TW202349802A - Connection structure manufacturing method, film structure, and film structure manufacturing method - Google Patents

Abstract

Provided are a connection structure manufacturing method, a film structure, and a film structure manufacturing method that enable the shortening of processing takt time. Included are: a step (A1) for preparing a substrate on which a plurality of electronic components are mounted; a step (B1) for preparing a film structure in which a plurality of singulated adhesive films, which include singulated adhesive films containing solder particles, are arranged at prescribed positions on a substrate corresponding to the substrate on which the plurality of electronic components are mounted; a step (C1) for temporarily attaching, at once, the plurality of singulated adhesive films to prescribed locations on the substrate; a step (D1) for placing electronic components on the singulated adhesive films; and a step (E1) for reflowing the substrate provided with the singulated adhesive films and the electronic components. The processing takt time can be shortened because the plurality of singulated adhesive films is temporarily attached to the substrate at once.

Description

Manufacturing method of connection structure, membrane structure, and manufacturing method of membrane structure

This technology relates to a manufacturing method of a connection structure mounted with electronic components, a membrane structure, and a manufacturing method of a membrane structure. This application claims priority based on Japanese Patent Application No. 2022-030239 filed in Japan on February 28, 2022, which application is incorporated by reference into this application.

SMT (Surface Mount Technology) component mounting on rigid substrates or flexible substrates, LGA (Land Grid Array)/BGA (Ball Grid Array) mounting, connector mounting, etc. usually involves printing solder paste onto the substrate and using SMT. After the machine mounts the parts on it, it is installed through the reflow step.

Printing of solder paste requires making molds (patterns, templates) according to the layout of the substrate to be mounted, and there is a limit to shortening the time from subsequent steps (drying) after printing.

Therefore, when an adhesive film is used instead of solder paste, the effect of shortening the time can be expected by replacing the step of applying the solder paste with the step of temporarily applying the film (see, for example, Patent Document 1).

However, in the case of installation that requires a reflow step, multiple parts of different types will be mounted on one substrate at the same time. Therefore, a variety of adhesive films must be prepared accordingly and temporarily attached separately, which will lead to a longer manufacturing process. [Known technical documents] [Patent Document]

[Patent Document 1] Japanese Patent Application Publication No. 2019-194479

[Problem to be solved by the invention]

This technology is proposed in view of the actual situation of this conventional knowledge, and provides a manufacturing method of a connection structure, a membrane structure, and a manufacturing method of a membrane structure that can shorten the manufacturing process lead time. [Technical means to solve the problem]

The manufacturing method of the connection structure of the present technology has the following steps: preparing a substrate for mounting a plurality of electronic components; preparing a base material containing solder particles at a predetermined position corresponding to the substrate for mounting a plurality of electronic components. A film structure of a plurality of individualized adhesive films of an individualized adhesive film; temporarily affixing the plurality of individualized adhesive films to a predetermined position of the above-mentioned substrate at one time; placing electronic components on the above-mentioned individualized adhesive film on; and reflowing the substrate provided with the above-mentioned single-piece adhesive film and the above-mentioned electronic component.

The manufacturing method of the connection structure of the present technology has the following steps: preparing a substrate for mounting a plurality of electronic components; preparing a film structure provided with a single-piece adhesive film corresponding to the plurality of electronic components on the substrate; using a sticker The chip machine presses the electronic component against the singulated adhesive film corresponding to the electronic component, causes the singulated adhesive film to be bonded to the electronic component, and mounts the electronic component bonded with the singulated adhesive film; and The substrate provided with the above-mentioned singulated adhesive film and the above-mentioned electronic component is reflowed.

The manufacturing method of the connection structure of the present technology has the following steps: preparing a substrate for mounting a plurality of electronic components; preparing a film structure provided with a single-piece adhesive film corresponding to the plurality of electronic components on the substrate; using a sticker A chip machine mounts the above-mentioned singulation adhesive film on a predetermined position of the above-mentioned substrate; places electronic components on the above-mentioned singulation adhesive film; and reflows the substrate provided with the above-mentioned singulation adhesive film and the above-mentioned electronic components. .

The film structure of the present technology may also include a base material, and a plurality of singulated adhesive films provided at predetermined positions on the base material corresponding to a plurality of parts, and more than one of the plurality of singulated adhesive films may be provided Contains solder particles.

The film structure of the present technology may also include a base material, and a plurality of singulated adhesive films provided at predetermined positions on the base material corresponding to a plurality of parts, and more than one of the plurality of singulated adhesive films may be provided There are areas containing solder particles and areas not containing solder particles.

The film structure of the present technology may also include a base material, and a plurality of singulated adhesive films provided at predetermined positions on the base material corresponding to a plurality of parts, and more than one of the plurality of singulated adhesive films may be provided Different from other single-piece adhesive film thickness.

The film structure of the present technology may also include: a base material; a monolithic adhesive film having a first thickness, which is provided at a predetermined position on the base material corresponding to a plurality of parts, and has a region containing solder particles and an insulating film. A region containing solder particles; and a monolithic adhesive film having a second thickness, which is provided at a predetermined position on the above-mentioned base material corresponding to a plurality of parts, and has a region containing solder particles and a region not containing solder particles.

The manufacturing method of the film structure of the present technology is to provide a first singulated adhesive film on a first base material, a second singulated adhesive film on a second base material, and the above-mentioned first singulated adhesive film corresponding to a plurality of electronic components. The above-mentioned first singulated adhesive film and the above-mentioned second singulated adhesive film are arranged at predetermined positions of the 1 base material, the above-mentioned second base material, or the third base material, and the above-mentioned first singulated adhesive film and the above-mentioned second singulated adhesive film are One or more pieces of the sheeted adhesive film contain solder particles.

The manufacturing method of the film structure of the present technology is to provide a single-piece adhesive film containing no solder particles on a first base material, and to provide a single-piece adhesive film containing solder particles on a second base material. material, the above-mentioned second base material, or a predetermined position of the third base material, so that the above-mentioned singulated adhesive film not containing solder particles and the above-mentioned singulated adhesive film containing solder particles are brought close to each other, so as to arrange the Single-piece bonding film for areas and areas containing solder particles.

The manufacturing method of the film structure of the present technology is to provide a singulated adhesive film with a first thickness on a first base material, a singulated adhesive film with a second thickness on a second base material, and a plurality of The individualized adhesive film having the first thickness and the individualized adhesive film having the second thickness are arranged at predetermined positions of the first base material, the second base material, or the third base material corresponding to the component.

The manufacturing method of the film structure of the present technology is to provide a single-piece adhesive film that does not contain solder particles and has a first thickness on a first base material, and provides a second base material that does not contain solder particles and has a second thickness. A singulated adhesive film, a singulated adhesive film containing solder particles and having the above-mentioned first thickness is provided on the third base material, and a singulated adhesive film containing solder particles and having the above-mentioned second thickness is provided on the fourth base material. Film, the above-mentioned single piece containing no solder particles and having the first thickness is placed at a predetermined position on the above-mentioned first base material, the above-mentioned second base material, the above-mentioned third base material, the above-mentioned fourth base material, or the above-mentioned fifth base material. The chemical adhesive film and the above-mentioned singulated adhesive film containing solder particles and having a first thickness are brought close to each other, and the singulated adhesive film having a first thickness having a region not containing solder particles and a region containing solder particles is arranged, and The above-mentioned singulated adhesive film containing no solder particles and having a second thickness and the above-mentioned singulated adhesive film containing solder particles and having a second thickness are arranged close to each other to have a region not containing solder particles and a region containing solder particles, and A monolithic adhesive film having a second thickness. [Effects of the invention]

According to this technology, the process throughput can be shortened compared to preparing a variety of adhesive films and temporarily applying them separately.

Hereinafter, embodiments of the present invention will be described in detail in the following order with reference to the drawings. 1. Manufacturing method of connecting structure 2. Membrane structure and manufacturing method of membrane structure 3.Examples

＜1. Manufacturing method of connected structure＞ <1-1. First Embodiment> The manufacturing method of the connection structure of the first embodiment includes: step (A1), which prepares a substrate for mounting a plurality of electronic components; step (B1), which prepares a substrate corresponding to the substrate for mounting the plurality of electronic components. A film structure including a plurality of individualized adhesive films containing solder particles is arranged at a predetermined position on the base material; step (C1) is to temporarily attach a plurality of individualized adhesive films at one time on a predetermined position of the substrate; step (D1), which is to place the electronic components on the singulation adhesive film; and step (E1), which is to reflow the substrate provided with the singulation adhesive film and the electronic components. . According to the manufacturing method of the connected structure of the first embodiment, a plurality of individualized adhesive films are temporarily attached to the substrate at one time, so the process throughput can be shortened. In addition, compared with temporarily affixing the adhesive film to the entire surface of the substrate, there is no need to temporarily affix the adhesive film to useless areas, so the cost can be reduced.

It is preferable that at least one of the individualized adhesive films contains solder particles. This allows electronic components to be mounted using a reflow oven. Moreover, it is preferable that at least one of the individualized adhesive films has a region containing solder particles and a region not containing solder particles. This can prevent solder from wetting and spreading to exposed metal outside the terminal portion, for example, like a socket connector, thereby preventing solder from wetting and spreading to useless areas outside the terminal portion. Moreover, it is preferable that one or more thicknesses of the individualized adhesive film are different from other individualized adhesive films. By this, when the terminal height or terminal area of electronic parts is different, the size or weight of electronic parts is different, the wetting of the adhesive around the connector needs to be controlled, etc., even if the required amount of adhesive is different, it can Improve joint strength.

The monolithic adhesive film is preferably formed on the base material by half-cut processing, screen printing, or inkjet printing. Half-cut processing uses a Victoria knife to cut only the adhesive film without cutting the base material, and remove the useless parts through die-cutting processing, etc. Screen printing uses the pressure generated by a scraper to cause the adhesive to pass through the mesh of the screen to print (coat) it on the substrate, and to produce a single-piece adhesive film of a specific thickness based on, for example, the thickness of the screen. The mesh cover is made of silk mesh woven from synthetic fibers such as polyester or stainless steel or various metal fibers. When the adhesive contains solder particles, it is sufficient to make the mesh larger than the maximum diameter of the solder particles. Inkjet printing can inject a specified amount of resin from the nozzle. Since the resin can be patterned onto the object (adhesion film) from the nozzle, no plate is required. For example, viscosity can be provided on the surface of the singulated adhesive film by dots or lines of resin on a portion of the surface of the singulated adhesive film. It can also be injected to more than half of the entire surface to form a layer. The thickness can be measured in the same manner as the following singulated adhesive film. In addition to providing viscosity, inkjet printing can also be used to provide resin on the single-piece adhesive film (the same operation as normal layer formation or addition of blends can be expected, but from the viewpoint of operation time and functional provision) In other words, it has the advantage of being able to be used separately) to improve bonding strength or reliability.

1 to 3 are diagrams for explaining the manufacturing method of the connection structure according to the first embodiment. Fig. 1 is a top view showing an example of a substrate. Fig. 2 is a top view showing an example of a membrane structure. Fig. 3 is a top view showing an example of a membrane structure. A diagram showing the state where the individualized adhesive film is temporarily attached to the substrate.

[Step (A1)] As shown in FIG. 1 , in step (A1), a substrate 10 for mounting a plurality of electronic components is prepared. The substrate 10 includes a first connector mounting area 11, a second connector mounting area 12, a first chip mounting area 13, a second chip mounting area 14, a third chip mounting area 15, a fourth chip mounting area 16, and a fifth chip. Mounting area 17 and sixth chip mounting area 18. Terminals corresponding to the respective electronic components are formed in each of the mounting areas 11 to 18 .

The substrate 10 is not particularly limited, as long as it is a hard substrate or a flexible printed circuit (FPC: Flexible Printed Circuits) that is heat-resistant to reflow heat. For example, a glass epoxy substrate, a ceramic substrate, a plastic substrate, or a resin multilayer substrate can be used. substrate, etc. Furthermore, it is preferable that the terminals of each mounting area 11 to 18 are plated with gold, nickel, palladium, silver, copper, tin, or the like.

Electronic components are not particularly limited as long as they can be joined by reflow soldering. Examples include connectors, IC (Integrated Circuit) or LSI (Large Scale Integration) packages, LED (Light Emitting Diode), switches, etc. . Examples of the connector include a receptacle connector and a plug connector, and a receptacle connector covering and fitting into a plug connector may be used. In addition, in order to prevent the overall appearance of the receptacle connector from becoming too large and reduce the outer appearance after mating, the receptacle connector may have a shorter terminal length than the plug connector. If the terminal length is shortened, the soldering area will be correspondingly reduced, so the soldering strength between the socket connector and the substrate tends to be reduced. Therefore, in order for the socket connector to obtain sufficient strength with a relatively small soldering area, the thickness of the conductive adhesive film can also be made larger than that used in the soldering of the plug connector, and the area of the conductive adhesive film can also be widened . The adjustment of the size of such parts and the thickness or area of the adhesive film is not limited to socket connectors. In this technology, other parts can also be appropriately adjusted by size or weight, and welding area.

[Step (B1)] As shown in FIG. 2 , in step (B1), a film structure is prepared in which a single piece containing solder particles is arranged at a predetermined position on the base material 20 corresponding to the substrate 10 on which a plurality of electronic components are mounted. A plurality of the adhesive films are separated into individual sheets 21 to 28.

The singulated adhesive films 21 to 28 are not particularly limited, and examples include film-shaped conductive films, solder particle-containing resin films obtained by melting solder particles, and anisotropic conductive films (ACF: Anis otropic Conductive Film). , film-like adhesive film (NCF: Non Conductive Film), etc. They can be a single layer or a layered structure of 2 or more layers. There are no particular restrictions on the combination. By laminating at least one of a conductive film (containing solder particles) or a resin film containing solder particles on an adhesive film (excluding solder particles), it is possible to adjust the composition of a single-piece adhesive film. Film thickness and solder particle content. In this case, it is only necessary to select which surface should be the substrate side according to the purpose.

The film structure may be a sheet in which the individualized adhesive films 21 to 28 are arranged on the base material 20 so as to correspond to one substrate, or may be a sheet in which the individualized adhesive films 21 to 28 are arranged on a strip-shaped base material. A reel that is continuously arranged and wound with unit areas separated in the length direction. Here, the "unit area" means an area having a predetermined length in the longitudinal direction of the base material, for example, a rectangular shape.

In the film structure shown in FIG. 2 , all the first to eighth individualized adhesive films 21 to 28 contain solder particles, but the film structure is not limited to this as long as the first to eighth individualized adhesive films 21 to 28 It is sufficient that at least one of the individualized adhesive films 28 contains solder particles. In the film structure shown in FIG. 2, the first individualized adhesive films 21a and 21b respectively correspond to the terminal rows of the first connector mounting area 11, and the second individualized adhesive films 22a and 22b respectively correspond to the second connection Corresponds to the terminal row of device installation area 12. Moreover, the third singulation adhesive film 23 to the eighth singulation adhesive film 28 are respectively connected with the first wafer mounting area 13, the second wafer mounting area 14, the third wafer mounting area 15, the fourth wafer mounting area 16, and the third wafer mounting area 14. The fifth chip mounting area 17 and the sixth chip mounting area 18 correspond to each other. In addition, the film structure has a region on the base material 20 in which the individualized connection films 21 to 28 do not exist.

[Step (C1)] As shown in FIG. 3 , in step (C1), a plurality of individualized adhesive films 21 to 28 are temporarily attached to a predetermined position of the substrate 10 at one time, so that the plurality of individualized adhesive films 21 to 28 are removed from the base material 20 Transferred to the substrate 10 in one go. The base material 20 on which the plurality of individualized adhesive films 21 to 28 is arranged is aligned and temporarily affixed (attached) to the substrate 10 at one time, whereby the plurality of individualized adhesive films 21 to 28 are attached. 28. Compared with temporary bonding, the production lead time can be shortened. In addition, by providing alignment marks on the base material 20, positioning accuracy can be further improved.

The first singulation adhesive films 21a and 21b are temporarily affixed to the first connector mounting area 11, and the second singulation adhesive films 22a and 22b are temporarily affixed to the second connector mounting area 12. Furthermore, the third singulation adhesive film 23 to the eighth singulation adhesive film 28 are temporarily attached to the first wafer mounting area 13 to the sixth wafer mounting area 18, respectively.

[Step (D1)] In step (D1), the electronic components are placed on the singulation adhesive films 21 to 28. In step (D1), it is preferable to use a chip mounter to pick up the electronic components and mount the electronic components on the single-piece adhesive films 21 to 28.

The first connector component is mounted on the first singulated adhesive films 21a and 21b, and the second connector component is mounted on the second singulated adhesive film 22a and 22b. Furthermore, the first to sixth wafer components are respectively mounted on the third to eighth singulation adhesive films 23 to 28 . Furthermore, in the example shown in FIG. 3 , two monolithic chips are used for one connector component and one monolithic chip is used for one chip component. However, the present invention is not limited to this, and one connector component may be used. One single chip is used for the component, and multiple single chips can be used for one chip component. In addition, when there are unevenness or steps in the same substrate, or when electronic components with different electrode heights or positions are combined with the substrate, the amount of resin required is different, so the thickness of the monolithic adhesive film can also be different. .

[Step (E1)] In step (E1), the substrate 10 provided with the singulation adhesive films 21 to 28 and the electronic components is reflowed. The reflow furnace has, for example, a preheating area, a main heating area, and a cooling area, and allows the substrate 10 to flow through them sequentially, thereby bonding the electronic components to the substrate 10 with solder.

In the reflow furnace, the conductive adhesive is melted by heating. The formal heating above the melting point of the solder causes the solder particles sandwiched between the electrodes to move, condense and melt in the adhesive flow, etc., so that the solder is moistened and spreads to The electrodes join the terminal rows of the electronic components and the terminal rows of the substrate 10 by cooling. The reflow oven can heat and join the above-mentioned terminals without mechanical pressure, so it can suppress damage to the surface electronic components and the substrate 10 . Examples of the reflow oven include atmospheric pressure reflow, vacuum reflow, atmospheric pressure oven, autoclave (pressurized oven), etc. Among them, vacuum reflow that can eliminate air bubbles contained in the joint is preferably used. , autoclave, etc. In addition, a reflow furnace using inert gas such as nitrogen can also be used.

<1-1-1. Modification 1 of the first embodiment> In the film structure shown in Figure 2, one single-piece adhesive film is arranged for one electronic component. However, the present invention is not limited to this. One single-piece adhesive film may be arranged for two or more electronic components. . In this case, it is preferable that the monolithic adhesive film contains solder particles at the connection part between the substrate and the terminal of the electronic component and does not contain solder particles other than the connection part.

FIG. 4 is a plan view showing a modified example of the membrane structure. In the film structure shown in FIG. 4 , first to fourth individualized adhesive films 30A to 30D are arranged on a base material 30 .

The first singulated adhesive film 30A corresponds to the first connector mounting region 11 and has containing portions 31a and 31b containing solder particles and a non-containing portion 31c containing no solder particles. The containing portions 31a and 31b correspond to the first singulated adhesive films 21a and 21b of the film structure shown in Fig. 2 .

The second singulated adhesive film 30B corresponds to the second connector mounting area 12 and has containing portions 32a and 32b containing solder particles and a non-containing portion 32c containing no solder particles. The containing portions 32a and 32b correspond to the second singulated adhesive films 22a and 22b of the film structure shown in Fig. 2 .

The third singulation adhesive film 30C has a first containing portion 33 containing solder particles corresponding to the first chip mounting area 13, a second containing portion 34 containing solder particles corresponding to the second chip mounting area 14, and a third containing portion 33 corresponding to the first chip mounting area 13. The third containing part 35 containing solder particles corresponding to the chip mounting area 15, the fourth containing part 36 containing solder particles corresponding to the fourth chip mounting area 16, and the first containing part 33 to the fourth containing part 36 are integrated. The non-containing part does not contain solder particles. The first to fourth containing portions 33 to 36 correspond to the third to sixth individualizing adhesive films 23 to 26 of the film structure shown in FIG. 2 .

The fourth singulation adhesive film 30D has a first containing portion 37 containing solder particles corresponding to the fifth chip mounting area 15, a second containing portion 38 containing solder particles corresponding to the sixth chip mounting area 16, and has a first containing portion 37 containing solder particles corresponding to the sixth chip mounting area 16. The first containing part 37 to the second containing part 38 are integrated non-containing parts that do not contain solder particles. The first to second containing portions 37 to 38 correspond to the seventh to eighth individualized adhesive films 27 to 28 of the film structure shown in FIG. 2 .

FIG. 5 is a diagram showing a state in which a single-piece adhesive film according to the modification is temporarily attached to a substrate at one time. As shown in FIG. 5 , in step (C1), the first individualized adhesive film 30A to the fourth individualized adhesive film 30D are temporarily attached at once, and the first individualized adhesive film 30A to the fourth individualized adhesive film 30D are temporarily attached. The sheet-formed adhesive film 30D is transferred from the base material 30 to the substrate 10 at once.

The first singulation adhesive film 30A is temporarily affixed to the first connector mounting area 11 , and the second singulation adhesive film 30B is temporarily affixed to the second connector mounting area 12 . Furthermore, the third singulation adhesive film 30C is temporarily affixed to the first wafer mounting area 13 to the fourth wafer mounting area 16, and the fourth singulation adhesive film 30D is temporarily affixed to the fifth wafer mounting area 17 to the sixth wafer. Installation area 18. Furthermore, in the example shown in FIG. 5 , when the same substrate has unevenness or steps, or when electronic components with different electrode heights or positions are combined with the substrate, the amount of resin required is different, so the amount of resin required is different. The thickness of the containing part containing solder particles or the non-containing part not containing solder particles may also be different.

<1-1-2. Modification 2 of the first embodiment> In the case of sharing with solder paste, the single-piece adhesive film is temporarily attached and then printed with solder paste, and then mounted and reflowed. This can also be used with solder paste.

That is, in the first embodiment, after the step of temporarily attaching the singulation adhesive film to the substrate (C1), there is provided a step of applying solder paste to a predetermined portion of the substrate, and in the step of placing the components (D1) By placing the parts on the solder paste, the single-piece adhesive film and the solder paste can be shared, which can also be used when the amount of solder in the welded part is to be increased.

6 to 9 are diagrams for explaining variations of the method of manufacturing the connected structure of the first embodiment. In addition, in FIGS. 6 to 9 , for convenience of explanation, one single-piece adhesive film is temporarily attached, but it is preferable to temporarily attach a plurality of single-piece adhesive films at one time. Hereinafter, the steps of temporarily attaching the individualized adhesive film, the printing step of printing solder paste, the mounting step of mounting electronic components, and the reflow step of reflowing are explained.

[Temporarily posted steps] Fig. 6 is a diagram showing the temporary attaching step of temporarily attaching the individualized adhesive film to the substrate. Fig. 6(A) is a cross-sectional view and Fig. 6(B) is a top view. The substrate 40 has a singulated adhesive film mounting area 41 and a solder paste mounting area 42 . The solder paste mounting area 42 has first to fourth electrodes 43 to 46 .

As shown in FIG. 6 , in the step of temporarily attaching the individualized adhesive film, the individualized adhesive film 51 is temporarily attached to the individualized adhesive film mounting area 41 on the substrate 40 . The temporary pasting steps are the same as step (C1) shown in Figure 3. Furthermore, when there are unevenness or steps in the same substrate, or when electronic components with different electrode heights or positions are combined with the substrate, the amount of resin required is different, so the thickness of the single-piece adhesive film can also be Different respectively.

[Printing steps] Fig. 7 is a diagram showing the steps of printing solder paste, Fig. 7(A) is a cross-sectional view, and Fig. 7(B) is a top view. As shown in FIG. 7 , in the step of printing the solder paste, the metal mask 60 and the scraper 61 are used to apply the solder paste 63 to the first to fourth electrodes 43 to 46 to form the first to fourth solder paste layers 63 to 46 . Paste layer 66. It is preferable to provide a recessed portion on the bottom surface of the metal mask 60 corresponding to the singulated adhesive film mounting area 41 . By providing a recess in the bottom surface of the metal mask 60 corresponding to the singulated adhesive film mounting area 41, the singulated adhesive film 51 can be prevented from being flattened, and the singulated adhesive film 51 can be prevented from being attached to the metal mask. 60.

[Installation steps] Fig. 8 is a diagram showing the steps of placing parts, Fig. 8(A) is a cross-sectional view, and Fig. 8(B) is a top view. As shown in FIG. 8 , in the component mounting step, the first chip component 71 is mounted on the singulation adhesive film 51 , and the second chip component 72 is mounted on the first solder paste layer 63 and the second solder paste layer. 64, the third chip component 73 is mounted on the third solder paste layer 65 and the fourth solder paste layer 66. In the step of placing components, it is preferable to use a placement machine to mount the first to third chip components 71 to 73 in the same manner as step (D1).

[Reflow step] FIG. 9(A) is a diagram showing the reflow step, and FIG. 9(B) is a diagram showing an example of the connection structure after the reflow step. In addition, FIG. 10 is a graph showing an example of the temperature conditions of the reflow furnace.

The reflow step is the same as step (E1). In the reflow furnace, for example, as shown in Figure 10, the temperature is raised and preheated to 180°C for 1 minute and 30 seconds, then the temperature is raised and officially heated to 260°C for 30 seconds, and then cooled. Thereby, the first wafer component 71 and the substrate 40 are soldered together, and the second wafer components 72 and 73 are soldered to the substrate 40 .

<1-2 Second Embodiment> The manufacturing method of the connection structure of the second embodiment includes: step (A2), which is to prepare a substrate for mounting a plurality of electronic components; step (B2), which is to prepare a substrate corresponding to the plurality of electronic components. The film structure of the single-piece adhesive film; step (D2), which uses a placement machine to press the electronic component to the single-piece adhesive film corresponding to the electronic component, so that the single-piece adhesive film is bonded to the electronic component , and equipped with electronic components bonded with a single-chip adhesive film; and step (E2), which is to reflow the substrate provided with the single-chip adhesive film and the electronic components. According to the manufacturing method of the connected structure of the second embodiment, the electronic component is pressed against the singulated adhesive film corresponding to the electronic component using a chip mounter, so that the singulated adhesive film is bonded to the electronic component and mounted. Since electronic components with single-chip adhesive films are laminated together, the manufacturing process lead time can be shortened. In addition, the membrane structure to be prepared does not necessarily need to be consistent with the layout of the substrate, so it can be packed tightly into a single piece. As a membrane structure, a space-saving effect can be expected.

Hereinafter, the steps of preparing the substrate (A2), preparing the film structure (B2), mounting electronic components (D2), and reflowing the substrate (E2) are explained. In addition, the same structures as those in the first embodiment are denoted by the same reference numerals, and descriptions thereof are omitted here.

[Step (A2)] In step (A2), similarly to step (A1) of the first embodiment, a substrate 10 on which a plurality of electronic components is mounted is prepared.

[Step (B2)] In step (B2), a film structure in which individualized adhesive films corresponding to a plurality of electronic components are provided on a base material is prepared. The film structure is preferably a reel in which the single-piece adhesive film is continuously arranged at a specific range in the length direction on a belt-shaped base material and wound.

Fig. 11 is a top view showing the individualized adhesive film taken out from the reel. As shown in FIG. 11 , it is preferable to prepare first to eighth reels in which the first to eighth individualized adhesive films 21 to 28 are respectively wound. Furthermore, similar to the step (B1) shown in FIG. 2 , a singulated adhesive film containing solder particles may also be prepared and arranged at a predetermined position on the base material 20 corresponding to the substrate 10 on which a plurality of electronic components are mounted. A plurality of film structures are formed into individual pieces and the films 21 to 28 are connected to each other.

[Step (D2)] In step (D2), use a placement machine to press the electronic component onto the singulated adhesive film corresponding to the part, so that the singulated adhesive film is bonded to the electronic component, and the electronic component is mounted with the singulated adhesive film. Electronic parts. Furthermore, when there are unevenness or steps in the same substrate, or when electronic components with different electrode heights or positions are combined with the substrate, the amount of resin required is different, so the thickness of the monolithic adhesive film can be adjusted according to each. Electronic parts are individually different.

Figures 12 to 14 are diagrams showing the steps of mounting components. Figure 12 is a diagram showing a state in which the singulated adhesive film is bonded to the electronic component. Figure 13 is a diagram showing the singulated adhesive film bonded to the electronic component. Figure 14 is a diagram showing the state of mounting an electronic component on a substrate via a singulation adhesive film.

As shown in FIG. 12 , the electronic component 81 picked up by the suction head 80 of the placement machine is pressed to the singulation adhesive film 82 , so that the singulation adhesive film 82 is attached to the electronic component 81 , and the singulation adhesive film 82 is From the base material 83, it is transferred to the electronic component 81. Then, as shown in FIGS. 13 and 14 , the electronic component 81 to which the singulation adhesive film 82 is bonded is picked up using the adsorption head 80 and mounted on the substrate 84 with the singulation adhesive film 82 interposed therebetween.

Thereby, similarly to the first embodiment, the first connector component is mounted on the first connector mounting area 11 with the first singulated adhesive films 21a and 21b interposed, and the second singulated adhesive films 22a and 22b are interposed with each other. The second connector component is mounted on the second connector mounting area 12. Furthermore, the first to sixth wafer components are mounted in the first to sixth wafer mounting areas 13 to 18 with the third to eighth singulation adhesive films 23 to 28 interposed therebetween, respectively.

[Step (E2)] In step (E2), similarly to step (E1) of the first embodiment, the substrate 10 provided with the singulation adhesive films 21 to 28 and the electronic components is reflowed.

<1-2-1. Modification 1 of the second embodiment> In the case of sharing with solder paste, after printing the solder paste, use a placement machine to mount the electronic components laminated with the monolithic adhesive film and reflow them, thereby realizing sharing with the solder paste.

That is, in the second embodiment, before the step (D2) of mounting the electronic components to which the singulation adhesive film is bonded, there are further steps of disposing solder paste on a predetermined portion of the substrate and placing the electronic components on the solder paste. Through the above steps, the monolithic adhesive film and solder paste can be shared.

<1-3 Third Embodiment> The manufacturing method of the connection structure of the third embodiment includes: step (A3), which is to prepare a substrate for mounting a plurality of electronic components; step (B3), which is to prepare a substrate corresponding to the plurality of electronic components. The film structure of the single-piece adhesive film; step (C3), which uses a placement machine to mount the single-piece adhesive film on a prescribed position of the substrate; step (D3), which places the electronic components on the single chip on the adhesive film; and step (E3), which is to reflow the substrate provided with the monolithic adhesive film and the electronic components. According to the manufacturing method of the connected structure of the third embodiment, a mounting head is used to mount the singulated adhesive film on a predetermined position of the substrate. This eliminates the temporary bonding process itself, so the process throughput can be shortened. In addition, the membrane structure to be prepared does not necessarily have to match the layout of the substrate, so it can be packed tightly into a single piece. As a membrane structure, a space-saving effect can be expected.

The following describes the steps for preparing the substrate (A3), preparing the film structure (B3), mounting the monolithic adhesive film (C3), mounting electronic components (D3), and reflowing the substrate. (E3) for explanation. In addition, the same structures as those in the first embodiment and the second embodiment are denoted by the same reference numerals, and descriptions thereof are omitted here.

[Step (A3)] In step (A3), similarly to step (A1) of the first embodiment, the substrate 10 on which a plurality of electronic components are mounted is prepared.

[Step (B3)] In step (B3), similarly to step (B2) of the second embodiment, a film structure in which individualized adhesive films corresponding to a plurality of parts are provided on a base material is prepared. The film structure is preferably a reel in which the single-piece adhesive film is continuously arranged at a specific range in the length direction on a belt-shaped base material and wound.

[Step (C3))] In step (C3), a mounting machine is used to mount the singulated adhesive film on a predetermined position of the substrate. The placement machine is equipped with an adsorption head for adsorbing the single-piece adhesive film.

FIG. 15 is a diagram showing a structural example of the suction head. FIG. 15(A) is a top view of the suction surface of the suction head, and FIG. 15(B) is a side view of the side of the suction head. As shown in FIG. 15 , the adsorption head 90 is provided with an elastomer layer 91 at the front end and has adsorption holes 92 on the surface of the elastomer.

The upper limit of the horizontal width x1 and the vertical width y1 of the adsorption surface in the elastomer layer 91 is preferably 30 mm or less, more preferably 20 mm or less, and further preferably 15 mm or less. In addition, the lower limit of the horizontal width x2 and the vertical width y2 of the area where the adsorption holes 92 are formed in the adsorption surface is preferably 0.5 mm or more, more preferably 1.0 mm or more, and further preferably 2.0 mm or more. In addition, the lower limit of the diameter of the adsorption hole 92 is preferably 0.05 mm or more, more preferably 0.1 mm or more, and further preferably 0.2 mm or more. The upper limit of the diameter of the adsorption hole 92 is preferably 3 mm or less, more preferably 1 mm. or less, and more preferably 0.5 mm or less. In addition, a plurality of adsorption hole areas may be provided in one adsorption head to adsorb a plurality of individualized adhesive films, thereby bonding a plurality of individualized adhesive films together.

The elastomer layer 91 is made of a thermosetting elastomer such as silicone rubber, fluororubber, or urethane rubber. The lower limit of the thickness of the elastomer layer 91 is preferably 50 μm or more, more preferably 100 μm or more, further preferably 150 μm or more, and the upper limit of the thickness is preferably 500 μm or less, more preferably 300 μm or less, and further preferably Below 250 μm. This allows the individualized adhesive films to be attached to specified locations even if the substrate has unevenness or steps.

By using this suction head, like the first embodiment, the first singulation adhesive films 21a and 21b are mounted on the first connector mounting area 11, and the second singulation adhesive films 22a and 22b are mounted on the first connector mounting area 11. 2 Connector mounting area 12. Furthermore, the third singulation adhesive film 23 to the eighth singulation adhesive film 28 are respectively mounted on the first wafer mounting area 13 to the sixth wafer mounting area 18 . Furthermore, when there are unevenness or steps in the same substrate, or when electronic components with different heights or positions of electrodes are combined with the substrate, the amount of resin required is different, so the thickness of the monolithic adhesive film can also be different. different.

[Step (D3)] In step (D3), similarly to step (D3) of the first embodiment, the electronic components are placed on the singulation adhesive films 21 to 28. Thereby, similarly to the first embodiment, the first connector component is mounted on the first singulated adhesive films 21a and 21b, and the second connector component is mounted on the second singulated adhesive films 22a and 22b. Furthermore, the first to sixth wafer components are respectively mounted on the third to eighth singulation adhesive films 23 to 28 .

[Step (E2)] In step (E2), similarly to step (E1) of the first embodiment, the substrate 10 provided with the singulation adhesive films 21 to 28 and the electronic components is reflowed.

<1-3-1. Modification 1 of the third embodiment> In the case of sharing with solder paste, after printing the solder paste, use a placement machine to mount the singulated adhesive film and electronic components and perform reflow soldering. This can also be used with solder paste.

That is, in the third embodiment, before the step of mounting the singulation adhesive film (C3), there are further steps of placing solder paste on a predetermined position of the substrate and placing electronic components on the solder paste. Monolithic bonding film and solder paste can be shared.

Furthermore, the manufacturing method of the connection structure of the present technology can be used, for example, in semiconductor devices (including driver ICs and those using semiconductors such as optical elements, thermoelectric conversion elements, and photoelectric conversion elements), display devices (monitors, televisions, etc.) , head-mounted displays, etc.), mobile devices (tablet terminals, smartphones, wearable terminals, etc.), game consoles, audio-visual equipment, camera devices (those using image sensors such as camera modules), vehicles (mobile devices ) Manufacturing method for all electronic equipment that uses electrical connections such as electrical installations, medical equipment, sensor equipment (touch sensors, fingerprint verification, iris verification, etc.), home appliances, etc.

＜2. Membrane structure and method of manufacturing membrane structure＞ <2-1. First Embodiment> The film structure of the first embodiment includes a base material, and a plurality of singulated adhesive films arranged at predetermined positions on the base material corresponding to a plurality of electronic components, and at least one of the plurality of singulated adhesive films is provided. Contains solder particles. According to the film structure of the first embodiment, since the single-piece adhesive film is arranged at a predetermined position on the base material corresponding to a plurality of electronic components, it can be temporarily attached to the substrate at once, and the electronic components can be mounted using a reflow oven. Component.

Furthermore, the manufacturing method of the film structure of the first embodiment provides a first singulated adhesive film on the first base material and a second singulated adhesive film on the second base material, so as to correspond to a plurality of electronic components. The first singulated adhesive film and the second singulated adhesive film are arranged at predetermined positions of the first base material, the second base material, or the third base material, and the first singulated adhesive film and the second singulated adhesive film are arranged One or more of the films contains solder particles.

The base material is a support film that supports a plurality of single-piece adhesive films. Examples of the base material include PET (Poly Ethylene Terephthalate), OPP (Oriented Polypropylene), PMP (Poly-4-methylpentene-1), PTFE (Polytetrafluoroethylene), and the like. In addition, it is preferable to use one in which at least the surface on the single-piece adhesive film side is peeled off with, for example, polysiloxane resin.

The thickness of the base material is not particularly limited. From the viewpoint of peeling, the lower limit of the thickness of the base material is preferably 10 μm or more, more preferably 25 μm or more, and further preferably 38 μm or more. If the upper limit of the thickness of the base material is too thick, there is a concern that the adhesive film may be subjected to excessive pressure, so it is preferably 200 μm or less, more preferably 100 μm or less, further preferably 75 μm or less, and may be 50 μm or less. .

In addition, the width of the base material is not particularly limited. From the viewpoint of winding, the lower limit of the width of the base material is preferably 1 mm or more, more preferably 2 mm or more, and further preferably 4 mm or more. If the upper limit of the width of the base material is too large, it may become difficult to hold and operate, so it is preferably 500 mm or less, more preferably 250 mm or less, and still more preferably 120 mm or less.

The film structure may be a sheet in which a plurality of individualized adhesive films are arranged on a base material in a manner corresponding to one substrate, or may be a strip-shaped base material in which a plurality of individualized adhesive films are arranged in the length direction. A reel formed by continuously arranging and winding separated unit areas. In the case of a reel, the width of the base material may be the short side of the electronic component layout area (rectangular area) of the connection object, or the width of the field side. Here, the "unit area" refers to an area having a specific length in the longitudinal direction of the substrate, for example, a rectangular shape.

The monolithic adhesive film can be formed on the substrate by half-cut processing, screen printing, or inkjet printing. Half-cut processing uses a Victoria knife to cut only the adhesive film without cutting the base material, and remove the useless parts through die-cutting processing, etc. Screen printing uses the pressure generated by a scraper to cause the adhesive to pass through the mesh of the screen to print (coat) it on the substrate, and to produce a single-piece adhesive film of a specific thickness based on, for example, the thickness of the screen. The mesh cover is made of silk mesh woven from synthetic fibers such as polyester or stainless steel or various metal fibers. When the adhesive contains solder particles, it is sufficient to make the mesh larger than the maximum diameter of the solder particles. Inkjet printing does not require a plate but directly patterns the material. For example, the coating amount is controlled by the diameter of the nozzle to produce a single-piece adhesive film of a specified thickness. When the adhesive contains solder particles, it is sufficient to make the nozzle diameter larger than the maximum diameter of the solder particles.

In addition, the monolithic adhesive film may have a structure of two or more layers, and may have a structure of two or more layers of a layer containing solder particles and a layer not containing solder particles, or may have a structure of two or more layers of layers containing solder particles. The structure may also be a structure of two or more layers without solder particles.

When the single-piece adhesive film is composed of two or more layers, it is preferable to form an original sheet of two or more layers by coating or lamination, and then perform half-cut processing. Alternatively, the individualized adhesive films may be produced by screen printing and then laminated and formed. Alternatively, nozzle jet printing (inkjet printing) can be used to produce individualized adhesive films and then be laminated and formed.

When the monolithic adhesive film is a conductive film containing solder particles, the lower limit of the ratio of the thickness of the adhesive film to the average particle diameter of the solder particles is preferably 0.6 or more, more preferably 0.8 or more, and still more preferably 0.9 or above. In addition, the thickness of the singulated adhesive film may exist when the same substrate has unevenness or steps, or when electronic components with different electrode heights or positions are combined with the substrate. In this case, the amount of resin required varies, so it is not particularly limited. Generally, it is preferably 200 μm or less, which is suitable for film formation. Furthermore, the thickness of the individualized adhesive films can also be different respectively. When a plurality of individualized adhesive films are provided on the same substrate, it is preferable that the thickness of the maximum thickness of the individualized adhesive films is 200 μm or less. .

The thickness of the monolithic adhesive film can be measured using a well-known micrometer or digital thickness gauge (for example, Sanyo Co., Ltd.: MDE-25M, minimum display amount: 0.0001 mm) capable of measuring 1 μm or less, preferably 0.1 μm or less. . Simply measure the film thickness at more than 10 locations and average it to obtain the result. However, when the film thickness is thinner than the particle diameter, a contact-type thickness meter is not suitable, so it is better to use a laser displacement meter (such as Keynes Co., Ltd., spectroscopic interference displacement type SI-T series, etc.). Here, the film thickness is only the thickness of the adhesive resin layer and does not include the particle size when exposed. In addition, when the single-piece bonded film has multiple layers, the film thickness refers to the thickness of the multiple layers.

The adhesive of the monolithic adhesive film may be thermosetting or thermoplastic, and is preferably thermosetting that can be melted and hardened by temperature control through a reflow step. The following describes thermosetting adhesives (insulating adhesives).

[Thermosetting adhesive] The curable adhesive preferably has an exothermic peak temperature higher than the melting point of the solder particles, and preferably has a melting temperature lower than the melting point of the solder particles. Here, the exothermic peak temperature can be determined by using a rotational rheometer (manufactured by Thermo Fisher Co., Ltd.) with a measuring pressure of 1 N, a temperature range of 30 to 200°C, a temperature rise rate of 10°C/min, a measuring frequency of 1 Hz, and a measuring plate diameter of 8 mm. measured under conditions. Thereby, the thermosetting adhesive is melted by heating, and the solder is melted while the solder particles are sandwiched between the terminals, so that electronic components having fine-pitch electrodes can be joined.

Examples of the thermosetting adhesive include a thermal radical polymerization resin composition containing a (meth)acrylate compound and a thermal radical polymerization initiator, and thermal cationic polymerization containing an epoxy compound and a thermal cationic polymerization initiator. type resin composition, a thermal anionic polymerization type resin composition containing an epoxy compound and a thermal anionic polymerization initiator, etc. Moreover, a well-known adhesive composition can also be used. In addition, the (meth)acrylic acid monomer system includes any one of an acrylic acid monomer and a methacrylic acid monomer.

Hereinafter, a thermal anionic polymerization-type resin composition containing a solid epoxy resin, a liquid epoxy resin, and an epoxy resin hardener will be described as a specific example.

The solid epoxy resin is not particularly limited as long as it is solid at normal temperature and has one or more epoxy groups in the molecule. For example, it can also be a bisphenol A-type epoxy resin or a biphenyl-type epoxy resin. Oxygen resin, etc. Thereby, the film shape can be maintained. In addition, the normal temperature is within the range of 20℃±15℃ (5℃～35℃) specified by JIS Z 8703.

The liquid epoxy resin is not particularly limited, as long as it is liquid at normal temperature. For example, it can be bisphenol A type epoxy resin, bisphenol F type epoxy resin, etc., or it can be urethane-modified epoxy resin. Oxygen resin.

The blending amount of the liquid epoxy resin is preferably 160 parts by mass or less, more preferably 100 parts by mass or less, and still more preferably 70 parts by mass or less based on 100 parts by mass of the solid epoxy resin. If the blending amount of the liquid epoxy resin increases, it will be difficult to maintain the film shape. In addition, if the blending amount of liquid epoxy resin increases, the cured physical properties after thermal curing usually become high elasticity due to high cross-linking density, so the stress relaxation ability decreases.

The epoxy resin curing agent is not particularly limited as long as it is a thermal curing agent that starts curing by heat. Examples thereof include anionic curing agents such as amines and imidazole, and cationic curing agents such as sulfonium salts. In addition, the hardening agent may be microencapsulated so as to gain resistance to the solvent used during film formation.

[Solder particles] Solder particles can be selected from Sn-Pb series, Pb-Sn-Sb series, Sn-Sb series, Sn-Pb-Bi series, Bi-Sn series, etc. specified in JIS Z 3282-1999, depending on the electrode material and connection conditions. Select appropriately from Sn-Cu series, Sn-Pb-Cu series, Sn-In series, Sn-Ag series, Sn-Pb-Ag series, Pb-Ag series, etc. Bi-based solder can relax stress, inhibit cracks in the solder at the metal joint, and inhibit the increase in connection resistance.

The lower limit of the melting point of the solder particles is preferably 110°C or higher, more preferably 120°C or higher, and further preferably 130°C or higher. The upper limit of the melting point of the solder particles may be 200°C or lower, preferably 180°C or lower, more preferably 160°C or lower, and further preferably 150°C or lower. In addition, in order to activate the surface of the solder particles, a flux compound may be added directly or indirectly to the surface. By activating the surface, metal bonding with the electrode portion can be promoted.

The average particle size of the solder particles is preferably 0.5 times or less, more preferably 0.3 times or less, and still more preferably 0.2 times or less the minimum value of the distance between terminals (distance between intervals) in the terminal row of the electronic component. Based on the relationship between the spacing distance and the average particle size of the solder particles, a reflow furnace can be used to join the terminal rows of the electronic component and the terminal rows of the substrate. If the average particle size of the solder particles is greater than 0.5 times the minimum distance between terminals in the terminal row of the electronic component and the terminal row of the substrate, the possibility of short circuit will increase.

The lower limit of the average particle diameter of the solder particles is preferably 0.5 μm or more, more preferably 3 μm or more, and more preferably 5 μm or more. Thereby, the coating thickness of the film can be fixed. If the average particle size of the solder particles is less than 0.5 μm, a good solder joint state with the electrode portion cannot be obtained, and reliability tends to deteriorate. Moreover, the upper limit of the average particle diameter of the solder particles may be 50 μm or less, 30 μm or less, preferably 20 μm or less, and further preferably 10 μm or less.

The average particle diameter is based on an observation image using an electron microscope such as a metal microscope, an optical microscope, and a SEM (Scanning Electron Microscope). For example, N=20 or more, preferably N=50 or more, and still more preferably N=200. The average of the major axis diameters of the particles measured above is the average of the particle diameters when the particles are spherical. In addition, the measured value obtained by measuring the observed image using well-known image analysis software ("WinROOF": Mitani Shoji Co., Ltd., "A image kun (registered trademark)": Asahi Kasei Engineering Co., Ltd., etc.) , measured values measured using an image-type particle size distribution measuring device (for example, FPIA-3000 (Malvern Instruments Ltd)) (N=1000 or more). The average particle diameter calculated from an observation image or an image-type particle size distribution measuring device can be set as the average value of the maximum length of the particles. Furthermore, when producing a conductive adhesive, the particle diameter (D50) at which the cumulative frequency in the particle size distribution obtained by laser diffraction and scattering methods becomes 50%, and the arithmetic mean diameter (preferably (based on volume) and other manufacturer values.

In addition, the maximum diameter of the solder particles can be 200% or less of the average particle diameter, preferably 150% or less of the average particle diameter, and more preferably 120% or less of the average particle diameter. By setting the maximum diameter of the solder particles within the above range, the solder particles can be sandwiched between the electrodes, and the electrodes can be joined by melting the solder particles.

Furthermore, in the case of an agglomerate formed by agglomeration of a plurality of solder particles, the size of the agglomerate may be equal to the average particle diameter or the maximum diameter of the solder particles, or the average particle diameter or the maximum diameter of the solder particles may be smaller than the above values. The size of each solder particle can be determined by observing the above image.

The solder particles are preferably dispersed in the adhesive, and the solder particles can be randomly arranged or fixedly arranged. In addition, the solder particles may be an agglomerate formed by a plurality of agglomerations.

The lower limit of the mass ratio range of the blending amount of solder particles is preferably 10 wt% or more, more preferably 20 wt% or more, and further preferably 30 wt% or more, and the upper limit of the mass ratio range is preferably 60 wt% or less. More preferably, it is 50 wt% or less, and still more preferably, it is 40 wt% or less. In addition, the lower limit of the volume ratio range of the blending amount of solder particles is preferably 2 vol% or more, more preferably 4 vol% or more, and further preferably 6 vol% or more, and the upper limit of the volume ratio range is preferably 90 vol%. or less, more preferably 85 vol% or less, still more preferably 80 vol% or less. By making the blending amount of solder particles satisfy the above mass ratio range or volume ratio range, excellent conductivity, heat dissipation, and adhesion can be obtained. When the solder particles are present in the adhesive, the volume ratio can be used, and when the conductive adhesive is produced (before the solder particles are present in the adhesive), the mass ratio can be used. The mass ratio can be converted into a volume ratio based on the specific gravity or blending ratio of the blend. If the blending amount of the solder particles is too small, excellent conductivity, heat dissipation, and adhesion will not be obtained. If the blending amount is too much, the anisotropy will be easily damaged and it will be difficult to obtain excellent conduction reliability.

[Flux compound] The flux compound removes foreign matter or oxide film on the surface of the electrode, prevents oxidation of the electrode surface, removes the oxide film on the surface of the solder particles, and reduces the surface tension of the molten solder. Examples of the flux compound include carboxylic acids such as acetylpropionic acid, maleic acid, oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, and sebacic acid. Among them, it is preferable to use glutaric acid which is excellent in removing the oxide film.

[Other additives] In addition to the above-mentioned adhesive, solder particles, and flux compounds, the monolithic adhesive film may also be blended with various additives conventionally used as adhesives within a range that does not impair the effects of the present invention. The particle size of the additive is preferably smaller than the average particle size of the solder particles, but is not particularly limited as long as it is a size that does not hinder the bonding between the electrodes.

The monolithic adhesive film can be obtained, for example, by mixing an insulating adhesive, solder particles, and a flux compound in a solvent, and applying the mixture to a predetermined thickness with a rod coater. After it is peeled off the film, it is dried to evaporate the solvent and then half-cut. Alternatively, for example, the mixture may be applied onto the release treatment film using a bar coater, and then the mixture may be pressed to a predetermined thickness and then subjected to half-cut processing. In addition, in order to improve the dispersibility of the solder particles, it is preferable to perform high shearing in a state containing a solvent. For example, a well-known batch-type planetary stirring device can be used. In addition, the remaining solvent amount of the conductive adhesive is preferably 2% or less, more preferably 1% or less.

FIG. 16 is a diagram showing an example of the manufacturing method of the membrane structure according to the first embodiment. FIG. 16(A) is a top view of the membrane structure before processing, and FIG. 16(B) is a view of the membrane structure after processing. Top view.

As shown in FIGS. 16(A) and 16(B) , the adhesive film 101 on the first base material 100 is processed into a predetermined shape. For example, a Victoria knife is used to perform half-cut processing, without cutting the first base material 100, but only cutting the adhesive film, and removing the useless portion, thereby obtaining the first single piece of a predetermined shape on the first base material 100. Films 102, 103 follow.

Moreover, the 2nd single piece adhesive film was produced on the 2nd base material in the same manner as the manufacturing method of the film structure shown in FIG.16(A) and FIG.16(B). Next, the first singulation adhesive film and the second singulation adhesive film are arranged at predetermined positions on the base material corresponding to the plurality of electronic components. The first base material 100 or the second base material may be used as the base material for arranging the monolithic film, or a new third base material may be used. When using the third base material, a placement machine can be used.

<2-2. Second embodiment> The film structure of the second embodiment includes a base material and a plurality of singulated adhesive films arranged at predetermined positions on the base material corresponding to a plurality of electronic components. At least one of the plurality of singulated adhesive films has a film containing Areas with solder particles and areas without solder particles. According to the film structure of the second embodiment, since the single-piece adhesive film is arranged at a predetermined position on the base material corresponding to a plurality of electronic components, it can be temporarily attached to the substrate at once, and the solder can be prevented from being wetted into useless areas. Wet diffusion.

The monolithic adhesive film can be formed on the base material by half-cut processing, screen printing, or inkjet printing, as in the first embodiment. In addition, description of the same structure as that of the first embodiment is omitted here.

Furthermore, in the manufacturing method of the film structure of the second embodiment, a singulated adhesive film containing no solder particles is provided on the first base material, and a singulated adhesive film containing solder particles is provided on the second base material. The predetermined position of the 1 base material, the 2nd base material, or the 3rd base material is such that the singulated adhesive film containing no solder particles and the singulated adhesive film containing solder particles are close to each other, and a region containing no solder particles is arranged. Single-piece bonding film for areas containing solder particles.

Fig. 17 is a diagram showing an example of the manufacturing method of the membrane structure according to the second embodiment. Fig. 17(A) is a top view of the first membrane structure, and Fig. 17(B) is a top view of the second membrane structure. FIG. 17(C) is a top view showing the processed membrane structure.

The first membrane structure shown in Fig. 17(A) and the second membrane structure shown in Fig. 17(B) are manufactured by the same method as the membrane structure shown in Fig. 16(A) and Fig. 16(B) In this way, the first singulated adhesive films 111 and 112 are formed on the first base material 110, and the second singulated adhesive films 121a, 121b, 122a, and 122b are formed on the second base material 120.

The first singulated adhesive films 111 and 112 do not contain solder particles, and have fitting portions 111a, 111b, 112a for the second singulated adhesive films 121a, 121b, 122a, 122b in the terminal row portion of the electronic component. 112b. The fitting portions 111a, 111b, 112a, and 112b can be formed by half-cutting with a Victoria knife and by die-cutting, for example.

As shown in FIG. 17(C) , the first singulation adhesive films 111, 112 and the second singulation adhesive films 121a, 121b, 122a, 122b are brought close to each other at predetermined positions on the substrate corresponding to the plurality of electronic components. configuration. Thereby, a composite monolithic adhesive film having a region not containing solder particles and a region containing solder particles can be produced. The first base material 110 or the second base material 120 can be used as the base material for disposing the singulated film, or a new third base material can be used. When using the third base material, a placement machine can be used.

<2-3. Third embodiment> The film structure of the third embodiment includes a base material and a plurality of singulated adhesive films arranged at predetermined positions on the base material corresponding to a plurality of electronic components. The thickness of at least one of the plurality of singulated adhesive films is equal to Other single-piece adhesive films are different. According to the film structure of the third embodiment, since the individualized adhesive films are arranged at predetermined positions on the substrate corresponding to the plurality of electronic components, they can be temporarily attached to the substrate at once, and the joint strength can be improved.

The monolithic adhesive film can be formed on the base material by half-cut processing, screen printing, or inkjet printing, as in the first embodiment. In addition, description of the same structure as that of the first embodiment and the second embodiment is omitted here.

Furthermore, the manufacturing method of the film structure according to the third embodiment provides a singulated adhesive film having a first thickness on the first base material, a singulated adhesive film having a second thickness on the second base material, and The singulated adhesive film having the first thickness and the singulated adhesive film having the second thickness are arranged at predetermined positions on the first base material, the second base material, or the third base material corresponding to the plurality of parts.

Fig. 18 is a diagram showing an example of the manufacturing method of the membrane structure according to the third embodiment. Fig. 18(A) is a top view of the first membrane structure, and Fig. 18(B) is a top view of the second membrane structure. FIG. 18(C) is a top view of the processed membrane structure, and FIG. 18(D) is a cross-sectional view of the processed membrane structure.

The first membrane structure shown in Fig. 18(A) and the second membrane structure shown in Fig. 18(B) are manufactured by the same method as the membrane structure shown in Fig. 16(A) and Fig. 16(B) In this way, the first singulated adhesive film 131 is formed on the first base material 130, and the second singulated adhesive film 141 is formed on the second base material 140. The first singulated adhesive film 131 has a first thickness, and the second singulated adhesive film 131 has a second thickness different from the first thickness.

As shown in FIG. 18(C) and FIG. 18(D) , the first singulation adhesive film 131 and the second singulation adhesive film 141 are arranged at predetermined positions on the base material corresponding to the plurality of electronic components. The first base material 130 or the second base material 140 can be used as the base material for disposing the singulated film, or a new third base material can be used. When using the third base material, a placement machine can be used.

<2-4. Fourth embodiment> The film structure of the fourth embodiment includes: a base material; a monolithic adhesive film having a first thickness, which is provided at a predetermined position on the base material corresponding to a plurality of parts, and has a region containing solder particles and a region not containing solder particles. A region of solder particles; and a monolithic adhesive film with a second thickness, which is provided at a predetermined position on a base material corresponding to a plurality of parts, and has an area containing solder particles and an area not containing solder particles. According to the film structure of the fourth embodiment, since the single-piece adhesive film is arranged at a predetermined position on the base material corresponding to a plurality of electronic components, it can be temporarily attached to the substrate at once, and the solder can be prevented from wetting to useless areas. Diffusion and improve joint strength.

The monolithic adhesive film can be formed on the base material by half-cut processing, screen printing, or inkjet printing, as in the first embodiment. In addition, descriptions of the same structures as those in the first to third embodiments are omitted here.

Furthermore, in the manufacturing method of the film structure of the fourth embodiment, a singulated adhesive film containing no solder particles and having a first thickness is provided on the first base material, and a single-piece adhesive film containing no solder particles and having a first thickness is provided on the second base material. A 2-thickness singulated adhesive film, a singulated adhesive film containing solder particles and having a first thickness is provided on the third base material, and a singulated adhesive film containing solder particles and having a second thickness is provided on the fourth base material. After the film is formed, a single-piece adhesive film containing no solder particles and having a first thickness is formed at a predetermined position on the first base material, the second base material, the third base material, the fourth base material, or the fifth base material. The singulated adhesive film containing solder particles and having a first thickness is placed close to each other, and the singulated adhesive film having a first thickness and a region containing no solder particles and a region containing solder particles are arranged so that the solder particles are not contained and The singulated adhesive film having the second thickness and the singulated adhesive film containing the solder particles and having the second thickness are placed close to each other, and the singulated adhesive film having the second thickness is arranged to have a region not containing solder particles and a region containing solder particles. Then the membrane.

Fig. 19 is a diagram showing an example of the manufacturing method of the membrane structure according to the fourth embodiment. Fig. 19(A) is a top view of the first membrane structure, and Fig. 19(B) is a top view of the second membrane structure. Figure 19(C) is a top view of the third membrane structure. Figure 19(D) is a top view of the fourth membrane structure. Figure 19(E) is a top view of the processed membrane structure. Figure 19(F) ) is a cross-sectional view of the membrane structure after processing.

The first to fourth membrane structures shown in Figures 19(A) to 19(D) respectively are manufactured in the same manner as the membrane structures shown in Figures 16(A) and 16(B) , the first singulated adhesive film 151 is formed on the first base material 150, the second singulated adhesive film 161 is formed on the second base material 160, and the third singulated adhesive film is formed on the third base material 170. 171a and 171b, the fourth single-piece adhesive films 181a and 181b are produced on the fourth base material 180.

The first singulated adhesive film 151 does not contain solder particles, and has fitting portions 151a and 151b for the third singulated adhesive films 171a and 171b to be fitted in the terminal row portion of the electronic component. The second singulated adhesive film 161 does not contain solder particles, and has fitting portions 161a and 161b for the fourth singulated adhesive films 181a and 181b to be fitted in the terminal row portion of the electronic component. In addition, the first singulated adhesive film 151 and the third singulated adhesive film 171 have a first thickness, and the second singulated adhesive film 161 and the fourth singulated adhesive film 181 have a second thickness greater than the first thickness. .

As shown in FIGS. 19(E) and 19(F) , the first singulation adhesive film 151 and the second singulation adhesive films 171 a and 171 b are brought close to each other at predetermined positions on the substrate corresponding to the plurality of electronic components. are arranged, and the third singulated adhesive film 161 and the fourth singulated adhesive films 181a and 181b are arranged close to each other. Thereby, it is possible to produce a composite single-piece adhesive film having a first thickness having a region not containing solder particles and a region containing solder particles, and a composite composite film having a first thickness on the same base material. 2-thickness monolithic adhesive film. Any of the first base material 150, the second base material 160, the third base material 170, and the fourth base material 180 may be used as the base material on which the singulated film is disposed, or a new fifth base material may be used. When using the fifth base material, a placement machine can be used.

Furthermore, the film structure may be one or more of a plurality of monolithic adhesive films having a region having a first thickness and a region having a second thickness. That is, the fourth singulated adhesive films 181a and 181b having the second thickness may be fitted into the fitting portions 151a and 151b of the first singulated adhesive film 151 having the first thickness, so that the fourth singulated adhesive films 181a and 181b having the first thickness are The third singulated adhesive films 171a and 171b are fitted into the fitting portions 161a and 161b of the second singulated adhesive film 161 having a second thickness. The monolithic adhesive film with this structure can follow the concave or convex portions on the surface of the substrate or the bottom surface of the electronic component to prevent the solder from wetting and spreading to useless areas, and can improve the quality of the solder. Joint strength. [Example]

＜3. Example＞ Hereinafter, embodiments using this technology will be described. In the embodiment, a film structure provided with a plurality of monolithic adhesive films is produced, the plurality of monolithic adhesive films are temporarily attached to the substrate at once, and electronic components (plug connectors, socket connectors) are mounted on the single-piece adhesive film. The chips are bonded to the film and the electronic components are mounted by reflow soldering. Next, conduction performance and joint strength after mounting electronic components are evaluated. In addition, during the installation of the socket connector, the adhesion of the solder to the wiring other than the terminals of the socket connector is evaluated. Furthermore, the present technology is not limited to these embodiments.

The following conductive adhesive film A, conductive adhesive film B, adhesive film A, adhesive film B, electronic component A, electronic component B, and substrate were prepared. Moreover, reflow was performed under the following reflow conditions.

Conductive adhesive film A: Blended with 80 parts by mass of solid epoxy resin (bisphenol F epoxy resin, Mitsubishi Chemical Co., Ltd., JER4007P) and liquid epoxy resin (dicyclopentadiene skeleton epoxy resin, ADEKA Co., Ltd., EP4088L) 20 parts by mass, epoxy resin hardener (imidazole-based hardener, Shikoku Chemical Industry Co., Ltd., Curezol 2P4MHZ-PW), 5 parts by mass of flux compound (glutaric acid (1,3-propanedicarboxylic acid), Tokyo Kasei Co., Ltd.) 3 parts by mass, and 300 parts by mass of solder particles with an average particle size of 20 μm (MCP-137, 5N Plus inc, Sn-58Bi alloy, solidus temperature 138°C) on a 50 μm base PET An anisotropic conductive adhesive film A with a thickness of 25 μm was formed on the film (processed by peeling treatment).

Conductive adhesive film B: Conductive adhesive film B was produced in the same manner as conductive adhesive film A except that the thickness was 35 μm. Next membrane A: Except that solder particles were not mixed, an adhesive film B with a thickness of 25 μm was produced in the same manner as the conductive adhesive film A. Next membrane B: Except that solder particles were not blended, an adhesive film B with a thickness of 35 μm was produced in the same manner as the conductive adhesive film B. Electronic parts A: 10 pins on one side (20 pins on both sides), 0.35 mm pitch plug connector, Hirose Electric (shared), BM23FR0.6-20DP-0.35V (895), mounting size 1.5 mm × 5.2 mm Electronic parts B: 10 pins on one side (20 pins on both sides), 0.35 mm pitch socket connector, Hirose Electric (stock), BM23FR0.6-20DS-0.35V (895), installation size 2.0 mm × 6.0 mm Substrate: Rigid substrate that can mount one plug connector and one receptacle connector respectively (Glass epoxy substrate for Dexerials evaluation, Ni-Au plated) Reflow conditions: 150℃～260℃-100 sec, peak 260℃

[Evaluation of conduction performance] For the connection structure after the connector is installed, use a digital multimeter to measure the resistance value when a current of 1 mA flows through the four-terminal method, and evaluate the resistance value based on the following evaluation standards. The resistance value of the connection structure after the electronic components are installed is preferably less than 100 mΩ. A: The resistance value does not reach 100 mΩ NG: Resistance value is 100 mΩ or more

[Evaluation of joint strength] For the connected structure after the connector is installed, use a wafer shear strength testing machine to measure the wafer shear strength under the conditions of a shear speed of 20 μm/sec and a temperature of 25°C for the tool that moves the connector, and evaluate it as follows Benchmarks evaluate wafer shear strength. The chip shear strength of the connection structure after the connector is installed is ideally 3 N or more. A: Wafer shear strength is 5 N or more B: Wafer shear strength is 3 N or more and less than 5 N NG: Wafer shear strength does not reach 3 N

[Evaluation of solder adhesion] FIG. 20 is a top view showing an example of the receptacle connector. The socket connector has a first pin part 191a and a second pin part 191b for connecting to the substrate, and a first fitting part 192a and a second fitting part 192b for fitting with the plug. The first pin part 191a and The first fitting part 192a is electrically connected, and the second pin part 191b and the second fitting part 192b are electrically connected. Furthermore, in this embodiment, the socket connector is configured to cover the plug connector and mate with it. In order to prevent the overall appearance of the socket connector from becoming too large and reduce the outer appearance after mating, the socket connector has a shorter terminal length than the plug connector. If the terminal length is shortened, the soldering area will be correspondingly reduced, so the soldering strength between the socket connector and the substrate tends to be reduced. Therefore, in order for the socket connector to obtain sufficient strength with a relatively small soldering area, the thickness of the conductive adhesive film is made larger than that used in the soldering of the plug connector, and the area of the conductive adhesive film is also widened. The amount of resin is adjusted in such a way that sufficient bonding strength is obtained. Furthermore, the relationship between the socket connector and the plug connector of the present technology is not limited to the above embodiment.

With respect to the connected structure after mounting the receptacle connector, adhesion of solder to the first fitting portion 192 a and the second fitting portion 192 b due to solder wetting and diffusion was visually confirmed, and the evaluation was performed based on the following evaluation criteria. Preferably, the solder will not wet and spread to the first fitting portion 192a and the second fitting portion 192b of the connection structure after the socket connector is installed. OK: The solder is not wetted and spreads to the first fitting part and the second fitting part. NG: The solder wets and spreads to the first fitting part or the second fitting part.

[Membrane structure 1] FIG. 21 is a plan view showing the dimensions of the membrane structure 1. In the same manner as the manufacturing method of the membrane structure shown in FIGS. 16(A) and 16(B) , the conductive adhesive film A with a thickness of 25 μm is half-cut with a Victoria knife. Instead of cutting the base PET film, only the conductive adhesive film A was cut to remove unnecessary portions, and the film structure 1 with the individualized adhesive films was produced to the size shown in FIG. 21 .

[Membrane structure 2] FIG. 22 is a plan view showing the dimensions of the membrane structure 2. As shown in Figure 17(A), use the adhesive film A with a thickness of 25 μm to produce a single-piece adhesive film that does not contain solder particles, and as shown in Figure 17(B), use a conductive film with a thickness of 25 μm. The adhesive film A is a solder particle-containing single-piece adhesive film containing solder particles. Next, the individualized adhesive film without solder particles is bonded to the individualized adhesive film containing solder particles, so that the individualized adhesive film containing solder particles is embedded in the terminal row part of the electronic component, such as The film structure 2 having the dimensions shown in Fig. 22 and having the individualized adhesive films including a portion that does not contain solder particles and a portion that contains solder particles is produced.

[Membrane structure 3] FIG. 23 is a plan view showing the dimensions of the membrane structure 3. As shown in Fig. 18(A) , conductive adhesive film A with a thickness of 25 μm was used to produce a single-piece adhesive film with a thickness of 25 μm, and as shown in Fig. 18(B) , a conductive adhesive film B with a thickness of 35 μm was used. Create a single-piece adhesive film with a thickness of 35 μm. Next, as shown in FIGS. 18(C) and 18(D) , a 25 μm-thick single-piece adhesive film and a 35 μm-thick single-piece adhesive film are bonded to each other, so that as shown in FIG. 23 size, a film structure 3 including a monolithic adhesive film with a thickness of 25 μm and a monolithic adhesive film with a thickness of 35 μm was produced.

[Membrane structure 4] FIG. 24 is a plan view showing the dimensions of the membrane structure 4. As shown in Figure 19(A), use the adhesive film A with a thickness of 25 μm to produce a single-piece adhesive film that does not contain solder particles, and as shown in Figure 19(C), use a conductive film with a thickness of 25 μm. The adhesive film A is a solder particle-containing single-piece adhesive film containing solder particles. Moreover, as shown in Fig. 19(B) , the adhesive film B with a thickness of 35 μm was used to produce a single-piece adhesive film that does not contain solder particles, and as shown in Fig. 19(D) , an adhesive film with a thickness of 35 μm was used. The conductive adhesive film A is used to produce a solder particle-containing monolithic adhesive film.

Next, as shown in FIGS. 19(E) and 19(F) , the singulated adhesive film containing no solder particles is bonded to the singulated adhesive film containing solder particles, thereby making the solder particle-containing singulated adhesive films The sheet bonding film is fitted to the terminal row portion of the electronic component. The size is shown in Figure 24. A sheet bonding film with a thickness of 25 μm and a thickness of 25 μm is produced and arranged with a portion that does not contain solder particles and a portion that contains solder particles. 35 μm monolithic membrane structure 4.

[Membrane structure 5] The membrane structure shown in FIG. 24 was produced as the membrane structure 5 by the following method. By screen printing using a paste in which adhesive film A is dissolved in PMA (propylene glycol monomethyl ether acetate), a 25 μm-thick, solder-free single piece shown in Figure 19(A) is produced. Adhesion film, a solder particle-containing single-piece adhesive film with a thickness of 25 μm as shown in Figure 19(C), and a single-piece adhesive film without solder particles with a thickness of 35 μm as shown in Figure 19(B) film, and a solder particle-containing monolithic adhesive film with a thickness of 35 μm as shown in Figure 19(D). After printing the paste into a prescribed shape using a screen, it is dried in an oven at 80°C for 5 minutes to produce a single-piece adhesive film. In addition, a single-piece adhesive film of a prescribed thickness is produced using screens with different thicknesses.

Next, as shown in FIGS. 19(E) and 19(F) , the singulated adhesive film containing no solder particles is bonded to the singulated adhesive film containing solder particles, thereby making the solder particle-containing singulated adhesive films The sheet bonding film is fitted to the terminal row part of the electronic component. The size is shown in Figure 24. A sheet bonding film with a thickness of 25 μm is produced and arranged with a portion that does not contain solder particles and a portion that contains solder particles. The membrane structure 5 is a monolithic film-bonded membrane with a thickness of 35 μm.

[Membrane structure 6] The membrane structure shown in FIG. 24 was produced as the membrane structure 6 by the following method. As shown in FIGS. 19(E) and 19(F) , it is produced by nozzle jet printing using a paste in which the adhesive film A is dissolved in PMA. In addition, nozzles with different nozzle diameters were used to control the coating amount, and the dimensions were shown in Figure 24, and a 25 μm-thick monolithic adhesive film with a thickness of 25 μm and a position where there were areas not containing solder particles and areas containing solder particles were produced. 35 μm monolithic film-bonded membrane structure 6.

Table 1 shows the evaluation results of conductive performance, joint strength, and solder adhesion of film structures 1 to 6.

[Table 1] Membrane structure 1 Membrane structure 2 Membrane structure 3 Membrane structure 4 Membrane structure 5 Membrane structure 6 Uniform NCF site exists There are thicker parts There are thicker areas in areas where NCF exists. There are thicker areas in areas where NCF exists. There are thicker areas in areas where NCF exists. Victoria knife processing Screen printing processing Nozzle printing processing Electronic parts A (plug) conduction performance A A A A A A Bonding strength A A A A A A Electronic parts B (socket) conduction performance A A A A A A Bonding strength B B A A A A solder adhesion NG OK NG OK OK OK

As shown in Table 1, it is known that the film structures 1 to 6 can temporarily affix a plurality of single-piece adhesive films to the substrate at one time, thereby shortening the process throughput. Comparing the case of using the film structure 1 and the case of using the film structure 2, it can be seen that by arranging a single-piece adhesive film with a portion that does not contain solder particles and a portion that contains solder particles, it is possible to prevent solder from flowing into useless areas. Wetting and spreading. From a comparison between the case of using the film structure 1 and the case of using the film structure 3, it can be seen that by making the thickness of the monolithic adhesive film disposed on the receptacle connector larger than that of the monolithic adhesive film disposed on the plug connector Thickness can improve the joint strength of socket connectors.

Furthermore, from a comparison of the case where the film structure 1 is used, the case where the film structure 2 is used, the case where the film structure 3 is used, and the case where the film structure 4 is used, it can be seen that by arranging the portions containing no solder particles and A plug connector and a receptacle connection can be obtained by forming a single-piece adhesive film on the part containing solder particles and making the thickness of the single-piece adhesive film disposed on the socket connector greater than the thickness of the single-piece adhesive film disposed on the plug connector. Excellent joint strength and solder joints.

Furthermore, a comparison of the case of using the film structure 4, the case of using the film structure 5, and the case of using the film structure 6 shows that no matter which one of Victoria knife processing, screen printing processing, and nozzle printing processing is used, In both methods, a single-piece adhesive film can be disposed in areas that do not contain solder particles and areas that contain solder particles, and the thickness of the single-piece adhesive film placed in the socket connector can be made larger than that of the single-piece adhesive film placed in the plug connector. By reducing the thickness of the bonding film, excellent joint strength and solder joints of plug connectors and socket connectors can be obtained.

[Laying single-chip adhesive films onto electronic components and mounting of electronic components using a placement machine] Use the suction head of the placement machine to grab the plug connector, then drop it onto the individualized adhesive film composed of the conductive adhesive film A corresponding to the plug connector, and pull the individualized adhesive film upward. The individualized adhesive film can be peeled off from the base PET film and directly mounted on the substrate. The same goes for socket connectors.

[Single-piece adhesive film mounted on placement machine] It is simulated to install a single-chip adhesive film on a placement machine to produce a head tool with adsorption holes as shown in Figure 15. In the adsorption head shown in Figure 15, polysilicone rubber with a thickness of 200 μm is used as the elastomer layer 91, the vertical width x1 of the adsorption surface is set to 10 mm and the horizontal width y1 is set to 10 mm, and the adsorption hole 92 is formed. The vertical width x2 of the area is set to 2.5 mm, the horizontal width y2 is set to 6 mm, and the diameter of the adsorption hole 92 is set to 0.35 mm. Studies have been conducted on using a chip mounter equipped with this suction head to mount a monolithic adhesive film composed of a conductive adhesive film A corresponding to a plug connector on a substrate. As a result, the monolithic adhesive film can be mounted on the substrate. The same applies to the monolithic adhesive film corresponding to the socket connector.

10:Substrate 11: 1st connector installation area 12: 2nd connector installation area 13: 1st chip mounting area 14: 2nd chip mounting area 15: The third chip mounting area 16: 4th chip mounting area 17: 5th chip mounting area 18: The 6th chip mounting area 21: The first single-piece adhesive film 22: The second single-piece adhesive film 23: The third single-piece adhesive film 24: The 4th single-piece adhesive film 25: The fifth single-piece adhesive film 26: The 6th single-piece adhesive film 27: The 7th single-piece adhesive film 28: The 8th single-piece adhesive film 30:Substrate 30A: The first single-piece adhesive film 30B: The second single-piece adhesive film 30C: The third single-piece adhesive film 30D: The 4th single-piece adhesive film 31a, 31b: contains parts 31c: non-containing parts 32a, 32b: contains parts 32c: non-containing parts 33: The first containing part 34: The second containing part 35: The third containing part 36: The fourth part contains 37: The first containing part 38: The second containing part 40:Substrate 41: Single-piece adhesive film installation area 42: Solder paste installation area 43: 1st electrode 44: 2nd electrode 45: 3rd electrode 46: 4th electrode 51:Single-piece adhesive film 60:Metal mask 61:Scraper 63:Solder paste 63: 1st solder paste layer 64: 2nd solder paste layer 65: 3rd solder paste layer 66: 4th solder paste layer 71: 1st chip parts 72: 2nd chip parts 80: Adsorption head 81:Electronic parts 82:Single-piece adhesive film 83:Substrate 84:Substrate 90:Adsorption head 91: Elastomer layer 92: Adsorption hole 100: 1st base material 101: Apply film 102,103: The first single-piece adhesive film 110: 1st base material 111,112: The first single-piece adhesive film 111a, 111b, 112a, 112b: Fitting part 120: 2nd base material 121a, 121b, 122a, 122b: 2nd single-piece adhesive film 130: 1st base material 131: The first single-piece adhesive film 140: 2nd base material 141: The second single-piece adhesive film 150: 1st base material 151: The first single-piece adhesive film 151a, 151b: chimeric part 160: 2nd base material 161: The second single-piece adhesive film 161a, 161b: chimeric part 170: 3rd base material 171a, 171b: The third single-piece adhesive film 180: 4th base material 181a, 181b: The fourth single-piece adhesive film

[Fig. 1] is a top view showing an example of a substrate; [Fig. 2] is a top view showing an example of a membrane structure; [Figure 3] is a diagram showing the state where the single-piece adhesive film is temporarily attached to the substrate; [Fig. 4] is a top view showing a modified example of the membrane structure; [Fig. 5] is a diagram showing a state in which a single-piece adhesive film according to the variation is temporarily attached to a substrate at one time; [Fig. 6] is a diagram showing the temporary attaching step of temporarily attaching the individualized adhesive film to the substrate; [Fig. 7] is a diagram showing the printing steps of printing solder paste; [Figure 8] is a diagram showing the steps for placing electronic components; [Fig. 9] (A) is a diagram showing the reflow step, and (B) is a diagram showing an example of the connection structure after the reflow step; [Fig. 10] is a graph showing an example of temperature conditions of a reflow furnace; [Figure 11] is a top view showing the individualized adhesive film taken out from the reel; [Figure 12] is a diagram showing the state of laminating a single-piece adhesive film to an electronic component; [Fig. 13] is a diagram showing a state in which a singulated adhesive film bonded to an electronic component is mounted on a substrate; [Fig. 14] is a diagram showing a state in which electronic components are mounted on a substrate through a singulated adhesive film; [Fig. 15] (A) is a top view showing the suction surface of the suction head, (B) is a side view showing the side of the suction head; [Fig. 16] (A) is a top view showing the membrane structure before processing, and (B) is a top view showing the membrane structure after processing; [Fig. 17] (A) is a top view showing the first membrane structure, (B) is a top view showing the second membrane structure, and (C) is a top view showing the processed membrane structure; [Fig. 18] (A) is a top view showing the first membrane structure, (B) is a top view showing the second membrane structure, (C) is a top view showing the membrane structure after processing, (D) is processing The cross-sectional view of the membrane structure shown below; [Fig. 19] (A) is a top view showing the first membrane structure, (B) is a top view showing the second membrane structure, (C) is a top view showing the third membrane structure, (D) is a top view showing the fourth membrane structure The top view of the membrane structure, (E) represents the top view of the membrane structure after processing, (F) represents the cross-sectional view of the membrane structure after processing; [Fig. 20] is a top view showing an example of a socket connector; [Fig. 21] is a top view showing the dimensions of the membrane structure 1; [Fig. 22] is a top view showing the dimensions of the membrane structure 2; [Fig. 23] is a top view showing the dimensions of the membrane structure 3; [Fig. 24] is a plan view showing the dimensions of the membrane structure 4.

20:Substrate

21a: The first single piece of adhesive film

21b: The first single piece of adhesive film

22a: The second single piece of adhesive film

22b: The second single piece of adhesive film

23: The third single piece of adhesive film

24: The 4th single piece chemical adhesive film

25: The fifth single piece of adhesive film

26: The 6th single piece chemical adhesive film

27: The 7th single piece chemical adhesive film

28: The 8th single piece chemical adhesive film

Claims (19)

A method of manufacturing a connected structure, which has the following steps: Prepare substrates for mounting multiple electronic components; Prepare a film structure in which a plurality of singulated adhesive films including a singulated adhesive film containing solder particles are arranged at predetermined positions on the base material corresponding to the above-mentioned substrate for mounting a plurality of electronic components; Temporarily affix the above-mentioned plurality of single-piece adhesive films to prescribed parts of the above-mentioned substrate at one time; Place electronic components on the above-mentioned single-piece adhesive film; and The substrate provided with the above-mentioned singulated adhesive film and the above-mentioned electronic component is reflowed. A method of manufacturing a connected structure, which has the following steps: Prepare substrates for mounting multiple electronic components; Prepare a film structure on which a single-piece adhesive film corresponding to the plurality of electronic components is provided on a base material; Use a chip mounter to press the electronic component onto the singulated adhesive film corresponding to the electronic component, so that the singulated adhesive film is bonded to the electronic component, and the electronic component bonded with the singulated adhesive film is mounted; and The substrate provided with the above-mentioned singulated adhesive film and the above-mentioned electronic component is reflowed. A method of manufacturing a connected structure, which has the following steps: Prepare substrates for mounting multiple electronic components; Prepare a film structure on which a single-piece adhesive film corresponding to the plurality of electronic components is provided on a base material; Use a placement machine to mount the above-mentioned single-piece adhesive film on the prescribed position of the above-mentioned substrate; Place electronic components on the above-mentioned single-piece adhesive film; and The substrate provided with the above-mentioned singulated adhesive film and the above-mentioned electronic component is reflowed. The manufacturing method of the connection structure of claim 1 further includes the step of disposing solder paste on a predetermined position of the substrate after the temporary pasting step. In the step of placing the above components, the components are placed on the above solder paste. The manufacturing method of the connection structure of Claim 2 further includes the following steps before mounting the electronic components bonded with the above-mentioned single-piece adhesive film: Apply solder paste to the specified parts of the above-mentioned substrate; and Place electronic components on the above solder paste. The method of manufacturing a connection structure according to Claim 3 further includes the step of disposing solder paste on a predetermined portion of the substrate before mounting the single-piece adhesive film. In the step of mounting the above components, the components are placed on the above solder paste. The method for manufacturing a connected structure according to any one of claims 1 to 6, wherein at least one of the individualized adhesive films contains solder particles. The method for manufacturing a connected structure according to any one of claims 1 to 7, wherein at least one of the individualized adhesive films has a region containing solder particles and a region not containing solder particles. The method for manufacturing a connected structure according to any one of claims 1 to 8, wherein at least one of the individualized adhesive films has a different thickness from the other individualized adhesive films. The method for manufacturing a connected structure according to any one of claims 1 to 9, wherein the single-piece adhesive film is formed on the base material by half-cut processing, screen printing, or inkjet printing. A membrane structure having: base material; and A plurality of single-piece adhesive films, which are arranged at prescribed positions on the above-mentioned base material corresponding to a plurality of parts; At least one of the plurality of individualized adhesive films contains solder particles. A membrane structure having: base material; and A plurality of single-piece adhesive films, which are arranged at prescribed positions on the above-mentioned base material corresponding to a plurality of parts; At least one of the plurality of monolithic adhesive films has a region containing solder particles and a region not containing solder particles. A membrane structure having: base material; and A plurality of single-piece adhesive films, which are arranged at prescribed positions on the above-mentioned base material corresponding to a plurality of parts; One or more of the plurality of individualized adhesive films has a different thickness from the other individualized adhesive films. A membrane structure having: base material; A monolithic adhesive film having a first thickness, which is provided at a predetermined position on the above-mentioned base material corresponding to a plurality of parts, and has an area containing solder particles and an area not containing solder particles; and A monolithic adhesive film having a second thickness is provided at a predetermined position on the base material corresponding to a plurality of parts, and has a region containing solder particles and a region not containing solder particles. The film structure according to any one of claims 11 to 15, wherein the single-piece adhesive film is formed on the base material by half-cut processing, screen printing, or inkjet printing. A method of manufacturing a film structure, which includes providing a first monolithic adhesive film on a first base material, A second single-piece adhesive film is provided on the second base material, The above-mentioned first singulation adhesive film and the above-mentioned second singulation adhesive film are arranged at predetermined positions on the above-mentioned first base material, the above-mentioned second base material, or the above-mentioned third base material corresponding to the plurality of electronic components, At least one of the first singulated adhesive film and the second singulated adhesive film contains solder particles. A method of manufacturing a film structure, which is to provide a single-piece adhesive film that does not contain solder particles on a first base material, A single-piece adhesive film containing solder particles is provided on the second base material, At a predetermined position of the above-mentioned first base material, the above-mentioned second base material, or the above-mentioned third base material, the above-mentioned singulated adhesive film not containing solder particles and the above-mentioned singulated adhesive film containing solder particles are brought close to each other, so as to arrange Single-piece adhesive film for areas that do not contain solder particles and areas that contain solder particles. A method of manufacturing a film structure, which includes providing a monolithic adhesive film with a first thickness on a first base material, A monolithic adhesive film having a second thickness is provided on the second base material, The above-mentioned single-piece adhesive film having the first thickness and the above-mentioned single-piece adhesive film having the second thickness are arranged at predetermined positions of the above-mentioned first base material, the above-mentioned second base material, or the above-mentioned third base material corresponding to the plurality of parts. membrane. A method of manufacturing a film structure, which is to provide a single-piece adhesive film that does not contain solder particles and has a first thickness on a first base material, A monolithic adhesive film containing no solder particles and having a second thickness is provided on the second base material, A singulated adhesive film containing solder particles and having the above-mentioned first thickness is provided on the third base material, A singulated adhesive film containing solder particles and having the above-mentioned second thickness is provided on the fourth base material, At predetermined positions of the above-mentioned first base material, the above-mentioned second base material, the above-mentioned third base material, the above-mentioned fourth base material, or the above-mentioned fifth base material, the above-mentioned solder particles-free and having the first thickness are individually bonded. The film and the above-mentioned singulated adhesive film containing solder particles and having a first thickness are brought close to each other, so that the singulated adhesive film having a first thickness and a region not containing solder particles and a region containing solder particles is arranged, and the above-mentioned The singulated adhesive film containing solder particles and having a second thickness and the singulated adhesive film containing solder particles and having a second thickness are arranged close to each other so as to have a region not containing solder particles and a region containing solder particles and having a third thickness. 2-thickness monolithic adhesive film.