TW202349117A

TW202349117A - 樹脂組成物、硬化物、積層體、硬化物的製造方法、積層體的製造方法、半導體元件的製造方法及半導體元件

樹脂組成物、硬化物、積層體、硬化物的製造方法、積層體的製造方法、半導體元件的製造方法及半導體元件 Download PDF

Info

Publication number: TW202349117A
Authority: TW; Taiwan
Prior art keywords: group; formula; preferred; resin composition; compounds
Prior art date: 2022-03-29

Application number

TW112111323A

Other languages

English (en)

Chinese (zh)

Inventor

小川倫弘

野崎敦靖

Original Assignee

日商富士軟片股份有限公司

Priority date

2022-03-29

Filing date

2023-03-25

Publication date

2023-12-16

2023-03-25 Application filed by 日商富士軟片股份有限公司 filed Critical 日商富士軟片股份有限公司

2023-12-16 Publication of TW202349117A publication Critical patent/TW202349117A/zh

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239000002243 precursor Substances 0.000 claims abstract description 116
239000010410 layer Substances 0.000 claims description 160
238000000034 method Methods 0.000 claims description 111
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238000010438 heat treatment Methods 0.000 claims description 87
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