TW202402964A - 熱硬化性樹脂組合物、熱傳導性樹脂片材、散熱積層體、散熱性電路基板、半導體裝置及功率模組 - Google Patents

熱硬化性樹脂組合物、熱傳導性樹脂片材、散熱積層體、散熱性電路基板、半導體裝置及功率模組 Download PDF

Info

Publication number
TW202402964A
TW202402964A TW112111150A TW112111150A TW202402964A TW 202402964 A TW202402964 A TW 202402964A TW 112111150 A TW112111150 A TW 112111150A TW 112111150 A TW112111150 A TW 112111150A TW 202402964 A TW202402964 A TW 202402964A
Authority
TW
Taiwan
Prior art keywords
thermosetting resin
mass
resin composition
thermally conductive
boron nitride
Prior art date
Application number
TW112111150A
Other languages
English (en)
Chinese (zh)
Inventor
田中俊行
谷口紗絵
澤村敏行
山本由実子
日高克彦
Original Assignee
日商三菱化學股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商三菱化學股份有限公司 filed Critical 日商三菱化學股份有限公司
Publication of TW202402964A publication Critical patent/TW202402964A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C08J3/247—Heating methods
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/0427—Coating with only one layer of a composition containing a polymer binder
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2371/00—Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2467/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C08J2467/06—Unsaturated polyesters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C08K2003/282—Binary compounds of nitrogen with aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
TW112111150A 2022-03-24 2023-03-24 熱硬化性樹脂組合物、熱傳導性樹脂片材、散熱積層體、散熱性電路基板、半導體裝置及功率模組 TW202402964A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2022-047899 2022-03-24
JP2022-047900 2022-03-24
JP2022047900 2022-03-24
JP2022047899 2022-03-24

Publications (1)

Publication Number Publication Date
TW202402964A true TW202402964A (zh) 2024-01-16

Family

ID=88101629

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112111150A TW202402964A (zh) 2022-03-24 2023-03-24 熱硬化性樹脂組合物、熱傳導性樹脂片材、散熱積層體、散熱性電路基板、半導體裝置及功率模組

Country Status (5)

Country Link
US (1) US20250019489A1 (https=)
EP (1) EP4502056A4 (https=)
JP (1) JPWO2023182470A1 (https=)
TW (1) TW202402964A (https=)
WO (1) WO2023182470A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2025197972A1 (https=) * 2024-03-22 2025-09-25

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001288339A (ja) * 2000-02-03 2001-10-16 Nec Corp エポキシ樹脂組成物の難燃化方法および難燃性エポキシ樹脂組成物
JP5627196B2 (ja) 2009-04-28 2014-11-19 国立大学法人横浜国立大学 エポキシ樹脂組成物及びその硬化物
JP6274014B2 (ja) * 2013-05-27 2018-02-07 三菱ケミカル株式会社 窒化ホウ素凝集粒子、凝集ｂｎ粒子含有樹脂組成物及び放熱シート
JP6794613B2 (ja) 2014-02-05 2020-12-02 三菱ケミカル株式会社 窒化ホウ素凝集粒子、窒化ホウ素凝集粒子の製造方法、該窒化ホウ素凝集粒子含有樹脂組成物、及び成形体
JP6786778B2 (ja) 2015-08-12 2020-11-18 三菱ケミカル株式会社 放熱樹脂シート及び該放熱樹脂シートを含むデバイス
JP7188070B2 (ja) * 2018-01-05 2022-12-13 三菱ケミカル株式会社 放熱絶縁シートおよび該シート硬化物を絶縁層とする積層構造体
JP7151156B2 (ja) * 2018-05-09 2022-10-12 住友ベークライト株式会社 高熱伝導性硬化性組成物、高熱伝導性硬化膜、積層体およびパワーモジュール
JP7383971B2 (ja) 2018-10-11 2023-11-21 三菱ケミカル株式会社 樹脂組成物、樹脂硬化物および複合成形体
JP7395849B2 (ja) * 2019-06-03 2023-12-12 住友ベークライト株式会社 熱硬化性樹脂組成物、その樹脂シート、及び金属ベース基板
WO2021085593A1 (ja) * 2019-10-30 2021-05-06 三菱ケミカル株式会社 樹脂組成物、硬化物、複合成形体、半導体デバイス
JP7562944B2 (ja) 2019-11-28 2024-10-08 住友ベークライト株式会社 基材付き樹脂膜、プリント配線基板および電子装置
US20230018491A1 (en) * 2019-12-09 2023-01-19 Sumitomo Bakelite Co., Ltd. Thermosetting resin composition, resin sheet, and metal base substrate

Also Published As

Publication number Publication date
JPWO2023182470A1 (https=) 2023-09-28
EP4502056A4 (en) 2025-07-30
US20250019489A1 (en) 2025-01-16
WO2023182470A1 (ja) 2023-09-28
EP4502056A1 (en) 2025-02-05

Similar Documents

Publication Publication Date Title
CN102770956B (zh) 热固性树脂组合物、导热性乙阶片材及电源模块
CN109312164B (zh) 膜用树脂组合物、膜、带有基材的膜、金属/树脂层叠体、树脂固化物、半导体装置以及膜的制造方法
JP7772151B2 (ja) 樹脂組成物、樹脂硬化物および複合成形体
US20250034354A1 (en) Thermosetting resin composition, resin cured product and composite molded body
JP2009224109A (ja) 絶縁シート及び積層構造体
US20240010814A1 (en) Resin composition, cured product sheet, composite molded body, and semiconductor device
US20250019489A1 (en) Thermosetting resin composition, thermally conductive resin sheet, heat-dissipating layered product, heat-dissipating circuit board, semiconductor device and power module
JP7383971B2 (ja) 樹脂組成物、樹脂硬化物および複合成形体
JP2023147229A (ja) 熱硬化性樹脂組成物、硬化物、複合成形体および半導体デバイス
TWI901792B (zh) 接著膜、附支撐片的接著膜及構造體
JP2023152859A (ja) 放熱シート積層体、及び放熱シート積層体の製造方法
CN118355074A (zh) 热固性树脂组合物、导热性树脂片、散热层叠体、散热性电路基板、半导体装置及功率模块
JP2024137893A (ja) 熱硬化性組成物、シート状硬化物、複合成形体及び半導体デバイス
JP2023102284A (ja) 熱伝導性樹脂組成物、熱伝導性樹脂シート、放熱積層体、放熱性回路基板、半導体装置およびパワーモジュール
JP2024134539A (ja) 熱硬化性組成物、硬化物、熱伝導性シート及び複合成形体
JP7800253B2 (ja) シート硬化物の製造方法及び複合成形体の製造方法
WO2025197972A1 (ja) 熱硬化性組成物、熱硬化性シートの製造方法、熱伝導性シート、放熱積層体、放熱性回路基板及びパワー半導体装置
JP2023147228A (ja) 熱硬化性樹脂組成物、硬化物、複合成形体および半導体デバイス
TWI915323B (zh) 樹脂組合物、硬化物、複合成形體、半導體裝置
JP2025130241A (ja) 熱硬化性組成物、熱硬化性シート、熱伝導性シート、複合成形体、放熱積層体、放熱性回路基板、半導体装置及びパワーモジュール
JP2023145355A (ja) 熱硬化性樹脂組成物、熱硬化性樹脂シート、絶縁シート及び半導体装置
JP2023145370A (ja) 熱硬化性樹脂組成物、熱硬化性樹脂シート、絶縁シート及び半導体装置
JP2026061821A (ja) シート状硬化物、複合成形体及びパワー半導体装置
JP2026021971A (ja) 硬化物、複合成形体、半導体デバイス及び複合成形体の製造方法