 230000004048 modification Effects 0.000 description 33
- 238000012986 modification Methods 0.000 description 33
- 229910052751 metal Inorganic materials 0.000 description 28
- 239000002184 metal Substances 0.000 description 28
- 239000007788 liquid Substances 0.000 description 26
- 238000001704 evaporation Methods 0.000 description 21
- 230000008020 evaporation Effects 0.000 description 20
- 239000000919 ceramic Substances 0.000 description 17
- 238000012546 transfer Methods 0.000 description 15
- 238000005452 bending Methods 0.000 description 14
- 238000012545 processing Methods 0.000 description 12
- 238000003466 welding Methods 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 7
- 239000011888 foil Substances 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 6
- 238000005304 joining Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000007791 liquid phase Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
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- 238000005530 etching Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
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- 230000008569 process Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
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- 238000009826 distribution Methods 0.000 description 2
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- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- -1 composed of these Chemical compound 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
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- 230000010354 integration Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
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- 238000007789 sealing Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
本發明係關於一種熱擴散裝置及電子機器。The present invention relates to a thermal diffusion device and electronic equipment.
近年來,因元件之高積體化及高性能化所致之發熱量增加。又,由於因製品之小型化推進,而發熱密度增加,故散熱對策變重要。該狀況於智慧型手機及平板等移動終端之區域中尤為顯著。作為熱對策構件,多使用石墨片等,但由於該熱輸送量不充分,故探討各種熱對策構件之使用。其中,業界曾推進使用為面狀之熱管之蒸氣腔作為可使熱非常有效地擴散之探討。In recent years, the amount of heat generated has increased due to the high integration and high performance of components. In addition, as the heat density increases due to the miniaturization of products, heat dissipation measures become important. This situation is particularly significant in the area of mobile terminals such as smartphones and tablets. As heat countermeasure members, graphite sheets and the like are often used. However, since the heat transfer capacity is insufficient, the use of various heat countermeasure members has been examined. Among them, the industry has promoted the use of vapor chambers in the form of planar heat pipes to diffuse heat very effectively.
蒸氣腔具有在殼體之內部封入工作媒體(亦稱為工作液)、及藉由毛細管力來輸送工作媒體之芯之構造。工作媒體當在吸收來自電子零件等發熱元件之熱之蒸發部中吸收來自發熱元件之熱並於蒸氣腔內蒸發後,於蒸氣腔內移動且被冷卻並恢復液相。恢復液相之工作媒體藉由芯之毛細管力而再次向發熱元件側之蒸發部移動,將發熱元件冷卻。藉由重複其,而蒸氣腔可於不具有外部動力下獨立地工作,利用工作媒體之蒸發潛熱及凝結潛熱,二維高速地將熱擴散。The vapor chamber has a structure in which a working medium (also called a working fluid) is sealed inside the casing and a core is used to transport the working medium through capillary force. After the working medium absorbs heat from the heating element and evaporates in the vapor chamber in the evaporation section that absorbs heat from the heating element such as electronic parts, it moves in the vapor chamber and is cooled and returns to the liquid phase. The working medium that returns to the liquid phase moves to the evaporation part on the side of the heating element again by the capillary force of the core, cooling the heating element. By repeating this, the vapor chamber can work independently without external power, using the latent heat of evaporation and condensation of the working medium to diffuse heat in two dimensions at a high speed.
於專利文獻1中記載一種蒸氣腔,其包含:殼體,其包含於外緣部接合之對向之上部殼體片材及下部殼體片材,具有內部空間;工作液,其被封入上述內部空間;微通道,其配置於上述下部殼體片材中上述內部空間,構成上述工作液之流路;及片材狀之芯,其配置於上述殼體之上述內部空間,與上述微通道接觸而配置;且上述芯與上述微通道之接觸面積相對於俯視上述內部空間之面積為5%~40%。 [先前技術文獻] [專利文獻]Patent Document 1 describes a vapor chamber that includes a casing that includes an upper casing sheet and a lower casing sheet that are joined at the outer edge and have an internal space; and a working fluid that is enclosed in the above-mentioned casing. Internal space; micro-channels, which are arranged in the internal space of the above-mentioned lower shell sheet and constitute the flow path of the above-mentioned working fluid; and a sheet-shaped core, which is arranged in the above-mentioned internal space of the above-mentioned shell and are connected with the above-mentioned micro channels arranged in contact; and the contact area between the core and the microchannel is 5% to 40% relative to the area of the internal space when viewed from above. [Prior technical documents] [Patent documents]
[專利文獻1]國際公開第2021/229961號[Patent Document 1] International Publication No. 2021/229961
[發明所欲解決之問題][Problem to be solved by the invention]
於專利文獻1所記載之蒸氣腔中,工作液藉由來自密接於下部殼體片材之熱源之熱,於芯之孔中自液體變化為氣體。即,工作液於芯之孔中構成氣液界面。氣化之工作液於殼體之內部空間中放出熱並恢復液體。恢復液體之工作液藉由因芯之孔形成之毛細管力,於微通道中移動,並再次運送至熱源之附近。然而,就擴大殼體之內部空間中供氣化而成為蒸氣之工作液移動之空間即蒸氣空間之點,存在改善之餘地。In the vapor chamber described in Patent Document 1, the working fluid changes from liquid to gas in the hole of the core by heat from a heat source closely connected to the lower case sheet. That is, the working fluid forms a gas-liquid interface in the pores of the core. The vaporized working fluid releases heat and returns to liquid in the internal space of the housing. The working fluid that recovers the liquid moves in the microchannel through the capillary force formed by the holes in the core, and is again transported to the vicinity of the heat source. However, there is room for improvement in terms of enlarging the vapor space in the internal space of the casing for the working fluid that is vaporized to become vapor to move.
此外,上述之問題係不限於蒸氣腔,對於可藉由與蒸氣腔同樣之構成使熱擴散之熱擴散裝置共通之問題。In addition, the above-mentioned problems are not limited to the vapor chamber, but are common to thermal diffusion devices that can diffuse heat by having the same structure as the vapor chamber.
本發明係為了解決上述之問題而完成者,目的在於提供一種可擴大蒸氣空間之熱擴散裝置。進而,本發明之目的在於提供一種具備上述熱擴散裝置之電子機器。 [解決問題之技術手段]The present invention was completed in order to solve the above-mentioned problems, and its object is to provide a heat diffusion device that can expand the vapor space. Furthermore, an object of the present invention is to provide an electronic device provided with the above-mentioned thermal diffusion device. [Technical means to solve problems]
本發明之熱擴散裝置包含:殼體,其具有在厚度方向對向之第1內面及第2內面;工作媒體,其被封入上述殼體之內部空間;及芯,其配置於上述殼體之上述內部空間;且上述芯包含:與上述第1內面相接之支持體、及與上述支持體相接之有孔體;上述芯之緣端以向上述第1內面側接近之方式彎曲。The thermal diffusion device of the present invention includes: a casing having a first inner surface and a second inner surface facing each other in the thickness direction; a working medium sealed in the internal space of the casing; and a core disposed in the casing. The above-mentioned internal space of the body; and the above-mentioned core includes: a support body connected with the above-mentioned first inner surface, and a porous body connected with the above-mentioned support body; the edge end of the above-mentioned core is close to the above-mentioned first inner surface side Way to bend.
本發明之電子機器包含本發明之熱擴散裝置。 [發明之效果]The electronic device of the present invention includes the thermal diffusion device of the present invention. [The effect of the invention]
根據本發明,可提供一種可擴大蒸氣空間之熱擴散裝置。進而,根據本發明,可提供一種包含上述熱擴散裝置之電子機器。According to the present invention, a heat diffusion device capable of expanding the vapor space can be provided. Furthermore, according to the present invention, an electronic device including the above-mentioned thermal diffusion device can be provided.
以下,對於本發明之熱擴散裝置進行說明。 然而,本發明並非係限定於以下之實施形態者,可於不變更本發明之要旨之範圍內適宜變更而應用。此外,將2個以上之以下記載之本發明之各個較佳之構成組合而成者也為本發明。Hereinafter, the thermal diffusion device of the present invention will be described. However, the present invention is not limited to the following embodiments, and can be appropriately modified and applied within the scope that does not change the gist of the present invention. In addition, the present invention also includes a combination of two or more of each preferred configuration of the present invention described below.
以下,作為本發明之熱擴散裝置之一實施形態,以蒸氣腔為例進行說明。本發明之熱擴散裝置亦可應用於熱管等熱擴散裝置。Hereinafter, as an embodiment of the thermal diffusion device of the present invention, a vapor chamber will be described as an example. The thermal diffusion device of the present invention can also be applied to thermal diffusion devices such as heat pipes.
以下所示之圖式係示意性圖式,有其尺寸及縱橫比之比例尺等有時與實際之製品不同。The drawings shown below are schematic drawings, and their dimensions, aspect ratios, etc. may differ from the actual product.
圖1係示意性顯示本發明之熱擴散裝置之一例之立體圖。圖2係沿著圖1所示之熱擴散裝置之II-II線之剖視圖之一例。FIG. 1 is a perspective view schematically showing an example of the heat diffusion device of the present invention. FIG. 2 is an example of a cross-sectional view taken along line II-II of the heat diffusion device shown in FIG. 1 .
圖1及圖2所示之蒸氣腔(熱擴散裝置)1具備被密閉成氣密狀態之中空之殼體10。殼體10具有在厚度方向Z對向之第1內面11a及第2內面12a。蒸氣腔1進一步具備:工作媒體20,其被封入殼體10之內部空間;及芯30,其配置於殼體10之內部空間。The vapor chamber (thermal diffusion device) 1 shown in FIGS. 1 and 2 includes a hollow casing 10 sealed in an airtight state. The housing 10 has a first inner surface 11a and a second inner surface 12a facing each other in the thickness direction Z. The vapor chamber 1 further includes: a working medium 20 sealed in the internal space of the casing 10 ; and a core 30 arranged in the internal space of the casing 10 .
於殼體10設定使封入之工作媒體20蒸發之蒸發部。如圖1所示,於殼體10之外表面,配置發熱元件即熱源(heat source)HS。作為熱源HS,舉出電子機器之電子零件、例如中央處理裝置(CPU)等。殼體10之內部空間中熱源HS之附近且為由熱源HS加熱之部分相當於蒸發部。The casing 10 is provided with an evaporation part for evaporating the enclosed working medium 20 . As shown in FIG. 1 , a heating element (heat source) HS is arranged on the outer surface of the housing 10 . Examples of the heat source HS include electronic components of electronic equipment, such as a central processing unit (CPU). The portion in the inner space of the casing 10 near the heat source HS and heated by the heat source HS corresponds to the evaporation portion.
蒸氣腔1較佳為於整體上為面狀。亦即,殼體10較佳為於整體上為面狀。此處,「面狀」包含板狀及片材狀,意指寬度方向X之尺寸(以下稱為寬度)及長度方向Y之尺寸(以下稱為長度)相對於厚度方向Z之尺寸(以下稱為厚度或高度)相當大之形狀、例如寬度及長度為厚度之10倍以上、較佳為100倍以上之形狀。The steam chamber 1 is preferably planar as a whole. That is, the housing 10 is preferably planar as a whole. Here, "planar shape" includes plate shape and sheet shape, and means that the dimension in the width direction A shape with a considerable thickness or height, such as a shape with a width and length that are more than 10 times the thickness, preferably more than 100 times.
蒸氣腔1之大小、亦即殼體10之大小無特別限定。蒸氣腔1之寬度及長度可根據用途而適宜設定。蒸氣腔1之寬度及長度各自為例如5 mm以上500 mm以下,20 mm以上300 mm以下或50 mm以上200 mm以下。蒸氣腔1之寬度及長度可相同,亦可不同。The size of the steam chamber 1, that is, the size of the housing 10 is not particularly limited. The width and length of the steam chamber 1 can be appropriately set according to the purpose. The width and length of the vapor chamber 1 are, for example, 5 mm to 500 mm, 20 mm to 300 mm, or 50 mm to 200 mm. The width and length of the steam chamber 1 can be the same or different.
殼體10較佳為由外緣部經接合之在厚度方向Z對向之第1片材11及第2片材12構成。第1片材11具有殼體10之第1內面11a。第2片材12具有殼體10之第2內面12a。第1片材11及第2片材12之各自之外緣部藉由接合部13接合。The housing 10 is preferably composed of a first sheet 11 and a second sheet 12 facing each other in the thickness direction Z and having their outer edges joined. The first sheet 11 has the first inner surface 11 a of the housing 10 . The second sheet 12 has the second inner surface 12a of the housing 10. The respective outer edge portions of the first sheet 11 and the second sheet 12 are joined by the joining portion 13 .
於殼體10由第1片材11及第2片材12構成之情形下,構成第1片材11及第2片材12之材料只要為具有適於用作蒸氣腔之特性、例如熱傳導性、強度、柔軟性、可撓曲性等者,則無特別限定。構成第1片材11及第2片材12之材料較佳為金屬,可為例如銅、鎳、鋁、鎂、鈦、鐵、或以其等為主成分之合金等,尤佳為銅。構成第1片材11及第2片材12之材料可相同,亦可不同,較佳為相同。In the case where the housing 10 is composed of the first sheet 11 and the second sheet 12, the materials constituting the first sheet 11 and the second sheet 12 only need to have properties suitable for use as a vapor chamber, such as thermal conductivity. , strength, softness, flexibility, etc. are not particularly limited. The material constituting the first sheet 11 and the second sheet 12 is preferably metal, and may be, for example, copper, nickel, aluminum, magnesium, titanium, iron, or alloys mainly composed of these, and is particularly preferably copper. The materials constituting the first sheet 11 and the second sheet 12 may be the same or different, but are preferably the same.
於殼體10由第1片材11及第2片材12構成之情形下,第1片材11及第2片材12其等之外緣部藉由接合部13接合。上述之接合之方法無特別限定,例如可使用雷射熔接、電阻熔接、擴散接合、釺銲、TIG熔接(鎢-惰性氣體熔接)、超音波接合或樹脂密封,較佳為可使用雷射熔接、電阻熔接或釺銲。When the housing 10 is composed of the first sheet 11 and the second sheet 12 , the outer edge portions of the first sheet 11 and the second sheet 12 are joined by the joint portion 13 . The above-mentioned joining method is not particularly limited. For example, laser welding, resistance welding, diffusion joining, sinter welding, TIG welding (tungsten-inert gas welding), ultrasonic joining or resin sealing can be used. Preferably, laser welding can be used. , resistance welding or welding.
第1片材11及第2片材12之厚度無特別限定,各者較佳為10 μm以上200 μm以下,更佳為30 μm以上100 μm以下,最佳為40 μm以上60 μm以下。第1片材11及第2片材12之厚度可相同,亦可不同。又,第1片材11及第2片材12之各片材之厚度可遍及整體相同,亦可一部分較薄。The thickness of the first sheet 11 and the second sheet 12 is not particularly limited, but each is preferably from 10 μm to 200 μm, more preferably from 30 μm to 100 μm, and most preferably from 40 μm to 60 μm. The thickness of the first sheet 11 and the second sheet 12 may be the same or different. In addition, the thickness of each of the first sheet 11 and the second sheet 12 may be the same throughout, or may be partially thinner.
第1片材11及第2片材12之形狀無特別限定。例如,第1片材11及第2片材12各者可為外緣部較外緣部以外之部分為厚之形狀。The shapes of the first sheet 11 and the second sheet 12 are not particularly limited. For example, each of the first sheet 11 and the second sheet 12 may have a shape in which the outer edge portion is thicker than the portion other than the outer edge portion.
於接合部13中,將第1片材11與第2片材12接合。於接合部13可存在將第1片材11及第2片材12接合後之痕跡。In the joint part 13, the first sheet 11 and the second sheet 12 are joined. The joining portion 13 may have traces of joining the first sheet 11 and the second sheet 12 .
蒸氣腔1整體之厚度無特別限定,較佳為50 μm以上500 μm以下。The overall thickness of the vapor chamber 1 is not particularly limited, but is preferably 50 μm or more and 500 μm or less.
自厚度方向Z觀察到之殼體10之平面形狀無特別限定,例如舉出三角形或矩形等多角形、圓形、橢圓形、及將其等組合而成之形狀等。又,殼體10之平面形狀可為L字型、C字型(コ字型)、階梯型等。又,殼體10可具有貫通口。殼體10之平面形狀可為與蒸氣腔之用途、蒸氣腔之組入部位之形狀、位於附近之其他零件相應之形狀。The planar shape of the housing 10 when viewed from the thickness direction Z is not particularly limited, and examples thereof include polygonal shapes such as triangles and rectangles, circles, ellipses, and combinations thereof. In addition, the planar shape of the housing 10 may be L-shaped, C-shaped (U-shaped), stepped, etc. In addition, the housing 10 may have a through-hole. The planar shape of the housing 10 can be a shape corresponding to the purpose of the steam chamber, the shape of the place where the steam chamber is incorporated, and other nearby components.
工作媒體20只要為於殼體10內之環境下可能產生氣-液之相變化者,則無特別限定,例如可使用水、醇類、替代氟利昂等。例如,工作媒體係水性化合物,較佳為水。The working medium 20 is not particularly limited as long as the gas-liquid phase change may occur under the environment in the casing 10 . For example, water, alcohol, alternative Freon, etc. may be used. For example, the working medium is an aqueous compound, preferably water.
芯30具有可藉由毛細管力使工作媒體20移動之毛細管構造。芯30之毛細管構造可為於先前之蒸氣腔中使用之周知之構造。The core 30 has a capillary structure that can move the working medium 20 by capillary force. The capillary structure of the core 30 may be a well-known structure used in previous vapor chambers.
芯30之大小及形狀無特別限定,例如,較佳為於殼體10之內部空間中連續地配置芯30。可自厚度方向Z觀察,於殼體10之內部空間之整體配置芯30,亦可自厚度方向Z觀察,於殼體10之內部空間之一部分配置芯30。對於殼體10之內部空間中之芯之配置之例,使用圖23、圖24及圖25於後文描述。The size and shape of the core 30 are not particularly limited. For example, it is preferable that the core 30 is continuously arranged in the internal space of the housing 10 . The core 30 can be disposed in the entire internal space of the casing 10 when viewed from the thickness direction Z, or it can be disposed in a part of the internal space of the casing 10 when viewed from the thickness direction Z. Examples of the arrangement of cores in the internal space of the housing 10 will be described later using FIGS. 23 , 24 and 25 .
如圖2所示,芯30包含與第1內面11a相接之支持體31、及與支持體31相接之有孔體32。As shown in FIG. 2 , the core 30 includes a support 31 in contact with the first inner surface 11 a and a porous body 32 in contact with the support 31 .
圖3係圖2之III部分之放大圖。圖3係顯示芯30之緣端之周邊之放大圖。Figure 3 is an enlarged view of part III of Figure 2. FIG. 3 is an enlarged view showing the periphery of the edge of the core 30 .
圖4係顯示圖2之III部分之變化例之放大圖。FIG. 4 is an enlarged view showing a modified example of part III of FIG. 2 .
芯30之緣端以向第1內面11a側接近之方式彎曲。芯30之緣端向圖3及圖4中之下側彎曲。於圖3及圖4所示之芯30中,有孔體32之緣端以向第1內面11a側接近之方式彎曲。The edge end of the core 30 is bent toward the first inner surface 11a side. The edge of the core 30 is bent toward the lower side in FIGS. 3 and 4 . In the core 30 shown in FIGS. 3 and 4 , the edge end of the perforated body 32 is bent toward the first inner surface 11 a side.
若芯30之緣端以向第1內面11a側接近之方式彎曲,則相較於緣端不彎曲之芯,可較芯30之緣端更擴大第2內面12a側之空間,故而可擴大供氣化而成為蒸氣之工作媒體20移動之空間即蒸氣空間。具體而言,於芯30中,與緣端不以向第1內面11a側接近之方式彎曲之芯進行比較,可擴大於圖3及圖4中以R表示之區域作為蒸氣空間。若擴大蒸氣空間,則可提高蒸氣腔1之熱傳導率。If the edge end of the core 30 is bent so as to approach the first inner surface 11a side, compared to a core with an unbent edge end, the space on the second inner surface 12a side can be expanded further than the edge end of the core 30, so it can The space in which the working medium 20 that expands the gas supply and becomes vapor moves is the vapor space. Specifically, in the core 30 , compared with a core in which the edge is not bent so as to approach the first inner surface 11 a side, the area indicated by R in FIGS. 3 and 4 can be expanded as the vapor space. If the vapor space is enlarged, the thermal conductivity of the vapor chamber 1 can be increased.
芯30之緣端例如可藉由進行沖切加工,而以向第1內面11a側接近之方式彎曲。於芯30由陶瓷多孔質燒結體等多孔質燒結體構成之情形下,可印刷糊狀之材料,在進行沖切加工之後,進行煅燒,藉此,將芯30之緣端以向第1內面11a側接近之方式彎曲。或,可預先較厚地製作多孔質燒結體,並藉由蝕刻処理等去除多孔質燒結體之一部分,藉此,將芯30之緣端以向第1內面11a側接近之方式彎曲。The edge end of the core 30 can be bent so as to approach the first inner surface 11a side by performing a punching process, for example. In the case where the core 30 is made of a porous sintered body such as a ceramic porous sintered body, a paste-like material can be printed, punched and then fired, whereby the edge of the core 30 can be directed toward the first inner surface. It is curved so that the surface 11a side approaches. Alternatively, the porous sintered body may be made thick in advance, and a part of the porous sintered body may be removed by etching or the like, thereby bending the edge of the core 30 toward the first inner surface 11a side.
芯30之緣端之形狀只要以向第1內面11a側接近之方式彎曲即可,無特別限定。The shape of the edge of the core 30 is not particularly limited as long as it is curved so as to approach the first inner surface 11a side.
於圖3及圖4所示之例中,芯30之緣端於沿著厚度方向Z之剖面中,以向第1內面11a側接近之方式曲線狀彎曲。該情形下,芯30之緣端較佳為如圖3及圖4所示般為向第2內面12a側(上側)凸起之形狀。芯30之緣端於在沿著厚度方向Z之剖面中曲線狀彎曲之情形下,可以曲率為一定之方式彎曲,亦可一面曲率發生變化,一面彎曲。又,芯30之緣端可於沿著厚度方向Z之剖面中,以向第1內面11a側接近之方式,於規定之位置直線狀彎折。In the example shown in FIGS. 3 and 4 , the edge of the core 30 is curved in a cross-section along the thickness direction Z so as to approach the first inner surface 11 a side. In this case, it is preferable that the edge end of the core 30 has a shape convex toward the second inner surface 12a side (upper side) as shown in FIGS. 3 and 4 . When the edge of the core 30 is curved in the cross section along the thickness direction Z, it may be bent in a constant curvature, or it may be bent while the curvature changes. In addition, the edge end of the core 30 can be linearly bent at a predetermined position in a cross section along the thickness direction Z so as to approach the first inner surface 11a side.
如圖3所示,於沿著厚度方向Z之剖面中,較佳為在芯30之緣端與殼體10之內緣之間,在垂直於厚度方向Z之方向存在間隙。亦即,於沿著厚度方向Z之剖面中,較佳為芯30之緣端與殼體10之內緣不相接。以下,說明藉由在沿著厚度方向Z之剖面中,在芯30之緣端與殼體10之內緣之間在垂直於厚度方向Z之方向存在間隙而形成之效果。As shown in FIG. 3 , in the cross section along the thickness direction Z, it is preferable that there is a gap between the edge end of the core 30 and the inner edge of the housing 10 in the direction perpendicular to the thickness direction Z. That is, in the cross section along the thickness direction Z, it is preferable that the edge end of the core 30 does not contact the inner edge of the housing 10 . Hereinafter, the effect produced by having a gap in the direction perpendicular to the thickness direction Z between the edge end of the core 30 and the inner edge of the housing 10 in the cross section along the thickness direction Z will be described.
於蒸氣腔1中,在蒸氣空間中殼體10之內緣附近之部分中,成為蒸氣之工作媒體20藉由與殼體10之內緣相接而容易成為液體。因而,於在沿著厚度方向Z之剖面中,芯30之緣端與殼體10之內緣相接之情形下,有因液體之工作媒體20積存於芯30之緣端與殼體10之內緣相接之部分附近之蒸氣空間而蒸氣空間變窄之虞。針對於此,若於沿著厚度方向Z之剖面中,在芯30之緣端與殼體10之內緣之間在垂直於厚度方向Z之方向存在間隙,則液體之工作媒體20可通過芯30之緣端與殼體10之內緣之間隙移動至液體流路,故而可防止因液體之工作媒體20積存於蒸氣空間而蒸氣空間變窄。In the vapor chamber 1, in the portion of the vapor space near the inner edge of the casing 10, the working medium 20 that becomes vapor easily becomes liquid by being in contact with the inner edge of the casing 10. Therefore, in the case where the edge of the core 30 is in contact with the inner edge of the casing 10 in the cross section along the thickness direction Z, the liquid working medium 20 is accumulated between the edge of the core 30 and the casing 10 There is a risk that the vapor space will become narrower near the portion where the inner edges are connected. In view of this, if in the cross section along the thickness direction Z, there is a gap between the edge end of the core 30 and the inner edge of the housing 10 in the direction perpendicular to the thickness direction Z, then the liquid working medium 20 can pass through the core The gap between the edge of 30 and the inner edge of the housing 10 is moved to the liquid flow path, thereby preventing the vapor space from being narrowed due to the accumulation of the liquid working medium 20 in the vapor space.
芯30之緣端與殼體10之內緣之距離(圖3中以A表示之長度)較佳為例如10 μm以上。若芯30之緣端與殼體10之內緣之距離(圖3中以A表示之長度)為10 μm以上,則可進一步有效率地防止因液體之工作媒體20積存於蒸氣空間而蒸氣空間變窄。另一方面,芯30之緣端與殼體10之內緣之距離(圖3中以A表示之長度)較佳為500 μm以下。The distance between the edge of the core 30 and the inner edge of the housing 10 (the length indicated by A in FIG. 3 ) is preferably, for example, 10 μm or more. If the distance between the edge of the core 30 and the inner edge of the casing 10 (the length indicated by A in Figure 3) is 10 μm or more, it can further effectively prevent the liquid working medium 20 from accumulating in the vapor space and causing the vapor space to collapse. Narrow. On the other hand, the distance between the edge of the core 30 and the inner edge of the housing 10 (the length indicated by A in FIG. 3 ) is preferably 500 μm or less.
如圖4所示般,於沿著厚度方向Z之剖面中,可在芯30之緣端與殼體10之內緣之間在垂直於厚度方向Z之方向不存在間隙。於圖4中,芯30之緣端與殼體10之內緣相接。此外,於如圖4所示般芯30之緣端與殼體10之內緣相接之情形下,芯30之緣端與殼體10之內緣之距離為0 μm。As shown in FIG. 4 , in the cross section along the thickness direction Z, there may be no gap between the edge end of the core 30 and the inner edge of the housing 10 in the direction perpendicular to the thickness direction Z. In FIG. 4 , the edge end of the core 30 is connected to the inner edge of the housing 10 . In addition, when the edge end of the core 30 is in contact with the inner edge of the housing 10 as shown in FIG. 4 , the distance between the edge end of the core 30 and the inner edge of the housing 10 is 0 μm.
芯30之緣端與構成芯30之緣端以外之部分之厚度方向Z之距離、即芯30之緣端之彎曲高度(圖3中以B表示之距離)無特別限定,例如可為1 μm以上、100 μm以下。The distance in the thickness direction Z between the edge end of the core 30 and the portion constituting the core 30 other than the edge end, that is, the bending height of the edge end of the core 30 (the distance represented by B in FIG. 3 ) is not particularly limited, and may be, for example, 1 μm. Above, below 100 μm.
沿著厚度方向Z之剖面中之芯30之緣端以向第2內面12a側接近之方式彎曲之部分處之垂直於厚度方向Z之方向上之長度、即芯30之緣端之彎曲寬度(圖3中以C表示之長度)無特別限定,例如可為1 μm以上、1000 μm以下。於圖3中,芯30之緣端之彎曲寬度為寬度方向X上之長度。The length of the portion of the edge of the core 30 in the cross section along the thickness direction Z that is bent toward the second inner surface 12a side in the direction perpendicular to the thickness direction Z is the bending width of the edge of the core 30 (The length represented by C in FIG. 3) is not particularly limited, and may be, for example, 1 μm or more and 1000 μm or less. In FIG. 3 , the bending width of the edge end of the core 30 is the length in the width direction X.
可僅芯30之緣端中之一部分以向第1內面11a側接近之方式彎曲,但基於擴大蒸氣空間之觀點,較佳為芯30之緣端之整體以向第1內面11a側接近之方式彎曲。Only a part of the edge of the core 30 may be bent toward the first inner surface 11a side. However, from the viewpoint of expanding the vapor space, it is preferable that the entire edge of the core 30 be bent toward the first inner surface 11a side. way to bend.
第1片材11與第2片材12之接合部13較佳為在厚度方向Z上位於與芯30之緣端不同之位置。若第1片材11與第2片材12之接合部13在厚度方向Z上位於與芯30之緣端相同之位置,則於蒸氣腔之製造過程中,在將第1片材11與第2片材12接合時,因芯30進入接合部13,而作為芯30發揮功能之部分減少,故而有最大熱輸送量降低之虞。針對於此,若第1片材11與第2片材12之接合部13在厚度方向Z上位於與芯30之緣端不同之位置,則可防止芯30之緣端進入接合部13,故而可防止於蒸氣腔1中最大熱輸送量降低。The joint portion 13 of the first sheet 11 and the second sheet 12 is preferably located at a position different from the edge end of the core 30 in the thickness direction Z. If the joint 13 of the first sheet 11 and the second sheet 12 is located at the same position as the edge of the core 30 in the thickness direction Z, then during the manufacturing process of the steam chamber, the first sheet 11 and the second sheet 12 are When the 2 sheets 12 are joined, the core 30 enters the joint portion 13 and the portion that functions as the core 30 is reduced, so the maximum heat transfer amount may be reduced. In this regard, if the joint portion 13 of the first sheet 11 and the second sheet 12 is located at a different position from the edge end of the core 30 in the thickness direction Z, the edge end of the core 30 can be prevented from entering the joint portion 13. Therefore, It can prevent the maximum heat transfer capacity in the steam chamber 1 from being reduced.
於圖3及圖4中,第1片材11與第2片材12之接合部13在厚度方向Z上位於芯30之緣端與殼體10之第2內面12a之間,但芯30之緣端可在厚度方向Z上位於第1片材11與第2片材12之接合部13與殼體10之第2內面12a之間。In Figures 3 and 4, the joint 13 of the first sheet 11 and the second sheet 12 is located between the edge end of the core 30 and the second inner surface 12a of the housing 10 in the thickness direction Z, but the core 30 The edge end may be located between the joint portion 13 of the first sheet 11 and the second sheet 12 and the second inner surface 12a of the housing 10 in the thickness direction Z.
圖5係示意性顯示構成圖2所示之熱擴散裝置之芯之一例之將一部分放大之剖視圖。圖6係自支持體側觀察圖5所示之芯之俯視圖。FIG. 5 is a partially enlarged cross-sectional view schematically showing an example of the core constituting the heat diffusion device shown in FIG. 2 . Fig. 6 is a top view of the core shown in Fig. 5 viewed from the support side.
於芯30中,例如藉由利用沖切加工等使金屬箔之一部分彎曲並凹入,而於凹入之部分形成有支持體31。由於在支持體31之凹入之部分形成蒸氣空間,故熱傳導率提高。不限於圖5所示之例,於對金屬箔進行沖切加工時,根據沖切加工之狀況,可在將金屬箔之一部分彎曲時,在凹入之部分形成貫通孔。In the core 30, a part of the metal foil is bent and recessed by, for example, punching processing, and the support 31 is formed in the recessed part. Since the vapor space is formed in the recessed portion of the support 31, the thermal conductivity is improved. Not limited to the example shown in FIG. 5 , when punching metal foil, depending on the conditions of the punching process, a through hole may be formed in the recessed portion when bending a part of the metal foil.
進行沖切加工等之前之金屬箔之厚度較佳為一定。惟,於彎曲之部分中,金屬箔亦有時變薄。根據以上事實,於芯30中,較佳為支持體31之厚度與有孔體32之厚度相同、或較有孔體32之厚度為小。The thickness of the metal foil before punching processing etc. is preferably kept constant. However, the metal foil sometimes becomes thinner in the curved portion. Based on the above facts, in the core 30 , it is preferable that the thickness of the support body 31 is the same as the thickness of the porous body 32 , or is smaller than the thickness of the porous body 32 .
於芯30中,有孔體32係由與支持體31相同之材料構成。In the core 30 , the porous body 32 is made of the same material as the support 31 .
於芯30中,將支持體31及有孔體32一體地構成。於本說明書中,「將支持體31及有孔體32一體地構成」意指在支持體31與有孔體32之間不存在界面,具體而言,意指在支持體31與有孔體32之間無法判別出邊界。In the core 30, the support body 31 and the porous body 32 are integrally formed. In this specification, "the support 31 and the porous body 32 are integrally formed" means that there is no interface between the support 31 and the porous body 32. Specifically, it means that there is no interface between the support 31 and the porous body. There is no boundary between 32 and 32.
於芯30中,支持體31如例如圖8所示般包含複數個柱狀構件。藉由在柱狀構件之間保持液相之工作媒體20,而可提高蒸氣腔1之熱輸送性能。此處,「柱狀」意指底面之長邊之長度之比相對於底面之短邊之長度未達5倍之形狀。In the core 30 , the support 31 includes a plurality of columnar members as shown in FIG. 8 , for example. By maintaining the liquid phase working medium 20 between the columnar members, the heat transfer performance of the vapor chamber 1 can be improved. Here, "columnar" means a shape in which the ratio of the length of the long side of the base is less than 5 times the length of the short side of the base.
柱狀構件之形狀無特別限定,例如舉出圓柱形狀、角柱形狀、圓錐台形狀、角錐台形狀等形狀。The shape of the columnar member is not particularly limited, and examples include a cylindrical shape, a rectangular prism shape, a truncated cone shape, a truncated cone shape, and the like.
支持體31之形狀無特別限定,較佳為如圖2及圖5所示般,支持體31具有寬度自有孔體32向第1內面11a變窄之錐形形狀。藉此,可抑制有孔體32向支持體31之間之落入,且於殼體10側擴大支持體31之間之流路。其結果,透過率上升,最大熱輸送量變大。The shape of the support 31 is not particularly limited, but it is preferably a tapered shape in which the width of the support 31 becomes narrower from the porous body 32 toward the first inner surface 11 a as shown in FIGS. 2 and 5 . This prevents the porous body 32 from falling between the supports 31 and expands the flow path between the supports 31 on the housing 10 side. As a result, the transmittance increases and the maximum heat transfer amount becomes larger.
支持體31之配置無特別限定,較佳為於規定之區域中均等地配置,更佳為遍及整體而均等地配置,例如以支持體31之中心間距離(節距)為一定之方式配置。The arrangement of the supports 31 is not particularly limited, but it is preferably arranged evenly in a predetermined area, more preferably evenly throughout the whole, for example, the distance (pitch) between the centers of the supports 31 is constant.
支持體31之中心間距離(圖6中以P 31表示之長度)例如為60 μm以上800 μm以下。支持體31之寬度(圖6中以W 31表示之長度)例如為20 μm以上500 μm以下。支持體31之高度(圖5中以T 31表示之長度)例如為10 μm以上100 μm以下。支持體31之垂直於高度方向之剖面之圓相當直徑例如為20 μm以上500 μm以下。 The distance between the centers of the supports 31 (length represented by P 31 in FIG. 6 ) is, for example, 60 μm or more and 800 μm or less. The width of the support 31 (length represented by W 31 in FIG. 6 ) is, for example, 20 μm or more and 500 μm or less. The height of the support 31 (length represented by T 31 in FIG. 5 ) is, for example, 10 μm or more and 100 μm or less. The circular equivalent diameter of the cross section perpendicular to the height direction of the support 31 is, for example, 20 μm or more and 500 μm or less.
於圖5所示之例中,芯30之緣端之彎曲高度(圖5中以B表示之距離)較支持體31之高度(圖5中以T 31表示之長度)為小。 In the example shown in FIG. 5 , the bending height of the edge end of the core 30 (the distance represented by B in FIG. 5 ) is smaller than the height of the support 31 (the length represented by T 31 in FIG. 5 ).
芯30之緣端處之彎曲寬度(圖5及圖6中以C表示之距離)可較支持體31之寬度(圖6中以W 31表示之長度)為小,亦可較其為大,還可與其相同。 The bending width at the edge of the core 30 (the distance represented by C in Figures 5 and 6) can be smaller or larger than the width of the support 31 (the length represented by W31 in Figure 6). It can also be the same.
於芯30中,有孔體32可具有沿著厚度方向Z貫通之貫通孔33。於貫通孔33內,工作媒體20可藉由毛細現象而移動。貫通孔33較佳為自厚度方向Z觀察設置於支持體31不存在之部分。貫通孔33之形狀無特別限定,垂直於厚度方向Z之面中之剖面較佳為圓形或橢圓形。In the core 30 , the porous body 32 may have a through hole 33 penetrating along the thickness direction Z. In the through hole 33, the working medium 20 can move by capillary phenomenon. The through-hole 33 is preferably provided in a non-existent portion of the support 31 when viewed from the thickness direction Z. The shape of the through hole 33 is not particularly limited, but the cross section in the plane perpendicular to the thickness direction Z is preferably circular or elliptical.
有孔體32之貫通孔33之配置無特別限定,較佳為於規定之區域中均等地配置,更佳為遍及整體而均等地配置,例如以有孔體32之貫通孔33之中心間距離(節距)為一定之方式配置。The arrangement of the through-holes 33 of the perforated body 32 is not particularly limited. It is preferably arranged evenly in a predetermined area, and more preferably it is evenly arranged throughout the entire body. For example, the distance between the centers of the through-holes 33 of the perforated body 32 is (Pitch) is configured in a certain way.
有孔體32之貫通孔33之中心間距離(圖6中以P 33表示之長度)例如為3 μm以上150 μm以下。貫通孔33之直徑(圖6中以ϕ 33表示之長度)例如為100 μm以下。有孔體32之厚度(圖5中以T 32表示之長度)例如為5 μm以上50 μm以下。 The distance between the centers of the through holes 33 of the porous body 32 (length represented by P 33 in FIG. 6 ) is, for example, 3 μm or more and 150 μm or less. The diameter of the through hole 33 (length represented by ϕ 33 in FIG. 6 ) is, for example, 100 μm or less. The thickness of the porous body 32 (length represented by T 32 in FIG. 5 ) is, for example, 5 μm or more and 50 μm or less.
芯30之緣端之彎曲高度(圖5中以B表示之距離)可較有孔體32之厚度(圖5中以T 32表示之長度)為小,亦可較其為大,還可與其相同。 The bending height of the edge of the core 30 (the distance represented by B in Figure 5) can be smaller than the thickness of the porous body 32 (the length represented by T32 in Figure 5), can also be greater, or can be compared with the thickness of the porous body 32. same.
芯30之緣端之彎曲寬度(圖5及圖6中以C表示之距離)可較貫通孔33之直徑(圖6中以ϕ 33表示之長度)為小,亦可較其為大,還可與其相同。 The bending width of the edge of the core 30 (the distance represented by C in Figures 5 and 6) can be smaller than the diameter of the through hole 33 (the length represented by ϕ33 in Figure 6), or can be larger, or it can be larger. Can be the same as it.
貫通孔33例如可藉由對構成有孔體32之金屬等進行藉由沖切加工進行之沖壓來製作。芯30可藉由總括進行形成支持體31之沖切加工、及形成貫通孔33之沖切加工而形成。The through hole 33 can be produced, for example, by punching metal or the like constituting the porous body 32 by punching. The core 30 can be formed by collectively performing punching processing to form the support 31 and punching processing to form the through-hole 33 .
如圖2所示,蒸氣腔1可進一步具備支柱40,該支柱40以與殼體10之第2內面12a相接之方式配置於內部空間。藉由在殼體10之內部空間配置支柱40,而可支持殼體10及芯30。As shown in FIG. 2 , the vapor chamber 1 may further include a support column 40 disposed in the internal space so as to be in contact with the second inner surface 12 a of the housing 10 . By arranging the pillars 40 in the internal space of the housing 10, the housing 10 and the core 30 can be supported.
構成支柱40之材料無特別限定,例如舉出樹脂、金屬、陶瓷、或其等之混合物、積層物等。又,支柱40可與殼體10為一體,例如,可藉由對殼體10之第2內面12a進行蝕刻加工等而形成。The material constituting the support 40 is not particularly limited, and examples thereof include resin, metal, ceramics, mixtures and laminates thereof, and the like. In addition, the pillar 40 may be integrated with the housing 10, and may be formed by etching the second inner surface 12a of the housing 10, for example.
支柱40之形狀只要為可支持殼體10及芯30之形狀,則無特別限定,作為支柱40之垂直於高度方向之剖面之形狀,例如舉出矩形等多角形、圓形、橢圓形等。The shape of the support 40 is not particularly limited as long as it can support the housing 10 and the core 30 . Examples of the shape of the cross section of the support 40 perpendicular to the height direction include polygons such as rectangles, circles, and ellipses.
支柱40之高度於一蒸氣腔中,可相同,亦可不同。The heights of the pillars 40 in a steam chamber can be the same or different.
支柱40之高度例如可為50 μm以上1000 μm以下。The height of the pillar 40 may be, for example, 50 μm or more and 1000 μm or less.
支柱40之高度較佳為較支持體31之高度為大。The height of the pillar 40 is preferably greater than the height of the support body 31 .
於圖2所示之剖面中,支柱40之寬度只要為賦予可抑制殼體10之變形之強度者,則無特別限定,支柱40之端部之垂直於高度方向之剖面之圓相當直徑為例如100 μm以上2000 μm以下,較佳為300 μm以上1000 μm以下。藉由增大支柱40之圓相當直徑,可進一步抑制殼體10之變形。另一方面,藉由減小支柱40之圓相當直徑,可將用於供工作媒體20之蒸氣移動之空間確保為更寬廣。In the cross section shown in FIG. 2 , the width of the pillar 40 is not particularly limited as long as it provides strength that can suppress the deformation of the housing 10 . The circular equivalent diameter of the cross section perpendicular to the height direction of the end of the pillar 40 is, for example, 100 μm or more and 2000 μm or less, preferably 300 μm or more and 1000 μm or less. By increasing the circle equivalent diameter of the pillar 40, the deformation of the housing 10 can be further suppressed. On the other hand, by reducing the circle equivalent diameter of the support 40, a wider space for the vapor of the working medium 20 to move can be ensured.
支柱40之垂直於高度方向之剖面之圓相當直徑較佳為較支持體31之垂直於高度方向之剖面之圓相當直徑為大。The circular equivalent diameter of the cross section perpendicular to the height direction of the support 40 is preferably larger than the circular equivalent diameter of the support body 31 of the cross section perpendicular to the height direction.
支柱40之配置無特別限定,但較佳為於特定之區域中均等地配置,更佳為遍及整體而均等地配置,例如以支柱40間之距離為一定之方式配置。藉由將支柱40均等地配置,而可遍及蒸氣腔1之整體地確保均一之強度。The arrangement of the pillars 40 is not particularly limited, but it is preferably arranged evenly in a specific area, more preferably evenly throughout the whole, for example, the distance between the pillars 40 is constant. By arranging the pillars 40 evenly, uniform strength can be ensured throughout the entire vapor chamber 1 .
彼此相鄰之支柱40彼此之中心間距離例如可為100 μm以上5000 μm以下。The distance between the centers of adjacent pillars 40 may be, for example, 100 μm or more and 5000 μm or less.
彼此相鄰之支柱40彼此之中心間距離較佳為較彼此相鄰之支持體31彼此之中心間距離為大。於支持體31包含複數個柱狀構件之情形下,彼此相鄰之支柱40彼此之中心間距離較佳為較彼此相鄰之柱狀構件彼此之中心間距離為大。The distance between the centers of adjacent pillars 40 is preferably larger than the distance between the centers of adjacent supports 31 . In the case where the support body 31 includes a plurality of columnar members, the distance between the centers of adjacent pillars 40 is preferably larger than the distance between the centers of adjacent columnar members.
圖7係示意性顯示芯之第1變化例之將一部分放大之剖視圖。FIG. 7 is a partially enlarged cross-sectional view of the first variation of the schematic display core.
此外,於圖7至圖9所示之剖視圖中,為使芯之變化例之說明簡單,而未圖示芯之緣端之樣態。圖7至圖9所示之剖視圖中之芯之緣端之形狀可與圖5所示之剖視圖中之芯30之緣端之形狀相同。In addition, in the cross-sectional views shown in FIGS. 7 to 9 , in order to simplify the explanation of variations of the core, the edge end of the core is not shown. The shape of the edge end of the core in the cross-sectional view shown in FIGS. 7 to 9 may be the same as the shape of the edge end of the core 30 in the cross-sectional view shown in FIG. 5 .
於圖7所示之芯30A中,支持體31不凹入。In the core 30A shown in Figure 7, the support 31 is not recessed.
於圖7所示之芯30A中,有孔體32係由與支持體31相同之材料構成。於有孔體32由與支持體31相同之材料構成之情形下,構成支持體31及有孔體32之材料無特別限定,例如舉出樹脂、金屬、陶瓷、或其等之混合物、積層物等。構成支持體31及有孔體32之材料較佳為金屬。In the core 30A shown in FIG. 7 , the porous body 32 is made of the same material as the support 31 . When the porous body 32 is made of the same material as the support 31, the material constituting the support 31 and the porous body 32 is not particularly limited, and examples thereof include resin, metal, ceramics, or mixtures and laminates thereof. wait. The material constituting the support body 31 and the porous body 32 is preferably metal.
於芯30A中,可將支持體31及有孔體32一體地構成。In the core 30A, the support body 31 and the porous body 32 can be integrally formed.
將支持體31及有孔體32一體地構成之芯30A例如可藉由蝕刻技術、利用多層塗佈進行之印刷技術、其他多層技術等來製作。The core 30A in which the support 31 and the porous body 32 are integrated can be produced by, for example, etching technology, printing technology using multi-layer coating, or other multi-layer technology.
於芯30A中,在有孔體32係由與支持體31相同之材料構成之情形下,可不將支持體31及有孔體32一體地構成。例如,由於作為支持體31之銅柱、與作為有孔體32之銅網於以擴散接合或點熔接等固定之芯30A中,難以在支持體31與有孔體32之間遍及全面地接合,故於支持體31與有孔體32之間之一部分產生間隙。於如此之芯30A中,由於在支持體31與有孔體32之間能夠判別出邊界,故有孔體32係由與支持體31相同之材料構成,但支持體31與有孔體32不一體地構成。In the core 30A, when the porous body 32 is made of the same material as the support 31, the support 31 and the porous body 32 do not need to be integrally formed. For example, since the copper pillars as the support 31 and the copper mesh as the porous body 32 are fixed in the core 30A by diffusion bonding or point welding, it is difficult to fully join the support 31 and the porous body 32 . , so a gap is generated in a part between the support body 31 and the porous body 32 . In such a core 30A, since a boundary can be distinguished between the support body 31 and the porous body 32, the porous body 32 is made of the same material as the support body 31, but the support body 31 and the porous body 32 are different. Constructed in one piece.
圖8係示意性顯示芯之第2變化例之將一部分放大之剖視圖。FIG. 8 is a partially enlarged cross-sectional view of a second modification example of the schematic display core.
於圖8所示之芯30B中,支持體31不凹入。In the core 30B shown in Figure 8, the support 31 is not recessed.
於圖8所示之芯30B中,支持體31及有孔體32係由多孔質體構成。藉由不僅有孔體32,而且支持體31亦由多孔質體構成,而可提高芯30B之毛細管力。In the core 30B shown in FIG. 8 , the support 31 and the porous body 32 are made of porous bodies. Since not only the porous body 32 but also the supporting body 31 is made of a porous body, the capillary force of the core 30B can be improved.
作為構成支持體31及有孔體32之多孔質體,例如舉出金屬多孔質燒結體、陶瓷多孔質燒結體等多孔質燒結體、或金屬多孔體、陶瓷多孔體、樹脂多孔體等多孔體。Examples of the porous body constituting the support 31 and the porous body 32 include porous sintered bodies such as metal porous sintered bodies and ceramic porous sintered bodies, or porous bodies such as metal porous bodies, ceramic porous bodies, and resin porous bodies. .
由多孔質體構成之芯30B例如可藉由利用使用金屬膏糊或陶瓷膏糊之多層塗佈進行之印刷技術等來製作。此時,用於形成支持體31之膏糊中之金屬或陶瓷之含有量可與用於形成有孔體32之膏糊中之金屬或陶瓷之含有量相同,亦可較用於形成有孔體32之膏糊中之金屬或陶瓷之含有量為少,還可較用於形成有孔體32之膏糊中之金屬或陶瓷之含有量為多。例如,藉由使用於形成支持體31之膏糊中之金屬或陶瓷之含有量較用於形成有孔體32之膏糊中之金屬或陶瓷之含有量為多,而可使支持體31之密度較有孔體32之密度為大。其結果,可提高支持體31之強度。The core 30B made of a porous body can be produced by, for example, a printing technique using multi-layer coating using a metal paste or a ceramic paste. At this time, the content of the metal or ceramic in the paste used to form the support 31 may be the same as the content of the metal or ceramic in the paste used to form the porous body 32, or may be greater than that used to form the porous body 32. The content of metal or ceramic in the paste for the body 32 may be less, or may be greater than the content of metal or ceramic in the paste used to form the porous body 32 . For example, the content of the metal or ceramic in the paste used to form the support 31 is greater than the content of metal or ceramic in the paste used to form the porous body 32, so that the support 31 can be made more durable. The density is greater than that of the porous body 32 . As a result, the strength of the support 31 can be improved.
由多孔質體構成之有孔體32可具有沿著厚度方向Z貫通之貫通孔33。由多孔質體構成之有孔體32可不具有沿著厚度方向Z貫通之貫通孔33。The porous body 32 made of a porous body may have a through hole 33 penetrating along the thickness direction Z. The porous body 32 made of a porous body does not need to have the through-hole 33 penetrating along the thickness direction Z.
圖9係示意性顯示芯之第3變化例之將一部分放大之剖視圖。FIG. 9 is a partially enlarged cross-sectional view of a third modification example of the schematic display core.
於圖9所示之芯30C中,支持體31不凹入。In the core 30C shown in Figure 9, the support 31 is not recessed.
於圖9所示之芯30C中,有孔體32係由與支持體31不同之材料構成。In the core 30C shown in FIG. 9 , the porous body 32 is made of a different material from the support 31 .
於支持體31與有孔體32由不同之材料構成之情形下,構成支持體31之材料無特別限定,例如舉出樹脂、金屬、陶瓷、或其等之混合物、積層物等。構成有孔體32之材料無特別限定,例如舉出樹脂、金屬、陶瓷、或其等之混合物、積層物等。When the support 31 and the porous body 32 are made of different materials, the material constituting the support 31 is not particularly limited, and examples thereof include resin, metal, ceramics, mixtures, and laminates thereof. The material constituting the porous body 32 is not particularly limited, and examples thereof include resin, metal, ceramics, mixtures and laminates thereof, and the like.
支持體31與有孔體32由不同之材料構成之芯30C例如可藉由利用使用金屬膏糊或陶瓷膏糊之多層塗佈進行之印刷技術等來製作。The core 30C in which the support 31 and the porous body 32 are made of different materials can be produced by, for example, printing technology using multi-layer coating using metal paste or ceramic paste.
於有孔體32由與支持體31不同之材料構成之情形下,支持體31與有孔體32可以擴散接合或點熔接等固定。When the porous body 32 is made of a different material from the support body 31 , the support body 31 and the porous body 32 can be fixed by diffusion bonding or point welding.
於芯30C中,例如,有孔體32係由多孔質體構成。In the core 30C, the porous body 32 is composed of a porous body, for example.
作為構成有孔體32之多孔質體,例如舉出金屬多孔質燒結體、陶瓷多孔質燒結體等多孔質燒結體、或金屬多孔體、陶瓷多孔體、樹脂多孔體等多孔體。Examples of the porous body constituting the porous body 32 include porous sintered bodies such as metal porous sintered bodies and ceramic porous sintered bodies, or porous bodies such as metal porous bodies, ceramic porous bodies, and resin porous bodies.
由多孔質體構成之有孔體32可具有沿著厚度方向Z貫通之貫通孔33。由多孔質體構成之有孔體32可不具有沿著厚度方向Z貫通之貫通孔33。The porous body 32 made of a porous body may have through-holes 33 penetrating along the thickness direction Z. The porous body 32 made of a porous body does not need to have the through-hole 33 penetrating along the thickness direction Z.
圖10A係示意性顯示芯之第4變化例之將一部分放大之剖視圖。圖10B係示意性顯示自有孔體側觀察圖10A所示之芯時之於貫通孔、凸部及凸部附近之蒸氣之流動之俯視圖。FIG. 10A is a partially enlarged cross-sectional view of a fourth modification example of the schematic display core. FIG. 10B is a plan view schematically showing the flow of vapor in the through holes, the convex portions, and the vicinity of the convex portions when the core shown in FIG. 10A is viewed from the porous body side.
於圖10A所示之芯30D中,在貫通孔33之周緣,在接近第2內面12a之方向設置有凸部34。In the core 30D shown in FIG. 10A , a convex portion 34 is provided on the periphery of the through hole 33 in a direction approaching the second inner surface 12 a.
凸部34具有第1內面11a側之第1端部35及第2內面12a側之第2端部36。The convex portion 34 has a first end portion 35 on the first inner surface 11a side and a second end portion 36 on the second inner surface 12a side.
以下,說明藉由在貫通孔33之周緣中在接近第2內面12a之方向設置有凸部34而形成之效果。於熱源HS中蒸發之工作媒體20以蒸氣之狀態於有孔體32與第2內面12a之間之空間中向遠離熱源HS之方向流動。如圖10B所示,若於貫通孔33之周緣中在接近第2內面12a之方向設置有凸部34,則於有孔體32與第2內面12a之間之空間中流動之蒸氣以於凸部34之外周緣迂回之方式流動。因而,可防止蒸氣之流動與貫通孔33內之工作媒體20之液面直接接觸。因此,芯30之毛細管力可降低蒸氣向反向之流動、所謂之逆流之影響。因而,可提高蒸氣腔1之最大熱輸送量。Hereinafter, the effect produced by providing the convex portion 34 in the direction close to the second inner surface 12a on the periphery of the through hole 33 will be described. The working medium 20 evaporated in the heat source HS flows in a vapor state in the space between the porous body 32 and the second inner surface 12a in a direction away from the heat source HS. As shown in FIG. 10B , if a protrusion 34 is provided on the periphery of the through hole 33 in a direction approaching the second inner surface 12 a , the vapor flowing in the space between the perforated body 32 and the second inner surface 12 a will be It flows in a roundabout manner at the outer periphery of the convex portion 34 . Therefore, the flow of steam can be prevented from directly contacting the liquid surface of the working medium 20 in the through hole 33 . Therefore, the capillary force of the core 30 can reduce the influence of the flow of vapor in the opposite direction, the so-called countercurrent. Therefore, the maximum heat transfer capacity of the steam chamber 1 can be increased.
凸部34較佳為設置於貫通孔33之周緣整體。凸部34可僅設置於貫通孔33之周緣之一部分。The convex portion 34 is preferably provided on the entire peripheral edge of the through hole 33 . The protrusion 34 may be provided only on a part of the periphery of the through hole 33 .
凸部34可設置於有孔體32中之所有貫通孔33之周緣,亦可僅設置於有孔體32中之一部分之貫通孔33之周緣。於凸部34僅設置於有孔體32中之一部分之貫通孔33之周緣之情形下,較佳為於位於熱源HS之正上方之貫通孔33以外之周緣設置有凸部34。The protrusions 34 may be provided at the periphery of all the through holes 33 in the porous body 32 , or may be provided at only the periphery of a part of the through holes 33 in the porous body 32 . When the convex portion 34 is provided only on the periphery of a part of the through-hole 33 in the perforated body 32, it is preferable to provide the convex portion 34 on the periphery other than the through-hole 33 located directly above the heat source HS.
貫通孔33及凸部34例如可藉由對構成有孔體32之金屬等進行藉由沖切加工進行之沖壓來製作。於藉由沖切加工進行之沖壓中,藉由適宜調整沖壓之深度等,而可調節凸部之形狀等。此外,沖壓之深度例如意指於藉由沖切刀具進行沖壓時,沿著沖壓方向將沖切刀具壓入至何種程度。The through hole 33 and the convex portion 34 can be produced by, for example, punching the metal constituting the perforated body 32 by punching. In punching by punching processing, the shape of the convex portion, etc. can be adjusted by appropriately adjusting the depth of punching. In addition, the depth of punching means, for example, how far the punching tool is pressed along the punching direction when punching is performed by a punching tool.
凸部34之尺寸無特別限定。例如,凸部34之高度可較貫通孔33之直徑為大,凸部34之高度亦可較貫通孔33之直徑為小,凸部34之高度還可與貫通孔33之直徑相同。此外,於圖10A所示之凸部34中,凸部34之高度意指第1端部35及第2端部36之間之厚度方向Z上之距離。The size of the convex portion 34 is not particularly limited. For example, the height of the protrusion 34 can be larger than the diameter of the through hole 33 , the height of the protrusion 34 can also be smaller than the diameter of the through hole 33 , and the height of the protrusion 34 can also be the same as the diameter of the through hole 33 . In addition, in the convex portion 34 shown in FIG. 10A , the height of the convex portion 34 means the distance in the thickness direction Z between the first end portion 35 and the second end portion 36 .
於圖10A所示之例中,芯30D之緣端之彎曲高度(圖10A中以B表示之距離)較凸部34之高度為大。芯30D之緣端之彎曲高度(圖10A中以B表示之距離)可較凸部34之高度為小,亦可與凸部34之高度相同。In the example shown in FIG. 10A , the bending height of the edge end of the core 30D (the distance indicated by B in FIG. 10A ) is larger than the height of the convex portion 34 . The bending height of the edge of the core 30D (the distance indicated by B in FIG. 10A ) may be smaller than the height of the convex part 34 , or may be the same as the height of the convex part 34 .
此外,於在貫通孔33之周緣中在接近第2內面12a之方向設置有凸部34之情形下,有孔體32之厚度意指未設置凸部34之部分處之有孔體32之厚度。In addition, when the protrusion 34 is provided on the periphery of the through hole 33 in the direction approaching the second inner surface 12a, the thickness of the perforated body 32 means the thickness of the perforated body 32 in the portion where the protrusion 34 is not provided. thickness.
圖10A所示之芯30D藉由利用沖切加工等使金屬箔之一部分彎曲並凹入,而於凹入之部分形成有支持體31。芯30D可藉由總括進行形成支持體31之沖切加工、及形成貫通孔33及凸部34之沖切加工而形成。In the core 30D shown in FIG. 10A , a part of the metal foil is bent and recessed by punching processing or the like, and a support 31 is formed in the recessed part. The core 30D can be formed by collectively performing punching processing to form the support 31 and punching processing to form the through holes 33 and the convex portions 34 .
圖10A所示之芯30D可如圖7所示之芯30A、圖8所示之芯30B及圖9所示之芯30C般,支持體31不凹入。The core 30D shown in FIG. 10A can be like the core 30A shown in FIG. 7 , the core 30B shown in FIG. 8 , and the core 30C shown in FIG. 9 , and the supporting body 31 is not recessed.
圖11係示意性顯示圖10A所示之凸部之第1變化例之將一部分放大之剖視圖。FIG. 11 is a partially enlarged cross-sectional view schematically showing a first modification example of the convex portion shown in FIG. 10A .
此外,於圖11至圖15所示之剖視圖中,為使芯之變化例之說明簡單,而未圖示芯之緣端之樣態。圖11至圖15所示之剖視圖中之芯之緣端之形狀可與圖10A所示之剖視圖中之芯30D之緣端之形狀相同。In addition, in the cross-sectional views shown in FIGS. 11 to 15 , in order to simplify the explanation of variations of the core, the edge end of the core is not shown. The shape of the edge end of the core in the cross-sectional view shown in FIGS. 11 to 15 may be the same as the shape of the edge end of the core 30D in the cross-sectional view shown in FIG. 10A .
圖11所示之凸部34a具有第1內面11a側之第1端部35a及第2內面12a側之第2端部36a。凸部34a自厚度方向Z觀察,第2端部36a之內壁包圍之區域之剖面積較第1端部35a之內壁包圍之區域之剖面積為小。若自厚度方向Z觀察,第2端部36a之內壁包圍之區域之剖面積較第1端部35a之內壁包圍之區域之剖面積為小,則可進一步防止蒸氣之流動與貫通孔33內之工作媒體20之液面直接接觸。藉此,可進一步降低逆流之影響,故而可進一步提高蒸氣腔1之最大熱輸送量。The convex portion 34a shown in FIG. 11 has a first end portion 35a on the first inner surface 11a side and a second end portion 36a on the second inner surface 12a side. Viewed from the thickness direction Z of the convex portion 34a, the cross-sectional area of the region surrounded by the inner wall of the second end portion 36a is smaller than the cross-sectional area of the region surrounded by the inner wall of the first end portion 35a. If viewed from the thickness direction Z, the cross-sectional area of the area surrounded by the inner wall of the second end 36a is smaller than the cross-sectional area of the area surrounded by the inner wall of the first end 35a, then the flow of steam and the through-hole 33 can be further prevented. The liquid surface of the working medium 20 inside is in direct contact. Thereby, the influence of the counterflow can be further reduced, so the maximum heat transfer capacity of the steam chamber 1 can be further increased.
於凸部34a中,自厚度方向Z觀察,第2端部36a之內壁位於較第1端部35a之內壁為內側。若自厚度方向Z觀察,第2端部36a之內壁位於較第1端部35a之內壁為內側,則可進一步防止蒸氣之流動與貫通孔33內之工作媒體20之液面直接接觸。藉此,可進一步降低逆流之影響,故而可進一步提高蒸氣腔1之最大熱輸送量。In the convex portion 34a, when viewed from the thickness direction Z, the inner wall of the second end portion 36a is located inside the inner wall of the first end portion 35a. If viewed from the thickness direction Z, the inner wall of the second end 36 a is located inward of the inner wall of the first end 35 a, which further prevents the flow of steam from directly contacting the liquid surface of the working medium 20 in the through hole 33 . Thereby, the influence of the counterflow can be further reduced, so the maximum heat transfer capacity of the steam chamber 1 can be further increased.
凸部34a於沿著厚度方向Z之剖面中,具有凸部34a之外壁間之距離向接近第2內面12a之方向變窄之錐形形狀。若凸部34a於沿著厚度方向Z之剖面中,具有凸部34a之外壁間之距離向接近第2內面12a之方向變窄之錐形形狀,則於流經有孔體32與第2內面12a之間之空間之蒸氣與凸部34a接觸時,蒸氣不僅可以於凸部34a中迂回之方式流動,亦可於沿著厚度方向Z之剖面中以沿著凸部34a之外壁面之方式向第2內面12a側流動。因而,相較於在沿著厚度方向Z之剖面中不具有凸部34a之外壁間之距離向接近第2內面12a之方向變窄之錐形形狀的凸部34,可增加與凸部34a接觸之蒸氣之流動路徑。藉此,可抑制蒸氣腔1之熱傳導率之降低。In the cross section along the thickness direction Z, the convex portion 34a has a tapered shape in which the distance between the outer walls of the convex portion 34a becomes narrower toward the second inner surface 12a. If the convex portion 34a has a tapered shape in the cross section along the thickness direction Z in which the distance between the outer walls of the convex portion 34a narrows toward the second inner surface 12a, then when the perforated body 32 and the second inner surface 12a flow through, When the vapor in the space between the inner surfaces 12a comes into contact with the convex portion 34a, the vapor can not only flow in a circuitous manner in the convex portion 34a, but also along the outer wall of the convex portion 34a in the cross section along the thickness direction Z. The mode flows toward the second inner surface 12a side. Therefore, compared with a convex portion 34 in a cross section along the thickness direction Z that does not have a tapered shape in which the distance between the outer walls of the convex portion 34a narrows toward the second inner surface 12a, the distance between the convex portion 34a and the convex portion 34a can be increased. The flow path of the vapor in contact. Thereby, a decrease in the thermal conductivity of the vapor chamber 1 can be suppressed.
凸部34a於沿著厚度方向Z之剖面中,為向第2內面12a側(圖11中為上側)凸起之形狀。換言之,凸部34a於沿著厚度方向Z之剖面中,為相對於連結第1端部35a及第2端部36a之線段向第2內面12a側(圖11中為上側)彎曲之形狀。The convex portion 34a has a shape convex toward the second inner surface 12a side (upper side in FIG. 11) in the cross section along the thickness direction Z. In other words, the convex portion 34a has a shape curved toward the second inner surface 12a side (upper side in FIG. 11) with respect to the line segment connecting the first end portion 35a and the second end portion 36a in the cross section along the thickness direction Z.
圖12係示意性顯示圖10A所示之凸部之第2變化例之將一部分放大之剖視圖。FIG. 12 is a partially enlarged cross-sectional view schematically showing a second modification example of the convex portion shown in FIG. 10A .
圖12所示之凸部34b具有第1內面11a側之第1端部35b及第2內面12a側之第2端部36b。凸部34b於沿著厚度方向Z之剖面中,具有凸部34b之外壁間之距離向接近第2內面12a之方向變窄之錐形形狀。凸部34b於沿著厚度方向Z之剖面中,為向第1內面11a側(圖12中為下側)凸起之形狀。換言之,凸部34b於沿著厚度方向Z之剖面中,為相對於連結第1端部35b及第2端部36b之線段向第1內面11a側(圖12中為下側)彎曲之形狀。若如凸部34b般,於沿著厚度方向Z之剖面中為向第1內面11a側(圖12中為下側)凸起之形狀,則與為向第2內面12a側(圖11中為上側)凸起之形狀之凸部34a進行比較,凸部34b之第1端部35b側之部分中之外壁面之傾斜變得和緩。因而,流經有孔體32與第2內面12a之間之空間之蒸氣在與凸部34b之第1端部35b側之部分接觸時,在沿著厚度方向Z之剖面中容易以沿著凸部34a之外壁面之方式向第2內面12a側進一步流動。藉此,可進一步抑制蒸氣腔1之熱傳導率之降低。The convex portion 34b shown in FIG. 12 has a first end portion 35b on the first inner surface 11a side and a second end portion 36b on the second inner surface 12a side. In the cross section along the thickness direction Z, the convex portion 34b has a tapered shape in which the distance between the outer walls of the convex portion 34b becomes narrower toward the second inner surface 12a. The convex portion 34b has a shape convex toward the first inner surface 11a side (lower side in FIG. 12) in the cross section along the thickness direction Z. In other words, in the cross section along the thickness direction Z, the convex portion 34b has a shape that is curved toward the first inner surface 11a side (the lower side in FIG. 12) with respect to the line segment connecting the first end portion 35b and the second end portion 36b. . If the convex portion 34b has a shape convex toward the first inner surface 11a side (lower side in Fig. 12) in the cross section along the thickness direction Z, then the shape is convex toward the second inner surface 12a side (Fig. 11 Compared with the convex portion 34a having a convex shape (the middle is the upper side), the inclination of the outer wall surface becomes gentler in the portion of the convex portion 34b on the first end 35b side. Therefore, when the vapor flowing through the space between the porous body 32 and the second inner surface 12a comes into contact with the portion on the first end 35b side of the convex portion 34b, it is easy to flow along the cross section along the thickness direction Z. The outer wall surface of the convex portion 34a further flows toward the second inner surface 12a side. Thereby, the reduction in the thermal conductivity of the vapor chamber 1 can be further suppressed.
圖13係示意性顯示圖10A所示之凸部之第3變化例之將一部分放大之剖視圖。FIG. 13 is a partially enlarged cross-sectional view schematically showing a third modification example of the convex portion shown in FIG. 10A .
圖13所示之凸部34c具有第1內面11a側之第1端部35c及第2內面12a側之第2端部36c。凸部34c自厚度方向Z觀察,第2端部36c之內壁包圍之區域之剖面積較第1端部35c之內壁包圍之區域之剖面積為小。凸部34c於第2端部36c中具備將凸部34c之開口縮窄之蓋部37。於凸部34c中,在自厚度方向Z觀察時,相較於在第2端部36c中不存在蓋部37之凸部34b,第2端部36c之內壁包圍之區域之剖面積變小。若凸部34c於第2端部36c中具備將凸部34c之開口縮窄之蓋部37,則可進一步防止蒸氣之流動與貫通孔33內之工作媒體20之液面直接接觸。藉此,可進一步降低逆流之影響,故而可進一步提高蒸氣腔1之最大熱輸送量。The convex portion 34c shown in FIG. 13 has a first end portion 35c on the first inner surface 11a side and a second end portion 36c on the second inner surface 12a side. When viewed from the thickness direction Z of the convex portion 34c, the cross-sectional area of the region surrounded by the inner wall of the second end portion 36c is smaller than the cross-sectional area of the region surrounded by the inner wall of the first end portion 35c. The convex part 34c is provided with the cover part 37 which narrows the opening of the convex part 34c in the 2nd end part 36c. In the convex portion 34c, when viewed from the thickness direction Z, the cross-sectional area of the region surrounded by the inner wall of the second end portion 36c is smaller compared to the convex portion 34b in which the cover portion 37 is not present in the second end portion 36c. . If the convex part 34c is provided with the cover part 37 in the second end part 36c which narrows the opening of the convex part 34c, it can further prevent the flow of steam from directly contacting the liquid surface of the working medium 20 in the through hole 33. Thereby, the influence of the counterflow can be further reduced, so the maximum heat transfer capacity of the steam chamber 1 can be further increased.
將凸部34c之開口縮窄之蓋部37例如可藉由對第2端部36c進行沖切加工而形成。將凸部34c之開口縮窄之蓋部37之大小及形狀無特別限定,只要將凸部34c之於第2端部36c側之開口縮窄即可。將凸部34c之開口縮窄之蓋部37較佳為平坦面。將凸部34c之開口縮窄之蓋部37較佳為對於厚度方向Z垂直之平坦面。將凸部34c之開口縮窄之蓋部37可一部分或整體為曲面狀。將凸部34c之開口縮窄之蓋部37可表面具有凹凸形狀。將凸部34c之開口縮窄之蓋部37之厚度可與凸部34c之厚度相同,亦可不同。The cover portion 37 that narrows the opening of the convex portion 34c can be formed by punching the second end portion 36c, for example. The size and shape of the cover portion 37 that narrows the opening of the convex portion 34c are not particularly limited, as long as the opening of the convex portion 34c on the second end 36c side is narrowed. The cover portion 37 narrowing the opening of the convex portion 34c is preferably a flat surface. The cover portion 37 that narrows the opening of the convex portion 34c is preferably a flat surface perpendicular to the thickness direction Z. The cover portion 37 that narrows the opening of the convex portion 34c may be partially or entirely curved. The cover portion 37 that narrows the opening of the convex portion 34c may have a concave and convex shape on the surface. The thickness of the cover portion 37 that narrows the opening of the convex portion 34c may be the same as or different from the thickness of the convex portion 34c.
圖14係示意性顯示圖10A所示之凸部之第4變化例之將一部分放大之剖視圖。FIG. 14 is a partially enlarged cross-sectional view schematically showing a fourth modification example of the convex portion shown in FIG. 10A.
圖14所示之凸部34d具有第1內面11a側之第1端部35d及第2內面12a側之第2端部36d。凸部34d自厚度方向Z觀察,第2端部36d之內壁包圍之區域之剖面積較第1端部35d之內壁包圍之區域之剖面積為大。The convex portion 34d shown in Fig. 14 has a first end portion 35d on the first inner surface 11a side and a second end portion 36d on the second inner surface 12a side. When viewing the convex portion 34d from the thickness direction Z, the cross-sectional area of the region surrounded by the inner wall of the second end portion 36d is larger than the cross-sectional area of the region surrounded by the inner wall of the first end portion 35d.
於凸部34d中,自厚度方向Z觀察,第2端部36d之內壁位於較第1端部35d之內壁為外側。In the convex portion 34d, when viewed from the thickness direction Z, the inner wall of the second end portion 36d is located outside the inner wall of the first end portion 35d.
圖15係示意性顯示圖10A所示之凸部之第5變化例之將一部分放大之剖視圖。FIG. 15 is a partially enlarged cross-sectional view schematically showing a fifth modification example of the convex portion shown in FIG. 10A.
圖15所示之凸部34e具有第1內面11a側之第1端部35e及第2內面12a側之第2端部36e。凸部34e自厚度方向Z觀察,第2端部36e之內壁包圍之區域之剖面積較第1端部35e之內壁包圍之區域之剖面積為大。凸部34e於第2端部36e中具備將凸部34e之開口縮窄之蓋部37。於凸部34e中,在自厚度方向Z觀察時,相較於在第2端部36e中不存在蓋部37之凸部34d,第2端部36e之內壁包圍之區域之剖面積變小。若凸部34e於第2端部36e中具備將凸部34e之開口縮窄之蓋部37,則可進一步防止蒸氣之流動與貫通孔33內之工作媒體20之液面直接接觸。藉此,可進一步降低逆流之影響,故而可進一步提高蒸氣腔1之最大熱輸送量。The convex portion 34e shown in FIG. 15 has a first end portion 35e on the first inner surface 11a side and a second end portion 36e on the second inner surface 12a side. When viewed from the thickness direction Z of the convex portion 34e, the cross-sectional area of the region surrounded by the inner wall of the second end portion 36e is larger than the cross-sectional area of the region surrounded by the inner wall of the first end portion 35e. The convex part 34e is provided with the cover part 37 which narrows the opening of the convex part 34e in the 2nd end part 36e. In the convex portion 34e, when viewed from the thickness direction Z, compared with the convex portion 34d in which the cover portion 37 is not present in the second end portion 36e, the cross-sectional area of the region surrounded by the inner wall of the second end portion 36e is smaller. . If the convex part 34e is provided with the cover part 37 in the second end part 36e which narrows the opening of the convex part 34e, it can further prevent the flow of steam from directly contacting the liquid surface of the working medium 20 in the through hole 33. Thereby, the influence of the counterflow can be further reduced, so the maximum heat transfer capacity of the steam chamber 1 can be further increased.
將凸部34e之開口縮窄之蓋部37例如可藉由對第2端部36e進行沖切加工而形成。將凸部34e之開口縮窄之蓋部37之大小及形狀無特別限定,只要將凸部34e之於第2端部36e側之開口縮窄即可。將凸部34e之開口縮窄之蓋部37較佳為平坦面。將凸部34e之開口縮窄之蓋部37較佳為對於厚度方向Z垂直之平坦面。將凸部34e之開口縮窄之蓋部37可一部分或整體為曲面狀。將凸部34e之開口縮窄之蓋部37可表面具有凹凸形狀。將凸部34e之開口縮窄之蓋部37之厚度可與凸部34e之厚度相同,亦可不同。The cover portion 37 that narrows the opening of the convex portion 34e can be formed by punching the second end portion 36e, for example. The size and shape of the cover portion 37 that narrows the opening of the convex portion 34e are not particularly limited, as long as the opening of the convex portion 34e on the second end 36e side is narrowed. The cover portion 37 narrowing the opening of the convex portion 34e is preferably a flat surface. The cover portion 37 that narrows the opening of the convex portion 34e is preferably a flat surface perpendicular to the thickness direction Z. The cover portion 37 that narrows the opening of the convex portion 34e may be partially or entirely curved. The surface of the cover 37 that narrows the opening of the convex portion 34e may have an uneven shape. The thickness of the cover portion 37 that narrows the opening of the protruding portion 34e may be the same as or different from the thickness of the protruding portion 34e.
圖16A係示意性顯示芯之第5變化例之將一部分放大之剖視圖。圖16B係顯示在圖16A所示之剖視圖中封入有工作媒體之狀態之一例之剖視圖。FIG. 16A is a partially enlarged cross-sectional view of a fifth modification example of the schematic display core. FIG. 16B is a cross-sectional view showing an example of a state in which the working medium is enclosed in the cross-sectional view shown in FIG. 16A.
此外,於圖16B及圖17至圖21所示之剖視圖中,為使芯之變化例之說明簡單,而未圖示芯之緣端之樣態。圖13B及圖17至圖21所示之剖視圖中之芯之緣端之形狀可與圖16A所示之剖視圖中之芯30E之緣端之形狀相同。In addition, in the cross-sectional views shown in FIG. 16B and FIGS. 17 to 21 , in order to simplify the description of variations of the core, the edge end of the core is not shown. The shape of the edge end of the core in the cross-sectional view shown in FIG. 13B and FIGS. 17 to 21 may be the same as the shape of the edge end of the core 30E in the cross-sectional view shown in FIG. 16A.
於圖16A所示之芯30E中,在貫通孔33之周緣,在接近第1內面11a之方向設置有凸部34。In the core 30E shown in FIG. 16A , a convex portion 34 is provided on the periphery of the through hole 33 in a direction approaching the first inner surface 11 a.
凸部34f具有第1內面11a側之第1端部35f及第2內面12a側之第2端部36f。The convex portion 34f has a first end portion 35f on the first inner surface 11a side and a second end portion 36f on the second inner surface 12a side.
以下,說明藉由在貫通孔33之周緣中在接近第1內面11a之方向設置有凸部34f而形成之效果。於圖16B中,工作媒體20藉由與由凸部34f之內壁包圍之面相接,而藉由毛細管力抽吸至貫通孔33內。因而,於自厚度方向Z觀察芯30E不存在貫通孔33之部分中,儘管工作媒體20之液面位於較有孔體32更靠第1內面11a側,但亦向貫通孔33內抽吸工作媒體20。如此,即便於如圖16B所示般工作媒體20之液量少之情形下,亦可向貫通孔33內抽吸工作媒體20。因此,即便於工作媒體20之液量少之情形下,亦可防止於芯30E中不易產生毛細管力。根據以上所述,於蒸氣腔1中,即便在工作媒體20之液量少之情形下,亦可抑制均熱性能及熱輸送性能之降低。Hereinafter, the effect produced by providing the convex portion 34f in the direction approaching the first inner surface 11a on the periphery of the through hole 33 will be described. In FIG. 16B , the working medium 20 is in contact with the surface surrounded by the inner wall of the convex portion 34 f and is sucked into the through hole 33 by capillary force. Therefore, in the portion where the core 30E does not have the through hole 33 when viewed from the thickness direction Z, even though the liquid level of the working medium 20 is located closer to the first inner surface 11 a than the porous body 32 , it is also sucked into the through hole 33 Work Media20. In this way, even when the liquid amount of the working medium 20 is small as shown in FIG. 16B , the working medium 20 can be sucked into the through hole 33 . Therefore, even when the liquid volume of the working medium 20 is small, it is possible to prevent capillary force from being easily generated in the core 30E. According to the above, in the vapor chamber 1 , even when the liquid amount of the working medium 20 is small, the deterioration of the heat distribution performance and the heat transfer performance can be suppressed.
若於貫通孔33之周緣在接近第1內面11a之方向設置有凸部34f,則即便於工作媒體20之液量少之情形下,亦可抑制均熱性能及熱輸送性能之降低,故而例如製造步序中之工作媒體20之注液量之設計值之變更、製造步序中之工作媒體20之注液量之不一及使用時之工作媒體20之液量之變動等對均熱性能或熱輸送性能造成之影響小。即,可謂若於貫通孔33之周緣在接近第1內面11a之方向設置有凸部34f,則對於蒸氣腔1中之工作媒體20之液量之穩健性提高。If the convex portion 34f is provided on the periphery of the through hole 33 in the direction approaching the first inner surface 11a, even when the liquid amount of the working medium 20 is small, the deterioration of the heat distribution performance and the heat transfer performance can be suppressed. For example, changes in the design value of the liquid injection amount of the working medium 20 in the manufacturing step, differences in the liquid injection amount of the working medium 20 in the manufacturing step, changes in the liquid amount of the working medium 20 during use, etc. have an impact on the uniform heating. There is little impact on performance or heat transfer performance. That is, it can be said that if the protrusion 34f is provided on the periphery of the through hole 33 in the direction approaching the first inner surface 11a, the stability with respect to the liquid amount of the working medium 20 in the vapor chamber 1 is improved.
凸部34f較佳為設置於貫通孔33之周緣整體。凸部34f只要為可藉由毛細管力抽吸工作媒體20之形狀,則可僅設置於貫通孔33之周緣之一部分。The convex portion 34f is preferably provided on the entire peripheral edge of the through hole 33. The convex portion 34f may be provided on only a part of the periphery of the through hole 33 as long as it has a shape that can suck the working medium 20 by capillary force.
凸部34f可設置於有孔體32中之所有貫通孔33之周緣,亦可僅設置於有孔體32中之一部分之貫通孔33之周緣。於凸部34f僅設置於有孔體32中之一部分之貫通孔33之周緣之情形下,較佳為至少於位於熱源HS之正上方之貫通孔33之周緣設置有凸部34f。於在位於熱源HS之正上方之貫通孔33設置有凸部34f之情形下,即便於工作媒體20之液量少之情形下,亦可抑制於蒸發部中不易引起工作媒體20之蒸發。可僅於位於熱源HS之正上方之貫通孔33之周緣設置凸部34f。The convex portion 34f may be provided at the periphery of all the through holes 33 in the perforated body 32, or may be provided at only the periphery of a part of the through holes 33 in the perforated body 32. When the convex portion 34f is provided only on the periphery of a part of the through-hole 33 in the perforated body 32, it is preferable that the convex portion 34f is provided on at least the periphery of the through-hole 33 located directly above the heat source HS. When the protrusion 34f is provided in the through hole 33 located directly above the heat source HS, evaporation of the working medium 20 in the evaporation part can be suppressed even when the liquid amount of the working medium 20 is small. The convex portion 34f may be provided only on the periphery of the through hole 33 located directly above the heat source HS.
貫通孔33及凸部34f例如可藉由對構成有孔體32之金屬等進行藉由沖切加工進行之沖壓來製作。於藉由沖切加工進行之沖壓中,藉由適宜調整沖壓之深度等,而可調節凸部之形狀等。此外,沖壓之深度例如意指於藉由沖切刀具進行沖壓時,沿著沖壓方向將沖切刀具壓入至何種程度。The through hole 33 and the convex portion 34f can be produced, for example, by punching the metal constituting the perforated body 32 by punching. In punching by punching processing, the shape of the convex portion, etc. can be adjusted by appropriately adjusting the depth of punching. In addition, the depth of punching means, for example, how far the punching tool is pressed along the punching direction when punching is performed by a punching tool.
凸部34f之尺寸無特別限定。例如,凸部34f之高度可較貫通孔33之直徑為大,凸部34f之高度亦可較貫通孔33之直徑為小,凸部34f之高度還可與貫通孔33之直徑相同。此外,於圖16A所示之凸部34f中,凸部34f之高度意指第1端部35f及第2端部36f之間之厚度方向Z上之距離。The size of the convex portion 34f is not particularly limited. For example, the height of the convex portion 34f can be larger than the diameter of the through hole 33 , the height of the convex portion 34f can also be smaller than the diameter of the through hole 33 , and the height of the convex portion 34f can also be the same as the diameter of the through hole 33 . In addition, in the convex part 34f shown in FIG. 16A, the height of the convex part 34f means the distance in the thickness direction Z between the 1st end part 35f and the 2nd end part 36f.
於圖16A所示之例中,芯30E之緣端之彎曲高度(圖16A中以B表示之距離)較凸部34f之高度為大。芯30E之緣端之彎曲高度(圖16A中以B表示之距離)可較凸部34f之高度為小,亦可與凸部34f之高度相同。In the example shown in FIG. 16A , the bending height of the edge end of the core 30E (the distance indicated by B in FIG. 16A ) is larger than the height of the convex portion 34f. The bending height of the edge of the core 30E (distance indicated by B in FIG. 16A) may be smaller than the height of the convex part 34f, or may be the same as the height of the convex part 34f.
此外,於在貫通孔33之周緣中在接近第1內面11a之方向設置有凸部34f之情形下,有孔體32之厚度意指未設置凸部34f之部分處之有孔體32之厚度。In addition, when the protrusion 34f is provided on the periphery of the through hole 33 in the direction close to the first inner surface 11a, the thickness of the perforated body 32 means the thickness of the perforated body 32 in the portion where the protrusion 34f is not provided. thickness.
圖16A所示之芯30E藉由利用沖切加工等使金屬箔之一部分彎曲並凹入,而於凹入之部分形成有支持體31。芯30E可藉由總括進行形成支持體31之沖切加工、及形成貫通孔33及凸部34f之沖切加工而形成。In the core 30E shown in FIG. 16A , a part of the metal foil is bent and recessed by punching processing or the like, and a support 31 is formed in the recessed part. The core 30E can be formed by collectively performing a punching process to form the support 31 and a punching process to form the through-hole 33 and the convex portion 34f.
圖16A所示之芯30E可如圖7所示之芯30A、圖8所示之芯30B及圖9所示之芯30C般,支持體31不凹入。The core 30E shown in FIG. 16A can be like the core 30A shown in FIG. 7, the core 30B shown in FIG. 8, and the core 30C shown in FIG. 9, and the support 31 is not recessed.
圖17係示意性顯示圖16A所示之凸部之第1變化例之將一部分放大之剖視圖。FIG. 17 is a partially enlarged cross-sectional view schematically showing a first modification example of the convex portion shown in FIG. 16A.
圖17所示之凸部34g具有第1內面11a側之第1端部35g及第2內面12a側之第2端部36g。凸部34g自厚度方向Z觀察,第1端部35g之內壁包圍之區域之剖面積較第2端部36g之內壁包圍之區域之剖面積為小。若自厚度方向Z觀察,第1端部35g之內壁包圍之區域之剖面積較第2端部36g之內壁包圍之區域之剖面積為小,則可提高在由第1端部35g之內壁包圍之區域中產生之毛細管力。因此,可提高芯30E之毛細管力,故而可提高蒸氣腔1之最大熱輸送量。The convex part 34g shown in FIG. 17 has the 1st end part 35g on the 1st inner surface 11a side, and the 2nd end part 36g on the 2nd inner surface 12a side. When viewing the convex portion 34g from the thickness direction Z, the cross-sectional area of the region surrounded by the inner wall of the first end portion 35g is smaller than the cross-sectional area of the region surrounded by the inner wall of the second end portion 36g. If viewed from the thickness direction Z, the cross-sectional area of the area surrounded by the inner wall of the first end 35g is smaller than the cross-sectional area of the area surrounded by the inner wall of the second end 36g, then it can be increased from the first end 35g The capillary force generated in the area surrounded by the inner wall. Therefore, the capillary force of the core 30E can be increased, and thus the maximum heat transfer capacity of the vapor chamber 1 can be increased.
於凸部34g中,自厚度方向Z觀察,第1端部35g之內壁可位於較第2端部36g之內壁為內側。In the convex portion 34g, when viewed from the thickness direction Z, the inner wall of the first end portion 35g can be located inward of the inner wall of the second end portion 36g.
凸部34g於沿著厚度方向Z之剖面中,具有凸部34g之外壁間之距離向接近第1內面11a之方向變窄之錐形形狀。In the cross section along the thickness direction Z, the convex portion 34g has a tapered shape in which the distance between the outer walls of the convex portion 34g becomes narrower toward the first inner surface 11a.
凸部34g於沿著厚度方向Z之剖面中為向第1內面11a側(圖17中為下側)凸起之形狀。換言之,凸部34g於沿著厚度方向Z之剖面中,為相對於連結第1端部35g及第2端部36g之線段向第1內面11a側(圖17中為下側)彎曲之形狀。The convex portion 34g has a shape convex toward the first inner surface 11a side (lower side in FIG. 17) in the cross section along the thickness direction Z. In other words, the convex portion 34g has a shape curved toward the first inner surface 11a side (lower side in FIG. 17 ) with respect to the line segment connecting the first end portion 35g and the second end portion 36g in the cross section along the thickness direction Z. .
圖18係示意性顯示圖16A所示之凸部之第2變化例之將一部分放大之剖視圖。FIG. 18 is a partially enlarged cross-sectional view schematically showing a second modification example of the convex portion shown in FIG. 16A.
圖18所示之凸部34h具有第1內面11a側之第1端部35h及第2內面12a側之第2端部36h。凸部34h於沿著厚度方向Z之剖面中,具有凸部34h之外壁間之距離向接近第1內面11a之方向變窄之錐形形狀。凸部34h於沿著厚度方向Z之剖面中,為向第2內面12a側(圖18中為上側)凸起之形狀。換言之,凸部34h於沿著厚度方向Z之剖面中,為相對於連結第1端部35h及第2端部36h之線段向第2內面12a側(圖18中為上側)彎曲之形狀。The convex part 34h shown in FIG. 18 has the 1st end part 35h on the 1st inner surface 11a side, and the 2nd end part 36h on the 2nd inner surface 12a side. In the cross section along the thickness direction Z, the convex portion 34h has a tapered shape in which the distance between the outer walls of the convex portion 34h becomes narrower toward the first inner surface 11a. The convex portion 34h has a shape convex toward the second inner surface 12a side (upper side in FIG. 18) in the cross section along the thickness direction Z. In other words, the convex portion 34h has a shape curved toward the second inner surface 12a side (upper side in FIG. 18) with respect to the line segment connecting the first end portion 35h and the second end portion 36h in the cross section along the thickness direction Z.
圖19係示意性顯示圖16A所示之凸部之第3變化例之將一部分放大之剖視圖。FIG. 19 is a partially enlarged cross-sectional view schematically showing a third modification example of the convex portion shown in FIG. 16A.
圖19所示之凸部34i具有第1內面11a側之第1端部35i及第2內面12a側之第2端部36i。凸部34i自厚度方向Z觀察,第1端部35i之內壁包圍之區域之剖面積較第2端部36i之內壁包圍之區域之剖面積為小。凸部34i於第1端部35i中具備將凸部34i之開口縮窄之蓋部37。於凸部34i中,在自厚度方向Z觀察時,相較於在第1端部35i中不存在蓋部37之凸部34h,第1端部35i之內壁包圍之區域之剖面積變小。The convex portion 34i shown in FIG. 19 has a first end portion 35i on the first inner surface 11a side and a second end portion 36i on the second inner surface 12a side. When viewed from the thickness direction Z of the convex portion 34i, the cross-sectional area of the region surrounded by the inner wall of the first end portion 35i is smaller than the cross-sectional area of the region surrounded by the inner wall of the second end portion 36i. The convex part 34i is provided with the cover part 37 which narrows the opening of the convex part 34i in the 1st end part 35i. In the convex portion 34i, when viewed from the thickness direction Z, compared with the convex portion 34h in which the cover portion 37 is not present in the first end portion 35i, the cross-sectional area of the region surrounded by the inner wall of the first end portion 35i is smaller. .
將凸部34i之開口縮窄之蓋部37例如可藉由對第1端部35i進行沖切加工而形成。將凸部34i之開口縮窄之蓋部37之大小及形狀無特別限定,只要將凸部34i之於第1端部35i側之開口縮窄即可。將凸部34i之開口縮窄之蓋部37較佳為平坦面。將凸部34i之開口縮窄之蓋部37較佳為對於厚度方向Z垂直之平坦面。將凸部34i之開口縮窄之蓋部37可一部分或整體為曲面狀。將凸部34i之開口縮窄之蓋部37可表面具有凹凸形狀。將凸部34i之開口縮窄之蓋部37之厚度可與凸部34i之厚度相同,亦可不同。The cover portion 37 that narrows the opening of the convex portion 34i can be formed by punching the first end portion 35i, for example. The size and shape of the cover portion 37 that narrows the opening of the convex portion 34i are not particularly limited, as long as the opening of the convex portion 34i on the first end 35i side is narrowed. The cover portion 37 narrowing the opening of the convex portion 34i is preferably a flat surface. The cover portion 37 that narrows the opening of the convex portion 34i is preferably a flat surface perpendicular to the thickness direction Z. The cover portion 37 that narrows the opening of the convex portion 34i may be partially or entirely curved. The cover portion 37 that narrows the opening of the convex portion 34i may have an uneven surface. The thickness of the cover portion 37 that narrows the opening of the protruding portion 34i may be the same as or different from the thickness of the protruding portion 34i.
圖20係示意性顯示圖16A所示之凸部之第4變化例之將一部分放大之剖視圖。FIG. 20 is a partially enlarged cross-sectional view schematically showing a fourth modification example of the convex portion shown in FIG. 16A.
圖20所示之凸部34j具有第1內面11a側之第1端部35j及第2內面12a側之第2端部36j。凸部34j自厚度方向Z觀察,第1端部35j之內壁包圍之區域之剖面積較第2端部36j之內壁包圍之區域之剖面積為大。若自厚度方向Z觀察,第1端部35j之內壁包圍之區域之剖面積較第2端部36j之內壁包圍之區域之剖面積為大,則可增加向貫通孔33內之工作媒體20之抽吸量。若向貫通孔33內之工作媒體20之抽吸量多,則在蒸氣腔1內之工作媒體20逐漸減少之情形下,直至工作媒體20完全不被抽吸至貫通孔33內為止之工作媒體20之變動之容許值變大。因而,對於蒸氣腔1中之工作媒體20之液量之穩健性提高。The convex portion 34j shown in FIG. 20 has a first end portion 35j on the first inner surface 11a side and a second end portion 36j on the second inner surface 12a side. When viewed from the thickness direction Z of the convex portion 34j, the cross-sectional area of the region surrounded by the inner wall of the first end portion 35j is larger than the cross-sectional area of the region surrounded by the inner wall of the second end portion 36j. If viewed from the thickness direction Z, the cross-sectional area of the area surrounded by the inner wall of the first end 35j is larger than the cross-sectional area of the area surrounded by the inner wall of the second end 36j, then the working medium in the through hole 33 can be increased. 20 puffs. If the amount of the working medium 20 sucked into the through hole 33 is large, the working medium 20 in the vapor chamber 1 gradually decreases until the working medium 20 is completely no longer sucked into the through hole 33 . The allowable value of the change of 20 becomes larger. Thus, the robustness with respect to the liquid volume of the working medium 20 in the vapor chamber 1 is increased.
於凸部34j中,自厚度方向Z觀察,第1端部35j之內壁可位於較第2端部36j之內壁為外側。In the convex portion 34j, when viewed from the thickness direction Z, the inner wall of the first end portion 35j can be located outside the inner wall of the second end portion 36j.
圖21係示意性顯示圖16A所示之凸部之第5變化例之將一部分放大之剖視圖。FIG. 21 is a partially enlarged cross-sectional view schematically showing a fifth modification example of the convex portion shown in FIG. 16A.
圖21所示之凸部34k具有第1內面11a側之第1端部35k及第2內面12a側之第2端部36k。凸部34k自厚度方向Z觀察,第1端部35k之內壁包圍之區域之剖面積較第2端部36k之內壁包圍之區域之剖面積為大。凸部34k於第1端部35k中具備將凸部34k之開口縮窄之蓋部37。於凸部34k中,在自厚度方向Z觀察時,相較於在第1端部35k中不存在蓋部37之凸部34j,第1端部35k之內壁包圍之區域之剖面積變小。The convex portion 34k shown in FIG. 21 has a first end portion 35k on the first inner surface 11a side and a second end portion 36k on the second inner surface 12a side. When viewed from the thickness direction Z of the convex portion 34k, the cross-sectional area of the region surrounded by the inner wall of the first end portion 35k is larger than the cross-sectional area of the region surrounded by the inner wall of the second end portion 36k. The convex part 34k is provided with the cover part 37 which narrows the opening of the convex part 34k in the 1st end part 35k. In the convex portion 34k, when viewed from the thickness direction Z, the cross-sectional area of the region surrounded by the inner wall of the first end portion 35k is smaller than that of the convex portion 34j in which the cover portion 37 is not present in the first end portion 35k. .
將凸部34k之開口縮窄之蓋部37例如可藉由對第1端部35k進行沖切加工而形成。將凸部34k之開口縮窄之蓋部37之大小及形狀無特別限定,只要將凸部34k之於第1端部35k側之開口縮窄即可。將凸部34k之開口縮窄之蓋部37較佳為平坦面。將凸部34k之開口縮窄之蓋部37較佳為對於厚度方向Z垂直之平坦面。將凸部34k之開口縮窄之蓋部37可一部分或整體為曲面狀。將凸部34k之開口縮窄之蓋部37可表面具有凹凸形狀。將凸部34k之開口縮窄之蓋部37之厚度可與凸部34k之厚度相同,亦可不同。The cover portion 37 that narrows the opening of the convex portion 34k can be formed by punching the first end portion 35k, for example. The size and shape of the cover portion 37 that narrows the opening of the convex portion 34k are not particularly limited, as long as the opening of the convex portion 34k on the first end 35k side is narrowed. The cover portion 37 narrowing the opening of the convex portion 34k is preferably a flat surface. The cover portion 37 that narrows the opening of the convex portion 34k is preferably a flat surface perpendicular to the thickness direction Z. The cover portion 37 that narrows the opening of the convex portion 34k may be partially or entirely curved. The cover portion 37 that narrows the opening of the convex portion 34k may have a concave and convex shape on the surface. The thickness of the cover portion 37 that narrows the opening of the protruding portion 34k may be the same as or different from the thickness of the protruding portion 34k.
圖22係示意性顯示芯之第6變化例之俯視圖。此外,圖22係自支持體側觀察到之芯之俯視圖。FIG. 22 is a top view of a sixth modification example of the schematic display core. In addition, FIG. 22 is a top view of the core viewed from the support side.
於圖22所示之芯30F中,支持體31包含複數個軌道狀構件。藉由在軌道狀構件之間保持液相之工作媒體20,而可提高蒸氣腔1之熱輸送性能。此處,「軌道狀」意指底面之長邊之長度之比相對於底面之短邊之長度為5倍以上之形狀。In the core 30F shown in Figure 22, the support 31 includes a plurality of track-shaped members. By maintaining the liquid phase working medium 20 between the rail-like members, the heat transfer performance of the vapor chamber 1 can be improved. Here, "orbital shape" means a shape in which the ratio of the length of the long side of the bottom surface to the length of the short side of the bottom surface is 5 times or more.
軌道狀構件之垂直於延伸方向之剖面形狀無特別限定,例如舉出四角形等多角形、半圓形、半橢圓形、將其等組合之形狀等。The cross-sectional shape of the track-shaped member perpendicular to the extending direction is not particularly limited, and examples thereof include polygonal shapes such as squares, semicircles, semiellipses, and shapes that are a combination thereof.
軌道狀構件只要較周圍相對地提高高度即可。因此,軌道狀構件除自第1內面11a突出之部分外,亦包含高度較形成於第1內面11a之槽相對變高之部分。The rail-shaped member only needs to be relatively higher than its surroundings. Therefore, in addition to the portion protruding from the first inner surface 11a, the rail-shaped member also includes a portion whose height is relatively higher than the groove formed in the first inner surface 11a.
又,芯30F不限定於圖22所揭示之形狀,可局部配置而利用,而非配置於內部空間之整體。例如,可於內部空間沿著外周構成軌道狀之支持體31,於其上配置沿著外周之形狀之有孔體32。In addition, the core 30F is not limited to the shape shown in FIG. 22 and may be partially arranged and utilized instead of being arranged in the entire internal space. For example, a track-shaped support body 31 may be formed in the inner space along the outer circumference, and a porous body 32 shaped along the outer circumference may be disposed thereon.
圖23係示意性顯示自厚度方向觀察圖1所示之熱擴散裝置時之芯之配置之俯視圖。FIG. 23 is a top view schematically showing the arrangement of the core of the heat diffusion device shown in FIG. 1 when viewed from the thickness direction.
於圖23所示之蒸氣腔1中,在自厚度方向Z觀察時,芯30遍及殼體10之內部空間之整體而配置。In the vapor chamber 1 shown in FIG. 23 , when viewed from the thickness direction Z, the core 30 is disposed throughout the entire internal space of the housing 10 .
於蒸氣腔1中,自厚度方向Z觀察,蒸發部EP(evaporation portion)重疊於殼體10之內緣。於圖23所示之蒸氣腔1中,自厚度方向Z觀察,蒸發部EP與芯30重疊。In the vapor chamber 1 , when viewed from the thickness direction Z, the evaporation portion EP (evaporation portion) overlaps the inner edge of the housing 10 . In the vapor chamber 1 shown in FIG. 23 , when viewed from the thickness direction Z, the evaporation part EP overlaps with the core 30 .
於圖23中,芯30之緣端與殼體10之內緣不相接。芯30之緣端與殼體10之內緣可相接。In FIG. 23 , the edge end of the core 30 is not in contact with the inner edge of the housing 10 . The edge end of the core 30 can be connected with the inner edge of the housing 10 .
圖24係示意性顯示自厚度方向觀察本發明之熱擴散裝置之第1變化例時之芯之配置之俯視圖。FIG. 24 is a plan view schematically showing the arrangement of the core of the first variation of the thermal diffusion device of the present invention when viewed from the thickness direction.
於圖24所示之蒸氣腔(熱擴散裝置)1A中,在自厚度方向Z觀察時,芯30遍及殼體10之內部空間之整體而配置,內部空間於自厚度方向Z觀察時具有配置有芯30之區域、及未配置芯30之區域,未配置芯30之區域於自厚度方向Z觀察時線狀延伸。In the vapor chamber (thermal diffusion device) 1A shown in FIG. 24 , when viewed from the thickness direction Z, the core 30 is disposed throughout the entire internal space of the housing 10 , and the internal space has a structure configured as viewed from the thickness direction Z. The area of the core 30 and the area where the core 30 is not arranged extend linearly when viewed from the thickness direction Z.
於蒸氣腔1A中,未配置芯30之區域於自厚度方向Z觀察時,可直線狀延伸,亦可曲線狀延伸。In the vapor chamber 1A, the area where the core 30 is not arranged may extend linearly or curvedly when viewed from the thickness direction Z.
於蒸氣腔1A中,芯30之緣端中殼體10之內緣側之緣端以向第2內面12a側接近之方式彎曲。芯30之緣端中未配置芯30之區域側之緣端可以向第2內面12a側接近之方式彎曲,亦可不以向第2內面12a側接近之方式彎曲。In the steam chamber 1A, the edge end of the core 30 on the inner edge side of the housing 10 is bent in such a manner as to approach the second inner surface 12a side. Among the edge ends of the core 30, the edge end on the side of the area where the core 30 is not arranged may or may not be bent so as to approach the second inner surface 12a side.
於圖24中,芯30之緣端與殼體10之內緣不相接。芯30之緣端與殼體10之內緣可相接。In FIG. 24 , the edge end of the core 30 is not in contact with the inner edge of the housing 10 . The edge end of the core 30 can be connected with the inner edge of the housing 10 .
於圖24所示之蒸氣腔1A中,自厚度方向Z觀察,蒸發部EP重疊於殼體10之內緣。於圖24所示之蒸氣腔1A中,未配置芯30之區域可於自厚度方向Z觀察時延伸至蒸發部EP,亦可不延伸至蒸發部EP。In the vapor chamber 1A shown in FIG. 24 , when viewed from the thickness direction Z, the evaporation part EP overlaps the inner edge of the housing 10 . In the vapor chamber 1A shown in FIG. 24 , the area where the core 30 is not arranged may extend to the evaporation part EP when viewed from the thickness direction Z, or may not extend to the evaporation part EP.
圖25係示意性顯示自厚度方向觀察本發明之熱擴散裝置之第2變化例時之芯之配置之俯視圖。FIG. 25 is a plan view schematically showing the arrangement of the core of the second modification example of the thermal diffusion device of the present invention when viewed from the thickness direction.
於圖25所示之蒸氣腔(熱擴散裝置)1B中,在自厚度方向Z觀察時,芯30沿著殼體10之內部空間之外周而配置。In the vapor chamber (thermal diffusion device) 1B shown in FIG. 25 , the core 30 is arranged along the outer periphery of the internal space of the housing 10 when viewed from the thickness direction Z.
於蒸氣腔1B中,芯30之緣端中殼體10之內緣側之緣端以向第2內面12a側接近之方式彎曲。芯30之緣端中芯30為中空之區域側之緣端可以向第2內面12a側接近之方式彎曲,亦可不以向第2內面12a側接近之方式彎曲。In the steam chamber 1B, the edge end of the core 30 on the inner edge side of the housing 10 is bent in such a manner as to approach the second inner surface 12a side. The edge end of the core 30 on the side of the hollow region of the core 30 may or may not be bent in a manner approaching the second inner surface 12a side.
於圖25所示之蒸氣腔1B中,自厚度方向Z觀察,蒸發部EP重疊於殼體10之內緣。於圖25所示之蒸氣腔1B中,自厚度方向Z觀察,蒸發部EP與芯30重疊。In the vapor chamber 1B shown in FIG. 25 , when viewed from the thickness direction Z, the evaporation part EP overlaps the inner edge of the housing 10 . In the vapor chamber 1B shown in FIG. 25 , when viewed from the thickness direction Z, the evaporation part EP overlaps with the core 30 .
於圖25中,芯30之緣端與殼體10之內緣不相接。芯30之緣端與殼體10之內緣可相接。In FIG. 25 , the edge end of the core 30 is not in contact with the inner edge of the housing 10 . The edge end of the core 30 can be connected with the inner edge of the housing 10 .
圖26係示意性顯示熱擴散裝置之第3變化例之剖視圖。FIG. 26 is a cross-sectional view schematically showing a third modification example of the thermal diffusion device.
於圖26所示之蒸氣腔(熱擴散裝置)1C中,支持體31係與殼體10之第1片材11一體地構成。於蒸氣腔1C中,第1片材11及支持體31例如可藉由蝕刻技術、利用多層塗佈進行之印刷技術、其他多層技術等來製作。於蒸氣腔1C中,有孔體32可與支持體31及殼體10之第1片材11由相同之材料構成,亦可由不同之材料構成。有孔體32可與支持體31及殼體10之第1片材11一體地構成。In the vapor chamber (thermal diffusion device) 1C shown in FIG. 26 , the support 31 is integrally formed with the first sheet 11 of the housing 10 . In the vapor chamber 1C, the first sheet 11 and the support 31 can be produced by, for example, etching technology, printing technology using multi-layer coating, or other multi-layer technology. In the steam chamber 1C, the porous body 32 may be made of the same material as the support 31 and the first sheet 11 of the housing 10, or may be made of different materials. The porous body 32 may be integrally formed with the support body 31 and the first sheet 11 of the housing 10 .
圖27係示意性顯示熱擴散裝置之第4變化例之剖視圖。FIG. 27 is a cross-sectional view schematically showing a fourth modification example of the thermal diffusion device.
於圖27所示之蒸氣腔(熱擴散裝置)1D中,例如,藉由沖切加工等使殼體10之第1內面11a之一部分彎曲並凹入,藉此,於凹入之部分形成有支持體31。In the vapor chamber (thermal diffusion device) 1D shown in FIG. 27, a part of the first inner surface 11a of the housing 10 is bent and recessed by, for example, punching processing, and thereby, the recessed part is formed. There is a support body 31.
本發明之熱擴散裝置不限定於上述實施形態,關於熱擴散裝置之構成、製造條件等,可於本發明之範圍內施加各種應用、變化。The thermal diffusion device of the present invention is not limited to the above-described embodiment, and various applications and changes can be applied to the structure, manufacturing conditions, etc. of the thermal diffusion device within the scope of the present invention.
於本發明之熱擴散裝置中,殼體可具有1個蒸發部,亦可具有複數個蒸發部。亦即,於於殼體之外表面可配置1個熱源,亦可配置複數個熱源。蒸發部及熱源之數量無特別限定。In the heat diffusion device of the present invention, the housing may have one evaporation part or a plurality of evaporation parts. That is to say, one heat source can be disposed on the outer surface of the casing, or a plurality of heat sources can be disposed. The number of evaporation parts and heat sources is not particularly limited.
於本發明之熱擴散裝置中,在殼體由第1片材及第2片材構成之情形下,第1片材與第2片材可以端部一致之方式重疊,亦可端部偏移而重疊。In the thermal diffusion device of the present invention, when the housing is composed of a first sheet and a second sheet, the first sheet and the second sheet may be overlapped so that their ends are aligned, or their ends may be offset. And overlap.
於本發明之熱擴散裝置中,在殼體由第1片材及第2片材構成之情形下,構成第1片材之材料、與構成第2片材之材料可不同。例如,藉由將強度高之材料用於第1片材,而可使施加於殼體之應力分散。又,藉由使兩者之材料不同,而可利用一片材獲得一功能,利用另一片材獲得另一功能。作為上述之功能,無特別限定,例如舉出熱傳導功能、電磁波屏蔽功能等。In the thermal diffusion device of the present invention, when the housing is composed of the first sheet and the second sheet, the material constituting the first sheet and the material constituting the second sheet may be different. For example, by using a high-strength material for the first sheet, the stress applied to the housing can be dispersed. Furthermore, by making the two materials different, one function can be obtained by using one piece of material, and another function can be obtained by using another sheet of material. The above functions are not particularly limited, and examples thereof include heat conduction function, electromagnetic wave shielding function, and the like.
本發明之熱擴散裝置出於散熱之目的可搭載於電子機器。因此,具備本發明之熱擴散裝置之電子機器亦為本發明之一。作為本發明之電子機器,例如舉出智慧型手機、平板終端、筆記型個人電腦、遊戲機器、穿戴式裝置等。本發明之熱擴散裝置如上述般,於無需外部動力下獨立地工作,利用工作媒體之蒸發潛熱及凝結潛熱,二維高速地將熱擴散。因此,藉由具備本發明之熱擴散裝置之電子機器,可於電子機器內部之有限之空間中有效地實現散熱。The thermal diffusion device of the present invention can be mounted on electronic equipment for the purpose of heat dissipation. Therefore, electronic equipment equipped with the thermal diffusion device of the present invention is also one of the present invention. Examples of electronic devices of the present invention include smartphones, tablet terminals, notebook personal computers, game machines, and wearable devices. As mentioned above, the thermal diffusion device of the present invention works independently without external power, and utilizes the latent heat of evaporation and condensation heat of the working medium to diffuse heat in two dimensions at a high speed. Therefore, by using an electronic device equipped with the thermal diffusion device of the present invention, heat dissipation can be effectively achieved in a limited space inside the electronic device.
於本說明書中揭示有以下之內容。The following contents are disclosed in this manual.
<1> 一種熱擴散裝置,其包含: 殼體,其具有在厚度方向對向之第1內面及第2內面; 工作媒體,其被封入上述殼體之內部空間;及 芯,其配置於上述殼體之上述內部空間;且 上述芯包含:與上述第1內面相接之支持體、及與上述支持體相接之有孔體; 上述芯之緣端以向上述第1內面側接近之方式彎曲。<1> A thermal diffusion device, which includes: a shell, which has a first inner surface and a second inner surface facing each other in the thickness direction; a working medium, which is enclosed in the internal space of the above-mentioned shell; and a core, which is configured In the above-mentioned internal space of the above-mentioned shell; and the above-mentioned core includes: a support body connected with the above-mentioned first inner surface, and a perforated body connected with the above-mentioned support body; the edge end of the above-mentioned core is directed towards the above-mentioned first inner surface Curved in a side-to-side approach.
<2> 如<1>之熱擴散裝置,其中於沿著上述厚度方向之剖面中,在上述芯之緣端與上述殼體之內緣之間在垂直於上述厚度方向之方向存在間隙。<2> The thermal diffusion device of <1>, wherein in the cross section along the thickness direction, there is a gap between the edge end of the core and the inner edge of the housing in a direction perpendicular to the thickness direction.
<3> 如<1>或<2>之熱擴散裝置,其中上述殼體係由外緣部經接合且於上述厚度方向對向之第1片材及第2片材構成;且 上述第1片材與上述第2片材之接合部於上述厚度方向上位於與上述芯之緣端不同之位置。<3> The thermal diffusion device of <1> or <2>, wherein the above-mentioned shell system is composed of a first sheet and a second sheet whose outer edges are joined and opposed in the above-mentioned thickness direction; and The above-mentioned first sheet The joint portion between the material and the second sheet is located at a position different from the edge end of the core in the thickness direction.
<4> 如<1>至<3>中任一項之熱擴散裝置,其進一步包含支柱,該支柱以與上述殼體之上述第2內面相接之方式配置於上述內部空間;且 上述支柱之高度較上述支持體之高度為大。<4> The thermal diffusion device according to any one of <1> to <3>, further comprising a pillar arranged in the above-mentioned internal space in a manner connected to the above-mentioned second inner surface of the above-mentioned casing; and The height of the pillar is greater than the height of the above-mentioned supporting body.
<5> 如<4>之熱擴散裝置,其中上述支柱之垂直於高度方向之剖面之圓相當直徑較上述支持體之垂直於高度方向之剖面之圓相當直徑為大。<5> The thermal diffusion device of <4>, wherein the circular equivalent diameter of the cross section perpendicular to the height direction of the support is larger than the circular equivalent diameter of the cross section perpendicular to the height direction of the support.
<6> 如<4>或<5>之熱擴散裝置,其中彼此相鄰之上述支柱彼此之中心間距離較彼此相鄰之上述支持體彼此之中心間距離為大。<6> The thermal diffusion device of <4> or <5>, wherein the distance between the centers of the adjacent pillars is larger than the distance between the centers of the adjacent supports.
<7> 如<1>至<6>中任一項之熱擴散裝置,其中上述有孔體係由與上述支持體相同之材料構成。<7> The thermal diffusion device according to any one of <1> to <6>, wherein the porous system is made of the same material as the support.
<8> 如<7>之熱擴散裝置,其中上述有孔體及上述支持體係由多孔質體構成。<8> The thermal diffusion device of <7>, wherein the porous body and the support system are composed of porous bodies.
<9> 如<1>至<6>中任一項之熱擴散裝置,其中上述有孔體係由與上述支持體不同之材料構成。<9> The thermal diffusion device according to any one of <1> to <6>, wherein the porous system is composed of a material different from that of the support.
<10> 如<9>之熱擴散裝置,其中上述有孔體係由多孔質體構成。<10> The thermal diffusion device of <9>, wherein the porous system is composed of a porous body.
<11> 如<1>至<10>中任一項之熱擴散裝置,其中上述支持體之厚度與上述有孔體之厚度相同、或較上述有孔體之厚度為小。<11> The thermal diffusion device according to any one of <1> to <10>, wherein the thickness of the support is the same as or smaller than the thickness of the porous body.
<12> 如<1>至<11>中任一項之熱擴散裝置,其中上述有孔體具有沿著上述厚度方向貫通之貫通孔;且 於上述貫通孔之周緣在接近上述第2內面之方向設置有凸部。<12> The thermal diffusion device according to any one of <1> to <11>, wherein the porous body has a through hole penetrating along the thickness direction; and the periphery of the through hole is close to the second inner surface A convex portion is provided in the direction.
<13> 如<12>之熱擴散裝置,其中上述凸部具有上述第1內面側之第1端部及上述第2內面側之第2端部;且 自上述厚度方向觀察,上述第2端部之內壁包圍之區域之剖面積較上述第1端部之內壁包圍之區域之剖面積為小。<13> The thermal diffusion device of <12>, wherein the convex portion has a first end on the first inner surface side and a second end on the second inner surface side; and Viewed from the thickness direction, the above-mentioned first end The cross-sectional area of the area surrounded by the inner wall of the second end is smaller than the cross-sectional area of the area surrounded by the inner wall of the first end.
<14> 如<1>至<11>中任一項之熱擴散裝置,其中上述有孔體具有沿著上述厚度方向貫通之貫通孔;且 於上述貫通孔之周緣在接近上述第1內面之方向設置有凸部。<14> The thermal diffusion device according to any one of <1> to <11>, wherein the porous body has a through hole penetrating along the thickness direction; and the periphery of the through hole is close to the first inner surface A convex portion is provided in the direction.
<15> 如<14>之熱擴散裝置,其中上述凸部具有上述第1內面側之第1端部及上述第2內面側之第2端部;且 自上述厚度方向觀察,上述第1端部之內壁包圍之區域之剖面積較上述第2端部之內壁包圍之區域之剖面積為小。<15> The thermal diffusion device of <14>, wherein the convex portion has a first end on the first inner surface side and a second end on the second inner surface side; and Viewed from the thickness direction, the above-mentioned first end The cross-sectional area of the area surrounded by the inner wall of the first end is smaller than the cross-sectional area of the area surrounded by the inner wall of the second end.
<16> 如<1>至<15>中任一項之熱擴散裝置,其中於自上述厚度方向觀察時,上述芯係遍及上述殼體之上述內部空間之整體而配置。<16> The thermal diffusion device according to any one of <1> to <15>, wherein the core is disposed throughout the entire internal space of the housing when viewed from the thickness direction.
<17> 如<1>至<15>中任一項之熱擴散裝置,其中於自上述厚度方向觀察時,上述芯係遍及上述殼體之上述內部空間之整體而配置;且 上述內部空間於自上述厚度方向觀察時具有配置有上述芯之區域、及未配置上述芯之區域; 未配置上述芯之區域於自上述厚度方向觀察時線狀延伸。<17> The thermal diffusion device according to any one of <1> to <15>, wherein when viewed from the thickness direction, the above-mentioned core is disposed throughout the entirety of the above-mentioned internal space of the above-mentioned housing; and The above-mentioned internal space is in When viewed from the above-mentioned thickness direction, it has an area where the above-mentioned core is arranged, and an area where the above-mentioned core is not arranged; The area where the above-mentioned core is not arranged extends linearly when viewed from the above-mentioned thickness direction.
<18> 如<1>至<15>中任一項之熱擴散裝置,其中於自上述厚度方向觀察時,上述芯係沿著上述殼體之上述內部空間之外周而配置。<18> The thermal diffusion device according to any one of <1> to <15>, wherein the core is arranged along the outer periphery of the internal space of the housing when viewed from the thickness direction.
<19> 一種電子機器,其包含<1>至<18>中任一項之熱擴散裝置。 [產業上之可利用性]<19> An electronic device including the thermal diffusion device according to any one of <1> to <18>. [Industrial availability]
本發明之熱擴散裝置於可攜式資訊終端等領域中可使用於廣範之用途。例如,可為了降低CPU等熱源之溫度,延長電子機器之使用時間而使用,可使用於智慧型手機、平板終端、筆記型個人電腦等。The thermal diffusion device of the present invention can be used in a wide range of applications in fields such as portable information terminals. For example, it can be used to reduce the temperature of heat sources such as CPUs and extend the use time of electronic equipment. It can be used in smartphones, tablet terminals, notebook personal computers, etc.
1,1A,1B,1C,1D:蒸氣腔(熱擴散裝置) 10:殼體 11:第1片材 11a:第1內面 12:第2片材 12a:第2內面 13:接合部 20:工作媒體 30,30A,30B,30C,30D,30E,30F:芯 31:支持體 32:有孔體 33:貫通孔 34,34a,34b,34c,34d,34e,34f,34g,34h,34i,34j,34k:凸部 35,35a,35b,35c,35d,35e,35f,35g,35h,35i,35j,35k:第1端部 36,36a,36b,36c,36d,36e,36f,36g,36h,36i,36j,36k:第2端部 37:蓋部 40:支柱 A:芯之遠端與殼體之內緣之距離 B:芯之緣端之彎曲高度 C:芯之緣端之彎曲寬度 EP:蒸發部 HS:熱源 II-II:線 III:部分 P 31:支持體之中心間距離 P 33:貫通孔之中心間距離 R:區域 T 31:支持體之高度 T 32:有孔體之厚度 W 31:支持體之寬度 X:寬度方向 Y:長度方向 Z:厚度方向 ϕ 33:貫通孔之直徑 1, 1A, 1B, 1C, 1D: Vapor chamber (thermal diffusion device) 10: Case 11: 1st sheet 11a: 1st inner surface 12: 2nd sheet 12a: 2nd inner surface 13: Joint part 20 : Working media 30, 30A, 30B, 30C, 30D, 30E, 30F: Core 31: Support body 32: Perforated body 33: Through hole 34, 34a, 34b, 34c, 34d, 34e, 34f, 34g, 34h, 34i , 34j, 34k: convex portion 35, 35a, 35b, 35c, 35d, 35e, 35f, 35g, 35h, 35i, 35j, 35k: first end 36, 36a, 36b, 36c, 36d, 36e, 36f, 36g , 36h, 36i, 36j, 36k: 2nd end 37: Cover 40: Pillar A: The distance between the far end of the core and the inner edge of the shell B: The bending height of the edge of the core C: The distance between the edge of the core Bend width EP: Evaporation part HS: Heat source II-II: Line III: Part P 31 : Distance between the centers of the support P 33 : Distance between the centers of the through holes R: Area T 31 : Height of the support T 32 : Hole Thickness of body W 31 : Width of support body X: Width direction Y: Length direction Z: Thickness direction ϕ 33 : Diameter of through hole
圖1係示意性顯示本發明之熱擴散裝置之一例之立體圖。 圖2係沿著圖1所示之熱擴散裝置之II-II線之剖視圖之一例。 圖3係圖2之III部分之放大圖。 圖4係顯示圖2之III部分之變化例之放大圖。 圖5係示意性顯示構成圖2所示之熱擴散裝置之芯之一例之將一部分放大之剖視圖。 圖6係自支持體側觀察圖5所示之芯之俯視圖。 圖7係示意性顯示芯之第1變化例之將一部分放大之剖視圖。 圖8係示意性顯示芯之第2變化例之將一部分放大之剖視圖。 圖9係示意性顯示芯之第3變化例之將一部分放大之剖視圖。 圖10A係示意性顯示芯之第4變化例之將一部分放大之剖視圖。 圖10B係示意性顯示自有孔體側觀察圖10A所示之芯時之於貫通孔、凸部及凸部附近之蒸氣之流動之俯視圖。 圖11係示意性顯示圖10A所示之凸部之第1變化例之將一部分放大之剖視圖。 圖12係示意性顯示圖10A所示之凸部之第2變化例之將一部分放大之剖視圖。 圖13係示意性顯示圖10A所示之凸部之第3變化例之將一部分放大之剖視圖。 圖14係示意性顯示圖10A所示之凸部之第4變化例之將一部分放大之剖視圖。 圖15係示意性顯示圖10A所示之凸部之第5變化例之將一部分放大之剖視圖。 圖16A係示意性顯示芯之第5變化例之將一部分放大之剖視圖。 圖16B係顯示在圖16A所示之剖視圖中封入有工作媒體之狀態之一例之剖視圖。 圖17係示意性顯示圖16A所示之凸部之第1變化例之將一部分放大之剖視圖。 圖18係示意性顯示圖16A所示之凸部之第2變化例之將一部分放大之剖視圖。 圖19係示意性顯示圖16A所示之凸部之第3變化例之將一部分放大之剖視圖。 圖20係示意性顯示圖16A所示之凸部之第4變化例之將一部分放大之剖視圖。 圖21係示意性顯示圖16A所示之凸部之第5變化例之將一部分放大之剖視圖。 圖22係示意性顯示芯之第6變化例之俯視圖。 圖23係示意性顯示自厚度方向觀察圖1所示之熱擴散裝置時之芯之配置之俯視圖。 圖24係示意性顯示自厚度方向觀察本發明之熱擴散裝置之第1變化例時之芯之配置之俯視圖。 圖25係示意性顯示自厚度方向觀察本發明之熱擴散裝置之第2變化例時之芯之配置之俯視圖。 圖26係示意性顯示熱擴散裝置之第3變化例之剖視圖。 圖27係示意性顯示熱擴散裝置之第4變化例之剖視圖。FIG. 1 is a perspective view schematically showing an example of the heat diffusion device of the present invention. Figure 2 is an example of a cross-sectional view along line II-II of the thermal diffusion device shown in Figure 1. Figure 3 is an enlarged view of part III of Figure 2. Figure 4 is an enlarged view showing a modification example of part III of Figure 2. FIG. 5 is a partially enlarged cross-sectional view schematically showing an example of the core constituting the heat diffusion device shown in FIG. 2 . Figure 6 is a top view of the core shown in Figure 5 viewed from the side of the self-supporting body. Figure 7 is a partially enlarged cross-sectional view of the first variation of the schematic display core. Figure 8 is a partially enlarged cross-sectional view of the second modification example of the schematic display core. Figure 9 is a partially enlarged cross-sectional view of a third modification example of the schematic display core. 10A is a partially enlarged cross-sectional view of a fourth modification example of the schematic display core. 10B is a plan view schematically showing the flow of vapor in the through holes, the convex portions, and the vicinity of the convex portions when the core shown in FIG. 10A is viewed from the side of the porous body. Fig. 11 is a partially enlarged cross-sectional view schematically showing a first variation of the convex portion shown in Fig. 10A. Fig. 12 is a partially enlarged cross-sectional view schematically showing a second modification example of the convex portion shown in Fig. 10A. Fig. 13 is a partially enlarged cross-sectional view schematically showing a third modification example of the convex portion shown in Fig. 10A. 14 is a partially enlarged cross-sectional view schematically showing a fourth variation example of the convex portion shown in FIG. 10A. Fig. 15 is a partially enlarged cross-sectional view schematically showing a fifth modification example of the convex portion shown in Fig. 10A. 16A is a partially enlarged cross-sectional view of a fifth modification example of the schematic display core. 16B is a cross-sectional view showing an example of a state in which a working medium is enclosed in the cross-sectional view shown in FIG. 16A. Fig. 17 is a partially enlarged cross-sectional view schematically showing a first variation of the convex portion shown in Fig. 16A. Fig. 18 is a partially enlarged cross-sectional view schematically showing a second modification example of the convex portion shown in Fig. 16A. Fig. 19 is a partially enlarged cross-sectional view schematically showing a third modification example of the convex portion shown in Fig. 16A. Fig. 20 is a partially enlarged cross-sectional view schematically showing a fourth modification example of the convex portion shown in Fig. 16A. Fig. 21 is a partially enlarged cross-sectional view schematically showing a fifth modification example of the convex portion shown in Fig. 16A. Figure 22 is a top view of the sixth modification example of the schematic display core. Figure 23 is a top view schematically showing the arrangement of the core of the heat diffusion device shown in Figure 1 when viewed from the thickness direction. 24 is a top view schematically showing the arrangement of the core of the first variation of the thermal diffusion device of the present invention when viewed from the thickness direction. 25 is a top view schematically showing the arrangement of the core of the second variation of the thermal diffusion device of the present invention when viewed from the thickness direction. 26 is a cross-sectional view schematically showing a third modification example of the heat diffusion device. 27 is a cross-sectional view schematically showing a fourth modification example of the heat diffusion device.
1:蒸氣腔(熱擴散裝置) 1: Vapor chamber (heat diffusion device)
10:殼體 10: Shell
11:第1片材 11:Sheet 1
11a:第1內面 11a: 1st inner surface
12:第2片材 12: 2nd sheet
12a:第2內面 12a: 2nd inner surface
13:接合部 13:Joint
20:工作媒體 20:Work media
30:芯 30:core
31:支持體 31:Support
32:有孔體 32: Porous body
33:貫通孔 33:Through hole
40:支柱 40:Pillar
III:部分 III:Part
X:寬度方向 X: width direction
Y:長度方向 Y: length direction
Z:厚度方向 Z:Thickness direction
Claims (19)
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WO2020123631A1 (en) * | 2018-12-11 | 2020-06-18 | Kelvin Thermal Technologies, Inc. | Vapor chamber |
WO2021188128A1 (en) * | 2020-03-18 | 2021-09-23 | Kelvin Thermal Technologies, Inc. | Deformed mesh thermal ground plane |
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