TW202346558A - 化學機械研磨後(post cmp)清潔組合物 - Google Patents
化學機械研磨後(post cmp)清潔組合物 Download PDFInfo
- Publication number
- TW202346558A TW202346558A TW112110858A TW112110858A TW202346558A TW 202346558 A TW202346558 A TW 202346558A TW 112110858 A TW112110858 A TW 112110858A TW 112110858 A TW112110858 A TW 112110858A TW 202346558 A TW202346558 A TW 202346558A
- Authority
- TW
- Taiwan
- Prior art keywords
- acid
- composition
- water
- cleaning
- poly
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 152
- 238000004140 cleaning Methods 0.000 title abstract description 62
- 238000000034 method Methods 0.000 claims abstract description 48
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 44
- 239000000758 substrate Substances 0.000 claims abstract description 42
- 238000004377 microelectronic Methods 0.000 claims abstract description 38
- 239000002738 chelating agent Substances 0.000 claims abstract description 23
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000003638 chemical reducing agent Substances 0.000 claims abstract description 18
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims abstract description 12
- -1 poly(styrenesulfonic acid) Polymers 0.000 claims description 78
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 24
- 125000000217 alkyl group Chemical group 0.000 claims description 19
- 239000002253 acid Substances 0.000 claims description 18
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 claims description 16
- 150000003839 salts Chemical class 0.000 claims description 13
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims description 12
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 11
- WHUUTDBJXJRKMK-UHFFFAOYSA-N Glutamic acid Natural products OC(=O)C(N)CCC(O)=O WHUUTDBJXJRKMK-UHFFFAOYSA-N 0.000 claims description 10
- WHUUTDBJXJRKMK-VKHMYHEASA-N L-glutamic acid Chemical compound OC(=O)[C@@H](N)CCC(O)=O WHUUTDBJXJRKMK-VKHMYHEASA-N 0.000 claims description 10
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 10
- 235000013922 glutamic acid Nutrition 0.000 claims description 10
- 239000004220 glutamic acid Substances 0.000 claims description 10
- CKLJMWTZIZZHCS-REOHCLBHSA-N L-aspartic acid Chemical compound OC(=O)[C@@H](N)CC(O)=O CKLJMWTZIZZHCS-REOHCLBHSA-N 0.000 claims description 9
- 235000003704 aspartic acid Nutrition 0.000 claims description 9
- OQFSQFPPLPISGP-UHFFFAOYSA-N beta-carboxyaspartic acid Natural products OC(=O)C(N)C(C(O)=O)C(O)=O OQFSQFPPLPISGP-UHFFFAOYSA-N 0.000 claims description 9
- 229920000642 polymer Polymers 0.000 claims description 9
- 235000015165 citric acid Nutrition 0.000 claims description 8
- 239000002211 L-ascorbic acid Substances 0.000 claims description 7
- 235000000069 L-ascorbic acid Nutrition 0.000 claims description 7
- 229960005070 ascorbic acid Drugs 0.000 claims description 7
- 239000002904 solvent Substances 0.000 claims description 7
- 229920001174 Diethylhydroxylamine Polymers 0.000 claims description 6
- FVCOIAYSJZGECG-UHFFFAOYSA-N diethylhydroxylamine Chemical compound CCN(O)CC FVCOIAYSJZGECG-UHFFFAOYSA-N 0.000 claims description 6
- 239000003112 inhibitor Substances 0.000 claims description 6
- 239000002736 nonionic surfactant Substances 0.000 claims description 6
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 claims description 6
- 229920000172 poly(styrenesulfonic acid) Polymers 0.000 claims description 6
- CMCBDXRRFKYBDG-UHFFFAOYSA-N 1-dodecoxydodecane Chemical compound CCCCCCCCCCCCOCCCCCCCCCCCC CMCBDXRRFKYBDG-UHFFFAOYSA-N 0.000 claims description 5
- AHZILZSKKSPIKM-UHFFFAOYSA-N 3-aminooctan-4-ol Chemical compound CCCCC(O)C(N)CC AHZILZSKKSPIKM-UHFFFAOYSA-N 0.000 claims description 5
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 claims description 5
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 5
- 238000005260 corrosion Methods 0.000 claims description 5
- 230000007797 corrosion Effects 0.000 claims description 5
- 150000001412 amines Chemical class 0.000 claims description 4
- 235000011007 phosphoric acid Nutrition 0.000 claims description 4
- 125000003277 amino group Chemical group 0.000 claims description 3
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 abstract description 21
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 abstract description 21
- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract description 5
- 229920005591 polysilicon Polymers 0.000 abstract 1
- 239000002245 particle Substances 0.000 description 34
- 239000000126 substance Substances 0.000 description 26
- 239000000463 material Substances 0.000 description 25
- 239000012141 concentrate Substances 0.000 description 24
- 239000004615 ingredient Substances 0.000 description 22
- 235000019441 ethanol Nutrition 0.000 description 21
- 238000012545 processing Methods 0.000 description 19
- 235000012431 wafers Nutrition 0.000 description 19
- 239000002002 slurry Substances 0.000 description 17
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 12
- 239000000243 solution Substances 0.000 description 12
- 229920001577 copolymer Polymers 0.000 description 11
- 238000005498 polishing Methods 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- 229910021641 deionized water Inorganic materials 0.000 description 9
- 229910052757 nitrogen Inorganic materials 0.000 description 9
- 238000002474 experimental method Methods 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 7
- 238000005530 etching Methods 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- 238000004380 ashing Methods 0.000 description 6
- 239000003989 dielectric material Substances 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- 229960002989 glutamic acid Drugs 0.000 description 6
- 229920001223 polyethylene glycol Polymers 0.000 description 6
- 229920002125 Sokalan® Polymers 0.000 description 5
- 150000001298 alcohols Chemical class 0.000 description 5
- 229960005261 aspartic acid Drugs 0.000 description 5
- 239000008367 deionised water Substances 0.000 description 5
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 5
- 239000011976 maleic acid Substances 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000003002 pH adjusting agent Substances 0.000 description 5
- 229920001451 polypropylene glycol Polymers 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 239000004094 surface-active agent Substances 0.000 description 5
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 5
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 4
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical class OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 229920006318 anionic polymer Polymers 0.000 description 4
- 229920001400 block copolymer Polymers 0.000 description 4
- 239000001768 carboxy methyl cellulose Substances 0.000 description 4
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 4
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 4
- 239000007795 chemical reaction product Substances 0.000 description 4
- 239000008139 complexing agent Substances 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000000227 grinding Methods 0.000 description 4
- 229920001519 homopolymer Polymers 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000001020 plasma etching Methods 0.000 description 4
- 239000002243 precursor Substances 0.000 description 4
- VDZOOKBUILJEDG-UHFFFAOYSA-M tetrabutylammonium hydroxide Chemical compound [OH-].CCCC[N+](CCCC)(CCCC)CCCC VDZOOKBUILJEDG-UHFFFAOYSA-M 0.000 description 4
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 4
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 4
- HMBHAQMOBKLWRX-UHFFFAOYSA-N 2,3-dihydro-1,4-benzodioxine-3-carboxylic acid Chemical compound C1=CC=C2OC(C(=O)O)COC2=C1 HMBHAQMOBKLWRX-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 239000000783 alginic acid Substances 0.000 description 3
- 235000010443 alginic acid Nutrition 0.000 description 3
- 229920000615 alginic acid Polymers 0.000 description 3
- 229960001126 alginic acid Drugs 0.000 description 3
- 150000004781 alginic acids Chemical class 0.000 description 3
- 239000006227 byproduct Substances 0.000 description 3
- 229940075419 choline hydroxide Drugs 0.000 description 3
- 239000000356 contaminant Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 229920000867 polyelectrolyte Polymers 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- IBLKWZIFZMJLFL-UHFFFAOYSA-N 1-phenoxypropan-2-ol Chemical compound CC(O)COC1=CC=CC=C1 IBLKWZIFZMJLFL-UHFFFAOYSA-N 0.000 description 2
- COBPKKZHLDDMTB-UHFFFAOYSA-N 2-[2-(2-butoxyethoxy)ethoxy]ethanol Chemical compound CCCCOCCOCCOCCO COBPKKZHLDDMTB-UHFFFAOYSA-N 0.000 description 2
- JKMHFZQWWAIEOD-UHFFFAOYSA-N 2-[4-(2-hydroxyethyl)piperazin-1-yl]ethanesulfonic acid Chemical compound OCC[NH+]1CCN(CCS([O-])(=O)=O)CC1 JKMHFZQWWAIEOD-UHFFFAOYSA-N 0.000 description 2
- ODIAMVWPUHIALN-UHFFFAOYSA-N 2-[4-(2-hydroxyethyl)piperidin-1-yl]ethanesulfonic acid Chemical compound OCCC1CCN(CCS(O)(=O)=O)CC1 ODIAMVWPUHIALN-UHFFFAOYSA-N 0.000 description 2
- 229940100555 2-methyl-4-isothiazolin-3-one Drugs 0.000 description 2
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 description 2
- AGBXYHCHUYARJY-UHFFFAOYSA-N 2-phenylethenesulfonic acid Chemical compound OS(=O)(=O)C=CC1=CC=CC=C1 AGBXYHCHUYARJY-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- 229940100484 5-chloro-2-methyl-4-isothiazolin-3-one Drugs 0.000 description 2
- 239000004475 Arginine Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 2
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 2
- SRBFZHDQGSBBOR-IOVATXLUSA-N D-xylopyranose Chemical compound O[C@@H]1COC(O)[C@H](O)[C@H]1O SRBFZHDQGSBBOR-IOVATXLUSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- 229920002153 Hydroxypropyl cellulose Polymers 0.000 description 2
- ODKSFYDXXFIFQN-BYPYZUCNSA-P L-argininium(2+) Chemical compound NC(=[NH2+])NCCC[C@H]([NH3+])C(O)=O ODKSFYDXXFIFQN-BYPYZUCNSA-P 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 229910052581 Si3N4 Chemical group 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- DTQVDTLACAAQTR-UHFFFAOYSA-N Trifluoroacetic acid Chemical compound OC(=O)C(F)(F)F DTQVDTLACAAQTR-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 239000002671 adjuvant Substances 0.000 description 2
- 150000003863 ammonium salts Chemical class 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- 229920001448 anionic polyelectrolyte Polymers 0.000 description 2
- ODKSFYDXXFIFQN-UHFFFAOYSA-N arginine Natural products OC(=O)C(N)CCCNC(N)=N ODKSFYDXXFIFQN-UHFFFAOYSA-N 0.000 description 2
- 229960003121 arginine Drugs 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- DMSMPAJRVJJAGA-UHFFFAOYSA-N benzo[d]isothiazol-3-one Chemical compound C1=CC=C2C(=O)NSC2=C1 DMSMPAJRVJJAGA-UHFFFAOYSA-N 0.000 description 2
- 239000003139 biocide Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 2
- DHNRXBZYEKSXIM-UHFFFAOYSA-N chloromethylisothiazolinone Chemical compound CN1SC(Cl)=CC1=O DHNRXBZYEKSXIM-UHFFFAOYSA-N 0.000 description 2
- 229960004106 citric acid Drugs 0.000 description 2
- 239000003599 detergent Substances 0.000 description 2
- 229960000633 dextran sulfate Drugs 0.000 description 2
- JQDCIBMGKCMHQV-UHFFFAOYSA-M diethyl(dimethyl)azanium;hydroxide Chemical compound [OH-].CC[N+](C)(C)CC JQDCIBMGKCMHQV-UHFFFAOYSA-M 0.000 description 2
- 238000007865 diluting Methods 0.000 description 2
- 238000010790 dilution Methods 0.000 description 2
- 239000012895 dilution Substances 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- DUYCTCQXNHFCSJ-UHFFFAOYSA-N dtpmp Chemical compound OP(=O)(O)CN(CP(O)(O)=O)CCN(CP(O)(=O)O)CCN(CP(O)(O)=O)CP(O)(O)=O DUYCTCQXNHFCSJ-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- MTZQAGJQAFMTAQ-UHFFFAOYSA-N ethyl benzoate Chemical compound CCOC(=O)C1=CC=CC=C1 MTZQAGJQAFMTAQ-UHFFFAOYSA-N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001863 hydroxypropyl cellulose Substances 0.000 description 2
- 235000010977 hydroxypropyl cellulose Nutrition 0.000 description 2
- 238000002354 inductively-coupled plasma atomic emission spectroscopy Methods 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- TZIHFWKZFHZASV-UHFFFAOYSA-N methyl formate Chemical compound COC=O TZIHFWKZFHZASV-UHFFFAOYSA-N 0.000 description 2
- BEGLCMHJXHIJLR-UHFFFAOYSA-N methylisothiazolinone Chemical compound CN1SC=CC1=O BEGLCMHJXHIJLR-UHFFFAOYSA-N 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 229920000620 organic polymer Polymers 0.000 description 2
- 125000002524 organometallic group Chemical group 0.000 description 2
- 239000007800 oxidant agent Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- 229960004838 phosphoric acid Drugs 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- SIOXPEMLGUPBBT-UHFFFAOYSA-N picolinic acid Chemical compound OC(=O)C1=CC=CC=N1 SIOXPEMLGUPBBT-UHFFFAOYSA-N 0.000 description 2
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 2
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 2
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- UIIIBRHUICCMAI-UHFFFAOYSA-N prop-2-ene-1-sulfonic acid Chemical compound OS(=O)(=O)CC=C UIIIBRHUICCMAI-UHFFFAOYSA-N 0.000 description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 2
- AAYRWMCIKCRHIN-UHFFFAOYSA-N propane-1-sulfonic acid;prop-2-enamide Chemical compound NC(=O)C=C.CCCS(O)(=O)=O AAYRWMCIKCRHIN-UHFFFAOYSA-N 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical group N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000000600 sorbitol Substances 0.000 description 2
- 241000894007 species Species 0.000 description 2
- DFQPZDGUFQJANM-UHFFFAOYSA-M tetrabutylphosphanium;hydroxide Chemical compound [OH-].CCCC[P+](CCCC)(CCCC)CCCC DFQPZDGUFQJANM-UHFFFAOYSA-M 0.000 description 2
- ZUHZGEOKBKGPSW-UHFFFAOYSA-N tetraglyme Chemical compound COCCOCCOCCOCCOC ZUHZGEOKBKGPSW-UHFFFAOYSA-N 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- QVOFCQBZXGLNAA-UHFFFAOYSA-M tributyl(methyl)azanium;hydroxide Chemical compound [OH-].CCCC[N+](C)(CCCC)CCCC QVOFCQBZXGLNAA-UHFFFAOYSA-M 0.000 description 2
- NLVXSWCKKBEXTG-UHFFFAOYSA-N vinylsulfonic acid Chemical compound OS(=O)(=O)C=C NLVXSWCKKBEXTG-UHFFFAOYSA-N 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- RDMBUDCFSZVKKJ-UHFFFAOYSA-N (2-oxo-1,3,2lambda5-dioxaphosphetan-2-yl) phosphono hydrogen phosphate Chemical compound OP(O)(=O)OP(O)(=O)OP1(=O)OCO1 RDMBUDCFSZVKKJ-UHFFFAOYSA-N 0.000 description 1
- MTCFGRXMJLQNBG-REOHCLBHSA-N (2S)-2-Amino-3-hydroxypropansäure Chemical compound OC[C@H](N)C(O)=O MTCFGRXMJLQNBG-REOHCLBHSA-N 0.000 description 1
- JNYAEWCLZODPBN-JGWLITMVSA-N (2r,3r,4s)-2-[(1r)-1,2-dihydroxyethyl]oxolane-3,4-diol Chemical compound OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O JNYAEWCLZODPBN-JGWLITMVSA-N 0.000 description 1
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 1
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- ZORQXIQZAOLNGE-UHFFFAOYSA-N 1,1-difluorocyclohexane Chemical compound FC1(F)CCCCC1 ZORQXIQZAOLNGE-UHFFFAOYSA-N 0.000 description 1
- LAVARTIQQDZFNT-UHFFFAOYSA-N 1-(1-methoxypropan-2-yloxy)propan-2-yl acetate Chemical compound COCC(C)OCC(C)OC(C)=O LAVARTIQQDZFNT-UHFFFAOYSA-N 0.000 description 1
- PVBLJPCMWKGTOH-UHFFFAOYSA-N 1-aminocyclohexan-1-ol Chemical compound NC1(O)CCCCC1 PVBLJPCMWKGTOH-UHFFFAOYSA-N 0.000 description 1
- WEGOLYBUWCMMMY-UHFFFAOYSA-N 1-bromo-2-propanol Chemical compound CC(O)CBr WEGOLYBUWCMMMY-UHFFFAOYSA-N 0.000 description 1
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 description 1
- YYTSGNJTASLUOY-UHFFFAOYSA-N 1-chloropropan-2-ol Chemical compound CC(O)CCl YYTSGNJTASLUOY-UHFFFAOYSA-N 0.000 description 1
- JMVIVASFFKKFQK-UHFFFAOYSA-N 1-phenylpyrrolidin-2-one Chemical compound O=C1CCCN1C1=CC=CC=C1 JMVIVASFFKKFQK-UHFFFAOYSA-N 0.000 description 1
- FENFUOGYJVOCRY-UHFFFAOYSA-N 1-propoxypropan-2-ol Chemical compound CCCOCC(C)O FENFUOGYJVOCRY-UHFFFAOYSA-N 0.000 description 1
- YZDDMFFTOVVVMX-UHFFFAOYSA-N 10-ethoxy-9,9-dimethyldecan-1-amine Chemical group CCOCC(C)(C)CCCCCCCCN YZDDMFFTOVVVMX-UHFFFAOYSA-N 0.000 description 1
- PTBDIHRZYDMNKB-UHFFFAOYSA-N 2,2-Bis(hydroxymethyl)propionic acid Chemical compound OCC(C)(CO)C(O)=O PTBDIHRZYDMNKB-UHFFFAOYSA-N 0.000 description 1
- WMDZKDKPYCNCDZ-UHFFFAOYSA-N 2-(2-butoxypropoxy)propan-1-ol Chemical compound CCCCOC(C)COC(C)CO WMDZKDKPYCNCDZ-UHFFFAOYSA-N 0.000 description 1
- MTVLEKBQSDTQGO-UHFFFAOYSA-N 2-(2-ethoxypropoxy)propan-1-ol Chemical compound CCOC(C)COC(C)CO MTVLEKBQSDTQGO-UHFFFAOYSA-N 0.000 description 1
- GZMAAYIALGURDQ-UHFFFAOYSA-N 2-(2-hexoxyethoxy)ethanol Chemical compound CCCCCCOCCOCCO GZMAAYIALGURDQ-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- CUDYYMUUJHLCGZ-UHFFFAOYSA-N 2-(2-methoxypropoxy)propan-1-ol Chemical compound COC(C)COC(C)CO CUDYYMUUJHLCGZ-UHFFFAOYSA-N 0.000 description 1
- ZUAURMBNZUCEAF-UHFFFAOYSA-N 2-(2-phenoxyethoxy)ethanol Chemical compound OCCOCCOC1=CC=CC=C1 ZUAURMBNZUCEAF-UHFFFAOYSA-N 0.000 description 1
- XYVAYAJYLWYJJN-UHFFFAOYSA-N 2-(2-propoxypropoxy)propan-1-ol Chemical compound CCCOC(C)COC(C)CO XYVAYAJYLWYJJN-UHFFFAOYSA-N 0.000 description 1
- LJDSTRZHPWMDPG-UHFFFAOYSA-N 2-(butylamino)ethanol Chemical compound CCCCNCCO LJDSTRZHPWMDPG-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- CIWBSHSKHKDKBQ-SZSCBOSDSA-N 2-[(1s)-1,2-dihydroxyethyl]-3,4-dihydroxy-2h-furan-5-one Chemical compound OC[C@H](O)C1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-SZSCBOSDSA-N 0.000 description 1
- QDCPNGVVOWVKJG-VAWYXSNFSA-N 2-[(e)-dodec-1-enyl]butanedioic acid Chemical compound CCCCCCCCCC\C=C\C(C(O)=O)CC(O)=O QDCPNGVVOWVKJG-VAWYXSNFSA-N 0.000 description 1
- JDSQBDGCMUXRBM-UHFFFAOYSA-N 2-[2-(2-butoxypropoxy)propoxy]propan-1-ol Chemical compound CCCCOC(C)COC(C)COC(C)CO JDSQBDGCMUXRBM-UHFFFAOYSA-N 0.000 description 1
- WFSMVVDJSNMRAR-UHFFFAOYSA-N 2-[2-(2-ethoxyethoxy)ethoxy]ethanol Chemical compound CCOCCOCCOCCO WFSMVVDJSNMRAR-UHFFFAOYSA-N 0.000 description 1
- WAEVWDZKMBQDEJ-UHFFFAOYSA-N 2-[2-(2-methoxypropoxy)propoxy]propan-1-ol Chemical compound COC(C)COC(C)COC(C)CO WAEVWDZKMBQDEJ-UHFFFAOYSA-N 0.000 description 1
- FYYLCPPEQLPTIQ-UHFFFAOYSA-N 2-[2-(2-propoxypropoxy)propoxy]propan-1-ol Chemical compound CCCOC(C)COC(C)COC(C)CO FYYLCPPEQLPTIQ-UHFFFAOYSA-N 0.000 description 1
- LSRXVFLSSBNNJC-UHFFFAOYSA-N 2-[2-[2-[2-[2-(2-phenoxyethoxy)ethoxy]ethoxy]ethoxy]ethoxy]ethanol Chemical compound OCCOCCOCCOCCOCCOCCOC1=CC=CC=C1 LSRXVFLSSBNNJC-UHFFFAOYSA-N 0.000 description 1
- MFGOFGRYDNHJTA-UHFFFAOYSA-N 2-amino-1-(2-fluorophenyl)ethanol Chemical compound NCC(O)C1=CC=CC=C1F MFGOFGRYDNHJTA-UHFFFAOYSA-N 0.000 description 1
- MSWZFWKMSRAUBD-IVMDWMLBSA-N 2-amino-2-deoxy-D-glucopyranose Chemical compound N[C@H]1C(O)O[C@H](CO)[C@@H](O)[C@@H]1O MSWZFWKMSRAUBD-IVMDWMLBSA-N 0.000 description 1
- DPEOTCPCYHSVTC-UHFFFAOYSA-N 2-aminohexan-1-ol Chemical compound CCCCC(N)CO DPEOTCPCYHSVTC-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- NLBSQHGCGGFVJW-UHFFFAOYSA-N 2-carboxyethylphosphonic acid Chemical compound OC(=O)CCP(O)(O)=O NLBSQHGCGGFVJW-UHFFFAOYSA-N 0.000 description 1
- VZIQXGLTRZLBEX-UHFFFAOYSA-N 2-chloro-1-propanol Chemical compound CC(Cl)CO VZIQXGLTRZLBEX-UHFFFAOYSA-N 0.000 description 1
- SZIFAVKTNFCBPC-UHFFFAOYSA-N 2-chloroethanol Chemical compound OCCCl SZIFAVKTNFCBPC-UHFFFAOYSA-N 0.000 description 1
- UPGSWASWQBLSKZ-UHFFFAOYSA-N 2-hexoxyethanol Chemical compound CCCCCCOCCO UPGSWASWQBLSKZ-UHFFFAOYSA-N 0.000 description 1
- FBYBILSNSUSRGL-UHFFFAOYSA-N 2-hydroxyethyl(methyl)azanium hydroxide Chemical compound [OH-].C[NH2+]CCO FBYBILSNSUSRGL-UHFFFAOYSA-N 0.000 description 1
- UOQDKQOXSLQEOJ-UHFFFAOYSA-N 2-methylprop-2-enoate;trimethylazanium Chemical compound C[NH+](C)C.CC(=C)C([O-])=O UOQDKQOXSLQEOJ-UHFFFAOYSA-N 0.000 description 1
- YEYKMVJDLWJFOA-UHFFFAOYSA-N 2-propoxyethanol Chemical compound CCCOCCO YEYKMVJDLWJFOA-UHFFFAOYSA-N 0.000 description 1
- RQFUZUMFPRMVDX-UHFFFAOYSA-N 3-Bromo-1-propanol Chemical compound OCCCBr RQFUZUMFPRMVDX-UHFFFAOYSA-N 0.000 description 1
- BMYNFMYTOJXKLE-UHFFFAOYSA-N 3-azaniumyl-2-hydroxypropanoate Chemical compound NCC(O)C(O)=O BMYNFMYTOJXKLE-UHFFFAOYSA-N 0.000 description 1
- SIBFQOUHOCRXDL-UHFFFAOYSA-N 3-bromopropane-1,2-diol Chemical compound OCC(O)CBr SIBFQOUHOCRXDL-UHFFFAOYSA-N 0.000 description 1
- LAMUXTNQCICZQX-UHFFFAOYSA-N 3-chloropropan-1-ol Chemical compound OCCCCl LAMUXTNQCICZQX-UHFFFAOYSA-N 0.000 description 1
- SSZWWUDQMAHNAQ-UHFFFAOYSA-N 3-chloropropane-1,2-diol Chemical compound OCC(O)CCl SSZWWUDQMAHNAQ-UHFFFAOYSA-N 0.000 description 1
- TZCFWOHAWRIQGF-UHFFFAOYSA-N 3-chloropropane-1-thiol Chemical compound SCCCCl TZCFWOHAWRIQGF-UHFFFAOYSA-N 0.000 description 1
- 229940018554 3-iodo-1-propanol Drugs 0.000 description 1
- CQVWOJSAGPFDQL-UHFFFAOYSA-N 3-iodopropan-1-ol Chemical compound OCCCI CQVWOJSAGPFDQL-UHFFFAOYSA-N 0.000 description 1
- VATRWWPJWVCZTA-UHFFFAOYSA-N 3-oxo-n-[2-(trifluoromethyl)phenyl]butanamide Chemical compound CC(=O)CC(=O)NC1=CC=CC=C1C(F)(F)F VATRWWPJWVCZTA-UHFFFAOYSA-N 0.000 description 1
- JFMGYULNQJPJCY-UHFFFAOYSA-N 4-(hydroxymethyl)-1,3-dioxolan-2-one Chemical compound OCC1COC(=O)O1 JFMGYULNQJPJCY-UHFFFAOYSA-N 0.000 description 1
- HXHGULXINZUGJX-UHFFFAOYSA-N 4-chlorobutanol Chemical compound OCCCCCl HXHGULXINZUGJX-UHFFFAOYSA-N 0.000 description 1
- QNGGJBVWSMKPMX-UHFFFAOYSA-N 4-hydroxy-3,3-bis(hydroxymethyl)butanoic acid Chemical compound OCC(CO)(CO)CC(O)=O QNGGJBVWSMKPMX-UHFFFAOYSA-N 0.000 description 1
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 description 1
- WDCOJSGXSPGNFK-UHFFFAOYSA-N 8-aminooctan-1-ol Chemical compound NCCCCCCCCO WDCOJSGXSPGNFK-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 241000208340 Araliaceae Species 0.000 description 1
- DCXYFEDJOCDNAF-UHFFFAOYSA-N Asparagine Natural products OC(=O)C(N)CC(N)=O DCXYFEDJOCDNAF-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- 241001474374 Blennius Species 0.000 description 1
- MNWHEINDSPXJFN-UHFFFAOYSA-N C(C1=CC=CC=C1)N.CN(C1=CC=CC=C1)C Chemical compound C(C1=CC=CC=C1)N.CN(C1=CC=CC=C1)C MNWHEINDSPXJFN-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- CIWBSHSKHKDKBQ-DUZGATOHSA-N D-araboascorbic acid Natural products OC[C@@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-DUZGATOHSA-N 0.000 description 1
- AEMOLEFTQBMNLQ-AQKNRBDQSA-N D-glucopyranuronic acid Chemical compound OC1O[C@H](C(O)=O)[C@@H](O)[C@H](O)[C@H]1O AEMOLEFTQBMNLQ-AQKNRBDQSA-N 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 1
- VURFVHCLMJOLKN-UHFFFAOYSA-N Diphosphine Natural products PP VURFVHCLMJOLKN-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- IAJILQKETJEXLJ-UHFFFAOYSA-N Galacturonsaeure Natural products O=CC(O)C(O)C(O)C(O)C(O)=O IAJILQKETJEXLJ-UHFFFAOYSA-N 0.000 description 1
- 239000004471 Glycine Substances 0.000 description 1
- 239000005562 Glyphosate Substances 0.000 description 1
- 239000007995 HEPES buffer Substances 0.000 description 1
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 description 1
- 239000004354 Hydroxyethyl cellulose Substances 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- 229920001479 Hydroxyethyl methyl cellulose Polymers 0.000 description 1
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 description 1
- XUJNEKJLAYXESH-REOHCLBHSA-N L-Cysteine Chemical compound SC[C@H](N)C(O)=O XUJNEKJLAYXESH-REOHCLBHSA-N 0.000 description 1
- ONIBWKKTOPOVIA-BYPYZUCNSA-N L-Proline Chemical compound OC(=O)[C@@H]1CCCN1 ONIBWKKTOPOVIA-BYPYZUCNSA-N 0.000 description 1
- QNAYBMKLOCPYGJ-REOHCLBHSA-N L-alanine Chemical compound C[C@H](N)C(O)=O QNAYBMKLOCPYGJ-REOHCLBHSA-N 0.000 description 1
- 150000000996 L-ascorbic acids Chemical class 0.000 description 1
- DCXYFEDJOCDNAF-REOHCLBHSA-N L-asparagine Chemical compound OC(=O)[C@@H](N)CC(N)=O DCXYFEDJOCDNAF-REOHCLBHSA-N 0.000 description 1
- HNDVDQJCIGZPNO-YFKPBYRVSA-N L-histidine Chemical compound OC(=O)[C@@H](N)CC1=CN=CN1 HNDVDQJCIGZPNO-YFKPBYRVSA-N 0.000 description 1
- AGPKZVBTJJNPAG-WHFBIAKZSA-N L-isoleucine Chemical compound CC[C@H](C)[C@H](N)C(O)=O AGPKZVBTJJNPAG-WHFBIAKZSA-N 0.000 description 1
- ROHFNLRQFUQHCH-YFKPBYRVSA-N L-leucine Chemical compound CC(C)C[C@H](N)C(O)=O ROHFNLRQFUQHCH-YFKPBYRVSA-N 0.000 description 1
- KDXKERNSBIXSRK-YFKPBYRVSA-N L-lysine Chemical compound NCCCC[C@H](N)C(O)=O KDXKERNSBIXSRK-YFKPBYRVSA-N 0.000 description 1
- FFEARJCKVFRZRR-BYPYZUCNSA-N L-methionine Chemical compound CSCC[C@H](N)C(O)=O FFEARJCKVFRZRR-BYPYZUCNSA-N 0.000 description 1
- COLNVLDHVKWLRT-QMMMGPOBSA-N L-phenylalanine Chemical compound OC(=O)[C@@H](N)CC1=CC=CC=C1 COLNVLDHVKWLRT-QMMMGPOBSA-N 0.000 description 1
- AYFVYJQAPQTCCC-GBXIJSLDSA-N L-threonine Chemical compound C[C@@H](O)[C@H](N)C(O)=O AYFVYJQAPQTCCC-GBXIJSLDSA-N 0.000 description 1
- QIVBCDIJIAJPQS-VIFPVBQESA-N L-tryptophane Chemical compound C1=CC=C2C(C[C@H](N)C(O)=O)=CNC2=C1 QIVBCDIJIAJPQS-VIFPVBQESA-N 0.000 description 1
- OUYCCCASQSFEME-QMMMGPOBSA-N L-tyrosine Chemical compound OC(=O)[C@@H](N)CC1=CC=C(O)C=C1 OUYCCCASQSFEME-QMMMGPOBSA-N 0.000 description 1
- KZSNJWFQEVHDMF-BYPYZUCNSA-N L-valine Chemical compound CC(C)[C@H](N)C(O)=O KZSNJWFQEVHDMF-BYPYZUCNSA-N 0.000 description 1
- ROHFNLRQFUQHCH-UHFFFAOYSA-N Leucine Natural products CC(C)CC(N)C(O)=O ROHFNLRQFUQHCH-UHFFFAOYSA-N 0.000 description 1
- KDXKERNSBIXSRK-UHFFFAOYSA-N Lysine Natural products NCCCCC(N)C(O)=O KDXKERNSBIXSRK-UHFFFAOYSA-N 0.000 description 1
- 239000004472 Lysine Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- WPPOGHDFAVQKLN-UHFFFAOYSA-N N-Octyl-2-pyrrolidone Chemical compound CCCCCCCCN1CCCC1=O WPPOGHDFAVQKLN-UHFFFAOYSA-N 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- QLZHNIAADXEJJP-UHFFFAOYSA-N Phenylphosphonic acid Chemical compound OP(O)(=O)C1=CC=CC=C1 QLZHNIAADXEJJP-UHFFFAOYSA-N 0.000 description 1
- RVGRUAULSDPKGF-UHFFFAOYSA-N Poloxamer Chemical compound C1CO1.CC1CO1 RVGRUAULSDPKGF-UHFFFAOYSA-N 0.000 description 1
- 229920000707 Poly(2-dimethylamino)ethyl methacrylate) methyl chloride Polymers 0.000 description 1
- 229920000463 Poly(ethylene glycol)-block-poly(propylene glycol)-block-poly(ethylene glycol) Polymers 0.000 description 1
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 1
- 229920000464 Poly(propylene glycol)-block-poly(ethylene glycol)-block-poly(propylene glycol) Polymers 0.000 description 1
- 229920002873 Polyethylenimine Polymers 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- ONIBWKKTOPOVIA-UHFFFAOYSA-N Proline Natural products OC(=O)C1CCCN1 ONIBWKKTOPOVIA-UHFFFAOYSA-N 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- MTCFGRXMJLQNBG-UHFFFAOYSA-N Serine Natural products OCC(N)C(O)=O MTCFGRXMJLQNBG-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 229930006000 Sucrose Natural products 0.000 description 1
- CZMRCDWAGMRECN-UGDNZRGBSA-N Sucrose Chemical compound O[C@H]1[C@H](O)[C@@H](CO)O[C@@]1(CO)O[C@@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 CZMRCDWAGMRECN-UGDNZRGBSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- AYFVYJQAPQTCCC-UHFFFAOYSA-N Threonine Natural products CC(O)C(N)C(O)=O AYFVYJQAPQTCCC-UHFFFAOYSA-N 0.000 description 1
- 239000004473 Threonine Substances 0.000 description 1
- ISWQCIVKKSOKNN-UHFFFAOYSA-L Tiron Chemical compound [Na+].[Na+].OC1=CC(S([O-])(=O)=O)=CC(S([O-])(=O)=O)=C1O ISWQCIVKKSOKNN-UHFFFAOYSA-L 0.000 description 1
- QIVBCDIJIAJPQS-UHFFFAOYSA-N Tryptophan Natural products C1=CC=C2C(CC(N)C(O)=O)=CNC2=C1 QIVBCDIJIAJPQS-UHFFFAOYSA-N 0.000 description 1
- KZSNJWFQEVHDMF-UHFFFAOYSA-N Valine Natural products CC(C)C(N)C(O)=O KZSNJWFQEVHDMF-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 239000001089 [(2R)-oxolan-2-yl]methanol Substances 0.000 description 1
- RKZXQQPEDGMHBJ-LIGJGSPWSA-N [(2s,3r,4r,5r)-2,3,4,5,6-pentakis[[(z)-octadec-9-enoyl]oxy]hexyl] (z)-octadec-9-enoate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OC[C@@H](OC(=O)CCCCCCC\C=C/CCCCCCCC)[C@@H](OC(=O)CCCCCCC\C=C/CCCCCCCC)[C@H](OC(=O)CCCCCCC\C=C/CCCCCCCC)[C@@H](OC(=O)CCCCCCC\C=C/CCCCCCCC)COC(=O)CCCCCCC\C=C/CCCCCCCC RKZXQQPEDGMHBJ-LIGJGSPWSA-N 0.000 description 1
- YDONNITUKPKTIG-UHFFFAOYSA-N [Nitrilotris(methylene)]trisphosphonic acid Chemical compound OP(O)(=O)CN(CP(O)(O)=O)CP(O)(O)=O YDONNITUKPKTIG-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 229960003767 alanine Drugs 0.000 description 1
- 235000004279 alanine Nutrition 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- 229940024606 amino acid Drugs 0.000 description 1
- 235000001014 amino acid Nutrition 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- XYXNTHIYBIDHGM-UHFFFAOYSA-N ammonium thiosulfate Chemical compound [NH4+].[NH4+].[O-]S([O-])(=O)=S XYXNTHIYBIDHGM-UHFFFAOYSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000006117 anti-reflective coating Substances 0.000 description 1
- 239000008365 aqueous carrier Substances 0.000 description 1
- PYMYPHUHKUWMLA-UHFFFAOYSA-N arabinose Natural products OCC(O)C(O)C(O)C=O PYMYPHUHKUWMLA-UHFFFAOYSA-N 0.000 description 1
- 235000010323 ascorbic acid Nutrition 0.000 description 1
- 239000011668 ascorbic acid Substances 0.000 description 1
- 229960001230 asparagine Drugs 0.000 description 1
- 235000009582 asparagine Nutrition 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 238000001636 atomic emission spectroscopy Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- KVBCYCWRDBDGBG-UHFFFAOYSA-N azane;dihydrofluoride Chemical compound [NH4+].F.[F-] KVBCYCWRDBDGBG-UHFFFAOYSA-N 0.000 description 1
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 description 1
- 229940092714 benzenesulfonic acid Drugs 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- BNQRPLGZFADFGA-UHFFFAOYSA-N benzyl(triphenyl)phosphanium Chemical compound C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)CC1=CC=CC=C1 BNQRPLGZFADFGA-UHFFFAOYSA-N 0.000 description 1
- SRBFZHDQGSBBOR-UHFFFAOYSA-N beta-D-Pyranose-Lyxose Natural products OC1COC(O)C(O)C1O SRBFZHDQGSBBOR-UHFFFAOYSA-N 0.000 description 1
- MSWZFWKMSRAUBD-UHFFFAOYSA-N beta-D-galactosamine Natural products NC1C(O)OC(CO)C(O)C1O MSWZFWKMSRAUBD-UHFFFAOYSA-N 0.000 description 1
- 230000003115 biocidal effect Effects 0.000 description 1
- 239000006172 buffering agent Substances 0.000 description 1
- BOOMOFPAGCSKKE-UHFFFAOYSA-N butane-2-sulfonic acid;prop-2-enamide Chemical compound NC(=O)C=C.CCC(C)S(O)(=O)=O BOOMOFPAGCSKKE-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- DFFDSQBEGQFJJU-UHFFFAOYSA-M butyl carbonate Chemical compound CCCCOC([O-])=O DFFDSQBEGQFJJU-UHFFFAOYSA-M 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229930188620 butyrolactone Natural products 0.000 description 1
- HUCVOHYBFXVBRW-UHFFFAOYSA-M caesium hydroxide Inorganic materials [OH-].[Cs+] HUCVOHYBFXVBRW-UHFFFAOYSA-M 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 229940105329 carboxymethylcellulose Drugs 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 230000009920 chelation Effects 0.000 description 1
- 230000002925 chemical effect Effects 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- XUJNEKJLAYXESH-UHFFFAOYSA-N cysteine Natural products SCC(N)C(O)=O XUJNEKJLAYXESH-UHFFFAOYSA-N 0.000 description 1
- 229960002433 cysteine Drugs 0.000 description 1
- 235000018417 cysteine Nutrition 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- QYMFNZIUDRQRSA-UHFFFAOYSA-N dimethyl butanedioate;dimethyl hexanedioate;dimethyl pentanedioate Chemical compound COC(=O)CCC(=O)OC.COC(=O)CCCC(=O)OC.COC(=O)CCCCC(=O)OC QYMFNZIUDRQRSA-UHFFFAOYSA-N 0.000 description 1
- OWMBTIRJFMGPAC-UHFFFAOYSA-N dimethylamino 2-methylprop-2-enoate Chemical compound CN(C)OC(=O)C(C)=C OWMBTIRJFMGPAC-UHFFFAOYSA-N 0.000 description 1
- FGRVOLIFQGXPCT-UHFFFAOYSA-L dipotassium;dioxido-oxo-sulfanylidene-$l^{6}-sulfane Chemical compound [K+].[K+].[O-]S([O-])(=O)=S FGRVOLIFQGXPCT-UHFFFAOYSA-L 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- BJAJDJDODCWPNS-UHFFFAOYSA-N dotp Chemical compound O=C1N2CCOC2=NC2=C1SC=C2 BJAJDJDODCWPNS-UHFFFAOYSA-N 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- NFDRPXJGHKJRLJ-UHFFFAOYSA-N edtmp Chemical compound OP(O)(=O)CN(CP(O)(O)=O)CCN(CP(O)(O)=O)CP(O)(O)=O NFDRPXJGHKJRLJ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004318 erythorbic acid Substances 0.000 description 1
- 235000010350 erythorbic acid Nutrition 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- JVHJRIQPDBCRRE-UHFFFAOYSA-N ethyl 2,2,3,3,4,4,4-heptafluorobutanoate Chemical compound CCOC(=O)C(F)(F)C(F)(F)C(F)(F)F JVHJRIQPDBCRRE-UHFFFAOYSA-N 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- KVFVBPYVNUCWJX-UHFFFAOYSA-M ethyl(trimethyl)azanium;hydroxide Chemical compound [OH-].CC[N+](C)(C)C KVFVBPYVNUCWJX-UHFFFAOYSA-M 0.000 description 1
- SMSCVBBYKOFGCY-UHFFFAOYSA-M ethyl(triphenyl)phosphanium;hydroxide Chemical compound [OH-].C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CC)C1=CC=CC=C1 SMSCVBBYKOFGCY-UHFFFAOYSA-M 0.000 description 1
- 150000002191 fatty alcohols Chemical class 0.000 description 1
- 150000002221 fluorine Chemical class 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 229930182830 galactose Natural products 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 229960002442 glucosamine Drugs 0.000 description 1
- 229940097043 glucuronic acid Drugs 0.000 description 1
- 229960002449 glycine Drugs 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- XDDAORKBJWWYJS-UHFFFAOYSA-N glyphosate Chemical compound OC(=O)CNCP(O)(O)=O XDDAORKBJWWYJS-UHFFFAOYSA-N 0.000 description 1
- 229940097068 glyphosate Drugs 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229960002885 histidine Drugs 0.000 description 1
- HNDVDQJCIGZPNO-UHFFFAOYSA-N histidine Natural products OC(=O)C(N)CC1=CN=CN1 HNDVDQJCIGZPNO-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 125000001183 hydrocarbyl group Chemical group 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 125000001165 hydrophobic group Chemical group 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229940026239 isoascorbic acid Drugs 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 229960000310 isoleucine Drugs 0.000 description 1
- AGPKZVBTJJNPAG-UHFFFAOYSA-N isoleucine Natural products CCC(C)C(N)C(O)=O AGPKZVBTJJNPAG-UHFFFAOYSA-N 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 229960003136 leucine Drugs 0.000 description 1
- 229960003646 lysine Drugs 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- 229930182817 methionine Natural products 0.000 description 1
- 229960004452 methionine Drugs 0.000 description 1
- MOVBJUGHBJJKOW-UHFFFAOYSA-N methyl 2-amino-5-methoxybenzoate Chemical compound COC(=O)C1=CC(OC)=CC=C1N MOVBJUGHBJJKOW-UHFFFAOYSA-N 0.000 description 1
- CRVGTESFCCXCTH-UHFFFAOYSA-N methyl diethanolamine Chemical compound OCCN(C)CCO CRVGTESFCCXCTH-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- PYIGXCSOLWAMGG-UHFFFAOYSA-M methyl(triphenyl)phosphanium;hydroxide Chemical compound [OH-].C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(C)C1=CC=CC=C1 PYIGXCSOLWAMGG-UHFFFAOYSA-M 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- HIQXJRBKNONWAH-UHFFFAOYSA-N methylidenephosphane Chemical compound P=C HIQXJRBKNONWAH-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- CQDGTJPVBWZJAZ-UHFFFAOYSA-N monoethyl carbonate Chemical compound CCOC(O)=O CQDGTJPVBWZJAZ-UHFFFAOYSA-N 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- PZYDAVFRVJXFHS-UHFFFAOYSA-N n-cyclohexyl-2-pyrrolidone Chemical compound O=C1CCCN1C1CCCCC1 PZYDAVFRVJXFHS-UHFFFAOYSA-N 0.000 description 1
- 229920005615 natural polymer Polymers 0.000 description 1
- GSGDTSDELPUTKU-UHFFFAOYSA-N nonoxybenzene Chemical compound CCCCCCCCCOC1=CC=CC=C1 GSGDTSDELPUTKU-UHFFFAOYSA-N 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- YOYLLRBMGQRFTN-SMCOLXIQSA-N norbuprenorphine Chemical compound C([C@@H](NCC1)[C@]23CC[C@]4([C@H](C3)C(C)(O)C(C)(C)C)OC)C3=CC=C(O)C5=C3[C@@]21[C@H]4O5 YOYLLRBMGQRFTN-SMCOLXIQSA-N 0.000 description 1
- YTJSFYQNRXLOIC-UHFFFAOYSA-N octadecylsilane Chemical class CCCCCCCCCCCCCCCCCC[SiH3] YTJSFYQNRXLOIC-UHFFFAOYSA-N 0.000 description 1
- UYDLBVPAAFVANX-UHFFFAOYSA-N octylphenoxy polyethoxyethanol Chemical group CC(C)(C)CC(C)(C)C1=CC=C(OCCOCCOCCOCCO)C=C1 UYDLBVPAAFVANX-UHFFFAOYSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000011236 particulate material Substances 0.000 description 1
- 239000013618 particulate matter Substances 0.000 description 1
- 239000001814 pectin Substances 0.000 description 1
- 235000010987 pectin Nutrition 0.000 description 1
- 229920001277 pectin Polymers 0.000 description 1
- RGSFGYAAUTVSQA-UHFFFAOYSA-N pentamethylene Natural products C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 229960005323 phenoxyethanol Drugs 0.000 description 1
- QCCDLTOVEPVEJK-UHFFFAOYSA-N phenylacetone Chemical compound CC(=O)CC1=CC=CC=C1 QCCDLTOVEPVEJK-UHFFFAOYSA-N 0.000 description 1
- COLNVLDHVKWLRT-UHFFFAOYSA-N phenylalanine Natural products OC(=O)C(N)CC1=CC=CC=C1 COLNVLDHVKWLRT-UHFFFAOYSA-N 0.000 description 1
- 229960005190 phenylalanine Drugs 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- LWMPFIOTEAXAGV-UHFFFAOYSA-N piperidin-1-amine Chemical compound NN1CCCCC1 LWMPFIOTEAXAGV-UHFFFAOYSA-N 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920000083 poly(allylamine) Polymers 0.000 description 1
- 229920000333 poly(propyleneimine) Polymers 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000259 polyoxyethylene lauryl ether Polymers 0.000 description 1
- 229920001709 polysilazane Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 229960003975 potassium Drugs 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 239000001508 potassium citrate Substances 0.000 description 1
- 229960002635 potassium citrate Drugs 0.000 description 1
- QEEAPRPFLLJWCF-UHFFFAOYSA-K potassium citrate (anhydrous) Chemical compound [K+].[K+].[K+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O QEEAPRPFLLJWCF-UHFFFAOYSA-K 0.000 description 1
- 235000011082 potassium citrates Nutrition 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229960002429 proline Drugs 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- FOWDZVNRQHPXDO-UHFFFAOYSA-N propyl hydrogen carbonate Chemical compound CCCOC(O)=O FOWDZVNRQHPXDO-UHFFFAOYSA-N 0.000 description 1
- 229960004063 propylene glycol Drugs 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229960001153 serine Drugs 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 1
- 239000001593 sorbitan monooleate Substances 0.000 description 1
- 235000011069 sorbitan monooleate Nutrition 0.000 description 1
- 229940035049 sorbitan monooleate Drugs 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000005720 sucrose Substances 0.000 description 1
- 235000000346 sugar Nutrition 0.000 description 1
- 150000008163 sugars Chemical class 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000006228 supernatant Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 239000011885 synergistic combination Substances 0.000 description 1
- 229920001059 synthetic polymer Polymers 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- FBWNMEQMRUMQSO-UHFFFAOYSA-N tergitol NP-9 Chemical group CCCCCCCCCC1=CC=C(OCCOCCOCCOCCOCCOCCOCCOCCOCCO)C=C1 FBWNMEQMRUMQSO-UHFFFAOYSA-N 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- 125000005207 tetraalkylammonium group Chemical group 0.000 description 1
- ZOMVKCHODRHQEV-UHFFFAOYSA-M tetraethylphosphanium;hydroxide Chemical compound [OH-].CC[P+](CC)(CC)CC ZOMVKCHODRHQEV-UHFFFAOYSA-M 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- BSYVTEYKTMYBMK-UHFFFAOYSA-N tetrahydrofurfuryl alcohol Chemical compound OCC1CCCO1 BSYVTEYKTMYBMK-UHFFFAOYSA-N 0.000 description 1
- OKIZCWYLBDKLSU-UHFFFAOYSA-N tetramethylazanium;hydrochloride Chemical compound Cl.C[N+](C)(C)C OKIZCWYLBDKLSU-UHFFFAOYSA-N 0.000 description 1
- CRUVUWATNULHFA-UHFFFAOYSA-M tetramethylphosphanium;hydroxide Chemical compound [OH-].C[P+](C)(C)C CRUVUWATNULHFA-UHFFFAOYSA-M 0.000 description 1
- OORMKVJAUGZYKP-UHFFFAOYSA-M tetrapropylphosphanium;hydroxide Chemical compound [OH-].CCC[P+](CCC)(CCC)CCC OORMKVJAUGZYKP-UHFFFAOYSA-M 0.000 description 1
- 229960002898 threonine Drugs 0.000 description 1
- YWYZEGXAUVWDED-UHFFFAOYSA-N triammonium citrate Chemical compound [NH4+].[NH4+].[NH4+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O YWYZEGXAUVWDED-UHFFFAOYSA-N 0.000 description 1
- 150000003627 tricarboxylic acid derivatives Chemical class 0.000 description 1
- DQWPFSLDHJDLRL-UHFFFAOYSA-N triethyl phosphate Chemical compound CCOP(=O)(OCC)OCC DQWPFSLDHJDLRL-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- SGKOGTXWLOGBID-UHFFFAOYSA-M triphenyl(propyl)phosphanium;hydroxide Chemical compound [OH-].C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CCC)C1=CC=CC=C1 SGKOGTXWLOGBID-UHFFFAOYSA-M 0.000 description 1
- ZQTYRTSKQFQYPQ-UHFFFAOYSA-N trisiloxane Chemical compound [SiH3]O[SiH2]O[SiH3] ZQTYRTSKQFQYPQ-UHFFFAOYSA-N 0.000 description 1
- 229960004799 tryptophan Drugs 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229960004441 tyrosine Drugs 0.000 description 1
- OUYCCCASQSFEME-UHFFFAOYSA-N tyrosine Natural products OC(=O)C(N)CC1=CC=C(O)C=C1 OUYCCCASQSFEME-UHFFFAOYSA-N 0.000 description 1
- 125000004417 unsaturated alkyl group Chemical group 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 229960004295 valine Drugs 0.000 description 1
- 239000004474 valine Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 229920003169 water-soluble polymer Polymers 0.000 description 1
- 238000000733 zeta-potential measurement Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/0005—Other compounding ingredients characterised by their effect
- C11D3/0042—Reducing agents
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D17/00—Detergent materials or soaps characterised by their shape or physical properties
- C11D17/0008—Detergent materials or soaps characterised by their shape or physical properties aqueous liquid non soap compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/042—Acids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2075—Carboxylic acids-salts thereof
- C11D3/2086—Hydroxy carboxylic acids-salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/24—Organic compounds containing halogen
- C11D3/245—Organic compounds containing halogen containing fluorine
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/30—Amines; Substituted amines ; Quaternized amines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/33—Amino carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/36—Organic compounds containing phosphorus
- C11D3/361—Phosphonates, phosphinates or phosphonites
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/36—Organic compounds containing phosphorus
- C11D3/364—Organic compounds containing phosphorus containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/43—Solvents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
- H01L21/02065—Cleaning during device manufacture during, before or after processing of insulating layers the processing being a planarization of insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Emergency Medicine (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Detergent Compositions (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
本發明提供用於存在二氧化鈰之化學機械研磨後清潔操作之組合物。在一個態樣中,本發明提供一種包含還原劑、螯合劑、胺基(C
6-C
12烷基)醇及水之組合物;其中該組合物具有小於約8之pH。經發現本發明之組合物在例如多晶矽(poly Si)基板上顯示出經改良之二氧化鈰之移除。亦提供一種使用此等組合物清潔微電子器件基板之方法及一種在一或多個容器中包含該等組合物之選定組分之套組。
Description
本發明大體上係關於自微電子器件之表面移除化學機械研磨後(post CMP)殘餘物的組合物及方法。
微電子器件晶圓用於形成積體電路。微電子器件晶圓包括諸如矽的基板,在該基板中區域經圖案化以沈積具有絕緣、導電或半導電特性之不同材料。
為獲得正確的圖案化,必須移除用於在基板上形成層之過剩材料。另外,為製造功能性的及可靠的電路,在後續處理之前準備一個平整的或平坦的微電子晶圓表面係很重要的。因此,有必要移除及/或研磨微電子器件晶圓之某些表面。
化學機械研磨或平坦化(「CMP」)係自微電子器件晶圓之表面移除材料,且藉由將物理製程(諸如磨耗)與化學製程(諸如氧化或螯合)相結合來研磨(例如平坦化)表面之製程。在其最基本的形式中,CMP涉及將具有活性化學物質之研磨漿料施加至研磨墊上,該研磨墊在移除、平坦化及研磨製程期間磨光微電子器件晶圓之表面。使用純物理或純化學作用的移除或研磨製程為達成快速、均一移除的效果不如二者之協同組合。此外,在積體電路之製造中,CMP漿料亦應能夠優先移除包含金屬及其他材料之複雜層之膜,使得可以產生高度平坦表面以用於之後的光微影、或圖案化、蝕刻及薄膜處理。
相對於含二氧化矽之漿料,使用二氧化鈰粒子的CMP漿料通常達成對絕緣體的更快研磨速度。此外,最常使用基於二氧化鈰之漿料,因為其能夠以最小氧化物沖蝕達成淺溝槽隔離(STI)圖案平坦化。不利的是,因為相對於氧化矽及氮化矽表面,二氧化鈰粒子帶相反電荷之ζ電勢,所以基於二氧化鈰之漿料難以自STI結構中移除。若在製造器件時此等殘餘物殘留於晶圓上,則殘餘物將導致短路及電阻增加。二氧化鈰粒子亦係使用二氧化鈰漿料對FinFET結構進行CMP處理後的一個問題。
因此,需要經改良之化學機械研磨後清潔組合物,其有效地移除殘餘粒子以及黏附至介電晶圓表面上之彼等殘餘物。
總而言之,本發明提供用於存在二氧化鈰之化學機械研磨後清潔操作中之組合物。在第一態樣中,本發明提供一種組合物,其包含
a. 還原劑;
b. 螯合劑;
c. 胺基(C
6-C
12烷基)醇;及
d. 水;
其中該組合物具有小於約8之pH。
發現本發明之組合物在例如多晶矽(poly Si)基板上顯示出經改良之二氧化鈰之移除。
亦提供一種使用此等組合物清潔微電子器件基板之方法及一種在一或多個容器中包含該等組合物之一或多種組分之套組。
除非上下文另外明確指示,否則如本說明書及隨附申請專利範圍中所使用之單數形式「一(a/an)」及「該」包括複數個提及物。除非上下文另外明確規定,否則如本說明書及隨附申請專利範圍中所使用之術語「或」通常採用其包括「及/或」之意義。
術語「約」通常係指被認為與所列舉值等效(例如,具有相同功能或結果)的數字範圍。在許多情況下,術語「約」可包括捨入至最接近的有效數字之數字。
使用端點表示的數字範圍包括該範圍內包涵的所有數字(例如,1至5包括1、1.5、2、2.75、3、3.80、4及5)。
在第一態樣中,本發明提供一種組合物,其包含
a. 還原劑;
b. 螯合劑;
c. 胺基(C
6-C
12烷基)醇;及
d. 水;
其中該組合物具有小於約8之pH。
在一個實施例中,該組合物將由約60至90重量百分比水、約0.01至約10重量百分比之螯合劑及約0.1至約5重量百分比或約0.1至約2重量百分比之胺基(C
6-C
12烷基)醇構成。
在某些實施例中,該組合物係由或主要由以上組分a.至d.組成,視情況與如本文所描述之一或多種其他成分組合。除非另外規定,否則如本文所使用,描述為「主要由一或多種特定項目組成」的組合物之組成或成分係指僅由彼等特定項目及不超過非顯著量之其他(另外的)材料構成的組成或成分,例如,以基於組成或成分之總重量計,僅含有特定項目及不超過5、3、2、1、0.5、0.1、0.05或0.01重量百分比之另外的成分。如本文所使用,描述為「主要由一或多種特定項目組成」之組合物的組成或成分係指僅由彼等特定項目構成的組成或成分。
如上文所指出,組合物之pH小於約8。在某些實施例中,pH將係中性或酸性,例如約1至約7,及在其他實施例中,pH將為約1.5至約6.5。一般熟習此項技術者會認識彼等適合於此目的之酸及鹼(亦即,pH調節劑)。
在一個實施例中,pH調節劑為鹼。為此目的,例示性pH調節劑包括鹼,諸如氫氧化膽鹼、氫氧化四丁基鏻(TBPH)、氫氧化四甲基鏻、氫氧化四乙基鏻、氫氧化四丙基鏻、氫氧化苄基三苯基鏻、氫氧化甲基三苯基鏻、氫氧化乙基三苯基鏻、氫氧化正丙基三苯基鏻、氫氧化四乙基銨(TEAH)、氫氧化四丙基銨(TPAH)、氫氧化四丁基銨(TBAH)、氫氧化三甲基乙基銨、氫氧化二乙基二甲基銨、氫氧化三丁基甲基銨(TBMAH)、氫氧化苄基三甲基銨(BTMAH)、氫氯化四甲基銨(TMAH)、氫氧化參(2-羥乙基)甲基銨、氫氧化二乙基二甲基銨、精胺酸、氫氧化鉀、氫氧化銫及其組合。
在一個實施例中,pH調節劑係選自氫氧化膽鹼及氫氧化四乙基銨(TEAH)。
在另一實施例中,pH調節劑係酸,且例如可選自硝酸、檸檬酸、硫酸、磷酸、氫氯酸、氫溴酸、甲磺酸、苯磺酸、及對甲苯磺酸、三氟甲磺酸、乙酸、乳酸、乙醇酸或其任何組合。在一個實施例中,pH調節劑為硝酸。
在某些實施例中,組合物進一步包含一或多種緩衝劑。在一個實施例中,組合物進一步包含N-(2-羥乙基)哌𠯤-N'-(2-乙磺酸)。
例示性還原劑包括諸如以下化合物:次磷酸(H
3PO
2)、抗壞血酸、L(+)-抗壞血酸、異抗壞血酸、抗壞血酸衍生物、DEHA(二乙基羥胺)、還原糖(半乳糖)及其組合。此外,亞磷酸、亞硫酸、硫代硫酸銨及硫代硫酸鉀、木糖、山梨糖醇。可利用N-胺基𠰌啉、N-胺基哌𠯤、氫醌、兒茶酚、四氫富瓦烯、N,N-二甲基苯胺苄胺、羥胺及其他硫基還原劑。在一個實施例中,還原劑係選自次磷酸及L-抗壞血酸。
如本文所使用之術語「螯合劑」包括熟習此項技術者理解為錯合劑、螯合劑及/或鉗合劑之彼等化合物。螯合劑將與待使用本文所描述之組合物移除的金屬原子及/或金屬離子化學結合、配位或物理固持。例示性螯合劑包括膦酸鹽(例如,1-羥基亞乙基-1,1-二膦酸(HEDP)、1,5,9-三氮雜環十二烷-N,N',N''-參(亞甲基膦酸)(DOTRP)、1,4,7,10-四氮雜環十二烷-N,N',N'',N'''-肆(亞甲基膦酸)(DOTP)、氮基參(亞甲基)三磷酸、二伸乙三胺五(亞甲基膦酸)(DETAP)、胺基三(亞甲基膦酸)、雙(六亞甲基)三胺五亞甲基膦酸、1,4,7-三氮雜環壬烷-N,N',N''-參(亞甲基)膦酸(NOTP)、羥乙基二膦酸、氮基參(亞甲基)膦酸、2-膦醯基-丁烷-1,2,3,4-四甲酸、羧乙基膦酸、胺乙基膦酸、嘉磷塞(glyphosate)、乙二胺四(亞甲基膦酸)苯膦酸、其鹽及其衍生物)及/或羧酸(例如,草酸、丁二酸、順丁烯二酸、蘋果酸、丙二酸、己二酸、鄰苯二甲酸、檸檬酸、檸檬酸鈉、檸檬酸鉀、檸檬酸銨、丙三羧酸、二羥甲基丙酸、三羥甲基丙酸、酒石酸、葡糖醛酸、2-羧基吡啶)及/或磺酸(諸如4,5-二羥基-1,3-苯二磺酸二鈉鹽)。在其他實施例中,螯合劑包括胺基酸,諸如甘胺酸、丙胺酸、組胺酸、白胺酸、異白胺酸、離胺酸、半胱胺酸、甲硫胺酸、苯丙胺酸、絲胺酸、纈胺酸、蘇胺酸、精胺酸、天冬醯胺、天冬胺酸、麩胺酸、麩醯胺酸、脯胺酸、色胺酸及酪胺酸。在其他實施例中,螯合劑包括胺磺酸,諸如4-(2-羥乙基)-1-哌𠯤乙磺酸。在一個實施例中,錯合劑係選自HEDP及檸檬酸中之至少一者。
以清潔組合物之總重量計,在清潔組合物中螯合劑之量係在約0.01重量%至約20重量%之範圍內。在某些實施例中,以清潔組合物之總重量計,錯合劑之存在量為約0.01重量%至約10重量%,且在其他實施例中,量為約0.01重量%至約5重量%。
本文所提及之胺基(C
6-C
12烷基)醇為具有至少一個胺及至少一個羥基官能基且與6至12個碳原子任意組合之化合物。在一個實施例中,胺基(C
6-C
12烷基)醇係選自3-胺基-4-辛醇、DL-2-胺基-1-己醇、2-(丁胺基)乙醇、1-胺基環己醇及8-胺基-1-辛醇。在一個實施例中,胺基(C
6-C
10烷基)醇包含3-胺基-4-辛醇。
在某些實施例中,組合物進一步包含一或多種氟化物來源。如本文所使用之「氟化物」來源對應的物種包括(但不限於)離子型氟化物(F
-)及HF
2 -或包含其之鹽。應瞭解氟化物來源可作為氟化物物種包括在內,或可自氟化物來源原位產生。氟化物來源包括氫氟酸、氟化銨、二氟化銨、六氟矽酸、四氟硼酸、四氟硼酸四丁基銨(TBA-BF
4)、六氟鉭酸、六氟鈦酸、六氟鉭酸銨、具有式[NR
1R
2R
3R
4]F之氟化四烷基銨,其中R
1、R
2、R
3及R
4彼此相同或不同且係選自C
1-C
6烷基(例如,甲基、乙基、丙基、丁基、戊基、己基)及C
6-C
10芳基(例如,苄基),諸如氟化四甲基銨或其組合。在一個實施例中,氟化物來源包含HF。
在其他實施例中,組合物進一步包含至少一種水分散性或水溶性聚合物。此類聚合物在存在時包括(但不限於)丙烯酸及甲基丙烯酸之均聚物及與例如丙烯醯胺甲基丙烷磺酸及順丁烯二酸之共聚物;順丁烯二酸/乙烯基醚共聚物;聚(乙烯基吡咯啶酮)/乙酸乙烯酯;均聚物,諸如膦酸化聚乙二醇寡聚物、聚(丙烯醯胺)、聚(丙烯酸) (PAA)、聚(甲基丙烯酸)、聚(甲基丙烯酸)銨鹽、聚(丙烯酸)銨鹽、聚(乙酸乙烯酯)、聚(乙二醇) (PEG)、聚丙二醇(PPG)、聚(苯乙烯磺酸)、聚(乙烯基磺酸)、聚(乙烯基膦酸)、聚(乙烯基磷酸)、聚(乙烯亞胺)、聚(丙烯亞胺)、聚烯丙胺、聚氧乙烯(PEO)、聚乙烯吡咯啶酮(PVP)、PPG-PEG-PPG嵌段共聚物、PEG-PPG-PEG嵌段共聚物、聚(乙烯醇)、聚(羥乙基)丙烯酸酯(及其共聚物)、聚(羥乙基)甲基丙烯酸酯(及其共聚物)、羥乙基纖維素、甲基羥乙基纖維素、羥丙基纖維素、甲基羥丙基纖維素、三仙膠、海藻酸鉀、果膠、羧甲基纖維素、葡糖胺、聚(二烯丙基二甲基銨)氯化物、PEG化(亦即,聚乙二醇化)甲基丙烯酸酯/丙烯酸酯共聚物、聚MADQuat (聚(氯化2-甲基丙烯醯氧乙基三甲基銨)CAS編號26161-33-1)及其共聚物、二甲胺基甲基丙烯酸酯聚合物及其共聚物、甲基丙烯酸三甲銨聚合物及其共聚物及其組合。以上共聚物可以為無規或嵌段共聚物。當存在時,組合物中聚合物之量以組合物之總重量計在約0.0001重量%至約5重量%之範圍內。
在另一實施例中,組合物進一步包含非離子界面活性劑。如本文所使用之術語「界面活性劑」係指降低兩種液體之間或液體與固體之間的表面張力(或界面張力)的有機化合物,通常為含有疏水性基團(例如烴(例如烷基)「尾部」)及親水性基團的有機兩親媒性化合物。當存在時,用於本文所描述之組合物的此等非離子界面活性劑包括直鏈,分支鏈飽和或不飽和烷基或芳族乙氧基化醇。例示性界面活性劑包括聚氧乙烯月桂基醚、十二烯基丁二酸單二乙醇醯胺、乙二胺肆(乙氧基-嵌段-丙氧基)四醇、聚乙二醇、聚丙二醇、聚乙烯或聚丙二醇醚、基於環氧乙烷及環氧丙烷的嵌段共聚物、聚氧丙烯蔗糖醚、三級辛基苯氧基聚乙氧基乙醇、10-乙氧基-9,9-二甲基癸烷-1-胺、聚氧乙烯(9)壬基苯醚(分支鏈)、聚氧乙烯(40)壬基苯醚(分支鏈)、二壬基苯基聚氧乙烯、壬基酚烷氧基化物、聚氧乙烯山梨糖醇六油酸酯、聚氧乙烯山梨糖醇四油酸酯、聚乙二醇脫水山梨糖醇單油酸酯、脫水山梨糖醇單油酸酯、醇烷氧基化物、烷基聚葡萄糖苷、全氟丁酸乙酯、1,1,3,3,5,5-六甲基-1,5-雙[2-(5-降莰-2-基)乙基]三矽氧烷、單體十八烷基矽烷衍生物、矽氧烷改質聚矽氮烷、聚矽氧-聚醚共聚物及乙氧基化氟界面活性劑。
在其他實施例中,組合物進一步包含一或多種水混溶性溶劑。此等溶劑包括二醇及二醇醚、甲醇、乙醇、異丙醇、丁醇及選自C
2-C
4二醇及C
2-C
4三醇之高級醇、四氫糠醇,諸如3-氯-1,2-丙二醇、3-氯-1-丙硫醇、1-氯-2-丙醇、2-氯-1-丙醇、3-氯-1-丙醇、3-溴-1,2-丙二醇、1-溴-2-丙醇、3-溴-1-丙醇、3-碘-1-丙醇、4-氯-1-丁醇、2-氯乙醇)、二氯甲烷、氯仿、乙酸、丙酸、三氟乙酸、四氫呋喃、N-甲基吡咯啶酮、環己基吡咯啶酮、N-辛基吡咯啶酮、N-苯基吡咯啶酮、甲基二乙醇胺、甲酸甲酯、二甲基甲醯胺、二甲亞碸、環丁碸、二乙醚、苯氧基-2-丙醇、苯丙酮、乳酸乙酯、乙酸乙酯、苯甲酸乙酯、乙腈、丙酮、乙二醇、丙二醇、1,3-丙二醇、二㗁烷、丁內酯、碳酸伸丁酯、碳酸伸乙酯、碳酸伸丙酯、二丙二醇、二乙二醇單甲醚、三乙二醇單甲醚、二乙二醇單乙醚、三乙二醇單乙醚、乙二醇單丙醚、乙二醇單丁醚、二乙二醇單丁醚、三乙二醇單丁醚、乙二醇單己醚、二乙二醇單己醚、乙二醇苯基醚、丙二醇甲醚、二丙二醇甲醚、三丙二醇甲醚、二丙二醇二甲醚、二丙二醇乙醚、丙二醇正丙醚、二丙二醇正丙醚、三丙二醇正丙醚、丙二醇正丁醚、二丙二醇正丁醚、三丙二醇正丁醚、丙二醇苯基醚、乙二醇單苯基醚、二乙二醇單苯醚、六乙二醇單苯醚、二丙二醇甲醚醋酸酯、四乙二醇二甲醚、二鹽基酯、碳酸甘油酯、N-甲醯基𠰌啉、磷酸三乙酯及其組合。
在其他實施例中,組合物進一步包含一或多種佐劑。在一個實施例中,佐劑係選自充當氫鍵結添加劑之化合物,氫鍵結添加劑用於減少矽石粒子對化學機械研磨後微電子器件清潔中所使用之刷子的黏附。參見例如,美國專利公開案第2019/0168265號,其以引用之方式併入本文中。例示性化合物包括非離子、陰離子、陽離子及兩性離子小分子及聚合物,其可以在中性pH下表現為聚電解質。陰離子聚合物或陰離子聚電解質可以係天然的、經改質的天然聚合物或合成聚合物。可包括於組合物中之例示性天然及經改質的天然陰離子聚合物包括(但不限於):褐藻酸(或鹽)、羧甲基纖維素、硫酸葡聚糖、聚(半乳糖醛酸)及其鹽。例示性合成性陰離子聚電解質包括(但不限於):順丁烯二酸(或酸酐)、苯乙烯磺酸(或鹽)、乙烯基磺酸(或鹽)、烯丙基磺酸(或鹽)、丙烯醯胺基丙基磺酸(或鹽)及其類似物之均聚物或共聚物,其中羧酸及磺酸之鹽較佳由銨或烷基銨陽離子中和。在一個實施例中,聚電解質陰離子聚合物之陽離子為銨陽離子(NH
4 +)、膽鹼鎓(
+N(CH
3)
3(CH
2CH
2OH))及
+N(CH
3)
4。因此,經合併之合成及天然聚電解質陰離子聚合物之實例為(甲基)丙烯酸、順丁烯二酸(或酸酐)、苯乙烯磺酸、乙烯基磺酸、烯丙基磺酸、乙烯基膦酸、丙烯醯胺基丙基磺酸、褐藻酸、羧甲基纖維素、硫酸葡聚糖、聚(半乳糖醛酸)及其鹽之均聚物或共聚物。
在另一實施例中,組合物進一步包含殺生物劑。例示性殺生物劑包括5-氯-2-甲基-4-異噻唑啉-3-酮、2-甲基-4-異噻唑啉-3-酮、苯并異噻唑酮、1,2-苯并異噻唑-3[2H]-酮、甲基異噻唑啉酮、甲基氯異噻唑啉酮及其組合。
如本文所使用之術語「殘餘物」(包括「污染物」)係指在製造微電子器件中所用之處理步驟之後仍然存在於微電子器件基板表面上之為化學或微粒材料的任何材料,例如處理步驟包括電漿蝕刻、電漿灰化(用於自經蝕刻之晶圓中移除光阻劑)、化學機械處理、濕式蝕刻等。殘餘物可以係任何非水化學材料,其為處理步驟中所使用處理組合物之一部分,諸如化學蝕刻劑、光阻劑、CMP漿料等。殘餘物可以替代地係在處理步驟期間自處理組合物之材料中得到的物質。此等類型之殘餘物之實例包括在處理後殘留在基板之表面的非水性,微粒狀或非微粒狀,化學或研磨材料(例如,研磨粒子、界面活性劑、氧化劑、腐蝕抑制劑、催化劑)。殘餘物可以最初就存在於諸如CMP漿料或蝕刻組合物的材料中,諸如存在於CMP研磨漿料中之固體研磨粒子或化學材料。替代地,殘餘物可以為在處理期間產生的呈微粒形式或非微粒形式的副產物或反應產物,例如存在於處理組合物,諸如CMP漿料或濕式蝕刻組合物中之化學品之副產物或反應產物,或在電漿蝕刻或電漿灰化製程期間存在、使用或產生的化學品之副產物或反應產物。
術語「化學機械研磨後殘餘物」係指在CMP處理步驟結束時存在的殘餘物,例如存在於CMP漿料中或來源於CMP漿料的粒子或化學材料;具體實例包括研磨粒子(例如,含二氧化矽或基於二氧化矽之研磨粒子、金屬氧化物(例如,氧化鋁)粒子、二氧化鈰或基於二氧化鈰之粒子及其類似物);最初存在於漿料中的化學品,諸如氧化劑、催化劑、界面活性劑、抑制劑、錯合劑等;金屬(例如,離子)、金屬氧化物或金屬錯合物,其來源於自經處理之基板表面移除的金屬材料;或使用漿料中之化學品與漿料中之另一種化學品或來源於基板的化學材料(諸如金屬離子)產生的反應產物或錯合物;襯墊粒子;或作為CMP製程之產物的任何其他材料。
「蝕刻後殘餘物」係指氣相電漿蝕刻製程之後殘留的材料,例如後段製程(「BEOL」)雙鑲嵌處理,或濕式蝕刻製程。蝕刻後殘餘物本質上可以係有機的、有機金屬的、有機矽的或無機的,例如,含矽材料、基於碳之有機材料及蝕刻氣體殘餘物,諸如氧氣及氟。
「灰化後殘餘物」係指在氧化或還原電漿灰化以移除經硬化之光阻劑及/或底部抗反射塗層(BARC)材料之後殘留的材料。灰化後殘餘物本質上可以係有機的、有機金屬的、有機矽的或無機的。
如本文所使用之「低k介電材料」為在多層微電子器件中作為介電材料使用的材料,其中該材料之介電常數小於約3.5。例示性低k介電材料包括低極性材料,諸如含矽有機聚合物、含矽有機-無機雜化材料、有機矽酸鹽玻璃(OSG)、正矽酸四乙酯(TEOS)、經氟化之矽酸鹽玻璃(FSG)及碳摻雜氧化物(CDO)玻璃。低k介電材料可以有來自於一系列有用的密度及一系列有用的孔隙率中之密度及孔隙率。
如上文所指出,本發明係關於組合物(「清潔組合物」或「清潔溶液」),可用於自上面具有殘餘物之微電子器件基板表面移除殘餘物的清潔方法中。組合物含有水性載劑(即,水)以及非水成分之組合,該等非水成分包括:還原劑、螯合劑及胺基(C
6-C
12烷基)醇。在某些實施例中,組合物在用於清潔製程之前係均質的溶液,該等溶液包含以下、由以下組成或基本上由以下組成:水及經溶解之非水成分,無任何固體或懸浮材料,諸如固體研磨粒子、黏聚物、凝結物等。
所描述之組合物可用於清潔微電子器件及其前驅物,具體包括微電子器件基板,意指在表面上包括一或多個微電子器件或其前驅物的半導體晶圓,該等微電子器件或其前驅物處於製造成最終的、完整的及功能性的微電子器件的過程中。
如本文所使用,微電子器件係包括在其上形成的尺寸極小(例如微米級或更小)的電路及相關結構的器件。例示性微電子器件包括平板顯示器、積體電路、記憶體器件、太陽能面板、光伏及微機電系統(MEMS)。微電子器件基板係諸如晶圓(例如,半導體晶圓)之結構,該結構包括處於正製備以形成最終微電子器件之狀態的一或多個微電子器件或其前驅物。
本文所述之組合物及方法可用於清潔處於任何處理階段的任何各種形式的微電子器件。可經清潔具有特別效用及益處的微電子器件基板(或在本文中簡稱為「基板」)包括在基板之表面處包括暴露表面的基板,該等暴露表面包含氧化鋁、TEOS、熱氧化矽、硼矽酸鹽或磷酸鹽二氧化矽玻璃、多晶矽、非晶矽、單晶矽、碳化矽、氮化矽、碳氧化矽、氮氧化矽、鎢、鉬、有機聚合物、低k介電質、旋塗式玻璃、基於矽氧烷之介電質及有機混合玻璃。藉由使用本文所描述之清潔組合物及方法,可以成功地將出現在基板表面的高百分比的殘餘物自表面移除,例如至少可以移除70%、80%、85%、90%、95%或99%殘餘物(亦稱為「清潔效率」)。
一些清潔組合物可能夠移除多種類型的粒子殘餘物。例如,一些pH值為2至4之清潔組合物有效地自氧化鋁基板表面移除二氧化鈰粒子,亦已發現該等組合物能夠在不侵蝕基板之情況下分散氧化鋁粒子,使此等粒子不會重新附著在氧化鋁表面。此等組合物亦可具有低的但可觀的蝕刻速率(諸如小於10 Å/分鐘)以提供受控的底切以分離此等粒子。
用於量測微電子器件基板表面之殘餘物的方法及設備係眾所周知的。清潔效率可根據清潔後存在於微電子器件表面之殘餘粒子之量(例如,數目)與清潔前存在的殘餘粒子之量(例如,數目)相比的減少來評定。例如,清潔前及清潔後分析可以使用原子力顯微鏡進行。表面上之殘餘粒子可記錄為一系列像素。可以應用直方圖(例如,Sigma Scan Pro)來過濾某些強度之像素(例如,231-235),且對殘餘粒子之數目進行計數。殘餘粒子移除量,亦即清潔效率可使用以下比率計算:
(表面上之清潔前殘餘粒子數目-表面上之清潔後殘餘粒子數目)/(表面上之清潔前殘餘粒子數目)。
替代地,清潔效率可視為清潔前殘餘微粒物質覆蓋之基板表面之總量與清潔後相比的百分比。例如,可以程式化原子力顯微鏡以執行z平面掃描,確定高於某個高度臨限值的相關地形區域,且隨後計算該等相關區域所覆蓋的總表面的面積。確定為相關區域的區域面積在清潔之後減少的量表明更有效的清潔組合物及清潔方法。
本發明之組合物可以濃縮物之形式製備且隨後出售,該濃縮物水含量相對較低,且因此,非水成分之量係相對濃縮的。商業製備濃縮物以用於在含有濃縮量之非水性成分及相對減少量之水的情況下銷售及運輸,且最終由濃縮物之購買者在使用時進行稀釋。濃縮物中不同非水成分之量係指在稀釋濃縮物後,將引起所需量的彼等非水成分存在於使用型組合物(use composition)中的量。
如所描述之組合物包括水作為非水性成分之液體載劑,亦即溶質。水可以為去離子(DIW)水。水可自任何來源存在於組合物中,諸如藉由包含在與其他成分合併以產生濃縮物形式之組合物的成分中;或作為以純形式與濃縮物之其他成分合併的水;或者作為由使用者例如在使用時加入濃縮物中的水,作為用於稀釋濃縮物以形成使用型組合物的稀釋水。
組合物中之水量可以係濃縮物之所需量,或使用型組合物之所需量,一般來說,相對於濃縮物中之水量來說,水總量更高。濃縮組合物中水之例示性量不應視為限制性的,以濃縮物組合物的總重量計,可以係約30、40或50至約85或90重量百分比,例如,約60、65或70至約80重量百分比之水。當稀釋後,此等量將按稀釋倍數減少。使用型組合物中水之例示性量可以係約70至約99.9重量百分比,例如,以使用型組合物之總重量計,約90或99.55至約95或99重量百分比之水。
本發明之組合物含有作為主要清潔化合物之胺基(C
6-C
12烷基)醇。
作為次要清潔化合物,組合物可視情況進一步含有C
2-C
4烷醇胺,諸如單乙醇胺。其他視情況選用的組分包括𠰌啉、褐藻酸、羧甲基纖維素、聚(乙烯吡咯啶酮)、聚(4-苯乙烯磺酸) (PSSA)、乙氧化脂肪醇及(4-(2-羥乙基)-1-哌𠯤乙磺酸。
本發明之組合物可藉由簡單地加入各個成分且混合至均質條件,諸如溶液而容易製備。此外,組合物可易於調配為在使用時或使用前混合的單包裝調配物或多部分調配物,例如多部分調配物之個別部分可由使用者在處理工具(清潔裝置)或在處理工具上游之儲存槽中混合。
因此,本發明之另一態樣係關於一種套組,其在一或多個容器中包含如本文所闡述之組合物之一或多種組分。套組在一或多個容器中可包含(i)還原劑;(ii)螯合劑;(iii)胺基(C
6-C
10烷基)醇,用於在製造或使用時與另外的溶劑(例如水)合併。套組亦可包括本文中所列舉之其他視情況選用之成分。套組之容器必須適用於儲存及運輸組合物且可為例如NOWPak®容器(Entegris, Inc., Billerica, Mass., USA)。
此外,如本文所描述之組合物可以濃縮物之形式提供用於商業銷售,該濃縮物可以在使用時使用適量水稀釋。在濃縮物形式中,組合物(濃縮物)包括如本文所闡述之非水成分,該等非水成分存在於濃縮物中的量使得當用所需量水(例如,DI水)稀釋濃縮物時,清潔組合物之各組分將以所需用於清潔步驟,諸如化學機械研磨後清潔步驟的量存在於經稀釋之使用型組合物中。經添加至濃縮物中以形成使用型組合物之水量可以為每體積濃縮物一或多體積水,例如每體積濃縮物2體積水(例如,3、4、5或10體積水)。當濃縮物用此水量稀釋時,濃縮物之各固體組分將以基於為稀釋濃縮物而添加之水之體積數而降低的濃度存在於使用型組合物中。
所描述之清潔組合物可用於微電子器件處理應用,該等應用包括藉由諸如蝕刻後殘餘物移除,灰化後殘餘物移除表面製備,化學機械研磨後殘餘物移除及其類似方法的方法清潔基板表面的製程。
本發明之組合物及方法可有效自表面移除大量殘餘物,其量係在清潔步驟之前最初存在於表面的,但不會對基板造成實質上損壞。在一個實施例中,在清潔步驟中,清潔組合物可有效地在藉由清潔步驟移除殘餘物之前移除至少85%的存在於基板表面上之殘餘物,或在清潔步驟之前初始存在的至少90%殘餘物,或至少95%殘餘物,或至少99%殘餘物。
在清潔步驟,諸如化學機械研磨後殘餘物清潔步驟中,清潔組合物可以與多種已知的、習知的、市售的清潔工具中的任一種一起使用,諸如兆音波(megasonics)及刷子洗滌,包括(但不限於) Verteq single wafer megasonic Goldfinger、ontrak systems DDS(雙邊洗滌器)、SEZ或其他單晶圓噴霧沖洗,Applied Materials Mirra-Mesa™/Reflexion™/ReflexionLK™,及兆聲波批量濕式清潔台系統,及Ebara Technologies公司的產品,諸如300 mm型號(FREX300S2及FREX300X3SC)及200 mm CMP系統(FREX200M)。
清潔步驟之條件及時間可根據需要而定,且可根據基板及殘餘物之類型而變化。在使用組合物自上面有化學機械研磨後殘餘物、蝕刻後殘餘物、灰化後殘餘物或污染物的微電子器件基板上清潔化學機械研磨後殘餘物、蝕刻後殘餘物、灰化後殘餘物或污染物時,清潔組合物可與基板表面在約20℃至約90℃,或約20℃至約50℃範圍內的溫度下接觸約1秒至約20分鐘,例如約5秒至10分鐘或約15秒至約5分鐘的時間。此等接觸時間及溫度係說明性的,且任何其他合適的時間及溫度條件在至少部分、較佳實質上有效自表面清潔初始量殘餘物時均可適用。
在器件基板表面被清潔至所需程度之後,清潔步驟中所使用清潔組合物可容易地自器件表面移除,其在給定的最終用途應用中可能係所需的及有效的。例如,可以藉由使用包括去離子水的沖洗溶液進行移除。其後,可根據需要處理器件,諸如藉由乾燥(例如,使用氮氣或自旋-乾燥循環),接著對經清潔及乾燥的器件表面進行後續處理。
在其他更一般或具體的方法中,微電子器件基板可首先經受處理步驟,該處理步驟包括CMP處理、電漿蝕刻、濕式蝕刻、電漿灰化或其類似處理中之任何一或多種,接著經受清潔步驟,該清潔步驟包括用本發明之組合物清潔基板表面。在第一個處理步驟結束時,殘餘物(例如蝕刻後殘餘物、化學機械研磨後殘餘物、灰化後殘餘物等)將出現在基板之表面。使用如所描述之清潔組合物的清潔步驟將有效地自微電子器件表面清潔大量殘餘物。
因此,在另一態樣中,本發明提供一種移除微電子器件基板上之殘餘物之方法,該方法包含:
使微電子器件基板之表面與組合物接觸,該組合物包含:
a. 還原劑;
b. 螯合劑;
c. 胺基(C
6-C
12烷基)醇;及
d. 水;
其中組合物具有小於約8之pH;及
至少部分地自基板移除殘餘物。
實例
本發明可藉由其某些實施例之以下實例進一步說明,但應理解,此等實例僅為達成說明之目的而包括在內,且除非另外特別指定,否則並不意欲限制本發明之範疇。
製備以下組合物。所示量以重量百分比為單位。
1去離子水
2聚(苯乙烯磺酸)
3三乙二醇單丁醚
4聚氧乙烯(23)月桂基醚
5聚丙烯酸
6N-(2-羥乙基)哌𠯤-N'-(2-乙磺酸)
原材料 | 比較實例1 | 實例1 | 實例2 | 實例3 | 實例4 | 實例5 | 實例6 |
DIW 1 | 83.42 | 80.95 | 85.48 | 83.81 | 85.9 | 85.5 | 80.45 |
PSSA 2 | -- | -- | 0.25 | 0.25 | -- | -- | -- |
TGMBE 3 | 2.5 | 2.5 | 2.5 | 2.5 | 2.5 | 2.5 | 2.5 |
Brij L23 4 | -- | -- | -- | -- | 0.1 | 0.5 | -- |
HEPES 6 | -- | -- | -- | -- | -- | -- | 0.5 |
檸檬酸 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
HEDP 5 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
H 3PO 2 | 1 | 1 | 1 | -- | 1 | 1 | 1 |
L-抗壞血酸 | -- | -- | -- | 2.67 | -- | -- | -- |
PAA 6 | -- | -- | -- | -- | -- | -- | -- |
3-胺基-4-辛醇 | -- | 2.5 | 2.5 | 2.5 | 2.5 | 2.5 | 2.5 |
HNO 3 | 1 | 1 | -- | -- | -- | -- | 1 |
氫氧化膽鹼 | 8.08 | 8.05 | 4.27 | 4.27 | 4 | 4 | 8.05 |
效能總結
對作為比較實例1和實例1-5之上述組合物進行以下測試:
蝕刻速率實驗之一般步驟:
將試片切割成約2.3 cm×2.3 cm之尺寸。藉由XRF (Rikagu ZSX-400之金屬膜)或橢圓偏振計(JA Woollam M-2000D之非金屬膜或金屬氧化物膜)進行蝕刻前及蝕刻後之厚度量測。對於poly Si樣品,在Teflon燒杯(1% HF溶液)中預處理表面;將試片浸漬至此溶液中15分鐘,隨後用去離子水沖洗且立即用氮氣乾燥。隨後將試片置放於燒杯中一段時間,藉由攪拌棒(約500 rpm)攪拌,隨後立即用去離子水沖洗且用氮氣流乾燥。由此,平均蝕刻速率值為:
AER=[(之前厚度)-(之後厚度)]/(化學品(HF溶液)浸漬所花費時間)。
在此實驗中,較低的平均值表明對薄膜損害更少。
Poly Si-DIW C/A(
接觸角
)
實驗之一般步驟
:
將試片切割成約2.3 cm×2.3 cm之尺寸。表面清潔之預處理及清潔劑浸漬如部分A中進行且在氮氣流下乾燥。用Krüss Scientific DAS100接觸角計測定接觸角-將試片置放於接觸角計之固持器上,進行水滴負載及接觸角量測。將經預處理之試片置放於固持器中以用於「之前」量測,「之前」係沒有來自表面污染之貢獻影響之純poly Si之潤濕特性。在實驗中,接觸角愈小,去離子水之潤濕/親水性愈佳。
對各種清潔溶液中之市售二氧化鈰粒子測定
ζ
電位。
在摻合機中攪拌二氧化鈰粒子以確保粒子充分分散在清潔溶液中,且隨後轉移至ζ電位機(Beckman Coulter,Delsa Nano C)之固持器中以用於自動ζ電位量測。在此實驗中,ζ電位之絕對值(與+/-符號無關)愈大愈佳,因為其意謂迫使粒子彼此排斥之電荷密度愈高。
清潔劑中
poly Si/TEOS
之
ζ
電位量測之一般步驟。
將試片切割成約2.3 cm×2.3 cm之尺寸。根據以上步驟A中所描述之方法,用稀HF預處理poly Si試片。將試片置放於固持器中以用於表面電位量測(在Anton Paar,SurPASS3中),其自動量測ζ電位。在此實驗中,ζ電位之絕對值(與+/-符號無關)愈大愈佳,因為其意謂迫使粒子彼此排斥之電荷密度愈高。
藉由組合物溶解二氧化鈰之一般步驟
將市售二氧化鈰粒子機械摻合以確保粒子充分分散,且隨後加入至各種清潔溶液中(在Teflon燒杯中)。隨後攪拌樣品5分鐘。將溶液轉移至離心管且以15,000離心15分鐘。採集2 ml上清液(即上層)樣品,且藉由ICP-OES分析(感應耦合光發射光譜測定法)測定鈰濃度。在此實驗中,ICP-OES鈰之濃度愈高愈佳,因為此表明更多的二氧化鈰溶解/分散於溶液中。
缺陷度評估之一般步驟
此量測之目的係評估組合物能多大程度上清潔TEO晶圓基板。製備且過濾組合物。TEOS晶圓(直徑8吋)、市售二氧化鈰漿料及適當CMP/清潔後部件及消耗品用於整個晶圓研磨實驗。200 mm晶圓在Mirra®上進行研磨處理,且在由Advanced Materials and Technology出售的OnTrak®上進行清潔,且藉由SP1量測缺陷,臨限值>0.11 µm (計數經處理之晶圓上可發現多少粒子)。
態樣
之前 | 比較實例1 | 實例1 | 實例2 | 實例3 | 實例4 | 實例5 | 實例6 | ||
Poly Si蝕刻速率 | 平均值 | -- | 0.17 | 0.80 | -0.23 | -0.20 | -0.04 | 0.06 | 0.96 |
標準差 | -- | 0.03 | 0.10 | 0.04 | 0.03 | 0.10 | 0.03 | 0.05 | |
TEOS蝕刻速率 | 平均值 | -- | 0.09 | 0.38 | -0.02 | 0.00 | -0.11 | -0.10 | 0.03 |
標準差 | -- | 0.15 | 0.41 | 0.02 | 0.02 | 0.04 | 0.07 | 0.03 | |
濕式蝕刻速率 | 平均值 | -- | 0.31 | 0.56 | 0.50 | 0.03 | 0.11 | 0.12 | |
標準差 | -- | 0.14 | 0.18 | 0.06 | 0.04 | 0.07 | 0.09 | ||
Poly Si DIW CA | 平均值 | 78.4 | 57.5 | 33.7 | 53.2 | 60.2 | 61.0 | 59.0 | 62.5 |
標準差 | 0.7 | 1.1 | 1.4 | 0.8 | 0.4 | 0.7 | 0.3 | 1.5 | |
二氧化鈰粒子ζ電位(mV) | -- | -48.8 | -53.0 | -50.4 | -53.0 | -48.4 | -46.5 | -34.6 | |
Poly Si ζ電位(mV) | 平均值 | -- | -25.4 | -36.6 | -44.7 | -51.5 | -4.5 | -4.4 | 23.8 |
標準差 | -- | 1.2 | 3.6 | 0.3 | 2.3 | 0.1 | 0.6 | 1.6 | |
TEOS ζ電位(mV) | 平均值 | -- | -4.9 | -21.1 | -35.9 | -37.5 | 0.9 | -2.2 | -22.1 |
標準差 | -- | 1.3 | 0.7 | 2.4 | 1.1 | 0.3 | 1.1 | 2.1 | |
二氧化鈰溶解(ppb) | -- | 15948 | 14126 | 28545 | 33906 | 21807 | 23258 | 12410 | |
缺陷度(計數>0.11 µm) | 平均值 | -- | 193 | 133 | 93 | ||||
標準差 | -- | 14 | 8 | 19 | |||||
pH | -- | 4.2 | 6.8 | 4.4 | 4.8 | 4.2 | 4.2 |
在第一態樣中,本發明提供一種組合物,其包含
a. 還原劑;
b. 螯合劑;
c. 胺基(C
6-C
12烷基)醇;及
d. 水;
其中該組合物具有小於約8之pH。
在第二態樣中,本發明提供第一態樣之組合物,其中還原劑係選自次磷酸、二乙基羥胺、亞硫酸及L-抗壞血酸。
在第三態樣中,本發明提供第一或第二態樣之組合物,其中螯合劑係選自天冬胺酸、麩胺酸、檸檬酸、磷酸、腈-參(亞甲基膦酸)及1-羥基亞乙基-1,1-二膦酸。
在第四態樣中,本發明提供第一、第二或第三態樣之組合物,其中胺基(C
6-C
12烷基)醇包含3-胺基-4-辛醇。
在第五態樣中,本發明提供第一至第四態樣中任一者之組合物,其進一步包含氟化物來源。
在第六態樣中,本發明提供第一至第五態樣中任一者之組合物,其進一步包含非離子界面活性劑。
在第七態樣中,本發明提供第一至第六態樣中任一者之組合物,其進一步包含水混溶性溶劑。
在第八態樣中,本發明提供第一至第七態樣中任一者之組合物,其進一步包含水溶性或水分散性聚合物。
在第九態樣中,本發明提供第一、第二、第四、第五或第七態樣中任一者之組合物,其進一步包含聚(苯乙烯磺酸)、聚氧乙烯(23)月桂基醚、麩胺酸及天冬胺酸中之至少一者。
在第十態樣中,本發明提供第一至第九態樣中任一者之組合物,其中組合物進一步包含N-(2-羥乙基)哌𠯤-N'-(2-乙磺酸)或其鹽。
在第十一態樣中,本發明提供第一至第十態樣中任一者之組合物,其中組合物不含腐蝕抑制劑。術語「不含」意欲對應於小於0.001重量%或低於具有有效作用之濃度。
在第十二態樣中,本發明提供一種移除微電子器件基板上之殘餘物之方法,該方法包含:
使微電子器件基板之表面與組合物接觸,該組合物包含:
a. 還原劑;
b. 螯合劑;
c. 胺基(C
6-C
12烷基)醇;及
d. 水;
其中組合物具有小於約8之pH,
且至少部分地自基板移除殘餘物。
在第十三態樣中,本發明提供第十二態樣之方法,其中該還原劑係選自次磷酸、二乙基羥胺、亞硫酸及L-抗壞血酸。
在第十四態樣中,本發明提供第十二或第十三態樣之方法,其中螯合劑係選自天冬胺酸、麩胺酸、檸檬酸、磷酸、腈-參(亞甲基膦酸)及1-羥基亞乙基-1,1-二膦酸。如請求項1之組合物,其中該胺基(C
6-C
12烷基)醇包含3-胺基-4-辛醇。
在第十五態樣中,本發明提供第十二至第十四態樣中任一者之方法,其中組合物進一步包含氟化物來源。
在第十六態樣中,本發明提供第十二至第十五態樣中任一者之方法,其中組合物進一步包含非離子界面活性劑。
在第十七態樣中,本發明提供第十二至第十六態樣中任一者之方法,其中組合物進一步包含水混溶性溶劑。
在第十八態樣中,本發明提供第十二至第十七態樣中任一者之方法,其中組合物進一步包含水溶性或水分散性聚合物。
在第十九態樣中,本發明提供第十二至第十八態樣中任一者之方法,其中組合物進一步包含聚(苯乙烯磺酸)、聚氧乙烯(23)月桂基醚、麩胺酸及天冬胺酸中之至少一者。
在第二十態樣中,本發明提供第十二至第十九態樣中任一者之方法,其中組合物進一步包含4-(2-羥乙基)-1-哌𠯤乙磺酸或其鹽。
在第二十一態樣中,本發明提供第十二至第二十態樣中任一者之方法,其中組合物不含腐蝕抑制劑。
在第二十二態樣中,本發明提供一種在一或多個容器中包含以下兩者或更多者之套組:(i)還原劑;(ii)螯合劑;(iii)胺基(C
6-C
10烷基)醇;及水。
在第二十三態樣中,本發明提供第二十二態樣之套組,其中組合物如第一至第十一態樣中任一者所闡述。
因此,根據所描述之本發明之若干說明性實施例,熟習此項技術者將易於瞭解,其他實施例可在此隨附申請專利範圍之範疇內予以製作及使用。在前述描述中已闡述了本文件所覆蓋的本發明之大量優點。然而,應理解,在許多方面,本發明僅係說明性的。當然,本發明之範疇由表述隨附申請專利範圍之語言來界定。
Claims (21)
- 一種組合物,其包含 a. 還原劑; b. 螯合劑; c. 胺基(C 6-C 12烷基)醇;及 d. 水; 其中該組合物具有小於約8之pH。
- 如請求項1之組合物,其中該還原劑係選自次磷酸、二乙基羥胺、亞硫酸及L-抗壞血酸。
- 如請求項1之組合物,其中該螯合劑係選自天冬胺酸、麩胺酸、檸檬酸、磷酸、腈-參(亞甲基膦酸)及1-羥基亞乙基-1,1-二膦酸。
- 如請求項1之組合物,其中該胺基(C 6-C 12烷基)醇包含3-胺基-4-辛醇。
- 如請求項1之組合物,其進一步包含氟化物來源。
- 如請求項1之組合物,其進一步包含非離子界面活性劑。
- 如請求項1之組合物,其進一步包含水混溶性溶劑。
- 如請求項1之組合物,其進一步包含水溶性或水分散性聚合物。
- 如請求項1之組合物,其進一步包含聚(苯乙烯磺酸)、聚氧乙烯(23)月桂基醚、麩胺酸及天冬胺酸中之至少一者。
- 如請求項1之組合物,其進一步包含N-(2-羥乙基)哌𠯤-N'-(2-乙磺酸)。
- 如請求項1之組合物,其中該組合物不含腐蝕抑制劑。
- 一種移除微電子器件基板上之殘餘物之方法,該方法包含: 使微電子器件基板之表面與組合物接觸,該組合物包含: a. 還原劑; b. 螯合劑; c. 胺基(C 6-C 12烷基)醇;及 d. 水; 其中該組合物具有小於約8之pH, 且至少部分地自該基板移除該等殘餘物。
- 如請求項12之方法,其中該還原劑係選自次磷酸、二乙基羥胺、亞硫酸及L-抗壞血酸。
- 如請求項12之方法,其中該螯合劑係選自天冬胺酸、麩胺酸、檸檬酸、磷酸、腈-參(亞甲基膦酸)及1-羥基亞乙基-1,1-二膦酸。
- 如請求項12之方法,其中該組合物進一步包含氟化物來源。
- 如請求項12之方法,其中該組合物進一步包含非離子界面活性劑。
- 如請求項12之方法,其中該組合物進一步包含水混溶性溶劑。
- 如請求項12之方法,其中該組合物進一步包含水溶性或水分散性聚合物。
- 如請求項12之方法,其中該組合物進一步包含聚(苯乙烯磺酸)、聚氧乙烯(23)月桂基醚、麩胺酸及天冬胺酸中之至少一者。
- 如請求項12之方法,其中該組合物進一步包含4-(2-羥乙基)-1-哌𠯤乙磺酸或其鹽。
- 如請求項12之方法,其中該組合物不含腐蝕抑制劑。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US202263323054P | 2022-03-23 | 2022-03-23 | |
US63/323,054 | 2022-03-23 | ||
US202263357524P | 2022-06-30 | 2022-06-30 | |
US63/357,524 | 2022-06-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202346558A true TW202346558A (zh) | 2023-12-01 |
Family
ID=88101819
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW112110858A TW202346558A (zh) | 2022-03-23 | 2023-03-23 | 化學機械研磨後(post cmp)清潔組合物 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20230323248A1 (zh) |
TW (1) | TW202346558A (zh) |
WO (1) | WO2023183316A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220106541A1 (en) * | 2020-10-05 | 2022-04-07 | Entegris, Inc. | Microelectronic Device Cleaning Composition |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008543060A (ja) * | 2005-05-26 | 2008-11-27 | アドバンスド テクノロジー マテリアルズ,インコーポレイテッド | 銅不活性化化学機械研磨後洗浄組成物及び使用方法 |
US7534753B2 (en) * | 2006-01-12 | 2009-05-19 | Air Products And Chemicals, Inc. | pH buffered aqueous cleaning composition and method for removing photoresist residue |
TWI564387B (zh) * | 2007-05-17 | 2017-01-01 | 恩特葛瑞斯股份有限公司 | 用於移除化學機械研磨後殘留物之清洗組成物、套組及方法 |
US11085011B2 (en) * | 2018-08-28 | 2021-08-10 | Entegris, Inc. | Post CMP cleaning compositions for ceria particles |
US11060051B2 (en) * | 2018-10-12 | 2021-07-13 | Fujimi Incorporated | Composition for rinsing or cleaning a surface with ceria particles adhered |
US20220336210A1 (en) * | 2021-04-16 | 2022-10-20 | Entegris, Inc. | Cleaning composition |
-
2023
- 2023-03-21 US US18/124,355 patent/US20230323248A1/en active Pending
- 2023-03-21 WO PCT/US2023/015791 patent/WO2023183316A1/en unknown
- 2023-03-23 TW TW112110858A patent/TW202346558A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
US20230323248A1 (en) | 2023-10-12 |
WO2023183316A1 (en) | 2023-09-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI703210B (zh) | 化學機械研磨後調配物及使用方法 | |
TWI821455B (zh) | 化學機械研磨後清潔組合物 | |
TWI710629B (zh) | 用於自表面移除氧化鈰粒子之組成物及方法 | |
KR100561178B1 (ko) | 반도체 장치용의 유기 및 플라즈마 에칭된 잔사의 세척조성물 | |
TW202016277A (zh) | 用於鈰粒子之化學機械研磨後(post cmp)清潔組合物 | |
WO2005076332A1 (ja) | 半導体デバイス用基板洗浄液及び洗浄方法 | |
CN1802731A (zh) | 半导体工艺中后蚀刻残留物的去除 | |
TWI794152B (zh) | 用於化學機械研磨後清潔之組成物 | |
TW202346558A (zh) | 化學機械研磨後(post cmp)清潔組合物 | |
TW202227602A (zh) | 微電子裝置清潔組合物 | |
JP5203637B2 (ja) | レジスト、エッチング残渣、及び金属酸化物をアルミニウム及びアルミニウム銅合金を有する基板から除去する方法及び組成物 | |
TW202330894A (zh) | 微電子裝置清潔組合物 | |
CN118369411A (zh) | 微电子装置清洁组合物 | |
WO2023177541A1 (en) | Microelectronic device cleaning composition | |
KR102026484B1 (ko) | 알루미늄 에칭후 잔류물 제거 및 동시 표면 부동태화 |