TW202349478A - 搬送單元及加工裝置 - Google Patents

搬送單元及加工裝置 Download PDF

Info

Publication number
TW202349478A
TW202349478A TW112121035A TW112121035A TW202349478A TW 202349478 A TW202349478 A TW 202349478A TW 112121035 A TW112121035 A TW 112121035A TW 112121035 A TW112121035 A TW 112121035A TW 202349478 A TW202349478 A TW 202349478A
Authority
TW
Taiwan
Prior art keywords
workpiece
frame unit
holding
holding mechanism
work
Prior art date
Application number
TW112121035A
Other languages
English (en)
Chinese (zh)
Inventor
首藤大地
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW202349478A publication Critical patent/TW202349478A/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Auxiliary Devices For Machine Tools (AREA)
  • Feeding Of Workpieces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
TW112121035A 2022-06-09 2023-06-06 搬送單元及加工裝置 TW202349478A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-093843 2022-06-09
JP2022093843A JP2023180487A (ja) 2022-06-09 2022-06-09 搬送ユニット及び加工装置

Publications (1)

Publication Number Publication Date
TW202349478A true TW202349478A (zh) 2023-12-16

Family

ID=89034012

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112121035A TW202349478A (zh) 2022-06-09 2023-06-06 搬送單元及加工裝置

Country Status (4)

Country Link
JP (1) JP2023180487A (ko)
KR (1) KR20230169847A (ko)
CN (1) CN117219536A (ko)
TW (1) TW202349478A (ko)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3349339B2 (ja) 1996-04-24 2002-11-25 シャープ株式会社 外観検査機能を備えたダイシング装置

Also Published As

Publication number Publication date
KR20230169847A (ko) 2023-12-18
CN117219536A (zh) 2023-12-12
JP2023180487A (ja) 2023-12-21

Similar Documents

Publication Publication Date Title
JP5149020B2 (ja) ウエーハの研削方法
TW201829118A (zh) 工作夾台及磨削裝置
TW202208079A (zh) 被加工物之清洗方法
JP2018192412A (ja) 加工装置
JP7320358B2 (ja) 加工装置及び洗浄方法
JP2021126743A (ja) 加工装置
TW202349478A (zh) 搬送單元及加工裝置
US11471991B2 (en) Method of processing workpiece
JP7339860B2 (ja) 加工装置
JP7161412B2 (ja) 洗浄ユニット
JP7433709B2 (ja) 洗浄装置及び洗浄方法
TWI769294B (zh) 研磨墊
TW202430328A (zh) 磨削裝置及磨削方法
JP2003303797A (ja) 研磨装置
US20230321680A1 (en) Processing apparatus
TW202216365A (zh) 研磨裝置及研磨方法
JP6983311B2 (ja) 基板処理システム及び基板処理方法
JP2024000701A (ja) 異物除去方法
TW202221785A (zh) 磨削裝置
JP2022190859A (ja) 研磨装置及び研磨方法
KR20240114701A (ko) 연삭 장치 및 연삭 방법
JP2023036121A (ja) 被加工物の研削方法
JP2023082836A (ja) 被加工物の研削方法
JP2023104444A (ja) 被加工物の加工方法
JP2023008104A (ja) 板状ワークを吸引保持するチャックテーブル、チャックテーブルを備える加工装置、及び加工装置を用いた板状ワークの加工方法