JPWO2025197972A1 - - Google Patents

Info

Publication number
JPWO2025197972A1
JPWO2025197972A1 JP2025547800A JP2025547800A JPWO2025197972A1 JP WO2025197972 A1 JPWO2025197972 A1 JP WO2025197972A1 JP 2025547800 A JP2025547800 A JP 2025547800A JP 2025547800 A JP2025547800 A JP 2025547800A JP WO2025197972 A1 JPWO2025197972 A1 JP WO2025197972A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025547800A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2025197972A1 publication Critical patent/JPWO2025197972A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2025547800A 2024-03-22 2025-03-19 Pending JPWO2025197972A1 (https=)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2024046094 2024-03-22
JP2024171097 2024-09-30
PCT/JP2025/010751 WO2025197972A1 (ja) 2024-03-22 2025-03-19 熱硬化性組成物、熱硬化性シートの製造方法、熱伝導性シート、放熱積層体、放熱性回路基板及びパワー半導体装置

Publications (1)

Publication Number Publication Date
JPWO2025197972A1 true JPWO2025197972A1 (https=) 2025-09-25

Family

ID=97139379

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025547800A Pending JPWO2025197972A1 (https=) 2024-03-22 2025-03-19

Country Status (2)

Country Link
JP (1) JPWO2025197972A1 (https=)
WO (1) WO2025197972A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011079905A (ja) * 2009-10-05 2011-04-21 Hitachi Chem Co Ltd エポキシ樹脂組成物、半導体封止充てん用樹脂組成物及び半導体装置
JP2018174250A (ja) * 2017-03-31 2018-11-08 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置
JP2019083225A (ja) * 2017-10-27 2019-05-30 日立化成株式会社 アンダーフィル用液状樹脂組成物、電子部品装置、及び電子部品装置の製造方法
WO2022210686A1 (ja) * 2021-03-29 2022-10-06 三菱ケミカル株式会社 樹脂組成物、シート硬化物、複合成形体及び半導体デバイス
WO2023182470A1 (ja) * 2022-03-24 2023-09-28 三菱ケミカル株式会社 熱硬化性樹脂組成物、熱伝導性樹脂シート、放熱積層体、放熱性回路基板、半導体装置およびパワーモジュール

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011079905A (ja) * 2009-10-05 2011-04-21 Hitachi Chem Co Ltd エポキシ樹脂組成物、半導体封止充てん用樹脂組成物及び半導体装置
JP2018174250A (ja) * 2017-03-31 2018-11-08 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置
JP2019083225A (ja) * 2017-10-27 2019-05-30 日立化成株式会社 アンダーフィル用液状樹脂組成物、電子部品装置、及び電子部品装置の製造方法
WO2022210686A1 (ja) * 2021-03-29 2022-10-06 三菱ケミカル株式会社 樹脂組成物、シート硬化物、複合成形体及び半導体デバイス
WO2023182470A1 (ja) * 2022-03-24 2023-09-28 三菱ケミカル株式会社 熱硬化性樹脂組成物、熱伝導性樹脂シート、放熱積層体、放熱性回路基板、半導体装置およびパワーモジュール

Also Published As

Publication number Publication date
WO2025197972A1 (ja) 2025-09-25

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