TW202341240A - Substrate processing module and substrate processing apparatus, and substrate processing unit - Google Patents

Substrate processing module and substrate processing apparatus, and substrate processing unit Download PDF

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TW202341240A
TW202341240A TW111147830A TW111147830A TW202341240A TW 202341240 A TW202341240 A TW 202341240A TW 111147830 A TW111147830 A TW 111147830A TW 111147830 A TW111147830 A TW 111147830A TW 202341240 A TW202341240 A TW 202341240A
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tank
chemical
module
substrate processing
substrate
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TW111147830A
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Chinese (zh)
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出口泰紀
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日商東邦化成股份有限公司
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A substrate processing module (7) is equipped with: a housing (20) and a collection groove (47) accommodating two treatment grooves (32 and 34) that can be respectively provided with a substrate (4) aligned along a first direction; wherein the collection groove (47) is arranged in the housing (20); the collection groove (47) and the treatment grooves (32 and 34) are separated from the housing (20).

Description

基板處理模組、基板處理裝置及基板處理單元 Substrate processing module, substrate processing device and substrate processing unit

本發明係關於一種處理基板的基板處理模組、基板處理裝置以及基板處理單元。 The invention relates to a substrate processing module, a substrate processing device and a substrate processing unit for processing a substrate.

就基板處理裝置而言,有一種洗淨裝置,以預定藥液將半導體等各種基板(以下亦稱「基板」)處理後,以純水等洗淨液來洗淨,去除附著於基板表面的異物。就洗淨裝置而言,有一種濕式的洗淨裝置,使基板浸漬於藥液及洗淨液中,藉此進行洗淨處理。 As for the substrate processing device, there is a cleaning device that processes various substrates such as semiconductors (hereinafter also referred to as "substrates") with a predetermined chemical solution, and then washes them with a cleaning solution such as pure water to remove any residues attached to the surface of the substrate. foreign body. As for the cleaning device, there is a wet cleaning device that immerses the substrate in a chemical solution and a cleaning solution to perform cleaning processing.

專利文獻1揭示一種基板處理裝置,係沿著裝置的長邊方向配置複數對藥液槽及洗淨槽,並且具有主搬運機構及副搬運機構。主搬運機構係使複數個基板沿著長邊方向從裝置的一端側移動到另一端側。副搬運機構係使複數個基板在一對藥液槽及洗淨槽的範圍內沿長邊方向及上下方向移動。 Patent Document 1 discloses a substrate processing apparatus in which a plurality of pairs of chemical solution tanks and cleaning tanks are arranged along the longitudinal direction of the apparatus, and has a main conveyance mechanism and a auxiliary conveyance mechanism. The main transport mechanism moves a plurality of substrates from one end side of the device to the other end side in the longitudinal direction. The auxiliary transport mechanism moves a plurality of substrates in the longitudinal direction and the up-down direction within the range of a pair of chemical solution tanks and cleaning tanks.

[先前技術文獻] [Prior technical literature]

[專利文獻] [Patent Document]

專利文獻1:日本專利公開公報特開2018-56158號 Patent document 1: Japanese Patent Publication No. 2018-56158

專利文獻1中,由於複數對藥液槽及洗淨槽係沿裝置的長邊方向相鄰,因而會發生鄰近位置之其他的藥液槽及洗淨槽受到積存於某一藥液槽的某一種藥液的氣態環境汙染的情形(亦即藥液所致汙染)。此外,由於主搬運機構及副搬運機構係面向藥液槽及洗淨槽,因而發生微粒所致的汙染。此外,由於沿著長邊方向配置複數對藥液槽及洗淨槽,因而使得裝置的長邊方向變長,此外,由於複數對藥液槽及洗淨槽係固定設置在裝置內,所以無法與處理程序的變更需求作靈活地應對,也會有維護時造成困難的情形。 In Patent Document 1, since a plurality of pairs of chemical liquid tanks and cleaning tanks are adjacent to each other along the longitudinal direction of the device, other chemical liquid tanks and cleaning tanks at adjacent positions may be affected by certain chemicals accumulated in a certain chemical liquid tank. A situation of gaseous environmental pollution of medicinal liquid (that is, pollution caused by medicinal liquid). In addition, since the main conveying mechanism and the auxiliary conveying mechanism face the chemical solution tank and the washing tank, contamination due to particulates occurs. In addition, since multiple pairs of chemical solution tanks and cleaning tanks are arranged along the longitudinal direction, the length of the device becomes longer. In addition, since the plurality of pairs of chemical solution tanks and cleaning tanks are fixedly installed in the device, it is impossible to Flexible response to changing needs of the handler may also cause difficulties during maintenance.

因此,殷切盼望能夠實現抑制藥液、微粒等所致汙染、裝置的小型化、靈活地應對且高擴充性的構成、並提升維護性。 Therefore, it is highly desired to achieve a structure that can suppress contamination caused by chemicals, particles, etc., reduce the size of the device, respond flexibly and with high scalability, and improve maintainability.

對此,本發明的課題在於提供一種可使維護性提升的基板處理模組、基板處理裝置以及基板處理單元。 In this regard, an object of the present invention is to provide a substrate processing module, a substrate processing device, and a substrate processing unit that can improve maintainability.

為了解決上述課題,本發明的一態樣的基板處理模組係具備:殼體;兩個處理槽,係在前述殼體內沿著第一方向排列,且可分別配置基板;以及校平機構,係用以進行前述處理槽的校平;其中,前述校平機構 係具有:設置於前述處理槽的接觸部;與前述接觸部接觸並支持前述接觸部的支持部;以及用以變更前述處理槽之高度的至少兩個高度變更部。 In order to solve the above problems, a substrate processing module according to one aspect of the present invention includes: a housing; two processing tanks arranged along a first direction in the housing, and capable of disposing substrates respectively; and a leveling mechanism. It is used to level the aforementioned treatment tank; wherein, the aforementioned leveling mechanism The system has: a contact portion provided in the processing tank; a support portion that is in contact with the contact portion and supports the contact portion; and at least two height changing portions for changing the height of the processing tank.

此外,本發明的一態樣的基板處理裝置係具備:前述基板處理模組、以及前述其他模組。 Furthermore, a substrate processing apparatus according to one aspect of the present invention includes the above-mentioned substrate processing module and the above-mentioned other module.

此外,本發明的一態樣的基板處理單元係具備:可分別配置基板的兩個處理槽;匯集槽,係以沿第一方向排列的狀態來收容前述處理槽;以及校平機構,係用以進行前述處理槽之校平;前述校平機構係具有:設置於前述處理槽的接觸部、與前述接觸部接觸並支持前述接觸部的支持部、以及用以變更前述處理槽之高度的至少兩個高度變更部。 In addition, a substrate processing unit according to one aspect of the present invention is provided with: two processing tanks in which substrates can be respectively arranged; a collection tank that accommodates the processing tanks in a state of being arranged along the first direction; and a leveling mechanism that uses To perform leveling of the treatment tank; the leveling mechanism has: a contact portion provided in the treatment tank, a support portion in contact with the contact portion and supporting the contact portion, and at least one for changing the height of the treatment tank. Two height changing sections.

根據本發明,可使維護性提升。 According to the present invention, maintainability can be improved.

1:基板處理裝置 1:Substrate processing device

2:載具 2:Vehicle

3:凸緣部 3: Flange part

4,4A,4B,4C:基板 4,4A,4B,4C:Substrate

5:搬入模組 5: Import the module

6:乾燥模組 6: Drying module

7,7A,7B,7C,7a,7b,7c,7d:化學模組(基板處理模組) 7,7A,7B,7C,7a,7b,7c,7d: Chemical module (substrate processing module)

8:搬出模組 8:Move out the module

9:第二搬運機構 9: Second transport mechanism

11:第一搬運部(搬運部) 11: First transportation department (transportation department)

12:第一致動器(致動器) 12: First actuator (actuator)

13:上下搬運部(搬運部) 13: Upper and lower conveying section (conveying section)

14:上下致動器(致動器) 14: Up and down actuator (actuator)

16:臂 16: arm

18:托架 18: Bracket

18A:上段部 18A: Upper section

18B:下段部 18B: Lower section

20:殼體 20: Shell

22:載置台 22: Loading platform

24:風扇過濾單元 24:Fan filter unit

26:搬入部 26:Moving in department

27:搬出部 27:Moving out department

29:共通排氣管道 29: Common exhaust pipe

31:乾燥腔 31:Drying chamber

32:藥液槽(處理槽、第二槽) 32: Chemical liquid tank (processing tank, second tank)

32A,32B,32C:第二槽 32A, 32B, 32C: Second slot

32a,32b:角部 32a,32b: Corner

34:洗淨槽(處理槽、第一槽) 34: Washing tank (processing tank, first tank)

34A,34B,34C:第一槽 34A, 34B, 34C: first slot

36:側方排氣管道(排氣管道) 36: Side exhaust pipe (exhaust pipe)

36a:側方排氣口(排氣口) 36a: Side exhaust port (exhaust port)

37:側方壁 37:Side wall

37a:間隙 37a: Gap

38:後方壁 38:Rear wall

38a:開口 38a:Open your mouth

39:後方排氣管道(排氣管道) 39: Rear exhaust pipe (exhaust pipe)

39a:後方排氣口(排氣口) 39a: Rear exhaust port (exhaust port)

40:第二搬運收容部 40:Second Transportation and Containment Department

41:第二致動器(致動器) 41: Second actuator (actuator)

41A:致動器本體部 41A: Actuator body part

41B:軌道 41B:Track

42:旋轉致動器(致動器) 42: Rotary actuator (actuator)

43:旋動臂部 43: Rotating arm

44:夾具部 44: Fixture Department

45:基板處理單元 45:Substrate processing unit

46:連桿部 46: Connecting rod part

47:匯集槽 47: Collection tank

47A,47B:內壁面 47A, 47B: Inner wall surface

48:第二搬運部(搬運部) 48: Second transport department (transportation department)

49:開口部 49:Opening part

50:底壁 50:Bottom wall

51:開口 51:Open your mouth

51C:底面 51C: Bottom

52:可動壁 52: Movable wall

54:面板 54:Panel

56,57:配管 56,57:Piping

58:正面 58:front

60:開口 60:Open your mouth

62:開口部 62:Opening part

64:面板 64:Panel

66,68:槽開口部 66,68: Groove opening

70,72:開口部 70,72:Opening part

74,76:面板 74,76:Panel

78:背面 78:Back

82:排氣管道 82:Exhaust pipe

84:排氣口 84:Exhaust port

85:連接配管 85:Connect piping

86:連接器 86:Connector

87:板部 87:Itabu

88:軌道 88:Orbit

88A,88B,88C:軌道 88A, 88B, 88C: Track

90:校平機構(第二校平機構) 90: Leveling mechanism (second leveling mechanism)

91:校平機構(第一校平機構) 91: Leveling agency (first leveling agency)

92,92A,92B,95,95A,95B:高度變更部 92,92A,92B,95,95A,95B:Height change part

93,96:接觸部(球部) 93,96: Contact part (ball part)

94,97:支持部(球承載部) 94,97: Support part (ball bearing part)

100:承載台 100: Bearing platform

102:調節螺絲 102:Adjustment screw

103:頭部 103:Head

104:導引部 104: Guidance Department

106:貫通孔 106:Through hole

107:安裝部 107:Installation Department

108:球面 108: Spherical surface

110:球面 110: Spherical surface

112:接觸部位 112:Contact part

114,116:棒狀部 114,116: Rod-shaped part

210:多面體形狀 210:Polyhedral shape

303,306:接觸部 303,306:Contact Department

304,307:支持部 304,307:Support Department

393,396:接觸部 393,396:Contact Department

432:藥液槽 432:Medicine tank

434:洗淨槽 434: Washing tank

490:校平機構 490: Leveling mechanism

492,492A,492B:高度變更部 492, 492A, 492B: Height change department

493:接觸部 493:Contact Department

494:支持部 494:Support Department

500,501:高度變更部 500,501:Height change department

A:處理空間 A: Processing space

B1:第一驅動空間 B1: First drive space

B2:第二驅動空間 B2: Second drive space

H1:中間位置 H1: middle position

H2:上升位置 H2: ascending position

H3:下降位置 H3: Descending position

L1,L2,M1,M2,M3,M4,M5,M6,M7,M8,M9,M10,M11,M12,M13,M14,R,Z1:箭頭 L1,L2,M1,M2,M3,M4,M5,M6,M7,M8,M9,M10,M11,M12,M13,M14,R,Z1: Arrow

D1,D2:曲率半徑 D1, D2: radius of curvature

N1:正面側 N1: Front side

N2:背面側 N2: Back side

S1:第一收容空間 S1: The first containment space

S2:第二收容空間 S2: Second Containment Space

X1,X2:中心線 X1,X2: center line

圖1為說明一實施型態的基板處理裝置的立體圖。 FIG. 1 is a perspective view illustrating a substrate processing apparatus according to an embodiment.

圖2為說明圖1所示之基板處理裝置的構成要素的立體圖。 FIG. 2 is a perspective view illustrating components of the substrate processing apparatus shown in FIG. 1 .

圖3為說明圖1所示之基板處理裝置中的化學模組的立體圖。 FIG. 3 is a perspective view illustrating a chemical module in the substrate processing apparatus shown in FIG. 1 .

圖4為說明圖1所示之基板處理裝置中的第二搬運機構的立體圖。 FIG. 4 is a perspective view illustrating a second transport mechanism in the substrate processing apparatus shown in FIG. 1 .

圖5為說明圖3所示之化學模組的主要部分的立體圖。 FIG. 5 is a perspective view illustrating the main parts of the chemical module shown in FIG. 3 .

圖6為說明圖1所示之基板處理裝置中的搬出模組的立體圖。 FIG. 6 is a perspective view illustrating the unloading module in the substrate processing apparatus shown in FIG. 1 .

圖7為說明圖1所示之基板處理裝置中的搬入模組的立體圖。 FIG. 7 is a perspective view illustrating a loading module in the substrate processing apparatus shown in FIG. 1 .

圖8為說明圖3所示之化學模組中的上下搬運部的動作之圖。 FIG. 8 is a diagram illustrating the operation of the vertical conveyance unit in the chemical module shown in FIG. 3 .

圖9為說明圖3所示之化學模組中的第一搬運部的動作之圖。 FIG. 9 is a diagram illustrating the operation of the first transport unit in the chemical module shown in FIG. 3 .

圖10為說明保持基板的載具之圖。 FIG. 10 is a diagram illustrating a carrier holding a substrate.

圖11為說明圖1所示之基板處理裝置中的乾燥模組的立體圖。 FIG. 11 is a perspective view illustrating the drying module in the substrate processing apparatus shown in FIG. 1 .

圖12為俯視觀看第二搬運機構時的概略圖。 FIG. 12 is a schematic plan view of the second transport mechanism.

圖13為顯示化學模組的概略立體圖。 Figure 13 is a schematic perspective view showing the chemical module.

圖14為說明化學模組中的第一搬運部的動作之圖。 FIG. 14 is a diagram illustrating the operation of the first transport unit in the chemical module.

圖15為顯示變形例之處理空間的概略俯視圖。 FIG. 15 is a schematic plan view showing a processing space of a modified example.

圖16A為用以說明基板處理裝置之動作的一例的概略圖。 FIG. 16A is a schematic diagram for explaining an example of the operation of the substrate processing apparatus.

圖16B為用以說明基板處理裝置之動作的一例的概略圖。 FIG. 16B is a schematic diagram for explaining an example of the operation of the substrate processing apparatus.

圖16C為用以說明基板處理裝置之動作的一例的概略圖。 FIG. 16C is a schematic diagram for explaining an example of the operation of the substrate processing apparatus.

圖16D為用以說明基板處理裝置之動作的一例的概略圖。 FIG. 16D is a schematic diagram for explaining an example of the operation of the substrate processing apparatus.

圖16E為用以說明基板處理裝置之動作的一例的概略圖。 FIG. 16E is a schematic diagram for explaining an example of the operation of the substrate processing apparatus.

圖16F為用以說明基板處理裝置之動作的一例的概略圖。 FIG. 16F is a schematic diagram for explaining an example of the operation of the substrate processing apparatus.

圖16G為用以說明基板處理裝置之動作的一例的概略圖。 FIG. 16G is a schematic diagram for explaining an example of the operation of the substrate processing apparatus.

圖16H為用以說明基板處理裝置之動作的一例的概略圖。 FIG. 16H is a schematic diagram for explaining an example of the operation of the substrate processing apparatus.

圖16I為用以說明基板處理裝置之動作的一例的概略圖。 FIG. 16I is a schematic diagram for explaining an example of the operation of the substrate processing apparatus.

圖16J為用以說明基板處理裝置之動作的一例的概略圖。 FIG. 16J is a schematic diagram for explaining an example of the operation of the substrate processing apparatus.

圖16K為用以說明基板處理裝置之動作的一例的概略圖。 FIG. 16K is a schematic diagram for explaining an example of the operation of the substrate processing apparatus.

圖16L為用以說明基板處理裝置之動作的一例的概略圖。 FIG. 16L is a schematic diagram for explaining an example of the operation of the substrate processing apparatus.

圖17為顯示處理一批次的基板時之動作例的概略俯視圖。 FIG. 17 is a schematic plan view showing an operation example when processing a batch of substrates.

圖18為顯示處理複數批次的基板時之動作例的概略俯視圖。 FIG. 18 is a schematic plan view showing an operation example when processing multiple lots of substrates.

圖19為顯示第一槽與第二槽之變形例的概略俯視圖。 FIG. 19 is a schematic plan view showing a modified example of the first groove and the second groove.

圖20為從殼體的正面側觀看複數個化學模組時的立體圖。 FIG. 20 is a perspective view of a plurality of chemical modules viewed from the front side of the housing.

圖21為從殼體的背面側觀看複數個化學模組時的立體圖(匯集槽朝前視側抽出的狀態)。 FIG. 21 is a perspective view of a plurality of chemical modules when viewed from the back side of the casing (the collecting tank is drawn out toward the front side).

圖22為從殼體的背面側觀看複數個化學模組時的立體圖(匯集槽朝後視側抽出的狀態)。 FIG. 22 is a perspective view of a plurality of chemical modules when viewed from the back side of the casing (the collecting tank is drawn out toward the rear view side).

圖23為從側方觀看包含校平機構的基板處理單元時的概略圖。 FIG. 23 is a schematic view of the substrate processing unit including the leveling mechanism when viewed from the side.

圖24A為前視觀看藥液槽時的概略圖。 FIG. 24A is a schematic view of the chemical solution tank viewed from the front.

圖24B為前視觀看洗淨槽時的概略圖。 FIG. 24B is a schematic view of the washing tank when viewed from the front.

圖25為從側方觀看高度變更部時的概略放大圖。 Fig. 25 is a schematic enlarged view of the height changing portion when viewed from the side.

圖26為顯示球部和球承載部的縱剖面的概略放大圖。 Fig. 26 is a schematic enlarged view showing a longitudinal section of the ball portion and the ball receiving portion.

圖27為匯集槽的概略俯視圖(配置有藥液槽和洗淨槽的狀態)。 Fig. 27 is a schematic plan view of the collecting tank (a state in which a chemical tank and a washing tank are arranged).

圖28為匯集槽的概略俯視圖(未配置藥液槽和洗淨槽的狀態)。 Fig. 28 is a schematic plan view of the collecting tank (in a state where the chemical tank and the washing tank are not arranged).

圖29為顯示變形例的球部和球承載部的縱剖面的概略放大圖。 FIG. 29 is a schematic enlarged view showing a vertical cross-section of a ball portion and a ball receiving portion according to a modified example.

圖30為從側方觀看變形例之包含校平機構的基板處理單元時的概略圖。 FIG. 30 is a schematic view of a substrate processing unit including a leveling mechanism according to a modified example when viewed from the side.

圖31為從側方觀看變形例之包含校平機構的基板處理單元時的概略圖。 31 is a schematic view of a substrate processing unit including a leveling mechanism according to a modified example when viewed from the side.

圖32A為從側方觀看變形例之包含校平機構的基板處理單元時的概略圖。 32A is a schematic view of a substrate processing unit including a leveling mechanism according to a modified example when viewed from the side.

圖32B為從前視觀看變形例之包含校平機構的基板處理單元時的概略圖。 FIG. 32B is a schematic view of a substrate processing unit including a leveling mechanism according to a modified example when viewed from the front.

圖33為變形例的匯集槽的概略俯視圖。 Fig. 33 is a schematic plan view of a collection tank according to a modified example.

以下,參照圖式說明本發明的基板處理裝置1的實施型態。 Hereinafter, an embodiment of the substrate processing apparatus 1 of the present invention will be described with reference to the drawings.

在此,本說明書中,所謂「模組」係指經規格化而構成為可裝卸(可交換)的構成要素,並且,在使用時係以經彙整的一個構成單位來操作的構成要素。此外,所謂「第一方向」係指一對藥液槽及洗淨槽的排列方向,亦即基板處理裝置1的短邊方向(例如,前後方向、縱向)。此外,所謂「第二方向」係指與第一方向及上下方向交叉的方向,且為複數個模組連設的方向,亦即基板處理裝置1的長邊方向(例如,左右方向、橫向)。第一方向亦可稱為TD(Transverse Direction,橫向)方向,而第二方向亦可稱為MD(Machine Direction,機器方向)方向。圖式中,「第一方向」顯示為Y軸方向,「第二方向」顯示為X軸方向,「上下方向」顯示為Z軸方向。 第一方向、第二方向及上下方向係彼此交叉(例如正交)。 Here, in this specification, the so-called "module" refers to a standardized component that is detachable (interchangeable) and that is operated as an integrated unit during use. In addition, the so-called “first direction” refers to the arrangement direction of a pair of chemical solution tanks and cleaning tanks, that is, the short-side direction (for example, the front-rear direction, the longitudinal direction) of the substrate processing apparatus 1 . In addition, the so-called "second direction" refers to the direction that intersects the first direction and the up-down direction, and is the direction in which a plurality of modules are connected, that is, the long-side direction (for example, the left-right direction, the transverse direction) of the substrate processing apparatus 1 . The first direction can also be called TD (Transverse Direction, transverse direction), and the second direction can also be called MD (Machine Direction, machine direction) direction. In the figure, the "first direction" is shown as the Y-axis direction, the "second direction" is shown as the X-axis direction, and the "up-and-down direction" is shown as the Z-axis direction. The first direction, the second direction and the up-down direction cross each other (eg, are orthogonal).

〔實施型態〕 [Implementation type]

參照圖1至圖10,說明一實施型態的基板處理裝置1。圖1為說明一實施型態的基板處理裝置1的立體圖。圖2為說明圖1所示之基板處理裝置1的構成要素的立體圖。圖3為說明圖1所示之基板處理裝置1中的化學模組7的立體圖。圖4為說明圖1所示之基板處理裝置1中的第二搬運機構9的立體圖。圖5為說明圖3所示之化學模組7的主要部分的立體圖。圖6為說明圖1所示之基板處理裝置1中的搬出模組8的立體圖。圖7為說明圖1所示之基板處理裝置1中的搬入模組5的立體圖。圖8為說明圖3所示之化學模組7中的上下搬運部13的動作之圖。圖9為說明圖3所示 之化學模組7中的第一搬運部11的動作之圖。圖10為說明保持基板4的載具2之圖。圖11為說明圖1所示之基板處理裝置1中的乾燥模組6的立體圖。 Referring to FIGS. 1 to 10 , a substrate processing apparatus 1 according to an embodiment will be described. FIG. 1 is a perspective view illustrating a substrate processing apparatus 1 according to an embodiment. FIG. 2 is a perspective view illustrating the components of the substrate processing apparatus 1 shown in FIG. 1 . FIG. 3 is a perspective view illustrating the chemical module 7 in the substrate processing apparatus 1 shown in FIG. 1 . FIG. 4 is a perspective view illustrating the second transport mechanism 9 in the substrate processing apparatus 1 shown in FIG. 1 . FIG. 5 is a perspective view illustrating the main part of the chemical module 7 shown in FIG. 3 . FIG. 6 is a perspective view illustrating the unloading module 8 in the substrate processing apparatus 1 shown in FIG. 1 . FIG. 7 is a perspective view illustrating the loading module 5 in the substrate processing apparatus 1 shown in FIG. 1 . FIG. 8 is a diagram illustrating the operation of the vertical conveyance unit 13 in the chemical module 7 shown in FIG. 3 . Figure 9 illustrates what is shown in Figure 3 The operation diagram of the first conveying part 11 in the chemical module 7. FIG. 10 is a diagram illustrating the carrier 2 holding the substrate 4 . FIG. 11 is a perspective view illustrating the drying module 6 in the substrate processing apparatus 1 shown in FIG. 1 .

基板處理裝置1係至少具備一個用以對保持於載具2的複數片基板4實施各種處理的模組。基板4具體而言例如為半導體基板、液晶顯示裝置用玻璃基板、光罩用玻璃基板、光碟用基板、微電機系統(Micro Electro Mechanical Systems;MEMS)感測器基板、太陽電池用面板等。模組係具有經規格化的殼體20,且模組係構成為可沿第二方向(X軸方向,亦即基板處理裝置1的長邊方向,以下亦稱「第二方向」)裝卸(交換)。模組的上部係配設有風扇過濾單元24。風扇過濾單元24係具備風扇及過濾器,該風扇及過濾器係用以將無塵室內的空氣引入而送至模組內。風扇過濾單元24係於模組內的處理空間形成清淨空氣的下降氣流。亦可設置將無塵室內的清淨空氣引入的其他構成來取代配設風扇過濾單元24。 The substrate processing apparatus 1 is provided with at least one module for performing various processes on the plurality of substrates 4 held on the carrier 2 . Specifically, the substrate 4 is, for example, a semiconductor substrate, a glass substrate for a liquid crystal display device, a glass substrate for a photomask, an optical disc substrate, a Micro Electro Mechanical Systems (MEMS) sensor substrate, a solar cell panel, etc. The module has a standardized housing 20, and the module is configured to be attachable and detachable along the second direction (X-axis direction, that is, the long side direction of the substrate processing apparatus 1, also referred to as the "second direction" below) exchange). The upper part of the module is equipped with a fan filter unit 24. The fan filter unit 24 is equipped with a fan and a filter, and the fan and filter are used to introduce the air in the clean room and send it to the module. The fan filter unit 24 forms a downward airflow of clean air in the processing space within the module. Instead of providing the fan filter unit 24, other structures for introducing clean air into the clean room may be provided.

如圖1及圖2所示,基板處理裝置1例如具備:搬入模組5、乾燥模組6、化學模組7(基板處理模組)、搬出模組8、以及第二搬運機構9。搬入模組5、化學模組7、乾燥模組6及搬出模組8係沿第二方向鄰接配設。搬入模組5、化學模組7、乾燥模組6、及搬出模組8係構成為可沿第二方向裝卸地連結。藉此,可與處理程序的變更需求作靈活地應對,使擴充性提高。 As shown in FIGS. 1 and 2 , the substrate processing apparatus 1 includes, for example, a loading module 5 , a drying module 6 , a chemical module 7 (substrate processing module), an unloading module 8 , and a second transport mechanism 9 . The loading module 5, the chemical module 7, the drying module 6, and the carrying module 8 are arranged adjacent to each other along the second direction. The loading module 5, the chemical module 7, the drying module 6, and the carrying module 8 are configured to be removably connected in the second direction. This makes it possible to flexibly respond to changes in processing procedures and improve scalability.

第二搬運機構9係沿第二方向延伸,且沿第二方向搬運圖10所示之保持複數片基板4的載具2。第二搬運機構9係配設於搬入模組5、 化學模組7、乾燥模組6、及搬出模組8中的第一方向(Y軸方向,基板處理裝置1的短邊方向,以下亦稱「第一方向」)之後方側的上部。 The second conveying mechanism 9 extends along the second direction, and conveys the carrier 2 holding the plurality of substrates 4 shown in FIG. 10 along the second direction. The second conveying mechanism 9 is arranged in the loading module 5, The upper part on the rear side of the chemical module 7 , the drying module 6 , and the unloading module 8 in the first direction (the Y-axis direction, the short side direction of the substrate processing apparatus 1 , also referred to as the “first direction” below).

基板處理裝置1係具有未圖示的控制部。控制部係例如進行基板處理裝置1的各要素的動作控制及資料演算。控制部係例如具有CPU(Central Processing Unit,中央處單元)、RAM(Random Access Memory,隨機存取記憶體)、及ROM(Read Only Memory,唯讀記憶體)。CPU係根據儲存於ROM的程式執行控制(例如,藉由第一搬運部11、上下搬運部13及第二搬運部48進行之載具2的搬運動作等控制)。 The substrate processing apparatus 1 has a control unit (not shown). The control unit performs, for example, operation control and data calculation of each element of the substrate processing apparatus 1 . The control unit includes, for example, a CPU (Central Processing Unit), a RAM (Random Access Memory), and a ROM (Read Only Memory). The CPU executes control (for example, control of the transportation operation of the carrier 2 by the first transportation part 11, the up-and-down transportation part 13, and the second transportation part 48) based on the program stored in the ROM.

搬入模組5中,以載具2為一個單位將處理前的基板4搬入裝置內。乾燥模組6中,以載具2為一個單位來執行例如藉由IPA(異丙醇)等進行之基板4的蒸氣乾燥。化學模組7中,以載具2為一個單位來執行基板4的洗淨處理。搬出模組8中,以載具2為一個單位將洗淨處理後的基板4搬出裝置外。 In the loading module 5, the substrate 4 before processing is loaded into the apparatus with the carrier 2 as a unit. In the drying module 6 , the substrate 4 is vapor-dried using, for example, IPA (isopropyl alcohol), with the carrier 2 as a unit. In the chemical module 7 , the cleaning process of the substrate 4 is performed with the carrier 2 as a unit. In the unloading module 8, the cleaned substrate 4 is carried out of the device with the carrier 2 as a unit.

搬入模組5亦稱為裝載部,且該搬入模組5係配設於基板處理裝置1的第二方向的上游側。如圖7所示,搬入模組5係在其殼體20的第二方向的上游側的側面具有構成為可開閉的搬入部26。載具2係經由搬入部26搬入至搬入模組5的內部。搬入至搬入模組5的內部的載具2係被載置於載置台22。搬入模組5的內部中,藉由第一搬運部11以臂16來進行載具2的第一方向的搬運,並藉由上下搬運部13以臂16來進行載具2的上下方向的搬運。第一搬運部11的第一致動器12係較載置台22的載置面配置於側方下部。上下搬運部13的上下致動器14亦較載置台22的載置面配置於側方下部。亦即,由於來自風扇過濾單元24的下降氣流與臂16 的臂長,被載置於載置台22的載具2被隔離成為不受第一致動器12及上下致動器14的影響。藉此,可抑制第一致動器12及上下致動器14產生的微粒所致之搬入模組5內的載具2的汙染。 The load-in module 5 is also called a loader, and is disposed on the upstream side of the substrate processing apparatus 1 in the second direction. As shown in FIG. 7 , the load-in module 5 has a load-in portion 26 configured to be openable and closable on the side surface of the housing 20 on the upstream side in the second direction. The carrier 2 is loaded into the inside of the loading module 5 via the loading part 26 . The carrier 2 loaded into the loading module 5 is placed on the mounting table 22 . Inside the loading module 5 , the carrier 2 is transported in the first direction by the arm 16 of the first transport unit 11 , and the carrier 2 is transported in the vertical direction by the arm 16 of the vertical transport unit 13 . . The first actuator 12 of the first conveyance unit 11 is arranged laterally and lower than the mounting surface of the mounting table 22 . The vertical actuator 14 of the vertical conveyance part 13 is also arranged laterally lower than the mounting surface of the mounting table 22 . That is, due to the downward airflow from the fan filter unit 24 and the arm 16 The arm length of the carrier 2 placed on the mounting table 22 is isolated from the influence of the first actuator 12 and the up and down actuator 14 . Thereby, contamination of the carrier 2 carried into the module 5 due to particles generated by the first actuator 12 and the up-and-down actuator 14 can be suppressed.

搬出模組8亦稱為卸載部,且該搬出模組8係配置於基板處理裝置1的第二方向的下游側。如圖6所示,被搬入至搬出模組8的內部的載具2係被載置於載置台22。搬出模組8的內部中,藉由第一搬運部11以臂16來進行載具2的第一方向的搬運,並藉由上下搬運部13以臂16來進行載具2的上下方向的搬運。第一搬運部11的第一致動器12係較載置台22的載置面配置於側方下部。上下搬運部13的上下致動器14亦較載置台22的載置面配置於側方下部。亦即,由於來自風扇過濾單元24的下降氣流與臂16的臂長度,被載置於載置台22的載具2被隔離成為不受第一致動器12及上下致動器14的影響。藉此,可抑制第一致動器12及上下致動器14產生的微粒所致之搬出模組8內的載具2的汙染。搬出模組8係在其殼體20的第二方向的下游側的側面具有構成為可開閉的搬出部27。載具2係經由搬出部27被搬出至搬出模組8的外部,亦即被搬出基板處理裝置1的外部。 The unloading module 8 is also called an unloading unit, and is arranged on the downstream side of the substrate processing apparatus 1 in the second direction. As shown in FIG. 6 , the carrier 2 carried into the unloading module 8 is placed on the mounting table 22 . Inside the unloading module 8 , the carrier 2 is transported in the first direction by the arm 16 of the first transport unit 11 , and the carrier 2 is transported in the vertical direction by the arm 16 of the vertical transport unit 13 . . The first actuator 12 of the first conveyance unit 11 is arranged laterally and lower than the mounting surface of the mounting table 22 . The vertical actuator 14 of the vertical conveyance part 13 is also arranged laterally lower than the mounting surface of the mounting table 22 . That is, due to the downward airflow from the fan filter unit 24 and the arm length of the arm 16 , the carrier 2 placed on the mounting table 22 is isolated from the influence of the first actuator 12 and the up and down actuator 14 . This can prevent the carrier 2 in the unloading module 8 from being contaminated by particles generated by the first actuator 12 and the upper and lower actuators 14 . The unloading module 8 has an unloading portion 27 configured to be openable and closable on the side surface of the housing 20 on the downstream side in the second direction. The carrier 2 is carried out to the outside of the carry-out module 8 via the carry-out part 27 , that is, out of the substrate processing apparatus 1 .

另外,上述態樣中,載具2係沿著第二方向從搬入模組5向搬出模組8朝一方向搬運,惟亦可為其他的態樣。例如,基板處理裝置1可僅具備搬入模組5或搬出模組8中的任一方,而搬入模組5具有裝載及卸載之雙方的功能,或是搬出模組8具有裝載及卸載之雙方的功能。此時,載具2係沿著第二方向朝一方向及另一方向的兩方向搬運(亦即,沿著第二方向往復搬運)。 In addition, in the above aspect, the carrier 2 is transported in one direction from the loading module 5 to the carrying out module 8 along the second direction, but other aspects are also possible. For example, the substrate processing apparatus 1 may have only either the loading module 5 or the carrying module 8, and the loading module 5 may have both loading and unloading functions, or the carrying module 8 may have both loading and unloading functions. Function. At this time, the carrier 2 is conveyed in both directions, one direction and the other, along the second direction (that is, reciprocated along the second direction).

基板處理裝置1係至少具有一個乾燥模組6。如圖1所示,乾燥模組6例如設置於化學模組7與搬出模組8之間。 The substrate processing device 1 has at least one drying module 6 . As shown in FIG. 1 , the drying module 6 is provided between the chemical module 7 and the unloading module 8 , for example.

如圖11所示,乾燥模組6例如與其他的模組5、7、8同樣地具有沿著第一方向搬運載具2的第一搬運部11以及沿著上下方向搬運載具2的上下搬運部13。第一搬運部11係具有第一致動器12,而上下搬運部13係具有上下致動器14。 As shown in FIG. 11 , for example, the drying module 6 has a first conveying part 11 for conveying the carrier 2 in the first direction and an upper and lower portion for conveying the carrier 2 in the up and down direction, like the other modules 5 , 7 , and 8 . Transport Department 13. The first conveying part 11 has a first actuator 12 , and the up-and-down conveying part 13 has an up-and-down actuator 14 .

乾燥模組6係具有乾燥腔31。乾燥腔31例如配設於乾燥模組6中之第一方向的前方側。藉由化學模組7進行各種的藥液洗淨、蝕刻、阻劑剝離等各種藥液處理之後,於乾燥腔31中進行使基板4乾燥的乾燥處理。乾燥模組6中,藉由上下搬運部13以臂16相對於乾燥腔31上下方向搬運保持基板4的載具2。第一致動器12及上下致動器14係在乾燥腔31的側方下部,與乾燥腔31分離而配置。因此,乾燥腔31被隔離成為不受第一致動器12及上下致動器14的影響。 The drying module 6 has a drying cavity 31 . The drying chamber 31 is, for example, disposed on the front side in the first direction of the drying module 6 . After various chemical liquid treatments such as chemical cleaning, etching, and resist stripping are performed by the chemical module 7 , a drying process is performed to dry the substrate 4 in the drying chamber 31 . In the drying module 6 , the carrier 2 holding the substrate 4 is transported in the vertical direction with respect to the drying chamber 31 by the arm 16 via the vertical transport part 13 . The first actuator 12 and the upper and lower actuators 14 are located at the lower side of the drying chamber 31 and are arranged separately from the drying chamber 31 . Therefore, the drying chamber 31 is isolated from the influence of the first actuator 12 and the upper and lower actuators 14 .

上述乾燥處理可使用通常習知的乾燥方法。具體而言,例如可採用利用馬蘭哥尼(Marangoni)效應之稱為IMD(IPA Mist Dryer)的乾燥方法。此乾燥方法係將保持基板4的載具2浸漬於乾燥腔31中所設的純水槽內,且對於其水面連續地供給IPA的微粒霧滴(mist)或蒸氣化的IPA,並且於使基板4上升或下降或者使水面漲高或降低之際,利用發生於通過水面之基板4之表面的表面張力之差進行乾燥。 A commonly known drying method can be used for the above-mentioned drying treatment. Specifically, for example, a drying method called IMD (IPA Mist Dryer) utilizing the Marangoni effect can be used. In this drying method, the carrier 2 holding the substrate 4 is immersed in a pure water tank provided in the drying chamber 31, and the fine particle mist of IPA or vaporized IPA is continuously supplied to the water surface, and the substrate is When the substrate 4 is raised or lowered or the water surface is raised or lowered, the difference in surface tension generated on the surface of the substrate 4 passing through the water surface is used for drying.

此外,就其他的乾燥方法而言,例如可使用藉由離心力進行乾燥之稱為Spin Dryer的乾燥方法。此乾燥方法係將保持基板4的載具2 設於乾燥腔31內所設的轉子,且藉由保定器等保持裝置將載具2及基板4固定之後,利用轉子旋轉所產生的離心力進行乾燥。 In addition, as another drying method, for example, a drying method called Spin Dryer that performs drying by centrifugal force can be used. This drying method is to hold the carrier 2 of the substrate 4 A rotor is installed in the drying chamber 31, and after the carrier 2 and the substrate 4 are fixed by a retainer or other holding device, the centrifugal force generated by the rotation of the rotor is used for drying.

此外,就其他的乾燥方法而言,例如可使用藉由蒸氣洗淨進行乾燥之稱為Vapor Dryer的乾燥方法。此乾燥方法係使乾燥腔31內充滿蒸發潛熱較小的溶媒(例如,IPA)經加熱而成為的飽和蒸氣,且將保持溫度低於其蒸氣溫度之基板4的載具2設於乾燥腔31,藉由於基板4之表面冷凝液化的IPA來洗淨載具2及基板4的表面,並且在載具2及基板4的溫度成為與IPA蒸氣相同的溫度時,使冷凝於載具2及基板4之表面的IPA的冷凝液化停止,使載具2及基板4乾燥。 In addition, as another drying method, for example, a drying method called Vapor Dryer that performs drying by steam cleaning can be used. This drying method is to fill the drying chamber 31 with saturated vapor that is heated from a solvent with a small latent heat of evaporation (for example, IPA), and to place the carrier 2 of the substrate 4 whose temperature is lower than its vapor temperature in the drying chamber 31 , by condensing the liquefied IPA on the surface of the substrate 4 to clean the surfaces of the carrier 2 and the substrate 4, and when the temperature of the carrier 2 and the substrate 4 becomes the same temperature as the IPA vapor, condense on the carrier 2 and the substrate The condensation and liquefaction of the IPA on the surface of 4 stops, and the carrier 2 and the substrate 4 are dried.

再者,就其他的乾燥方法而言,亦可使用以N2進行之N2吹拂乾燥等。不論是何種乾燥方法,乾燥腔31均被隔離成為不受搬運保持基板4之載具2的上下致動器14、第一致動器12等的影響。藉此,可抑制上下致動器14、第一致動器12等產生的微粒所致之乾燥模組6內的汙染。另外,第一致動器12及上下致動器14亦可在乾燥腔31的第一方向的後方側的下部與乾燥腔31分離而配置。此外,若僅進行上下方向的搬運時,乾燥模組6亦可不具備第一搬運部11。 Furthermore, for other drying methods, N 2 blow drying using N 2 can also be used. Regardless of the drying method, the drying chamber 31 is isolated so as not to be affected by the upper and lower actuators 14 , the first actuator 12 , etc. of the carrier 2 that transports and holds the substrate 4 . Thereby, contamination in the drying module 6 caused by particles generated by the upper and lower actuators 14, the first actuator 12, etc. can be suppressed. In addition, the first actuator 12 and the up-and-down actuator 14 may be arranged separately from the drying chamber 31 at a lower portion of the drying chamber 31 on the rear side in the first direction. In addition, if only the vertical transportation is performed, the drying module 6 does not need to include the first transportation part 11 .

化學模組7係至少具有一個模組。如圖1及圖2所示,化學模組7係例如具有:第一化學模組7a、第二化學模組7b、第三化學模組7c及第四化學模組7d。化學模組7中,係進行APM(ammonium hydroxide-hydrogen peroxide mixture、氨水、過氧化氫混合物)洗淨、SPM(sulfuric acid-hydrogen peroxide mixture、硫酸、過氧化氫水混合物)洗淨、HPM(hydrochloric acid-hydrogen peroxide mixture,鹽酸、過氧化氫混合物)、 DHF(diluted hydrofluoric acid,稀氫氟酸)洗淨等各種藥液洗淨、蝕刻、阻劑剝離等各種的藥液處理。此等藥液處理可依據要對於基板4進行之藥液處理的種類而任意地組合。各化學模組7a、7b、7c、7d係構成為可於第二方向裝卸地連結。藉此,可與處理程序的變更需求作靈活地應對,使擴充性提高。 Chemistry Module 7 series has at least one module. As shown in FIGS. 1 and 2 , the chemical module 7 includes, for example, a first chemical module 7a, a second chemical module 7b, a third chemical module 7c, and a fourth chemical module 7d. In the chemical module 7, APM (ammonium hydroxide-hydrogen peroxide mixture, ammonia water, hydrogen peroxide mixture) cleaning, SPM (sulfuric acid-hydrogen peroxide mixture, sulfuric acid, hydrogen peroxide water mixture) cleaning, HPM (hydrochloric water mixture) are performed. acid-hydrogen peroxide mixture, hydrochloric acid, hydrogen peroxide mixture), Various chemical liquid cleaning such as DHF (dilute hydrofluoric acid) cleaning, etching, resist stripping and other chemical liquid treatments. These chemical liquid treatments can be arbitrarily combined depending on the type of chemical liquid treatment to be performed on the substrate 4 . Each of the chemical modules 7a, 7b, 7c, and 7d is configured to be detachably connected in the second direction. This makes it possible to flexibly respond to changes in processing procedures and improve scalability.

如圖3、圖5及圖9所示,化學模組7係具有進行藥液洗淨的藥液槽32(第二槽)以及進行純水洗淨(清洗)的洗淨槽34(第一槽)。藥液槽32係配設於第一方向的後方側,而洗淨槽34係配設於第一方向的前方側。亦即,藥液槽32及洗淨槽34係沿著第一方向排列。藉此,可使化學模組7的第二方向的寬度變窄而可使基板處理裝置1小型化。在此,亦可為藥液槽32配設於第一方向的前方側,並且洗淨槽34配設於第一方向的後方側的構成。此外,由於用以排放由藥液槽32產生之藥液蒸氣的共通排氣管道29可配設於第一方向的後方側,故基板處理裝置1的維護變得容易。藥液槽32係用於積存上述各種藥液。洗淨槽34係用於積存純水。藥液槽32例如具有用於使載具2浸漬於藥液的內槽以及用於回收從內槽上端溢流的藥液的外槽。藥液槽32的開口部係於和載具2之搬運動作無關的時機,藉由蓋子來關閉。 As shown in FIGS. 3 , 5 and 9 , the chemical module 7 has a chemical solution tank 32 (second tank) for cleaning the chemical solution and a washing tank 34 (first tank) for cleaning (cleaning) with pure water. groove). The chemical solution tank 32 is arranged on the rear side in the first direction, and the cleaning tank 34 is arranged on the front side in the first direction. That is, the chemical solution tank 32 and the cleaning tank 34 are arranged along the first direction. Thereby, the width of the chemical module 7 in the second direction can be narrowed, and the substrate processing apparatus 1 can be miniaturized. Here, the chemical solution tank 32 may be arranged on the front side in the first direction, and the cleaning tank 34 may be arranged on the rear side in the first direction. In addition, since the common exhaust duct 29 for discharging the chemical solution vapor generated in the chemical solution tank 32 can be arranged on the rear side in the first direction, maintenance of the substrate processing apparatus 1 becomes easy. The chemical liquid tank 32 is used to store the various chemical liquids mentioned above. The washing tank 34 is used to store pure water. The chemical solution tank 32 has, for example, an inner tank for immersing the carrier 2 in the chemical solution and an outer tank for recovering the chemical solution that overflows from the upper end of the inner tank. The opening of the chemical solution tank 32 is closed by a lid at a timing independent of the transport operation of the carrier 2 .

藥液槽32的第二方向之側方係設有兩個側方壁37、37。亦即,藥液槽32的第二方向之側方係藉由側方壁37來分隔。藉此,可抑制鄰近位置之化學模組7的藥液槽32所積存之藥液的氣態環境所致之汙染。並且,藥液槽32的第一方向之後方係設有後方壁38。從上下方向觀看時,藥液槽32係藉由兩個側方壁37、37及後方壁38包圍成U字狀。 Two side walls 37, 37 are provided on the sides of the chemical liquid tank 32 in the second direction. That is, the sides of the chemical solution tank 32 in the second direction are separated by the side walls 37 . Thereby, the contamination caused by the gaseous environment of the chemical solution accumulated in the chemical solution tank 32 of the chemical module 7 located nearby can be suppressed. Furthermore, a rear wall 38 is provided behind the chemical solution tank 32 in the first direction. When viewed from the up and down direction, the chemical solution tank 32 is surrounded by two side walls 37 and 37 and a rear wall 38 to form a U shape.

例如,可於藥液槽32的側方上部分別配設具有側方排氣口36a的兩個側方排氣管道36、36。兩個側方排氣口36a、36a係稍低於藥液槽32的開口部但大致位於相同高度。後方壁38係配設有後方排氣管道39(圖示於圖9)的後方排氣口39a。兩個側方排氣管道36、36以及後方排氣管道39係從共通排氣管道29分歧而連接於共通排氣管道29。後方排氣口39a係比藥液槽32的開口部位於上方。如此,於前述藥液槽32的周圍配設用以排放藥液槽32所蒸發之藥液蒸氣的側方排氣口36a及後方排氣口39a。藉此,可抑制藥液槽32產生的藥液蒸氣擴散至化學模組7內的處理空間,而可抑制要在化學模組7內之處理空間搬運之基板4的汙染。 For example, two side exhaust pipes 36 and 36 each having a side exhaust port 36a may be provided on the upper side of the chemical tank 32 . The two side exhaust ports 36a, 36a are slightly lower than the opening of the chemical tank 32 but located at approximately the same height. The rear wall 38 is provided with a rear exhaust port 39a of a rear exhaust duct 39 (shown in FIG. 9). The two side exhaust ducts 36 and 36 and the rear exhaust duct 39 are branched from the common exhaust duct 29 and connected to the common exhaust duct 29 . The rear exhaust port 39a is located above the opening of the chemical tank 32 . In this way, side exhaust ports 36 a and rear exhaust ports 39 a for discharging the chemical vapor evaporated from the chemical solution tank 32 are provided around the chemical solution tank 32 . Thereby, the chemical solution vapor generated in the chemical solution tank 32 can be suppressed from diffusing into the processing space in the chemical module 7 , and contamination of the substrate 4 to be transported in the processing space in the chemical module 7 can be suppressed.

各化學模組7係具有沿著第一方向搬運載具2的第一搬運部11以及沿著上下方向搬運載具2的上下搬運部13。上下搬運部13係具有上下致動器14。載具2係被倒U字狀之臂16之一端側所設的托架18支持。另外,載具2的上部係具有凸緣部3,且如後所述,載具2可藉由第二搬運部48的夾具部44而對於凸緣部3進行夾放自如的夾持。此外,載具2的凸緣部3亦可構成為由托架18來支持。此外,臂16亦可具有D字形狀。 Each chemical module 7 has a first conveyance part 11 that conveys the carrier 2 in the first direction, and an up-and-down conveyance part 13 that conveys the carrier 2 in the up-and-down direction. The vertical conveyance part 13 has a vertical actuator 14. The carrier 2 is supported by a bracket 18 provided on one end side of the inverted U-shaped arm 16 . In addition, the upper portion of the carrier 2 has a flange portion 3, and as will be described later, the carrier 2 can freely clamp the flange portion 3 by the clamp portion 44 of the second conveyance portion 48. In addition, the flange portion 3 of the carrier 2 may be supported by the bracket 18 . In addition, the arm 16 may have a D-shape.

臂16的另一端側係安裝於上下致動器14。上下致動器14為電動的線性致動器,例如具有使臂16移動的螺桿軸、使該螺桿軸旋轉的馬達、電源、以及進行馬達的控制的控制部。載具2位於藥液槽32或洗淨槽34的正上方的狀態下,藉由上下致動器14使臂16往下方移動時,會將保持複數片基板4的載具2浸漬於藥液槽32的藥液或洗淨槽34的洗淨液。載具2在浸漬於藥液或洗淨液的狀態下,藉由上下致動器14使臂16往上 方移動時,會將保持複數片基板4的載具2從藥液或洗淨液提起。因此,載具2位於藥液槽32或洗淨槽34的正上方的狀態下,藉由上下致動器14使臂16沿著上下方向移動時,保持複數片基板4的載具2係相對於藥液槽32的藥液或洗淨槽34的洗淨液被提起或浸漬於藥液槽32的藥液或洗淨槽34的洗淨液。 The other end of the arm 16 is mounted on the upper and lower actuators 14 . The vertical actuator 14 is an electric linear actuator and has, for example, a screw shaft that moves the arm 16, a motor that rotates the screw shaft, a power source, and a control unit that controls the motor. With the carrier 2 positioned directly above the chemical solution tank 32 or the cleaning tank 34, when the arm 16 is moved downward by the up and down actuator 14, the carrier 2 holding the plurality of substrates 4 will be immersed in the chemical solution. The chemical solution in the tank 32 or the cleaning fluid in the cleaning tank 34. When the carrier 2 is immersed in the chemical solution or cleaning fluid, the arm 16 is moved upward by the up and down actuator 14 When moving, the carrier 2 holding a plurality of substrates 4 will be lifted up from the chemical solution or cleaning solution. Therefore, when the arm 16 is moved in the up and down direction by the up and down actuator 14 in a state where the carrier 2 is located directly above the chemical tank 32 or the cleaning tank 34, the carrier 2 holding the plurality of substrates 4 faces each other. The chemical liquid in the chemical liquid tank 32 or the cleaning liquid in the cleaning tank 34 is lifted up or immersed in the chemical liquid in the chemical liquid tank 32 or the cleaning liquid in the cleaning tank 34 .

第一搬運部11係具有第一致動器12。上下致動器14係安裝於第一致動器12。第一致動器12為電動的線性致動器,例如具有使上下致動器14移動的螺桿軸、使該螺桿軸旋轉的馬達、電源以及進行馬達的控制的控制部。臂16已移動到上方的狀態下,藉由第一致動器12使臂16朝第一方向的後方側移動時,保持複數片基板4的載具2係被搬運至藥液槽32的正上方。臂16定位於拉起位置的狀態下,藉由第一致動器12使臂16朝第一方向的前方側移動時,保持複數片基板4的載具2係被搬運至洗淨槽34的正上方。因此,臂16定位於拉起位置的狀態下,藉由第一致動器12使臂16沿著第一方向移動時,保持複數片基板4的載具2係被搬運於藥液槽32的正上方與洗淨槽34的正上方之間。 The first conveyance part 11 has a first actuator 12 . The upper and lower actuators 14 are installed on the first actuator 12 . The first actuator 12 is an electric linear actuator and has, for example, a screw shaft that moves the vertical actuator 14 , a motor that rotates the screw shaft, a power source, and a control unit that controls the motor. In a state where the arm 16 has moved upward, when the first actuator 12 moves the arm 16 toward the rear side in the first direction, the carrier 2 holding the plurality of substrates 4 is transported to the front of the chemical solution tank 32 above. With the arm 16 positioned at the pulled-up position, when the first actuator 12 moves the arm 16 toward the front side in the first direction, the carrier 2 holding the plurality of substrates 4 is transported to the cleaning tank 34 Directly above. Therefore, when the arm 16 is positioned in the pulled-up position and the first actuator 12 moves the arm 16 in the first direction, the carrier 2 holding the plurality of substrates 4 is transported to the chemical solution tank 32 Between directly above and directly above the washing tank 34.

第一致動器12及上下致動器14係隔著側方排氣管道36而較藥液槽32的開口部配置於靠外側且配置於側方下部。亦即,藉由來自風扇過濾單元24的下降氣流與側方排氣管道36的排氣,藥液槽32及洗淨槽34被隔離成為不受第一致動器12及上下致動器14的影響。藉此,可確保第一致動器12及上下致動器14與藥液槽32之開口部之間具有較大的分離距離,而可抑制第一致動器12及上下致動器14產生的微粒所致之化 學模組7內的汙染。另外,亦可為未設置兩個側方排氣管道36、36而僅利用後方排氣管道39來排氣的構成。 The first actuator 12 and the up-and-down actuator 14 are arranged on the outside of the opening of the chemical tank 32 and on the lower side of the side exhaust duct 36 . That is, by the downward airflow from the fan filter unit 24 and the exhaust from the side exhaust duct 36 , the chemical tank 32 and the washing tank 34 are isolated from the first actuator 12 and the upper and lower actuators 14 influence. Thereby, a larger separation distance can be ensured between the first actuator 12 and the upper and lower actuators 14 and the opening of the liquid tank 32 , thereby suppressing the generation of the first actuator 12 and the upper and lower actuators 14 . caused by particles Learn about pollution in Module 7. Alternatively, the two side exhaust ducts 36 and 36 may not be provided and only the rear exhaust duct 39 may be used for exhaust.

接著,參照圖1、圖2、圖4、圖8及圖9,說明第二搬運機構9。 Next, the second conveyance mechanism 9 will be described with reference to FIGS. 1 , 2 , 4 , 8 and 9 .

如圖1所示,第二搬運機構9係配置於搬入模組5、化學模組7、乾燥模組6、以及搬出模組8的第一方向的後方側的上部。如圖4所示,第二搬運機構9例如具有於第二方向連結複數個第二搬運收容部40及第二致動器41的構成。第二搬運收容部40例如分別構成搬入模組5、化學模組7、乾燥模組6及搬出模組8之各殼體20的一部分。亦即,第二搬運收容部40係與殼體20一體地構成。此外,第二搬運收容部40亦可構成為獨立的箱狀構件。圖2及圖4中,為了便於理解第二搬運收容部40的構成,以第二搬運收容部40與殼體20分離的態樣來圖示,惟第二搬運收容部40亦可為構成殼體20的一部分的一體成形物,或構成為獨立構件。第二搬運收容部40及第二致動器41係構成為可於第二方向裝卸地連結。 As shown in FIG. 1 , the second transport mechanism 9 is disposed above the rear side of the import module 5 , the chemical module 7 , the drying module 6 , and the unload module 8 in the first direction. As shown in FIG. 4 , for example, the second conveyance mechanism 9 has a structure in which a plurality of second conveyance accommodating parts 40 and second actuators 41 are connected in the second direction. The second transport accommodating part 40 constitutes, for example, a part of each housing 20 of the loading module 5 , the chemical module 7 , the drying module 6 , and the unloading module 8 . That is, the second transportation and accommodating part 40 is configured integrally with the casing 20 . In addition, the second transportation and accommodating part 40 may be configured as an independent box-shaped member. In FIGS. 2 and 4 , in order to facilitate understanding of the structure of the second transportation and accommodating part 40 , the second transportation and accommodating part 40 is shown in a state of being separated from the housing 20 . However, the second transportation and accommodating part 40 may also constitute a shell. It may be an integrally formed part of the body 20 or constitute an independent component. The second transport accommodating part 40 and the second actuator 41 are configured to be detachably connected in the second direction.

如圖4所示,第二搬運機構9係具有複數個第二搬運收容部40及至少一個第二搬運部48。第二搬運機構9中所配設之第二搬運部48的數量可對應於要連結之第二搬運收容部40的數量而適當地增減。第二搬運部48係具有第二致動器41。第二致動器41係收容於第二搬運收容部40之中。第一致動器12及上下致動器14係收容於化學模組7之中,並且第二致動器41係收容於第二搬運收容部40之中。藉此,由於第一致動器12及上下致動器14與第二致動器41係個別地收容,所以可抑制化學模組7內的汙染。 As shown in FIG. 4 , the second conveyance mechanism 9 has a plurality of second conveyance receiving parts 40 and at least one second conveyance part 48 . The number of second conveyance parts 48 provided in the second conveyance mechanism 9 can be appropriately increased or decreased in accordance with the number of second conveyance accommodating parts 40 to be connected. The second conveying part 48 has a second actuator 41 . The second actuator 41 is accommodated in the second transport accommodating part 40 . The first actuator 12 and the up and down actuator 14 are accommodated in the chemical module 7 , and the second actuator 41 is accommodated in the second transport accommodation part 40 . Thereby, since the first actuator 12 , the up-and-down actuator 14 and the second actuator 41 are housed separately, contamination in the chemical module 7 can be suppressed.

第二致動器41例如為電動的線性致動器。第二致動器41例如為齒條與小齒輪之組合,具有刻設有齒的齒條之平板狀的導引部、稱為小齒輪的圓形齒輪、使圓形齒輪旋轉的馬達、電源、以及進行馬達的控制的控制部。平板狀的導引部係具有複數個導引片,複數個導引片可構成為可於第二方向裝卸地連結複數個導引片。 The second actuator 41 is, for example, an electric linear actuator. The second actuator 41 is, for example, a combination of a rack and a pinion, and has a flat guide portion of the rack in which teeth are engraved, a circular gear called a pinion, a motor for rotating the circular gear, and a power supply. , and a control unit that controls the motor. The flat guide portion has a plurality of guide pieces, and the plurality of guide pieces can be configured to be detachably connected in the second direction.

如圖9所示,第二搬運部48係具有旋轉致動器42,該旋轉致動器42係經由連桿部46而與第二致動器41連接。旋轉致動器42例如為電動的旋轉致動器,具有:使兩個旋動臂部43、43旋轉的馬達、電源、以及進行馬達的控制的控制部。旋轉致動器42亦可為利用油壓或空氣壓來驅動的致動器。第二致動器41與藥液槽32之間係藉由後方壁38而被分隔。藉此,可抑制第二致動器41所引起之化學模組7內的汙染。 As shown in FIG. 9 , the second conveyance part 48 has a rotation actuator 42 connected to the second actuator 41 via a link part 46 . The rotation actuator 42 is, for example, an electric rotation actuator, and includes a motor for rotating the two rotation arms 43 and 43, a power source, and a control unit for controlling the motor. The rotary actuator 42 may also be an actuator driven by oil pressure or air pressure. The second actuator 41 and the chemical tank 32 are separated by the rear wall 38 . Thereby, contamination in the chemical module 7 caused by the second actuator 41 can be suppressed.

旋動臂部43係通過形成於後方壁38的開口38a而沿第一方向延伸。旋動臂部43係通過形成於側方壁37的間隙37a而可沿第二方向移動。旋動臂部43的前方側係配設有夾具部44。夾具部44係構成為位於洗淨槽34的正上方。藉此,可抑制夾具部44所夾持之載具2在不同種類的藥液槽32之上搬運所引起之化學模組7內的汙染。 The swing arm 43 extends in the first direction through the opening 38 a formed in the rear wall 38 . The swing arm 43 is movable in the second direction through the gap 37 a formed in the side wall 37 . A clamp portion 44 is provided on the front side of the swing arm portion 43 . The clamp portion 44 is located directly above the washing tank 34 . Thereby, contamination in the chemical module 7 caused by the carrier 2 clamped by the clamp portion 44 being transported on different types of chemical solution tanks 32 can be suppressed.

從側面觀看時(亦即,從第二方向觀看),夾具部44係具有U字形狀。兩個夾具部44、44係因旋動臂部43旋動而從兩側夾入載具2的凸緣部3,藉此夾持載具2的凸緣部3。兩個夾具部44、44係藉由朝彼此分離的方向旋動而解除載具2的凸緣部3的夾持。因此,兩個夾具部44、44可對於載具2的凸緣部3進行夾放。 When viewed from the side (that is, viewed from the second direction), the clamp portion 44 has a U-shape. The two clamp parts 44 and 44 clamp the flange part 3 of the carrier 2 from both sides due to the rotation of the swing arm part 43, thereby clamping the flange part 3 of the carrier 2. The two clamp parts 44 and 44 are rotated in directions away from each other to release the clamping of the flange part 3 of the carrier 2 . Therefore, the two clamp parts 44 and 44 can clamp the flange part 3 of the carrier 2 .

第二致動器41係收容於第二搬運收容部40之中,所以藥液槽32及洗淨槽34被隔離成為不受第二致動器41的影響。亦即,第二致動器41係與藥液槽32及洗淨槽34隔離。藉此,可抑制第二致動器41產生的微粒所致之汙染。 The second actuator 41 is accommodated in the second transport accommodating part 40, so the chemical tank 32 and the washing tank 34 are isolated from the influence of the second actuator 41. That is, the second actuator 41 is isolated from the chemical solution tank 32 and the cleaning tank 34 . Thereby, contamination caused by particles generated by the second actuator 41 can be suppressed.

以上已說明了本發明之具體的實施型態、數值等,惟本發明不限於上述實施型態,在本發明的範圍內可進行各種的變更而實施。 The specific embodiments, numerical values, etc. of the present invention have been described above. However, the present invention is not limited to the above-described embodiments and can be implemented with various changes within the scope of the present invention.

例如,上述的實施型態中,第一致動器12及上下致動器14係配置於側方下部(第二方向下部),惟亦可因應需要而配置於第一方向側。 For example, in the above-mentioned embodiment, the first actuator 12 and the up-and-down actuator 14 are disposed at the lower part of the side (the lower part in the second direction), but they may also be disposed on the first direction side as needed.

基板處理裝置1的模組的數量及組合可因應需要而適當地設計,例如,可將化學模組7與乾燥模組6交替地配置。 The number and combination of modules of the substrate processing apparatus 1 can be appropriately designed according to needs. For example, the chemical module 7 and the drying module 6 can be arranged alternately.

彙整本發明及實施型態時,則成為如下所述者。 The present invention and its embodiments are summarized as follows.

本發明的一態樣的基板處理裝置1係具備化學模組7,該化學模組7係具有藥液槽32及洗淨槽34,該藥液槽32係以藥液處理保持於載具2的基板4,該洗淨槽34係洗淨保持於前述載具2的前述基板4; A substrate processing apparatus 1 according to one aspect of the present invention is provided with a chemical module 7. The chemical module 7 has a chemical solution tank 32 and a cleaning tank 34. The chemical solution tank 32 is held on a carrier 2 for chemical solution processing. The cleaning tank 34 cleans the substrate 4 held on the carrier 2;

前述化學模組7係具備: The aforementioned chemical module 7 series has:

第一搬運部11,係沿著前述藥液槽32及前述洗淨槽34排列的第一方向搬運前述載具2; The first transport part 11 transports the carrier 2 along the first direction in which the chemical solution tank 32 and the washing tank 34 are arranged;

上下搬運部13,係沿與前述第一方向交叉的上下方向搬運前述載具2;以及 The up-and-down conveyance part 13 conveys the aforementioned carrier 2 in the up-and-down direction intersecting the aforementioned first direction; and

第二搬運部48,係沿與前述第一方向及前述上下方向交叉的第二方向搬運前述載具2; The second transport part 48 transports the carrier 2 in a second direction intersecting the first direction and the up-down direction;

前述第一搬運部11、前述第二搬運部48及前述上下搬運部13係分別藉由第一致動器12、第二致動器41及上下致動器14驅動; The first conveying part 11, the second conveying part 48 and the upper and lower conveying parts 13 are driven by the first actuator 12, the second actuator 41 and the up and down actuator 14 respectively;

前述第一致動器12、前述第二致動器41及前述上下致動器14係與前述藥液槽32及前述洗淨槽34隔離。 The first actuator 12 , the second actuator 41 and the up-down actuator 14 are isolated from the chemical solution tank 32 and the cleaning tank 34 .

根據上述構成,藉由第一搬運部11進行之第一方向的搬運及第二搬運部48進行之第二方向的搬運,鄰近位置之其他的藥液槽32及洗淨槽34被隔離成為不會受到附著於載具2的藥液的影響,所以可抑制藥液所致之汙染。此外,用以驅動搬運載具2的搬運部11、48、13的致動器被隔離成為不會受到藥液槽32及洗淨槽34的影響,所以可抑制化學模組7內之載具2因微粒所致之汙染。此外,由於藥液槽32及洗淨槽34沿著第一方向排列,使得化學模組7的第二方向的寬度變窄,而可使基板處理裝置1小型化。而且,由於將處理各步驟的裝置模組化,所以可藉由對化學模組7連接其他的模組5、6、8而對於變更需求靈活地應對。 According to the above-mentioned structure, by the conveyance in the first direction by the first conveyance part 11 and the conveyance in the second direction by the second conveyance part 48, the other chemical solution tanks 32 and the washing tank 34 in the adjacent positions are isolated and become inseparable. It is affected by the chemical solution attached to the carrier 2, so contamination caused by the chemical solution can be suppressed. In addition, the actuators used to drive the conveying parts 11, 48, and 13 of the conveying carrier 2 are isolated so as not to be affected by the chemical tank 32 and the cleaning tank 34, so the carriers in the chemical module 7 can be restrained. 2. Pollution caused by particulates. In addition, since the chemical tank 32 and the cleaning tank 34 are arranged along the first direction, the width of the chemical module 7 in the second direction is narrowed, and the substrate processing apparatus 1 can be miniaturized. Furthermore, since the apparatus for processing each step is modularized, other modules 5, 6, and 8 can be connected to the chemical module 7 to respond flexibly to changing requirements.

此外,一實施型態的基板處理裝置1中, In addition, in the substrate processing apparatus 1 of one embodiment,

前述化學模組7係構成為於前述第二方向可裝卸地連結。 The chemical module 7 is detachably connected in the second direction.

根據上述實施型態,可對於處理程序的變更需求作靈活地應對,使擴充性提高。 According to the above implementation type, it is possible to flexibly respond to changing requirements of the processing program, thereby improving scalability.

此外,一實施型態的基板處理裝置1中, In addition, in the substrate processing apparatus 1 of one embodiment,

前述第一致動器12及前述上下致動器14係比前述藥液槽32及前述洗淨槽34的各開口部配設於靠下方。 The first actuator 12 and the up-and-down actuator 14 are arranged below each opening of the chemical solution tank 32 and the washing tank 34 .

根據上述實施型態,可抑制第一致動器12及上下致動器14產生的微粒所導之化學模組7內的汙染。 According to the above embodiment, contamination in the chemical module 7 caused by particles generated by the first actuator 12 and the upper and lower actuators 14 can be suppressed.

此外,一實施型態的基板處理裝置1中,更具備:搬入模組5、乾燥模組6、或搬出模組8。該搬入模組5係用以將保持前述基板4的前述載具2搬入;該乾燥模組6係對保持於前述載具2的前述基板4進行乾燥;該搬出模組8係用以將保持前述基板4的前述載具2搬出; In addition, the substrate processing apparatus 1 of one embodiment further includes a loading module 5 , a drying module 6 , or an unloading module 8 . The loading module 5 is used to carry in the aforementioned carrier 2 holding the aforementioned substrate 4; the drying module 6 is used to dry the aforementioned substrate 4 held on the aforementioned carrier 2; and the unloading module 8 is used to carry out the holding of the aforementioned substrate 4. The aforementioned carrier 2 of the aforementioned substrate 4 is carried out;

前述搬入模組5、前述乾燥模組6及前述搬出模組8係構成為可於前述第二方向裝卸地連結。 The said loading module 5, the said drying module 6, and the said carrying out module 8 are comprised so that it can be connected removably in the said 2nd direction.

根據上述實施型態,可對於處理程序的變更需求作靈活地應對,使擴充性提高。 According to the above implementation type, it is possible to flexibly respond to changing requirements of the processing program, thereby improving scalability.

此外,一實施型態的基板處理裝置1中, In addition, in the substrate processing apparatus 1 of one embodiment,

前述第二致動器41與前述藥液槽32之間係藉由後方壁38來分隔。 The second actuator 41 and the chemical tank 32 are separated by a rear wall 38 .

根據上述實施型態,可抑制第二致動器41產生的微粒所致之化學模組7內的汙染。 According to the above embodiment, contamination in the chemical module 7 caused by particles generated by the second actuator 41 can be suppressed.

此外,一實施型態的基板處理裝置1中, In addition, in the substrate processing apparatus 1 of one embodiment,

前述藥液槽32的前述第二方向之側方係藉由側方壁37來分隔。 The sides of the chemical solution tank 32 in the second direction are separated by side walls 37 .

根據上述實施型態,可抑制相鄰之化學模組7的藥液槽32中積存的藥液之氣態環境所致之汙染。 According to the above embodiment, contamination caused by the gaseous environment of the chemical solution accumulated in the chemical solution tank 32 of the adjacent chemical module 7 can be suppressed.

此外,一實施型態的基板處理裝置1中, In addition, in the substrate processing apparatus 1 of one embodiment,

前述藥液槽32係配置於前述第一方向的後方側,前述洗淨槽34係配置於前述第一方向的前方側。 The chemical solution tank 32 is arranged on the rear side in the first direction, and the cleaning tank 34 is arranged on the front side in the first direction.

根據上述實施型態,可於第一方向的後方側配設用以將藥液槽32產生的藥液蒸氣排放的排氣管道39,基板處理裝置1的維護變得容易。 According to the above-described embodiment, the exhaust duct 39 for discharging the chemical solution vapor generated by the chemical solution tank 32 can be disposed on the rear side in the first direction, so that the maintenance of the substrate processing apparatus 1 becomes easy.

另外,上述實施型態係對於以載具2保持複數片基板4的情形進行了說明,惟不限於這樣的情形,亦可無載具。例如,亦可藉由夾具部44、托架18等直接保持複數片基板4。 In addition, the above-mentioned embodiment describes the case where a plurality of substrates 4 are held by the carrier 2. However, the present invention is not limited to this case, and the carrier 2 may not be used. For example, the plurality of substrates 4 may be directly held by the clamp part 44, the bracket 18, or the like.

在此,使用圖12來說明圖4所示的第二致動器41。圖12為俯視觀看第二搬運機構9時的概略圖。圖12中,省略了第二搬運收容部40的圖示。 Here, the second actuator 41 shown in FIG. 4 will be described using FIG. 12 . FIG. 12 is a schematic plan view of the second conveyance mechanism 9 . In FIG. 12 , the second transport and accommodating unit 40 is not shown.

如圖12所示,第二致動器41係具備:致動器本體部41A及複數條軌道41B。致動器本體部41A係沿著軌道41B往左右方向(第二方向)移動的驅動部。軌道41B係將致動器本體部41A支持成可移動的構件,且設置於每個模組。複數個模組因複數條軌道41B沿著第二方向排列形成連續的行進路徑而連結。 As shown in FIG. 12 , the second actuator 41 includes an actuator body 41A and a plurality of rails 41B. The actuator body portion 41A is a driving portion that moves in the left-right direction (second direction) along the rail 41B. The rail 41B supports the actuator body part 41A as a movable member and is provided in each module. The plurality of modules are connected because the plurality of rails 41B are arranged along the second direction to form a continuous traveling path.

第二致動器41為齒條與小齒輪之組合時,致動器本體部41A係具有馬達、減速部、小齒輪等的驅動部,且軌道41B為齒條。 When the second actuator 41 is a combination of a rack and a pinion, the actuator body part 41A has a driving part such as a motor, a reduction part, and a pinion, and the track 41B is a rack.

如圖12所示,對於複數條軌道41B致動器本體部41A僅設置一個且為複數個模組間通用者。藉此,可降低連結複數個模組時的成本。另外,致動器本體部41A不限於僅設置一個的情形,例如,如實施型態所示地分別於左右配置搬入模組5(裝載)與搬出模組8(卸載)時,亦可設置複數個致動器本體部41A。 As shown in FIG. 12 , only one actuator body part 41A is provided for the plurality of rails 41B and is common among the plurality of modules. This can reduce the cost of connecting multiple modules. In addition, the actuator body part 41A is not limited to the case where only one is provided. For example, when the loading module 5 (loading) and the carrying module 8 (unloading) are arranged on the left and right as shown in the embodiment, a plurality of actuator body parts 41A may be provided. an actuator body part 41A.

圖4中,符號41係標示複數個,且第二致動器41的軌道41B係存在有複數個。 In FIG. 4 , symbol 41 indicates a plurality of rails 41B of the second actuator 41 .

接著,使用圖13、圖14來說明配置致動器12、14、41、42的驅動空間與進行基板4的處理的處理空間之間的關係。 Next, the relationship between the drive space in which the actuators 12, 14, 41, and 42 are arranged and the processing space in which the substrate 4 is processed will be explained using FIGS. 13 and 14 .

圖13為顯示化學模組7的立體圖,圖14為說明化學模組7的第一搬運部11的動作之圖。 FIG. 13 is a perspective view showing the chemical module 7 , and FIG. 14 is a diagram explaining the operation of the first conveyance unit 11 of the chemical module 7 .

如圖13、圖14所示,殼體20係形成用以處理基板4的處理空間A。處理空間A係將藥液槽32及洗淨槽34包含於其內部的空間,且複數片基板4係於其內部沿前後方向(第一方向)及橫向(第二方向)被搬運。處理空間A係藉由一對的側方壁37與後方壁38而被包圍。 As shown in FIGS. 13 and 14 , the housing 20 forms a processing space A for processing the substrate 4 . The processing space A is a space including the chemical solution tank 32 and the cleaning tank 34 inside, and a plurality of substrates 4 are transported in the front-rear direction (first direction) and the transverse direction (second direction) inside the processing space A. The processing space A is surrounded by a pair of side walls 37 and a rear wall 38 .

如圖13、圖14所示,殼體20係形成第一驅動空間B1。第一驅動空間B1係用以配置第一致動器12及上下致動器14的空間。第一驅動空間B1係相對於藥液槽32及洗淨槽34的各開口部形成於第二方向的側方且形成於下方。 As shown in FIGS. 13 and 14 , the housing 20 forms a first drive space B1. The first drive space B1 is a space for arranging the first actuator 12 and the up and down actuators 14 . The first drive space B1 is formed laterally in the second direction and below the openings of the chemical solution tank 32 and the cleaning tank 34 .

如圖14所示,殼體20係形成第二驅動空間B2。第二驅動空間B2係用以配置第二致動器41及旋轉致動器42的空間。第二驅動空間B2係相對於處理空間A形成於第一方向的後方,亦即形成於後方壁38的後方。 As shown in FIG. 14 , the housing 20 forms a second driving space B2. The second drive space B2 is a space for arranging the second actuator 41 and the rotation actuator 42 . The second drive space B2 is formed behind the processing space A in the first direction, that is, behind the rear wall 38 .

由於致動器12、14、41、42配置於驅動空間B1、B2,因而可將致動器12、14、41、42與處理空間A隔離。藉此,可抑制致動器12、14、41、42產生的異物進入處理空間A而可抑制化學模組7內的汙染。 Since the actuators 12, 14, 41, and 42 are arranged in the drive spaces B1 and B2, the actuators 12, 14, 41, and 42 can be isolated from the processing space A. Thereby, foreign matter generated by the actuators 12, 14, 41, and 42 can be prevented from entering the processing space A and contamination in the chemical module 7 can be suppressed.

如圖13、圖14所示,第二驅動空間B2與處理空間A係藉由後方壁38而隔離,另一方面,如圖13所示,第一驅動空間B1與處理空間A係藉由側方排氣管道36而隔離。不僅是如此的情形,例如亦可設置區隔第一驅動空間B1與處理空間A的壁部來隔離第一驅動空間B1與處理空間A。在此使用圖15對於此例進行說明。 As shown in FIGS. 13 and 14 , the second driving space B2 and the processing space A are separated by the rear wall 38 . On the other hand, as shown in FIG. 13 , the first driving space B1 and the processing space A are separated by the side wall 38 . The exhaust pipe 36 is isolated. Not only this, but for example, a wall that separates the first driving space B1 and the processing space A may also be provided to isolate the first driving space B1 and the processing space A. This example will be described here using FIG. 15 .

圖15係顯示變形例之處理空間A的概略俯視圖。如圖15所示,設有包圍藥液槽32與洗淨槽34之周圍的底壁50。底壁50係構成處理空間A之底部的壁部。底壁50的一部分形成有開口51,而開口51的下方設有可動壁52。可動壁52係配置成覆蓋開口51,並且與支持托架18之臂16一體地沿前後方向移動(箭頭L1、L2)。可動壁52係具有沿前後方向延伸的長條形狀,且具有在臂16移動的範圍恆常地覆蓋開口51整體的長度。臂16係以貫通可動壁52的方式往下方延伸,並與上下致動器14連接。供臂16貫通之可動壁52的貫通孔係與臂16密接配置。圖15所示之例中,亦可設置側方排氣管道36。 FIG. 15 is a schematic plan view showing the processing space A of the modified example. As shown in FIG. 15 , a bottom wall 50 is provided surrounding the chemical solution tank 32 and the cleaning tank 34 . The bottom wall 50 is a wall portion constituting the bottom of the processing space A. An opening 51 is formed in a part of the bottom wall 50 , and a movable wall 52 is provided below the opening 51 . The movable wall 52 is configured to cover the opening 51 and moves in the front-rear direction integrally with the arm 16 supporting the bracket 18 (arrows L1, L2). The movable wall 52 has a long shape extending in the front-rear direction, and has a length that constantly covers the entire opening 51 in the range in which the arm 16 moves. The arm 16 extends downward through the movable wall 52 and is connected to the upper and lower actuators 14 . The through hole of the movable wall 52 through which the arm 16 passes is arranged in close contact with the arm 16 . In the example shown in Fig. 15, a side exhaust duct 36 may also be provided.

根據圖15所示的構成,由於設置臂16插通的可動壁52,因而可使臂16沿前後方向移動且可物理性地隔離處理空間A與第一驅動空間B1。藉此,可更確實地抑制化學模組7內的汙染。 According to the structure shown in FIG. 15 , since the movable wall 52 through which the arm 16 is inserted is provided, the arm 16 can be moved in the front-rear direction and the processing space A and the first drive space B1 can be physically isolated. Thereby, contamination in the chemical module 7 can be suppressed more reliably.

另外,後方壁38亦同樣地可設置旋動臂部43插通的可動壁。 In addition, the rear wall 38 may also be provided with a movable wall through which the swing arm 43 is inserted.

此外,圖15所示之例中,托架18係於用以收容載具2之空間的構成的外殼部分,具有上段部18A與下段部18B。上段部18A係較下段部18B朝上方突出的部分,具有從下方支持載具2的凸緣部3的功能。下段部18B係位於上段部18A之下方的部分,形成用以配置第二搬運部48之夾具部44(爪形狀)之前端的間隙。由於設置下段部18B,即使是載具2的凸緣部3支持於上段部18A的狀態下,第二搬運部48的夾具部44亦可在與上段部18A不同的位置支持載具2的凸緣部3。藉此,夾具部44與托架18可互不干涉地保持載具2,且可在夾具部44與托架18之間容易地交接載具2。 In addition, in the example shown in FIG. 15 , the bracket 18 is a shell part configured as a space for accommodating the carrier 2 , and has an upper section 18A and a lower section 18B. The upper stage portion 18A is a portion that protrudes upward than the lower stage portion 18B, and has a function of supporting the flange portion 3 of the carrier 2 from below. The lower portion 18B is a portion located below the upper portion 18A, and forms a gap for disposing the front end of the clamp portion 44 (claw shape) of the second conveyance portion 48 . Since the lower portion 18B is provided, even when the flange portion 3 of the carrier 2 is supported by the upper portion 18A, the clamp portion 44 of the second conveying portion 48 can support the flange of the carrier 2 at a different position from the upper portion 18A. Edge 3. Thereby, the clamp part 44 and the bracket 18 can hold the carrier 2 without interfering with each other, and the carrier 2 can be easily transferred between the clamp part 44 and the bracket 18 .

接著,使用圖16A至圖16L說明基板處理裝置1的動作的一例。 Next, an example of the operation of the substrate processing apparatus 1 will be described using FIGS. 16A to 16L .

圖16A至圖16L係用以說明基板處理裝置1的動作的一例的概略圖,各圖中的(a)係顯示處理空間A的俯視圖,(b)係顯示托架18及基板4之周邊構成的側視圖。 16A to 16L are schematic diagrams for explaining an example of the operation of the substrate processing apparatus 1. (a) in each figure shows a top view of the processing space A, and (b) shows the peripheral structure of the bracket 18 and the substrate 4. side view.

如圖16A所示,首先,處理空間A中,托架18在洗淨槽34的上方待機。如圖16A(b)所示,托架18係配置於洗淨槽34的上方,且配置於不干涉第二搬運部48的夾具部44的高度位置之中間位置H1。在托架18待機的狀態下,如圖16A(a)所示,第二搬運部48係使保持複數片基板4的載具2橫向移動(箭頭M1)。 As shown in FIG. 16A , first, in the processing space A, the carriage 18 waits above the washing tank 34 . As shown in FIG. 16A(b) , the bracket 18 is disposed above the washing tank 34 and is disposed at an intermediate position H1 between the height positions of the clamp portion 44 of the second conveyance portion 48 . While the carriage 18 is in a standby state, as shown in FIG. 16A(a) , the second transport unit 48 moves the carrier 2 holding the plurality of substrates 4 laterally (arrow M1).

如圖16B所示,第二搬運部48係使保持基板4的載具2移動至托架18的上方。之後,使托架18從中間位置H1上升(箭頭M2),以托架18保持載具2。 As shown in FIG. 16B , the second transport unit 48 moves the carrier 2 holding the substrate 4 above the bracket 18 . Thereafter, the bracket 18 is raised from the intermediate position H1 (arrow M2), and the carrier 2 is held by the bracket 18.

如圖16C所示,使托架18的上段部18A與載具2的凸緣部3抵接而從下方支持。如使用了圖15進行之說明,夾具部44係在與托架18的上段部18A不同的位置來支持載具2的凸緣部3而不干涉托架18。之後,使夾具部44朝打開的方向旋轉(箭頭M3),解除基板4的夾持。藉此,如圖16D所示,將載具2從夾具部44交接到托架18。 As shown in FIG. 16C , the upper portion 18A of the bracket 18 is brought into contact with the flange portion 3 of the carrier 2 to be supported from below. As explained using FIG. 15 , the clamp portion 44 supports the flange portion 3 of the carrier 2 at a position different from the upper portion 18A of the bracket 18 without interfering with the bracket 18 . Thereafter, the clamp portion 44 is rotated in the opening direction (arrow M3 ) to release the clamping of the substrate 4 . Thereby, as shown in FIG. 16D , the carrier 2 is transferred from the clamp part 44 to the bracket 18 .

托架18係將載具2保持於較中間位置H1還高的上升位置H2。此狀態下,使保持載具2的托架18往後方側朝藥液槽32移動(箭頭M4)。由於夾具部44係朝向離開托架18的方向開啟,所以不干涉載具2及托架18的移動。 The bracket 18 holds the carrier 2 at a raised position H2 that is higher than the intermediate position H1. In this state, the bracket 18 holding the carrier 2 is moved rearward toward the chemical tank 32 (arrow M4). Since the clamp part 44 is opened in the direction away from the bracket 18, it does not interfere with the movement of the carrier 2 and the bracket 18.

如圖16E所示,載具2及托架18係移動達藥液槽32的上方而停止。此狀態下,使載具2及托架18下降(箭頭M5),使基板4浸漬於藥液槽32中積存的藥液。此時,第二搬運部48的夾具部44係位於洗淨槽34的上方而不干涉載具2及托架18,所以可橫向退避(箭頭M6)。另外,亦可不使第二搬運部48退避而在洗淨槽34的上方持續待機。 As shown in FIG. 16E , the carrier 2 and the bracket 18 move above the chemical solution tank 32 and stop. In this state, the carrier 2 and the bracket 18 are lowered (arrow M5 ), and the substrate 4 is immersed in the chemical solution accumulated in the chemical solution tank 32 . At this time, the clamp part 44 of the second transport part 48 is located above the washing tank 34 and does not interfere with the carrier 2 and the bracket 18, so it can be evacuated laterally (arrow M6). In addition, the second transport unit 48 may not be retracted and may continue to wait above the washing tank 34 .

如圖16F所示,托架18係下降達使複數片基板4浸漬於藥液的高度位置之下降位置H3。藉由使基板4浸漬於藥液而可對基板4的表面進行蝕刻等處理。 As shown in FIG. 16F , the carriage 18 is lowered to a lowered position H3 at a height where the plurality of substrates 4 are immersed in the chemical solution. By immersing the substrate 4 in the chemical solution, the surface of the substrate 4 can be etched or otherwise processed.

就藥液槽32的藥液而言,若為可對基板4的表面進行處理者,則可使用任何的液體。例如,有機藥液的情形,可使用NMP、單乙醇胺等胺溶液、丙酮等,而無機藥液的情形,可使用SC1(APM)、SC2(HPM)、SPM、HF(氫氟酸)、BHF(緩衝氫氟酸)等。此外,亦可單獨使用一種液體或組合兩種以上的液體。 As the chemical solution in the chemical solution tank 32 , any liquid can be used as long as it can process the surface of the substrate 4 . For example, in the case of organic chemicals, NMP, amine solutions such as monoethanolamine, acetone, etc. can be used, and in the case of inorganic chemicals, SC1 (APM), SC2 (HPM), SPM, HF (hydrofluoric acid), BHF, etc. can be used. (buffered hydrofluoric acid) etc. In addition, one liquid may be used alone or two or more liquids may be combined.

基板4的藥液處理結束時,使載具2及托架18上升(箭頭M7)而提起基板4。如圖16G所示,托架18係上升至中間位置H1。此狀態下,使載具2及托架18往前方朝洗淨槽34移動(箭頭M8)。 When the chemical solution treatment of the substrate 4 is completed, the carrier 2 and the bracket 18 are raised (arrow M7 ) to lift up the substrate 4 . As shown in Figure 16G, the bracket 18 is raised to the intermediate position H1. In this state, the carrier 2 and the bracket 18 are moved forward toward the washing tank 34 (arrow M8).

如圖16H所示,載具2及托架18係移動達洗淨槽34的上方而停止。之後,使載具2及托架18下降(箭頭M9),將基板4配置於洗淨槽34的內部。 As shown in FIG. 16H , the carrier 2 and the bracket 18 move above the washing tank 34 and stop. Thereafter, the carrier 2 and the bracket 18 are lowered (arrow M9 ), and the substrate 4 is arranged inside the cleaning tank 34 .

如圖16I所示,托架18係在下降達下降位置H3的狀態下,使基板4浸漬於洗淨槽34中積存之純水等洗淨水。藉此,可對附著藥液之基板4的表面進行清洗處理。不限於浸漬於洗淨水的情形,亦可對基板4 噴射洗淨水。就清洗處理而言,若可將附著於基板4之表面的藥液置換成為不會於下一個處理造成問題的狀態,則可採用任意的液體、方法。例如,亦可採用質子性溶媒、水、IPA、乙醇等的酒精、NMP、單乙醇胺等胺溶液。此外,亦可單獨使用一種液體或組合兩種以上的液體。 As shown in FIG. 16I , the substrate 4 is immersed in washing water such as pure water accumulated in the washing tank 34 while the carriage 18 is lowered to the lowering position H3. Thereby, the surface of the substrate 4 to which the chemical solution is attached can be cleaned. Not limited to the case of immersing in clean water, the substrate 4 can also be Spray clean water. For the cleaning process, any liquid or method can be used as long as the chemical liquid adhering to the surface of the substrate 4 can be replaced to a state that will not cause problems in the next process. For example, protic solvents, alcohols such as water, IPA, and ethanol, NMP, and amine solutions such as monoethanolamine can also be used. In addition, one liquid may be used alone or two or more liquids may be combined.

在對基板4進行清洗處理之期間,亦可使原本退避的第二搬運部48返回到洗淨槽34的上方(箭頭M10)。第二搬運部48的夾具部44位於洗淨槽34的上方之後,使保持清洗處理已結束的基板4的載具2及托架18上升(箭頭M11)。 During the cleaning process of the substrate 4 , the second conveying part 48 that was originally retracted may be returned to the upper side of the cleaning tank 34 (arrow M10 ). After the clamp part 44 of the second transport part 48 is positioned above the cleaning tank 34, the carrier 2 and the bracket 18 holding the substrate 4 whose cleaning process has been completed are raised (arrow M11).

如圖16J所示,托架18係上升達用以將載具2交接給夾具部44的位置之上升位置H2。此狀態下,使夾具部44朝關閉的方向旋轉(箭頭M12),藉由夾具部44夾持複數片基板4。夾具部44係插入托架18的下段部18B與載具2的凸緣部3之間的間隙,從下方支持凸緣部3。 As shown in FIG. 16J , the bracket 18 rises to the rising position H2 for transferring the carrier 2 to the clamp part 44 . In this state, the clamp portion 44 is rotated in the closing direction (arrow M12 ), and the plurality of substrates 4 are clamped by the clamp portion 44 . The clamp portion 44 is inserted into the gap between the lower portion 18B of the bracket 18 and the flange portion 3 of the carrier 2 to support the flange portion 3 from below.

之後,如圖16K所示,在藉由夾具部44保持載具2的狀態下,使托架18下降(箭頭M13)。藉此,解除以托架18保持載具2,將載具2從托架18交接給夾具部44。 Thereafter, as shown in FIG. 16K , with the carrier 2 held by the clamp portion 44 , the bracket 18 is lowered (arrow M13 ). Thereby, the carrier 2 is released from being held by the bracket 18 , and the carrier 2 is transferred from the bracket 18 to the clamp unit 44 .

如圖16L所示,托架18係退避到不干涉載具2及夾具部44的中間位置H1。因此,具有保持載具2之夾具部44的第二搬運部48可朝下一個化學模組7移動(箭頭M14)。 As shown in FIG. 16L , the bracket 18 is retracted to the intermediate position H1 where it does not interfere with the carrier 2 and the clamp part 44 . Therefore, the second conveying part 48 having the clamp part 44 holding the carrier 2 can move toward the next chemical module 7 (arrow M14).

根據圖16A至圖16L所示的動作,在化學模組7的處理空間A中利用沿前後方向(第一方向)排列的藥液槽32及洗淨槽34,沿前後方向搬運基板4(第一搬運步驟),執行對於基板4的藥液處理與清洗處理,兩處理完成之後,可朝下一個化學模組7橫向(第二方向)搬運基板4(第二搬運 步驟)。藉由執行第一搬運步驟與第二搬運步驟,可製造經蝕刻處理等處理的基板4。 According to the operations shown in FIGS. 16A to 16L , in the processing space A of the chemical module 7 , the chemical solution tank 32 and the cleaning tank 34 arranged in the front-rear direction (first direction) are used to convey the substrate 4 in the front-rear direction (first direction). (a transport step), perform chemical solution treatment and cleaning process on the substrate 4. After the two processes are completed, the substrate 4 can be transported laterally (second direction) toward the next chemical module 7 (second transport step). steps). By performing the first transfer step and the second transfer step, the substrate 4 processed by etching or the like can be manufactured.

以一批次處理基板4時,可對於一批次的基板4,於每個模組執行圖16A至圖16L所示的動作。如圖17之概略俯視圖所示,可在化學模組7A執行基板4的處理(動作(1))之後,將基板4搬運至下一個化學模組7B而執行其他處理(動作(2)),再將基板4搬運至下一個化學模組7C而執行其它處理(動作(3))。在此,動作(1)至(3)的順序無具體限制,亦可為隨機的順序。亦即,不需按照化學模組7A、7B、7C排列的順序來搬運基板4而利用各模組執行處理。 When processing the substrates 4 in a batch, the operations shown in FIGS. 16A to 16L can be performed on each module of the batch of substrates 4 . As shown in the schematic top view of FIG. 17 , after the chemical module 7A performs processing of the substrate 4 (action (1)), the substrate 4 can be transferred to the next chemical module 7B to perform other processing (action (2)). Then, the substrate 4 is transported to the next chemical module 7C and other processes are performed (action (3)). Here, the order of actions (1) to (3) is not specifically limited and may also be in a random order. That is, it is not necessary to transport the substrate 4 in the order in which the chemical modules 7A, 7B, and 7C are arranged, and to perform processing using each module.

以複數批次來處理基板4的情形,如圖18的概略俯視圖所示,可在化學模組7A對基板4A進行處理(動作(4))的同時,在另一個化學模組7B對其他基板4B進行處理(動作(5)),並且在另一個化學模組7C對其他基板4C進行處理(動作(6))。由於模組7A、7B、7C分別設有第一搬運部11及上下搬運部13,所以各模組7A、7B、7C可併行地執行基板的搬運、處理。另外,動作(4)至(6)的順序無具體限制,亦可為隨機的順序。例如,亦可將基板4C搬運至化學模組7C,接著將基板4A搬運至化學模組7A,接著將基板4B搬運至化學模組7B,以各模組7A、7B、7C分別處理基板4A、4B、4C。 When the substrate 4 is processed in a plurality of batches, as shown in the schematic plan view of FIG. 18 , while the chemical module 7A is processing the substrate 4A (action (4)), another chemical module 7B can process other substrates. 4B performs processing (action (5)), and another substrate 4C is processed in another chemical module 7C (action (6)). Since the modules 7A, 7B, and 7C are respectively provided with the first conveying part 11 and the upper and lower conveying parts 13, the respective modules 7A, 7B, and 7C can carry out substrate conveying and processing in parallel. In addition, the order of actions (4) to (6) is not specifically limited and may also be in a random order. For example, the substrate 4C may be transported to the chemical module 7C, then the substrate 4A may be transported to the chemical module 7A, and then the substrate 4B may be transported to the chemical module 7B, and the substrates 4A, 7B, and 7C may be processed respectively. 4B, 4C.

如圖18所示,基板4A、4B位於遠離洗淨槽34上方的位置時,第二搬運部48的夾具部44(未圖示)不干涉基板4A、4B、載具2(圖17、圖18中省略圖示)、托架18,而可通過化學模組7A、7B橫向移動(動作(7))。移動至化學模組7C的第二搬運部48可接受處理結束的基板4C, 且辦運至下一個化學模組7(動作(8))。將基板4C交接給下一個化學模組7之後,可移動至化學模組7A、7B之中基板4A、4B的處理已結束的模組(動作(9)),並接收處理結束的基板,再搬運至下一個化學模組7。 As shown in FIG. 18 , when the substrates 4A and 4B are located far away from the upper part of the washing tank 34 , the clamp part 44 (not shown) of the second conveying part 48 does not interfere with the substrates 4A, 4B and the carrier 2 ( FIG. 17 , FIG. 18), the bracket 18 can be moved laterally by the chemical modules 7A and 7B (action (7)). The second transport unit 48 moved to the chemical module 7C receives the processed substrate 4C, And move to the next chemical module 7 (action (8)). After the substrate 4C is handed over to the next chemical module 7, it can be moved to the module in which the processing of the substrates 4A and 4B has been completed among the chemical modules 7A and 7B (action (9)), and the processed substrate can be received, and then Move to next chemistry module 7.

根據上述動作,可利用各模組併行處理複數批次的基板4A、4B、4C,且可在處理的期間中,使跨及模組間的第二搬運部48橫向移動。藉此,可實現以往的基板處理裝置之橫向一列地排列複數個槽的構成所無法實現的動作,可使處理的效率大幅地提升。 According to the above operation, multiple batches of substrates 4A, 4B, and 4C can be processed in parallel by each module, and the second conveying portion 48 spanning between the modules can be laterally moved during the processing. This makes it possible to achieve operations that were not possible with conventional substrate processing apparatuses in which a plurality of slots are arranged in a row in a transverse direction, thereby greatly improving processing efficiency.

(作用、功效1) (Function, efficacy 1)

如上所述,實施型態的化學模組7(基板處理模組)係具備:洗淨槽34(第一槽)、藥液槽32(第二槽)、第一搬運部11及第二搬運部48。該洗淨槽34(第一槽)及藥液槽32(第二槽)係沿第一方向排列,且可配置基板4。該第一搬運部11係使基板4沿著第一方向移動。該第二搬運部48係使基板4沿著與第一方向交叉的第二方向移動。 As described above, the chemical module 7 (substrate processing module) of the embodiment is provided with the cleaning tank 34 (first tank), the chemical tank 32 (second tank), the first conveyance part 11 and the second conveyance unit. Department 48. The cleaning tank 34 (first tank) and the chemical tank 32 (second tank) are arranged along the first direction, and the substrate 4 can be disposed. The first conveying unit 11 moves the substrate 4 along the first direction. The second conveyance unit 48 moves the substrate 4 along the second direction intersecting the first direction.

根據如此的構成,由於沿著第一方向排列洗淨槽34與藥液槽32,且設置沿著第一方向搬運基板4的第一搬運部11及沿著第二方向搬運基板4的第二搬運部48,因而可沿著不同方向(MD方向與TD方向)搬運基板4。藉此,相較於以往的基板處理裝置僅沿一方向排列配置複數個槽的情形,可縮小裝置整體的設置面積。此外,由於分別設置第一搬運部11與第二搬運部48,可利用第一搬運部11與第二搬運部48搬運、處理各別的基板4等,可使處理的效率提升。 According to such a structure, the cleaning tank 34 and the chemical tank 32 are arranged along the first direction, and the first conveying part 11 for conveying the substrate 4 along the first direction and the second conveying part 11 for conveying the substrate 4 along the second direction are provided. The conveying unit 48 can therefore convey the substrate 4 in different directions (MD direction and TD direction). Therefore, compared with the conventional substrate processing apparatus that only arranges a plurality of slots in one direction, the overall installation area of the apparatus can be reduced. In addition, since the first conveying part 11 and the second conveying part 48 are respectively provided, the first conveying part 11 and the second conveying part 48 can be used to convey and process the respective substrates 4 and the like, thereby improving the processing efficiency.

此外,實施型態的化學模組7中更具備上下搬運部13,該上下搬運部13係使基板4上下移動,且上下搬運部13係連結於第一搬運部 11,第一搬運部11係使上下搬運部13沿著第一方向移動。根據如此的構成,第二搬運部48可省去使基板4上下移動的功能、使基板4沿著第一方向移動的功能等,而可使基板4的移動簡單化。 In addition, the chemical module 7 of the embodiment further includes an up-and-down conveyance part 13 that moves the substrate 4 up and down, and the up-and-down conveyance part 13 is connected to the first conveyance part 11. The first conveying part 11 moves the vertical conveying part 13 along the first direction. According to such a structure, the second conveyance unit 48 can omit the function of moving the substrate 4 up and down, the function of moving the substrate 4 in the first direction, and the like, thereby simplifying the movement of the substrate 4 .

此外,實施型態的化學模組7可於第二方向連接其他的模組(搬入模組5、乾燥模組6、化學模組7、或搬出模組8)。藉此,可使用第二搬運部48在複數個模組之間搬運基板4。 In addition, the chemical module 7 of the embodiment can be connected to other modules (import module 5, drying module 6, chemical module 7, or unload module 8) in the second direction. Thereby, the second conveying part 48 can be used to convey the substrate 4 between a plurality of modules.

此外,實施型態的化學模組7中,第二搬運部48的第二致動器41係與其他模組共通地使用。根據如此的構成,可降低化學模組7與其他的模組連結時的成本。 In addition, in the chemical module 7 of the embodiment, the second actuator 41 of the second conveyance part 48 is used in common with other modules. According to such a structure, the cost when the chemical module 7 is connected with other modules can be reduced.

此外,實施型態的化學模組7中,第二搬運部48係具備沿著第二方向延伸的軌道41B,且軌道41B係與其他模組的軌道41B配置成沿著第二方向排列。根據如此的構成,可使用簡單的構造來連結模組彼此。 In addition, in the chemical module 7 of the embodiment, the second transport part 48 is provided with a rail 41B extending along the second direction, and the rail 41B is arranged to be aligned with the rails 41B of other modules along the second direction. With such a configuration, modules can be connected to each other using a simple structure.

此外,實施型態的化學模組7中更具備一對的側方壁37,該一對的側方壁係於第二方向包夾洗淨槽34及藥液槽32,且側方壁37係形成有用以使第二搬運部48通過的間隙37a。根據如此的構成,能夠以簡單的構成來實現以第二搬運部48進行之模組間的移動。此外,由於間隙37a的大小限制為僅可讓第二搬運部48通過的大小,所以可抑制模組間的汙染。 In addition, the chemical module 7 of the embodiment is further provided with a pair of side walls 37 that surround the cleaning tank 34 and the chemical solution tank 32 in the second direction, and the side walls 37 A gap 37a is formed through which the second conveyance part 48 passes. According to such a structure, the movement between modules by the second conveyance part 48 can be realized with a simple structure. In addition, since the size of the gap 37a is limited to a size that allows only the second conveyance unit 48 to pass, contamination between modules can be suppressed.

此外,實施型態的化學模組7中,洗淨槽34係配置於第一方向的前方側,藥液槽32係配置於第一方向的後方側,第二搬運部48係使基板4在洗淨槽34的上方移動。根據如此的構成,可減少於模組間的藥液 槽32彼此的汙染。此外,作業人員要從前方確認化學模組7的內部之際,可容易觀視確認由第二搬運部48搬運的基板4。 In addition, in the chemical module 7 of the embodiment, the cleaning tank 34 is arranged on the front side in the first direction, the chemical solution tank 32 is arranged on the rear side in the first direction, and the second conveying part 48 moves the substrate 4 in the first direction. The upper part of the washing tank 34 moves. With this configuration, the amount of chemical solution between modules can be reduced. Contamination of tanks 32 with each other. In addition, when the operator wants to check the inside of the chemical module 7 from the front, the operator can easily check the substrate 4 transported by the second transport unit 48 .

此外,實施型態的化學模組7中,於第二方向與化學模組7連結的其他模組係搬入模組5、搬出模組8、乾燥模組6、化學模組7中之任一者。根據如此的構成,可連結各式各樣功能的模組作為其他的模組。 In addition, in the chemical module 7 of the embodiment, the other module connected to the chemical module 7 in the second direction is any one of the import module 5, the export module 8, the drying module 6, and the chemical module 7. By. With this configuration, modules with various functions can be connected as other modules.

此外,實施型態的基板處理裝置1係具備:化學模組7、以及於第二方向與化學模組7連結的其他模組(搬入模組5、乾燥模組6、化學模組7、或搬出模組8)。根據如此的構成,可縮小設置面積且可實現處理效率高的基板處理裝置1。 In addition, the substrate processing apparatus 1 of the embodiment is equipped with the chemical module 7 and other modules (loading module 5, drying module 6, chemical module 7, or other modules connected to the chemical module 7 in the second direction). Move out module 8). According to such a configuration, the installation area can be reduced and the substrate processing apparatus 1 with high processing efficiency can be realized.

此外,實施型態的基板製造方法(基板處理方法)係包含:第一搬運步驟,係在化學模組7(基板處理模組)中,沿著第一方向搬運基板4,使基板4在沿著第一方向排列的洗淨槽34(第一槽)與藥液槽32(第二槽)之間移動;以及第二搬運步驟,係沿著與第一方向交叉的第二方向搬運基板4。 In addition, the substrate manufacturing method (substrate processing method) of the embodiment includes: a first transportation step in which the substrate 4 is transported along the first direction in the chemical module 7 (substrate processing module), so that the substrate 4 is moved along the first direction. moving between the cleaning tank 34 (first tank) and the chemical tank 32 (second tank) arranged in the first direction; and the second transport step is to transport the substrate 4 along the second direction intersecting the first direction. .

根據此種方法,在化學模組7中,可沿著不同的方向(MD方向與TD方向)來搬運基板4。藉此,相較於以往的基板處理裝置僅沿一方向排列配置複數個槽的情形,可縮小裝置整體的設置面積且可使處理的效率提升。另外,第二搬運步驟亦可由作業人員手動執行。 According to this method, the substrate 4 can be transported in different directions (MD direction and TD direction) in the chemical module 7 . Therefore, compared with the conventional substrate processing apparatus that only arranges a plurality of slots in one direction, the overall installation area of the apparatus can be reduced and the processing efficiency can be improved. In addition, the second transport step can also be performed manually by the operator.

(作用、功效2) (Function, efficacy 2)

如上所述,實施型態的化學模組7(基板處理模組)係具備:洗淨槽34(第一槽)、藥液槽32(第二槽)、第一搬運部11、第二搬運部48及上下搬運部13;其中,該洗淨槽34(第一槽)及藥液槽32(第二槽)係沿著第 一方向排列,且可配置基板4;該第一搬運部11係使基板4沿著第一方向移動;該第二搬運部48係使基板4沿著與第一方向交叉的第二方向移動;該上下搬運部13係連結於第一搬運部11,使基板4上下移動。此外,第一搬運部11的第一致動器12及第二搬運部48的第二致動器41係分別配置於與處理空間A隔離的驅動空間B1、B2,該處理空間A係可接近(access)洗淨槽34和藥液槽32的空間。 As described above, the chemical module 7 (substrate processing module) of the embodiment is provided with the cleaning tank 34 (first tank), the chemical solution tank 32 (second tank), the first conveyance part 11, the second conveyance part 11 and the second conveyance part 11 . part 48 and the up and down conveying part 13; wherein, the cleaning tank 34 (first tank) and the chemical liquid tank 32 (second tank) are along the The substrates 4 are arranged in one direction and can be arranged; the first conveying part 11 moves the substrates 4 along the first direction; the second conveying part 48 moves the substrates 4 along the second direction intersecting the first direction; The vertical conveying part 13 is connected to the first conveying part 11 and moves the substrate 4 up and down. In addition, the first actuator 12 of the first conveying part 11 and the second actuator 41 of the second conveying part 48 are respectively arranged in the driving spaces B1 and B2 isolated from the processing space A, and the processing space A is accessible. (access) the space of the washing tank 34 and the chemical solution tank 32 .

根據如此的構成,由於沿著第一方向排列洗淨槽34與藥液槽32,且設置沿著第一方向搬運基板4的第一搬運部11及沿著第二方向搬運基板4的第二搬運部,因而可沿著不同的方向(MD方向與TD方向)搬運基板4。藉此,相較於以往的基板處理裝置僅沿一方向排列配置複數個槽的情形,可縮小裝置整體的設置面積。此外,由於將兩個致動器12、41配置於與處理空間A隔離的驅動空間B1、B2,致動器12、41產生的異物難以侵入處理空間A,而可抑制化學模組7內的汙染。 According to such a structure, the cleaning tank 34 and the chemical tank 32 are arranged along the first direction, and the first conveying part 11 for conveying the substrate 4 along the first direction and the second conveying part 11 for conveying the substrate 4 along the second direction are provided. The conveying unit can therefore convey the substrate 4 in different directions (MD direction and TD direction). Therefore, compared with the conventional substrate processing apparatus that only arranges a plurality of slots in one direction, the overall installation area of the apparatus can be reduced. In addition, since the two actuators 12 and 41 are arranged in the driving spaces B1 and B2 that are isolated from the processing space A, foreign matter generated by the actuators 12 and 41 is difficult to invade the processing space A, and the chemical module 7 can be suppressed. pollution.

此外,實施型態的化學模組7中,第一致動器12係配置於第一驅動空間B1,第二致動器41係配置於第二驅動空間B2。根據如此的構成,由於將第一致動器12與第二致動器41分別配置於驅動空間B1、B2,而可有效運用模組內的空間。 In addition, in the chemical module 7 of the embodiment, the first actuator 12 is arranged in the first drive space B1, and the second actuator 41 is arranged in the second drive space B2. According to such a structure, since the first actuator 12 and the second actuator 41 are respectively arranged in the driving spaces B1 and B2, the space within the module can be effectively utilized.

此外,實施型態的化學模組7中,第一驅動空間B1係設於洗淨槽34及藥液槽32之各開口部的側方且設於下方,第二驅動空間B2係相對於處理空間A設於第一方向的後方。根據如此的構成,可有效運用化學模組7內的空間。 In addition, in the chemical module 7 of the embodiment, the first drive space B1 is provided to the side and below the openings of the cleaning tank 34 and the chemical solution tank 32, and the second drive space B2 is opposite to the processing Space A is located behind the first direction. According to such a structure, the space in the chemical module 7 can be effectively utilized.

此外,實施型態的化學模組7中更具備設於處理空間A的後方的後方壁38,且第二驅動空間B2係設於後方壁38的後方。根據如此的構成,由於處理空間A與第一驅動空間B1係藉由後方壁38而分隔,配置於第一驅動空間B1的第一致動器產生的異物難以進入至處理空間A而可抑制汙染。 In addition, the chemical module 7 of the embodiment further includes a rear wall 38 provided behind the processing space A, and the second drive space B2 is provided behind the rear wall 38 . According to such a structure, since the processing space A and the first driving space B1 are separated by the rear wall 38, foreign matter generated by the first actuator arranged in the first driving space B1 is difficult to enter the processing space A, and contamination can be suppressed. .

此外,實施型態的化學模組7中,後方壁38係形成用以將處理空間A的氣態環境朝外部進行排放的排氣口39a。根據如此的構成,即使異物進入處理空間A時,亦可通過排氣口39a排放到外部。 In addition, in the chemical module 7 of the embodiment, the rear wall 38 forms an exhaust port 39a for discharging the gaseous environment of the processing space A to the outside. According to such a configuration, even if foreign matter enters the processing space A, it can be discharged to the outside through the exhaust port 39a.

此外,實施型態的化學模組7中,第二搬運部48係具備:旋動臂部43(臂)及夾具部44。該旋動臂部43(臂)係從第二驅動空間B2往前方延伸,並且通過設於後方壁38的開口38a。該夾具部44係連結於旋動臂部43並配置於洗淨槽34的上方。根據如此的構成,可採用簡單的構成來實現第二搬運部48。此外,後方壁38的開口38a的面積若可供旋動臂部43通過就足夠,所以將開口38a的面積限制於最小限度時,可使第二致動器41產生的異物難以進入處理空間A。 In addition, in the chemical module 7 of the embodiment, the second conveyance part 48 includes a swing arm part 43 (arm) and a clamp part 44. The swing arm portion 43 (arm) extends forward from the second drive space B2 and passes through the opening 38a provided in the rear wall 38 . The clamp part 44 is connected to the rotating arm part 43 and is arranged above the washing tank 34 . According to such a structure, the second conveying part 48 can be realized with a simple structure. In addition, the area of the opening 38a of the rear wall 38 is sufficient for the swing arm 43 to pass through. Therefore, when the area of the opening 38a is limited to the minimum, it is difficult for foreign matter generated by the second actuator 41 to enter the processing space A. .

此外,實施型態的化學模組7中,第二驅動空間B2可與其他的模組連結。根據如此的構成,由於可連結第二驅動空間B2,因而可簡單地連結模組彼此。 In addition, in the chemical module 7 of the embodiment, the second drive space B2 can be connected to other modules. According to such a structure, since the second driving space B2 can be connected, the modules can be easily connected to each other.

此外,實施型態的化學模組7中,第二搬運部48更具備旋轉致動器42,該旋轉致動器42係使用以保持基板4的夾具部44旋轉,且旋轉致動器42係配置於第二驅動空間B2。根據如此的構成,由於將旋轉致 動器42與第二致動器41皆配置於第二驅動空間B2,可使旋轉致動器42產生的異物難以進入處理空間A而可抑制汙染。 In addition, in the chemical module 7 of the embodiment, the second transport part 48 further includes a rotation actuator 42 used to rotate the clamp part 44 of the substrate 4, and the rotation actuator 42 is Arranged in the second drive space B2. According to such a constitution, due to the rotation Both the actuator 42 and the second actuator 41 are disposed in the second driving space B2, which makes it difficult for foreign matter generated by the rotating actuator 42 to enter the processing space A, thereby suppressing contamination.

此外,實施型態的化學模組7中,上下搬運部13的上下致動器14係配置於第一驅動空間B1。根據如此的構成,由於將上下致動器14與第一致動器12皆配置於第一驅動空間B1,可使上下致動器14產生的異物難以進入處理空間A而可抑制汙染。 In addition, in the chemical module 7 of the embodiment, the vertical actuator 14 of the vertical conveyance unit 13 is arranged in the first drive space B1. According to such a structure, since both the upper and lower actuators 14 and the first actuator 12 are arranged in the first drive space B1, it is difficult for foreign matter generated by the upper and lower actuators 14 to enter the processing space A and contamination can be suppressed.

另外,實施型態中係以設置洗淨槽34與藥液槽32的兩個槽(第一槽、第二槽)的情形進行了說明,惟不限於這樣的情形。例如,如圖19的概略俯視圖所示,亦可在化學模組7A、7B、7C的各模組中,使用不同組合的槽。圖19所示之例中,化學模組7A的第一槽34A為洗淨槽,第二槽32A為藥液槽,化學模組7B的第一槽34B與第二槽32B兩方為藥液槽,化學模組7C的第一槽34C與第二槽32C兩方為單浴式處理槽。單浴式處理槽係指兼具藥液處理與洗淨處理兩方的功能之槽,具有藥液供給、排水的功能以及洗淨用液體的供給、排水的功能。 In addition, in the embodiment, the case where two tanks (the first tank and the second tank) of the cleaning tank 34 and the chemical solution tank 32 are provided has been described, but the invention is not limited to this case. For example, as shown in the schematic plan view of FIG. 19 , different combinations of tanks may be used in each of the chemical modules 7A, 7B, and 7C. In the example shown in Figure 19, the first tank 34A of the chemical module 7A is a cleaning tank, the second tank 32A is a chemical liquid tank, and the first tank 34B and the second tank 32B of the chemical module 7B are both chemical liquids. The first tank 34C and the second tank 32C of the chemical module 7C are single-bath treatment tanks. A single-bath treatment tank refers to a tank that has the functions of both chemical liquid treatment and cleaning treatment. It has the functions of supplying and draining the chemical liquid and supplying and draining the cleaning liquid.

化學模組7B的第一槽34B與第二槽32B所使用的藥液可為同種類或不同種類,化學模組7C的第一槽34C與第二槽32C所使用的藥液亦可為同種類或不同種類。 The chemical liquids used in the first tank 34B and the second tank 32B of the chemical module 7B can be of the same type or different types. The chemical liquids used in the first tank 34C and the second tank 32C of the chemical module 7C can also be of the same type. kind or different kind.

如圖19所示的佈局,第一槽與第二槽的組合不限於洗淨槽34與藥液槽32而可採用各式各樣的組合。第一槽與第二槽可採用藥液槽、洗淨槽、單浴式處理槽中之任一者,亦可採用任意的組合。 As shown in the layout shown in FIG. 19 , the combination of the first tank and the second tank is not limited to the cleaning tank 34 and the chemical tank 32 and various combinations can be used. The first tank and the second tank can be any one of a chemical tank, a washing tank, and a single-bath treatment tank, or any combination thereof.

如上所述,實施型態的化學模組7中,第一槽及第二槽分別為下述槽中之任一者:利用藥液處理基板4的藥液槽、洗淨基板4的洗淨 槽、及兼具對基板4進行藥液處理之功能與進行洗淨之功能的單浴式處理槽。根據如此的構成,第一槽與第二槽可採用各式各樣的組合。 As described above, in the chemical module 7 of the embodiment, the first tank and the second tank are each of the following tanks: a chemical solution tank for processing the substrate 4 with a chemical solution, or a cleaning tank for cleaning the substrate 4 . tank, and a single-bath type processing tank that has both the function of chemical liquid treatment and the function of cleaning the substrate 4 . According to such a structure, various combinations of the first groove and the second groove can be adopted.

(匯集槽抽出) (Tank extraction)

實施型態的化學模組7中更為了提升藥液槽32、洗淨槽34及其周邊構件的維護性,而設置構成可對殼體20進行抽出的基板處理單元45。使用圖20至圖22來說明基板處理單元45的構成。 In order to improve the maintainability of the chemical solution tank 32, the cleaning tank 34 and their surrounding components, the chemical module 7 of the embodiment is provided with a substrate processing unit 45 that can extract the casing 20. The structure of the substrate processing unit 45 will be described using FIGS. 20 to 22 .

圖20為從殼體20的正面側觀看複數個化學模組7A、7B、7C時的立體圖。圖21、圖22為從殼體20的背面側觀看複數個化學模組7A、7B、7C時的立體圖。 FIG. 20 is a perspective view of the plurality of chemical modules 7A, 7B, and 7C viewed from the front side of the housing 20 . 21 and 22 are perspective views of the plurality of chemical modules 7A, 7B, and 7C when viewed from the back side of the housing 20.

如圖20所示,化學模組7具有可對於殼體20進行抽出的基板處理單元45,作為與殼體20分離的構成。基板處理單元45具有收容藥液槽32及洗淨槽34的匯集槽47。匯集槽47係構成為包括藥液槽32及洗淨槽34在內與殼體20分離,且可一體進行抽出。本實施型態的基板處理單元45,係可經由設置於殼體20的正面側N1的開口部49,朝殼體20的正面側N1進行抽出,而朝背面側N2進行收回。 As shown in FIG. 20 , the chemical module 7 has a substrate processing unit 45 that can be extracted from the casing 20 as a separate structure from the casing 20 . The substrate processing unit 45 has a collecting tank 47 for accommodating the chemical tank 32 and the cleaning tank 34 . The collecting tank 47, including the chemical tank 32 and the cleaning tank 34, is separated from the casing 20 and can be extracted integrally. The substrate processing unit 45 of this embodiment can be drawn out toward the front side N1 of the casing 20 and retracted toward the back side N2 through the opening 49 provided on the front side N1 of the casing 20 .

匯集槽47中除了藥液槽32和洗淨槽34以外,還設置有複數根配管56,57(圖21,圖22)、其他配管關連構件(泵、過濾器、加熱器、閥、濃度計等),這些構件也可與匯集槽47一體地進行抽出。藉此,在將匯集槽47朝殼體20的外部抽出的狀態下,可對藥液槽32、洗淨槽34及其周邊的構件進行維護。另外,其他的配管關連構件,使該等自體被單元化,可與匯集槽47一體地進行抽出,並且可獨立於匯集槽47而以單元單體進行抽出。也就是,亦可僅抽出被單元化的其他配管關連構件。 In addition to the chemical solution tank 32 and the washing tank 34, the collecting tank 47 is also provided with a plurality of pipes 56, 57 (Fig. 21, Fig. 22), and other pipe-related components (pumps, filters, heaters, valves, and concentration meters). etc.), these components can also be extracted integrally with the collecting tank 47. Thereby, with the collecting tank 47 being pulled out of the casing 20 , the chemical tank 32 , the cleaning tank 34 and the surrounding components can be maintained. In addition, other piping-related members are unitized and can be extracted integrally with the collecting tank 47, and can be extracted as a single unit independently of the collecting tank 47. That is, it is also possible to extract only the other unitized pipe-related members.

根據上述構成,與如習知方式將藥液槽和洗淨槽固定於殼體的構成不同,作業者不需進入殼體20之中進行維護作業,可在殼體20的外側進行維護作業,因此可實現高維護性。而且,即使變更化學模組7的處理程序,也可將化學模組7的基板處理單元45代換成其他的單元來對應,可靈活並且迅速地對應處理程序的變更。 According to the above structure, unlike the conventional structure in which the chemical solution tank and the cleaning tank are fixed to the casing, the operator does not need to enter the casing 20 to perform maintenance operations, and can perform maintenance operations outside the casing 20. High maintainability is therefore achieved. Furthermore, even if the processing program of the chemical module 7 is changed, the substrate processing unit 45 of the chemical module 7 can be replaced with another unit to cope with the change of the processing program flexibly and quickly.

圖20所示之例中例示:三個化學模組7A、7B、7C當中位於中央的化學模組7B的匯集槽47朝正面側N1抽出,而由面板54關閉兩旁的化學模組7A、7C的開口部49的狀態。面板54可對殼體20進行裝卸,若化學模組7A、7C將面板54拆卸,亦可將內部的匯集槽47予以抽出。 In the example shown in FIG. 20 , among the three chemical modules 7A, 7B, and 7C, the collecting tank 47 of the central chemical module 7B is pulled out toward the front side N1, and the chemical modules 7A and 7C on both sides are closed by the panel 54. the state of the opening 49. The panel 54 can be attached and detached from the casing 20. If the chemical modules 7A and 7C disassemble the panel 54, the internal collecting tank 47 can also be pulled out.

匯集槽47更具有第一收容空間S1及第二收容空間S2,以作為用以收容各種構件的空間。 The collecting tank 47 further has a first receiving space S1 and a second receiving space S2 as spaces for accommodating various components.

第一收容空間S1為收容藥液槽32及洗淨槽34等的空間。第一收容空間S1係設置於匯集槽47的上部,且朝上方開口並且周圍四邊被壁部包圍。 The first accommodation space S1 is a space for accommodating the chemical solution tank 32, the washing tank 34, and the like. The first storage space S1 is provided at the upper part of the collection tank 47 and is open upward and surrounded by walls on all four sides.

第二收容空間S2為收容配管56等的空間。第二收容空間S2係位在第一收容空間S1的下方並沿著Y軸方向(第一方向)延伸,且從匯集槽47的正面58延伸至背面78(圖21、圖22)。配管56係用以進行供給或排放使用在洗淨槽34的洗淨用的液體(例如純水)的配管。配管56係插通設置於匯集槽47的正面58的開口60,而與洗淨槽34連接。從洗淨槽34延伸而收容在第二收容空間S2的配管56係朝向匯集槽47的背面側N2而延伸。 The second storage space S2 is a space for accommodating the pipes 56 and the like. The second receiving space S2 is located below the first receiving space S1 and extends along the Y-axis direction (first direction), and extends from the front 58 to the back 78 of the collection tank 47 (Fig. 21, Fig. 22). The piping 56 is a piping for supplying or discharging the cleaning liquid (for example, pure water) used in the cleaning tank 34 . The pipe 56 is inserted into the opening 60 provided in the front surface 58 of the collection tank 47 and is connected to the washing tank 34 . The pipe 56 extending from the washing tank 34 and accommodated in the second storage space S2 extends toward the back side N2 of the collection tank 47 .

在開口部49的上方設置與開口部49不同的開口部62。開口部62設為可對配置於殼體20的內部的洗淨槽34、藥液槽32進行觀視確認、接近的開口,且藉由面板64來關閉。在圖20所示之例中例示:化學模組7A的開口部62被面板64關閉,而化學模組7B、7C的開口部62呈開放的狀態。 An opening 62 different from the opening 49 is provided above the opening 49 . The opening 62 is an opening through which the cleaning tank 34 and the chemical solution tank 32 arranged inside the housing 20 can be viewed, checked, and accessed, and is closed by the panel 64 . In the example shown in FIG. 20 , the opening 62 of the chemical module 7A is closed by the panel 64 , while the openings 62 of the chemical modules 7B and 7C are open.

如圖20所示,可經由開口部62來對設置於殼體20之內部的兩個槽開口部66、68進行觀視確認、接近。槽開口部66、68為固定地形成於殼體20的開口部,而各自使前述的藥液槽32、洗淨槽34露出。如化學模組7C,在收容藥液槽32和洗淨槽34的匯集槽47配置在殼體20之中的狀態下,於槽開口部66露出藥液槽32,而於槽開口部68露出洗淨槽34。 As shown in FIG. 20 , the two groove openings 66 and 68 provided inside the housing 20 can be visually confirmed and approached through the opening 62 . The tank openings 66 and 68 are openings that are fixedly formed in the housing 20 and expose the aforementioned chemical tank 32 and cleaning tank 34 respectively. For example, in the chemical module 7C, when the collecting tank 47 for accommodating the chemical tank 32 and the cleaning tank 34 is disposed in the casing 20 , the chemical tank 32 is exposed at the tank opening 66 and the tank opening 68 is exposed. Wash tank 34.

經由槽開口部66、68,使藥液槽32及洗淨槽34、和殼體20彼此分離。藉由將藥液槽32及洗淨槽34、和殼體20予以分離、並且將匯集槽47與殼體20予以分離,藉此可構成對殼體20可進行抽出的基板處理單元45。此外,將基板處理單元45與殼體20分離,藉此使產生在藥液槽32、洗淨槽34的藥液、洗淨液難以附著在殼體20,可抑制對殼體20的腐蝕,可使化學模組7的耐久性提升。 The chemical solution tank 32, the cleaning tank 34, and the housing 20 are separated from each other via the tank openings 66 and 68. By separating the chemical tank 32 and the cleaning tank 34 from the casing 20, and by separating the collection tank 47 from the casing 20, the substrate processing unit 45 can be configured to be able to extract the casing 20. In addition, by separating the substrate processing unit 45 from the casing 20, the chemical liquid and cleaning liquid generated in the chemical liquid tank 32 and the cleaning tank 34 are less likely to adhere to the casing 20, thereby suppressing corrosion of the casing 20. Improves the durability of Chemistry Module 7.

如圖21、圖22所示,在殼體20的背面側N2設置有兩種類的開口部70、72、及兩種類的面板74、76。 As shown in FIGS. 21 and 22 , two types of openings 70 and 72 and two types of panels 74 and 76 are provided on the back side N2 of the housing 20 .

上段的開口部70係設為可對前述的槽開口部66、68等進行觀視確認、接近的開口,並可藉由面板74來打開關閉。下段的開口部72 係設為可對前述的匯集槽47等進行觀視確認、接近的開口,並可藉由面板76來打開關閉。 The upper opening 70 is an opening through which the aforementioned groove openings 66 , 68 and the like can be viewed and accessed, and can be opened and closed by the panel 74 . Lower opening 72 It is an opening through which the aforementioned collection tank 47 and the like can be viewed and accessed, and can be opened and closed by the panel 76 .

在圖21、圖22所示之例中,上段例示:化學模組7A、7B的開口部70呈開放,而藉由面板74來關閉化學模組7C的開口部70的狀態;下段例示:化學模組7B的開口部72呈開放,而藉由面板76來關閉化學模組7A、7C的開口部72的狀態。 In the examples shown in FIGS. 21 and 22 , the upper section illustrates a state in which the openings 70 of the chemical modules 7A and 7B are open, and the opening 70 of the chemical module 7C is closed by the panel 74 ; the lower section illustrates: the chemical The opening 72 of the module 7B is opened, and the openings 72 of the chemical modules 7A and 7C are closed by the panel 76 .

在匯集槽47的背面78設置有配管57。配管57為不同於前述配管56的另一配管,且該配管57與藥液槽32連接。配管57係用以進行供給或排放使用在藥液槽32的藥液的配管,且該配管57係插通設置於匯集槽47的背面78的開口80,而與藥液槽32連接。配管57沒有配置於第二收容空間S2,且從匯集槽47的背面78朝向背面側N2延伸。 A pipe 57 is provided on the back surface 78 of the collecting tank 47 . The piping 57 is another piping different from the aforementioned piping 56 , and is connected to the chemical solution tank 32 . The pipe 57 is a pipe for supplying or discharging the chemical solution used in the chemical solution tank 32 , and is inserted into the opening 80 provided on the back surface 78 of the collecting tank 47 to be connected to the chemical solution tank 32 . The pipe 57 is not arranged in the second storage space S2, but extends from the back surface 78 of the collection tank 47 toward the back surface side N2.

在匯集槽47的背面78還連接排氣管道82。排氣管道82係用以將匯集槽47的內部產生的氣體往殼體20的外部排放的管道。排氣管道82可安裝於固定地設置於殼體20的排氣口84。排氣口84連接用以將排氣管道82往外部連接的連接配管85。 The exhaust pipe 82 is also connected to the back surface 78 of the collecting tank 47 . The exhaust duct 82 is a duct for discharging the gas generated inside the collecting tank 47 to the outside of the casing 20 . The exhaust pipe 82 may be installed in an exhaust port 84 fixedly provided on the housing 20 . The exhaust port 84 is connected to a connection pipe 85 for connecting the exhaust duct 82 to the outside.

殼體20的背面側N2還設置複數個連接器86。連接器86為用以將配管56、57等的配管連接至外部的連接部(例如,一觸式連接器)。複數個連接器86係安裝於固定在殼體20的板部87。 A plurality of connectors 86 are also provided on the back side N2 of the housing 20 . The connector 86 is a connection part (for example, a one-touch connector) for connecting pipes such as the pipes 56 and 57 to the outside. The plurality of connectors 86 are mounted on the plate portion 87 fixed to the housing 20 .

圖21顯示匯集槽47朝正面側N1抽出的狀態,圖22顯示匯集槽47朝背面側N2收回的狀態(亦即,匯集槽47設置於殼體20內部的狀態)。 FIG. 21 shows a state in which the collecting tank 47 is drawn out toward the front side N1, and FIG. 22 shows a state in which the collecting tank 47 is retracted toward the back side N2 (that is, a state in which the collecting tank 47 is installed inside the housing 20).

如圖22所示,在匯集槽47朝背面側N2收回的狀態時,配管56、57都會處於到達連接器86的位置,藉由作業者將配管56、57的端部安裝至連接器86,藉此使配管56、57與外部的供給源、排放口等連接。排氣管道82也同樣地,藉由作業者將排氣管道82安裝至排氣口84,藉此使排氣管道82連接到外部。 As shown in Fig. 22, when the collecting tank 47 is retracted toward the back side N2, the pipes 56 and 57 are in a position to reach the connector 86. The operator installs the ends of the pipes 56 and 57 to the connector 86, Thereby, the pipes 56 and 57 are connected to an external supply source, a discharge port, etc. Likewise for the exhaust duct 82, the operator installs the exhaust duct 82 to the exhaust port 84, thereby connecting the exhaust duct 82 to the outside.

殼體20的內部還設置可將匯集槽47抽出的軌道88。軌道88為沿著Y軸方向(第一方向)延伸的構件,在本實施型態中由三根軌道88A、88B、88C所構成。兩端的軌道88A、88B係例如具有如夾持匯集槽47之左右角部而豎立成L字狀的形狀,且使匯集槽47一面沿著X軸方向(第二方向)定位一面行進。 The interior of the housing 20 is also provided with a track 88 for extracting the collecting tank 47 . The rail 88 is a member extending along the Y-axis direction (first direction), and in this embodiment is composed of three rails 88A, 88B, and 88C. The rails 88A and 88B at both ends have, for example, an L-shaped shape sandwiching the left and right corners of the collection trough 47, and move while positioning the collection trough 47 in the X-axis direction (second direction).

在上述構成中,要從圖22所示的運轉狀態轉換成圖21所示的維護狀態,做業者只要藉由手動將配管56、57從連接器86卸下,並且將排氣管道82從排氣口84卸下即可。作業者也解除其他零件必要部位的連接關係後,將匯集槽47朝正面側N1推出,從而使匯集槽47沿著軌道88行進。藉此,可將包含匯集槽47的基板處理單元45往殼體20的外部抽出。如此一來,就可容易地將基板處理單元45抽出。 In the above structure, in order to switch from the operating state shown in Fig. 22 to the maintenance state shown in Fig. 21, the operator only needs to manually remove the pipes 56 and 57 from the connector 86 and remove the exhaust pipe 82 from the exhaust pipe. Just remove the air port 84. After the operator also releases the connections between necessary parts of other parts, he pushes the collecting trough 47 toward the front side N1 so that the collecting trough 47 moves along the rail 88 . Thereby, the substrate processing unit 45 including the collection tank 47 can be drawn out of the casing 20 . In this way, the substrate processing unit 45 can be easily extracted.

根據上述構成,藉由將藥液槽32、洗淨槽34及匯集槽47與殼體20分離,並且將匯集槽47構成為可對殼體20進行抽出,藉此作業者可容易地進行維護,並可實現使維護性提升的化學模組7及基板處理單元45。 According to the above structure, by separating the chemical tank 32, the cleaning tank 34, and the collecting tank 47 from the casing 20, and configuring the collecting tank 47 to be able to extract the casing 20, the operator can easily perform maintenance. , and can realize the chemical module 7 and the substrate processing unit 45 that improve maintainability.

再者,藉由構成為:藥液槽32和洗淨槽34以沿Y軸方向(第一方向)排列的狀態,匯集槽47也可沿著Y軸方向(第一方向)進行抽出, 藉此可一面確保高維護性並一面縮小化學模組7的X軸方向的尺寸(橫寬)。藉此,即使沿著X軸方向連結複數個化學模組7的情形時,基板處理裝置1也不易變得大型,可謀求基板處理裝置1的省空間化。 Furthermore, by configuring the chemical solution tank 32 and the cleaning tank 34 to be arranged along the Y-axis direction (the first direction), the collection tank 47 can also be drawn out along the Y-axis direction (the first direction). This makes it possible to reduce the size (horizontal width) of the chemical module 7 in the X-axis direction while ensuring high maintainability. Thereby, even when a plurality of chemical modules 7 are connected along the X-axis direction, the substrate processing apparatus 1 is less likely to become large, and space saving of the substrate processing apparatus 1 can be achieved.

(作用、功效) (function, efficacy)

如上所述,實施型態的化學模組7(基板處理模組)係具備:殼體20;及匯集槽47;其中,匯集槽47係以沿Y軸方向(第一方向)排列的狀態來收容兩個可分別配置基板4的藥液槽32及洗淨槽34(處理槽),且匯集槽47係配置於殼體20的內部,且匯集槽47、藥液槽32及洗淨槽34係與殼體20分離。 As described above, the chemical module 7 (substrate processing module) of the embodiment is provided with: the housing 20; and the collection tank 47. Among them, the collection tank 47 is arranged in the Y-axis direction (the first direction). Accommodating two chemical liquid tanks 32 and cleaning tanks 34 (processing tanks) that can be respectively configured with the substrate 4, and the collecting tank 47 is arranged inside the housing 20, and the collecting tank 47, the chemical liquid tank 32 and the cleaning tank 34 The system is separated from the housing 20.

根據如此的構成,可將匯集槽47構成為可對殼體20進行抽出,且可將收容於匯集槽47的藥液槽32、洗淨槽34等、其他的構件予以在從殼體20抽出的狀態下進行維護。藉此,可實現高維護性。另外,在本說明書中,包括藥液槽32、洗淨槽34在內,將對於基板4進行任意處理(包含藥液處理、洗淨處理)之槽均稱為「處理槽」。 With such a configuration, the collecting tank 47 can be configured to be retractable from the casing 20 , and other components such as the chemical solution tank 32 and the washing tank 34 accommodated in the collecting tank 47 can be retracted from the casing 20 . Perform maintenance under the condition. This enables high maintainability. In addition, in this specification, including the chemical solution tank 32 and the cleaning tank 34, any tank that performs any processing (including chemical solution processing and cleaning processing) on the substrate 4 is called a "processing tank."

此外,在實施型態的化學模組7中,匯集槽47可對於殼體20沿著Y軸方向(第一方向)進行抽出。根據如此的構成,可縮小化學模組7的X軸方向的尺寸,可謀求省空間化。 In addition, in the chemical module 7 of the embodiment, the collection tank 47 can be extracted along the Y-axis direction (first direction) from the housing 20 . According to such a structure, the size of the chemical module 7 in the X-axis direction can be reduced, thereby achieving space saving.

此外,在實施型態的化學模組7中,匯集槽47可朝殼體20的正面側N1進行抽出。根據如此的構成,可在匯集槽47的正面側N1進行維護作業,且可在殼體20的背面側N2進行另外的作業(包含配管56、57、排氣管道82的裝卸作業)。 In addition, in the chemical module 7 of the embodiment, the collecting tank 47 can be drawn out toward the front side N1 of the housing 20 . According to such a structure, maintenance work can be performed on the front side N1 of the collection tank 47, and other work (including attachment and detachment work of the pipes 56, 57 and the exhaust duct 82) can be performed on the back side N2 of the casing 20.

此外,在實施型態的化學模組7中還具有與洗淨槽34(處理槽)連接的配管56,且匯集槽47形成:收容洗淨槽34的第一收容空間S1、及收容從洗淨槽34延伸而來的配管56的第二收容空間S2。根據如此的構成,可包括藥液槽32、洗淨槽34在內,將配管56等其他的構件一體地抽出而進行維護。 In addition, the chemical module 7 of the embodiment also has a pipe 56 connected to the washing tank 34 (processing tank), and the collecting tank 47 forms: a first accommodation space S1 for accommodating the washing tank 34, and an accommodating slave washing tank. The second accommodation space S2 of the pipe 56 extends from the clean tank 34 . According to such a structure, other components including the chemical solution tank 32 and the cleaning tank 34, such as the pipe 56, can be extracted integrally for maintenance.

此外,在實施型態的化學模組7中第二收容空間S2係設置於第一收容空間S1的下方。根據如此的構成,可有效運用匯集槽47中之上下的空間,並可縮小X軸方向的匯集槽47的尺寸而謀求省空間化。 In addition, in the chemical module 7 of the embodiment, the second storage space S2 is provided below the first storage space S1. According to such a structure, the upper and lower spaces in the collecting tank 47 can be effectively utilized, and the size of the collecting tank 47 in the X-axis direction can be reduced to achieve space saving.

此外,在實施型態的化學模組7中還具備連接器86,該連接器86係可裝卸地連接從第二收容空間S2延伸而來的配管56。根據如此的構成,只要將配管56從連接器86拆卸就可容易地抽出匯集槽47。 In addition, the chemical module 7 of the embodiment further includes a connector 86 for detachably connecting the pipe 56 extending from the second storage space S2. According to such a structure, the collecting tank 47 can be easily drawn out simply by detaching the pipe 56 from the connector 86 .

此外,在實施型態的化學模組7中,殼體20係具有使匯集槽47行進的軌道88。根據如此的構成,使用簡單的機構就可將匯集槽47設為可抽出。 In addition, in the chemical module 7 of the embodiment, the housing 20 has the rail 88 for moving the collection tank 47 . According to such a structure, the collection tank 47 can be made withdrawable using a simple mechanism.

此外,在實施型態的化學模組7中還具備:第一搬運部11、及第二搬運部48;該第一搬運部11可於與Y軸方向(第一方向)交叉的X軸方向(第二方向)連接其他的化學模組7,且使基板4沿著Y軸方向移動;該第二搬運部48係使基板4沿著X軸方向移動。根據如此的構成,一面可於X軸方向連接化學模組7,一面可在各化學模組7中將匯集槽47設為可抽出。 In addition, the chemical module 7 of the embodiment further includes a first conveyance part 11 and a second conveyance part 48; the first conveyance part 11 can move in the X-axis direction intersecting the Y-axis direction (first direction). (Second direction) The other chemical modules 7 are connected and the substrate 4 is moved along the Y-axis direction; the second conveying part 48 moves the substrate 4 along the X-axis direction. According to such a structure, the chemical modules 7 can be connected in the X-axis direction, and the collecting tank 47 can be made withdrawable in each chemical module 7 .

此外,實施型態的基板處理裝置1係具備:化學模組7(基板處理模組)、以及於與Y軸方向(第一方向)交叉的X軸方向(第二方向)與化 學模組7連結的其他的化學模組7。根據如此的構成,一面可連結複數個化學模組7,一面可實現維護性較高的基板處理裝置1。 In addition, the substrate processing apparatus 1 of the embodiment includes a chemical module 7 (substrate processing module), and an X-axis direction (second direction) intersecting the Y-axis direction (first direction) and a chemical module 7 (substrate processing module). Learn Module 7 is linked to other Chemistry Module 7. According to such a structure, a plurality of chemical modules 7 can be connected, and a substrate processing apparatus 1 with high maintainability can be realized.

此外,實施型態的基板處理單元45係具備:可分別配置基板4的藥液槽32及洗淨槽34(兩個處理槽)、以及以沿Y軸方向(第一方向)排列的狀態來收容藥液槽32及洗淨槽34的匯集槽47;其中,匯集槽47、藥液槽32及洗淨槽34係與將匯集槽47配置於內部的化學模組7的殼體20分離。根據如此的構成,可達成與實施型態的化學模組7同樣的功效(參照段落0157)。 In addition, the substrate processing unit 45 of the embodiment is equipped with a chemical tank 32 and a cleaning tank 34 (two processing tanks) in which the substrate 4 can be separately arranged and arranged in a state along the Y-axis direction (the first direction). The collection tank 47 accommodates the chemical solution tank 32 and the cleaning tank 34; the collection tank 47, the chemical solution tank 32 and the cleaning tank 34 are separated from the housing 20 of the chemical module 7 in which the collecting tank 47 is arranged. According to such a structure, the same effect as that of the chemical module 7 of the embodiment can be achieved (see paragraph 0157).

此外,在實施型態的基板處理單元45中,匯集槽47係可沿著Y軸方向(第一方向)相對於化學模組7的殼體20進行抽出。根據如此的構成,可縮小基板處理單元45的X軸方向的尺寸,並可謀求省空間化。 In addition, in the substrate processing unit 45 of the embodiment, the collecting tank 47 is extractable relative to the housing 20 of the chemical module 7 along the Y-axis direction (the first direction). According to such a structure, the size of the substrate processing unit 45 in the X-axis direction can be reduced, and space can be saved.

(校平機構) (leveling agency)

在實施型態的化學模組7中還設置用以進行藥液槽32及洗淨槽34之校平的校平機構,以使藥液槽32及洗淨槽34中之漲高處理的處理效率。使用圖23至圖28說明校平機構。 The chemical module 7 of the embodiment is also provided with a leveling mechanism for leveling the chemical solution tank 32 and the cleaning tank 34 so that the raising process in the chemical solution tank 32 and the cleaning tank 34 can be carried out. efficiency. The leveling mechanism will be described using Figures 23 to 28.

圖23為從側方觀看包含校平機構90、91的基板處理單元45時的概略圖,圖24A、圖24B分別為前視觀看藥液槽32、洗淨槽34時的概略圖。 23 is a schematic view of the substrate processing unit 45 including the leveling mechanisms 90 and 91 when viewed from the side, and FIGS. 24A and 24B are schematic views of the chemical solution tank 32 and the cleaning tank 34 when viewed from the front, respectively.

如圖23所示,基板處理單元45的匯集槽47的內部係設置校平機構90、91。校平機構90為用以進行藥液槽32之校平的機構,而校平機構91為用以進行洗淨槽34之校平的機構。 As shown in FIG. 23 , leveling mechanisms 90 and 91 are provided inside the collection tank 47 of the substrate processing unit 45 . The leveling mechanism 90 is a mechanism used for leveling the chemical solution tank 32 , and the leveling mechanism 91 is a mechanism used for leveling the washing tank 34 .

校平機構90係具備:高度變更部92、接觸部93及支持部94。同樣地,校平機構91係具備:高度變更部95、接觸部96及支持部97。校平機構90、91中每個構成要素具有同樣的構造,以下主要說明校平機構90。 The leveling mechanism 90 includes a height changing part 92, a contact part 93, and a supporting part 94. Similarly, the leveling mechanism 91 is provided with a height changing part 95, a contact part 96, and a support part 97. Each component of the leveling mechanisms 90 and 91 has the same structure. The leveling mechanism 90 will be mainly described below.

校平機構90的高度變更部92為用以變更藥液槽32中之特定部位的高度的構件。本實施型態的高度變更部92係設置於藥液槽32中的背面側N2。 The height changing portion 92 of the leveling mechanism 90 is a member for changing the height of a specific portion of the chemical solution tank 32 . The height changing part 92 of this embodiment is provided on the back side N2 of the chemical solution tank 32 .

如圖24A所示,高度變更部92係具有兩個於X軸方向隔開間隔的高度變更部92A、92B。高度變更部92A係與圖中左側的藥液槽32的角部32a抵接,而高度變更部92B係與圖中右側的藥液槽32的角部32b抵接。高度變更部92A係設置於匯集槽47之一方側的內壁面47A,而高度變更部92B係設置於匯集槽47之另一方側的內壁面47A。高度變更部92A、92B可分別獨立地變更高度。 As shown in FIG. 24A , the height changing part 92 has two height changing parts 92A and 92B spaced apart in the X-axis direction. The height change portion 92A is in contact with the corner portion 32a of the chemical solution tank 32 on the left side in the figure, and the height change portion 92B is in contact with the corner portion 32b of the chemical solution tank 32 on the right side in the figure. The height changing part 92A is provided on the inner wall surface 47A on one side of the collecting tank 47 , and the height changing part 92B is provided on the inner wall surface 47A on the other side of the collecting tank 47 . The height changing parts 92A and 92B can change the height independently.

接觸部93為設置於藥液槽32的構件,且與支持部94接觸。本實施型態的接觸部93具有凸狀的球面,亦稱為「球部」。支持部94為與接觸部93接觸而支持接觸部93的構件。本實施型態的支持部94具有承載屬於球部之接觸部93的凹狀的球面,亦稱為「球承載部」。 The contact portion 93 is a member provided in the chemical solution tank 32 and is in contact with the support portion 94 . The contact portion 93 of this embodiment has a convex spherical surface, which is also called a "ball portion". The support portion 94 is a member that contacts the contact portion 93 and supports the contact portion 93 . The support portion 94 of this embodiment has a concave spherical surface that supports the contact portion 93 belonging to the ball portion, which is also called a "ball bearing portion."

利用支持部94來承載並支持設置於藥液槽32的接觸部93,藉此可自如地調節藥液槽32的姿勢。使用前述高度變更部92A、92B來變更藥液槽32的兩個部位的高度,藉此可將藥液槽32的姿勢朝任意的方向調節,就能夠高精確地保持藥液槽32的平行度。藉此,當使藥液槽32中 藥液漲高來處理基板4時,易使藥液從藥液槽32的四邊均勻地漲高,可使基板4的處理效率提升。 The support portion 94 is used to carry and support the contact portion 93 provided in the chemical solution tank 32, whereby the posture of the chemical solution tank 32 can be freely adjusted. By using the aforementioned height changing portions 92A and 92B to change the heights of two parts of the chemical solution tank 32, the posture of the chemical solution tank 32 can be adjusted in any direction, and the parallelism of the chemical solution tank 32 can be maintained with high accuracy. . Thereby, when the chemical liquid tank 32 is When the chemical liquid rises to process the substrate 4 , it is easy for the chemical liquid to rise evenly from the four sides of the chemical liquid tank 32 , thereby improving the processing efficiency of the substrate 4 .

再者,與於藥液槽32的四個部位的角部分別設置高度變更部的情形相比,只要變更兩個部位的角部的高度即可,因此可容易並且在短時間進行校平作業,可實現高維護性。 Furthermore, compared with the case where height changing portions are respectively provided at the corners of the four locations of the chemical solution tank 32, only the heights of the corners of two locations need to be changed. Therefore, the leveling operation can be performed easily and in a short time. , achieving high maintainability.

同樣地,校平機構91的高度變更部95亦具有與高度變更部92同樣的構造,接觸部96亦具有與接觸部93同樣的構造(球部),且支持部97也具有與支持部94同樣的構造(球承載部)。如圖24B所示,利用支持部97來承載並支持設置於洗淨槽34的接觸部96,只要藉由兩個部位的高度變更部95A、95B來變更洗淨槽34的高度,就可自如地調整洗淨槽34的姿勢。藉此,易使藥液從洗淨槽34的四邊均勻地漲高,可使基板4的處理效率提升。 Similarly, the height change part 95 of the leveling mechanism 91 also has the same structure as the height change part 92 , the contact part 96 also has the same structure (ball part) as the contact part 93 , and the support part 97 also has the same structure as the support part 94 Same structure (ball bearing part). As shown in FIG. 24B , the contact portion 96 provided in the washing tank 34 is supported and supported by the support portion 97 , and the height of the washing tank 34 can be freely changed by using the two height changing portions 95A and 95B. Adjust the position of the washing tank 34 accordingly. This makes it easier for the chemical liquid to rise evenly from the four sides of the cleaning tank 34 , thereby improving the processing efficiency of the substrate 4 .

如圖23所示,藥液槽32的校平機構90中,高度變更部92係設置於背面側N2,並且接觸部93和支持部94設置於正面側N1。相對於此,洗淨槽34的校平機構91中,高度變更部95係設置於正面側N1,並且接觸部96和支持部97係設置於背面側N2。 As shown in FIG. 23 , in the leveling mechanism 90 of the chemical tank 32 , the height changing part 92 is provided on the back side N2 , and the contact part 93 and the supporting part 94 are provided on the front side N1 . On the other hand, in the leveling mechanism 91 of the washing tank 34, the height change part 95 is provided on the front side N1, and the contact part 96 and the support part 97 are provided on the back side N2.

根據上述配置,當進行藥液槽32之校平時,作業者只要從匯集槽47的背面78來接近高度變更部92即可,當進行洗淨槽34之校平時,只要從匯集槽47的正面58來接近高度變更部95即可。因此,無須接近匯集槽47的中央部,從可從匯集槽47的外側容易地接近高度變更部92、95,可容易地進行校平作業。 According to the above arrangement, when leveling the chemical solution tank 32, the operator only needs to approach the height changing portion 92 from the back 78 of the collecting tank 47. When leveling the washing tank 34, the operator only needs to approach the height changing portion 92 from the front side of the collecting tank 47. 58 to approach the height changing part 95. Therefore, it is not necessary to approach the central part of the collecting tank 47, but the height changing parts 92 and 95 can be easily accessed from the outside of the collecting tank 47, and the leveling operation can be easily performed.

在此,使用圖25說明高度變更部92、95的具體構成。圖25為從側方觀看高度變更部92(95)時的概略放大圖。 Here, the specific structure of the height changing parts 92 and 95 is demonstrated using FIG. 25. Fig. 25 is a schematic enlarged view of the height changing portion 92 (95) when viewed from the side.

如圖25所示,高度變更部92(95)係具備:承載台100、調節螺栓102以及導引部104。 As shown in FIG. 25 , the height change portion 92 (95) includes a mounting base 100, an adjustment bolt 102, and a guide portion 104.

承載台100為用以承載藥液槽32的角部32a、32b的板狀部分。從下方側利用調節螺栓102來支持承載台100。調節螺栓102為用以使承載台100上昇下降的構件,且將頭部103以朝向下方的狀態來配置。當作業者使調節螺栓102的頭部103旋轉時(箭頭R),調節螺栓102和被調節螺栓102支持的承載台100會一體地上下移動(箭頭Z1)。藉此,可分別變更藥液槽32的角部32a、32b的高度。 The supporting platform 100 is a plate-shaped portion for supporting the corner portions 32 a and 32 b of the chemical solution tank 32 . The mounting base 100 is supported from the lower side by adjusting bolts 102 . The adjustment bolt 102 is a member for raising and lowering the stage 100, and is arranged with the head 103 facing downward. When the operator rotates the head 103 of the adjusting bolt 102 (arrow R), the adjusting bolt 102 and the platform 100 supported by the adjusting bolt 102 move up and down together (arrow Z1). Thereby, the heights of the corner portions 32a and 32b of the chemical solution tank 32 can be changed respectively.

調節螺栓102係與導引部104螺合。導引部104係以螺合了調節螺栓102的狀態下支持調節螺栓102,並且導引承載台100的上下移動。導引部104具有大致L字狀的剖面形狀,並且插通形成於承載台100的貫通孔106。由調節螺栓102所支持的承載台100係保持在與導引部104中之朝上下方向豎立之部分的接合關係的狀態下進行上下移動,藉此一面保持大致水平狀態一面進行上下移動。 The adjusting bolt 102 is threaded with the guide portion 104 . The guide part 104 supports the adjusting bolt 102 in a state where the adjusting bolt 102 is screwed together, and guides the up and down movement of the platform 100 . The guide portion 104 has a substantially L-shaped cross-sectional shape and is inserted into the through hole 106 formed in the mounting base 100 . The platform 100 supported by the adjusting bolt 102 moves up and down while maintaining an engagement relationship with the vertically erected portion of the guide portion 104, thereby moving up and down while maintaining a substantially horizontal state.

導引部104係固定於匯集槽47的內壁面47A、47B(圖24A)。相對於此,承載台100及調節螺栓102係與內壁面47A、47B分離,而載置藥液槽32的承載台100可相對於導引部104及匯集槽47進行相對性地上下移動。 The guide part 104 is fixed to the inner wall surfaces 47A, 47B of the collecting tank 47 (Fig. 24A). In contrast, the platform 100 and the adjusting bolt 102 are separated from the inner wall surfaces 47A and 47B, and the platform 100 on which the chemical tank 32 is placed can relatively move up and down relative to the guide portion 104 and the collecting tank 47 .

接著,使用圖26說明接觸部93及支持部94的具體構成。圖26為顯示關於接觸部93(96)和支持部94(97)的縱剖面的概略放大圖。 Next, the specific structure of the contact part 93 and the support part 94 is demonstrated using FIG. 26. FIG. 26 is a schematic enlarged view showing a longitudinal section of the contact portion 93 (96) and the support portion 94 (97).

如圖26所示,藥液槽32係設置用以安裝接觸部93的安裝部107。接觸部93係安裝於安裝部107的下表面。 As shown in FIG. 26 , the chemical solution tank 32 is provided with a mounting portion 107 for mounting the contact portion 93 . The contact portion 93 is mounted on the lower surface of the mounting portion 107 .

接觸部93為具有凸狀之球面108的球部,承載接觸部93的支持部94為具有凹狀之球面110的球承載部。在本實施型態中,使球面108、110的曲率半徑不同。具體而言,球面108的曲率半徑D1設定比球面110的曲率半徑D2還短。若依此方式設定曲率半徑,當凸狀的球面108與凹狀的球面110接觸時,形成大致一點的接觸部位112,即形成所謂的點接觸。將接觸部93與支持部94設為點接觸,藉此可使球面108沿著球面110而平滑地移動,並可容易地進行藥液槽32的姿勢調整。另外,若為接觸部93和支持部94為點接觸,則曲率半徑D1、D2可為任意的長度,例如亦包含棒狀、錘形狀的前端形成微小的球面的情形。 The contact portion 93 is a ball portion with a convex spherical surface 108 , and the support portion 94 carrying the contact portion 93 is a ball bearing portion with a concave spherical surface 110 . In this embodiment, the radii of curvature of the spherical surfaces 108 and 110 are different. Specifically, the radius of curvature D1 of the spherical surface 108 is set shorter than the radius of curvature D2 of the spherical surface 110 . If the radius of curvature is set in this manner, when the convex spherical surface 108 contacts the concave spherical surface 110, a substantially one-point contact portion 112 is formed, which is a so-called point contact. The contact portion 93 and the support portion 94 are in point contact, whereby the spherical surface 108 can move smoothly along the spherical surface 110 and the posture of the chemical solution tank 32 can be easily adjusted. In addition, if the contact portion 93 and the support portion 94 are in point contact, the curvature radii D1 and D2 may be any length, including, for example, the case where the tip of a rod or a hammer forms a minute spherical surface.

使用圖27、圖28說明具有上述構成的校平機構90、91的配置關係等。圖27、圖28為藥液槽32及洗淨槽34的概略俯視圖,並為含有校平機構90、91之匯集槽47的概略俯視圖。圖27為顯示於將藥液槽32和洗淨槽34配置於匯集槽47的狀態,圖28為顯示將藥液槽32和洗淨槽34從匯集槽47拆卸後的狀態。 The arrangement relationship, etc. of the leveling mechanisms 90 and 91 having the above-mentioned structure will be described using FIGS. 27 and 28 . 27 and 28 are schematic top views of the chemical solution tank 32 and the cleaning tank 34, and are a schematic top view of the collection tank 47 including the leveling mechanisms 90 and 91. FIG. 27 shows the state in which the chemical solution tank 32 and the cleaning tank 34 are arranged in the collecting tank 47 . FIG. 28 shows the state in which the chemical solution tank 32 and the cleaning tank 34 are removed from the collecting tank 47 .

如圖27所示,藥液槽32還具有兩個棒狀部114。棒狀部114為固定於藥液槽32的側面並且沿著Y軸方向呈棒狀地延伸的構件。每個棒狀部114的一端被高度變更部92A、92B的承載台100所承載。承載台100承載棒狀部114的一端,從而變更承載台100的高度,藉此可調節藥液槽32的姿勢。 As shown in FIG. 27 , the chemical solution tank 32 also has two rod-shaped parts 114 . The rod-shaped portion 114 is a member fixed to the side surface of the chemical solution tank 32 and extending in a rod-like shape along the Y-axis direction. One end of each rod-shaped portion 114 is supported by the supporting platform 100 of the height changing portions 92A and 92B. The supporting platform 100 supports one end of the rod-shaped portion 114, thereby changing the height of the supporting platform 100, thereby adjusting the posture of the chemical solution tank 32.

同樣地,洗淨槽34係具有兩個棒狀部116。棒狀部116各自被高度變更部95A、95B的承載台100所承載,藉由變更承載台100的高度,可調節洗淨槽34的姿勢。 Similarly, the washing tank 34 has two rod-shaped parts 116 . The rod-shaped parts 116 are each carried by the mounting base 100 of the height changing parts 95A and 95B. By changing the height of the mounting base 100, the posture of the washing tank 34 can be adjusted.

如圖27所示,將接觸部93、96一體地安裝的安裝部107,相對於在藥液槽32設置於正面側N1,在洗淨槽34則是安裝於背面側N2。藉此,藥液槽32的安裝部107和洗淨槽34的安裝部107係與匯集槽47的中央部鄰接而配置。將兩個安裝部107匯集配置於匯集槽47的中央部,藉此高度變更時在匯集槽47的端部進行,無需接近匯集槽47的中央部,而可有效運用匯集槽47的空間,並且可容易地進行姿勢調節。 As shown in FIG. 27 , the mounting portion 107 that integrally mounts the contact portions 93 and 96 is mounted on the front side N1 of the chemical solution tank 32 and is mounted on the back side N2 of the cleaning tank 34 . Thereby, the mounting part 107 of the chemical solution tank 32 and the mounting part 107 of the washing tank 34 are arrange|positioned adjacent to the center part of the collecting tank 47. The two mounting parts 107 are arranged together at the center of the collecting tank 47. This allows the height to be changed at the end of the collecting tank 47 without approaching the central part of the collecting tank 47, thereby effectively utilizing the space of the collecting tank 47, and Posture adjustments can be made easily.

如圖28所示,在將藥液槽32和洗淨槽34從匯集槽47拆卸後的狀態下,支持部94、97係設置於匯集槽47的底面51C,而導引部104係設置於匯集槽47的內壁面47A、47B。雖然省略圖示,但承載台100和調節螺栓102都與導引部104接合,且高度變更部92A、92B、95A、95B都設置於匯集槽47。 As shown in FIG. 28 , in a state where the chemical solution tank 32 and the cleaning tank 34 are removed from the collecting tank 47 , the supporting parts 94 and 97 are provided on the bottom surface 51C of the collecting tank 47 , and the guide part 104 is provided on the bottom surface 51C of the collecting tank 47 . Inner wall surfaces 47A and 47B of the collecting tank 47 . Although illustration is omitted, the mounting base 100 and the adjusting bolt 102 are both engaged with the guide portion 104 , and the height changing portions 92A, 92B, 95A, and 95B are all provided in the collecting groove 47 .

在本實施型態中,將屬於球承載部的支持部94、97和高度變更部92、95設置於匯集槽47,並且將屬於球部的接觸部93、96設置於藥液槽32及洗淨槽34(處理槽)。如此一來,可將校平機構90、91容易地設置於藥液槽32及洗淨槽34與匯集槽47的接觸部位。 In this embodiment, the support parts 94 and 97 and the height changing parts 92 and 95 belonging to the ball bearing part are provided in the collecting tank 47, and the contact parts 93 and 96 belonging to the ball part are provided in the chemical tank 32 and the washing machine. Clean tank 34 (processing tank). In this way, the leveling mechanisms 90 and 91 can be easily disposed at the contact portions of the chemical solution tank 32 and the cleaning tank 34 and the collecting tank 47 .

根據上述構成,用以進行藥液槽32之校平的校平機構90係具有兩個高度變更部92、接觸部93及支持部94,而用以進行洗淨槽34之校平的校平機構91也同樣地具有兩個高度變更部95、接觸部96及支持部 97。藉此,與如以往構成方式在處理槽的四個角落進行高度變更的情形相比,可容易地執行藥液槽32和洗淨槽34的校平作業,可實現高維護性。 According to the above structure, the leveling mechanism 90 for leveling the chemical solution tank 32 has two height changing parts 92, the contact part 93 and the supporting part 94, and is used for leveling the washing tank 34. The mechanism 91 also has two height changing parts 95, a contact part 96 and a supporting part. 97. Thereby, compared with the case where the height of the treatment tank is changed at the four corners of the conventional structure, the leveling operation of the chemical tank 32 and the washing tank 34 can be easily performed, and high maintainability can be achieved.

(作用、功效) (function, efficacy)

如上所述,實施型態的化學模組7(基板處理模組)係具備:殼體20;在殼體20內沿Y軸方向(第一方向)排列,且可分別配置基板4的洗淨槽34及藥液槽32(處理槽)、以及用以進行洗淨槽34及藥液槽32之校平的校平機構91、90;其中,校平機構91、90分別具有:設置於洗淨槽34、藥液槽32的接觸部96、93;與接觸部96、93接觸並承載接觸部96、93的支持部97、94;以及用以變更洗淨槽34及藥液槽32之高度的至少兩個高度變更部95A、95B、92A、92B。 As described above, the chemical module 7 (substrate processing module) of the embodiment is provided with the housing 20 , which is arranged along the Y-axis direction (the first direction) in the housing 20 and can be separately arranged for cleaning the substrate 4 The tank 34 and the chemical liquid tank 32 (processing tank), and the leveling mechanisms 91 and 90 used to level the cleaning tank 34 and the chemical liquid tank 32; wherein the leveling mechanisms 91 and 90 respectively have: The contact parts 96 and 93 of the clean tank 34 and the chemical solution tank 32; the support parts 97 and 94 that are in contact with the contact parts 96 and 93 and carry the contact parts 96 and 93; and the parts used to change the cleaning tank 34 and the chemical solution tank 32. The height of at least two height changing parts 95A, 95B, 92A, 92B.

根據如此的構成,在排列有兩個處理槽的化學模組7中,使用簡單的構成就可容易地進行處理槽的校平,可實現維護性高的化學模組7。另外,接觸部96、93只要至少一部分為球狀即可,例如亦可整體為球狀。此外,球狀的大小沒有具體限定。 According to such a configuration, in the chemical module 7 in which two processing tanks are arranged, the processing tanks can be easily leveled using a simple configuration, and the chemical module 7 with high maintainability can be realized. In addition, the contact portions 96 and 93 only need to be spherical at least partially, for example, the entire contact portion 96 and 93 may be spherical. In addition, the size of the spherical shape is not specifically limited.

此外,在實施型態的化學模組7中,處理槽具備:洗淨槽34(第一槽)、及藥液槽32(第二槽);校平機構91、90具備:用以進行洗淨槽34之校平的校平機構91(第一校平機構)、以及用以進行藥液槽32之校平的校平機構90(第二校平機構)。此外,校平機構91具有:接觸部96、支持部97、以及兩個用以變更洗淨槽34之高度的高度變更部95A、95B;校平機構90具有:接觸部93、支持部94、以及兩個用以變更藥液槽32之高度的高度變更部92A、92B。根據如此的構成,就可高精確地校平每個洗淨槽34及藥液槽32。 In addition, in the chemical module 7 of the embodiment, the treatment tank is equipped with a cleaning tank 34 (first tank) and a chemical tank 32 (second tank); and the leveling mechanisms 91 and 90 are equipped with: for cleaning. A leveling mechanism 91 (first leveling mechanism) for leveling the clean tank 34, and a leveling mechanism 90 (second leveling mechanism) for leveling the chemical tank 32. In addition, the leveling mechanism 91 has a contact part 96, a support part 97, and two height changing parts 95A and 95B for changing the height of the washing tank 34; the leveling mechanism 90 has a contact part 93, a support part 94, and two height changing portions 92A and 92B for changing the height of the chemical solution tank 32 . According to such a structure, each cleaning tank 34 and the chemical solution tank 32 can be leveled with high precision.

此外,在實施型態的化學模組7中,洗淨槽34係相對於藥液槽32配置於殼體20的正面側N1,校平機構91的高度變更部95係設置於洗淨槽34的正面側N1,而校平機構90的高度變更部92係設置於藥液槽32的背面側N2。根據如此的構成,可從殼體20的正面側N1來接近而進行洗淨槽34的校平調節,且可從殼體20的背面側N2來接近而進行藥液槽32的校平調節。藉此,一面實現高維護性,一面縮短化學模組7的X軸方向的尺寸(橫寬)來謀求省空間化。 In addition, in the chemical module 7 of the embodiment, the cleaning tank 34 is arranged on the front side N1 of the housing 20 relative to the chemical solution tank 32 , and the height changing portion 95 of the leveling mechanism 91 is provided on the cleaning tank 34 The front side N1 of the leveling mechanism 90 is provided on the back side N2 of the chemical solution tank 32 . According to such a structure, the leveling adjustment of the washing tank 34 can be performed by approaching from the front side N1 of the housing 20, and the leveling adjustment of the chemical solution tank 32 can be performed by approaching from the back side N2 of the housing 20. Thereby, while achieving high maintainability, the size (horizontal width) of the chemical module 7 in the X-axis direction is shortened, thereby saving space.

此外,在實施型態的化學模組7還具備:第一搬運部11、及第二搬運部48;該第一搬運部11可於與Y軸方向(第一方向)交叉的X軸方向(第二方向)連接其他的化學模組7,且使基板4沿著Y軸方向移動;該第二搬運部48係使基板4沿著X軸方向移動。根據如此的構成,一面可於X軸方向連接化學模組7,一面可在各化學模組7中使用校平機構90、91來簡單地進行處理槽的校平。 In addition, the chemical module 7 in the embodiment further includes a first conveyance part 11 and a second conveyance part 48; the first conveyance part 11 can move in the X-axis direction (first direction) intersecting the Y-axis direction (first direction). second direction) to connect other chemical modules 7 and move the substrate 4 along the Y-axis direction; the second transport part 48 moves the substrate 4 along the X-axis direction. According to such a structure, the chemical modules 7 can be connected in the X-axis direction, and the leveling mechanisms 90 and 91 in each chemical module 7 can be used to easily level the treatment tank.

此外,實施型態的化學模組7還具備匯集槽47,該匯集槽47係收容洗淨槽34及藥液槽32,並且構成為與殼體20分離並可相對於殼體20沿Y軸方向(第一方向)進行抽出。根據如此的構成,可將匯集槽47進行抽出,藉此可更提升維護性。 In addition, the chemical module 7 of the embodiment further includes a collection tank 47 that accommodates the cleaning tank 34 and the chemical solution tank 32 and is configured to be separated from the housing 20 and moveable along the Y-axis relative to the housing 20 direction (first direction) to extract. According to such a structure, the collecting tank 47 can be extracted, thereby further improving maintainability.

此外,在實施型態的化學模組7中,校平機構91、90係設置於匯集槽47、與洗淨槽34及藥液槽32(處理槽)的接觸部位。根據如此的構成,可容易地設置校平機構91、90。 In addition, in the chemical module 7 of the embodiment, the leveling mechanisms 91 and 90 are provided at the contact portions of the collection tank 47 and the cleaning tank 34 and the chemical solution tank 32 (processing tank). With such a configuration, the leveling mechanisms 91 and 90 can be easily installed.

此外,在實施型態的化學模組7中,支持部97、94及高度變更部95、92係設置於匯集槽47,而接觸部96、93係設置於洗淨槽34及藥液槽32(處理槽)。根據如此的構成,可容易地設置校平機構91、90。 In addition, in the chemical module 7 of the embodiment, the support parts 97 and 94 and the height changing parts 95 and 92 are provided in the collection tank 47, and the contact parts 96 and 93 are provided in the cleaning tank 34 and the chemical solution tank 32 (processing tank). With such a configuration, the leveling mechanisms 91 and 90 can be easily installed.

此外,在實施型態的化學模組7中,接觸部96、93為一部分為球狀的球部,且支持部97、94為承載接觸部96、93的球承載部。根據如此的構成,可容易地設置校平機構91、90。 Furthermore, in the chemical module 7 of the embodiment, the contact portions 96 and 93 are partially spherical ball portions, and the support portions 97 and 94 are ball receiving portions that support the contact portions 96 and 93 . With such a configuration, the leveling mechanisms 91 and 90 can be easily installed.

此外,實施型態的基板處理裝置1具備:化學模組7(基板處理模組)、以及於與Y軸方向(第一方向)交叉的X軸方向(第二方向)與化學模組7連結的其他的化學模組7。根據如此的構成,一面可連結複數個化學模組7,一面可實現維護性較高的基板處理裝置1。 In addition, the substrate processing apparatus 1 of the embodiment includes a chemical module 7 (substrate processing module), and the chemical module 7 is connected to the X-axis direction (second direction) crossing the Y-axis direction (first direction). Other Chemistry Mods 7. According to such a structure, a plurality of chemical modules 7 can be connected, and a substrate processing apparatus 1 with high maintainability can be realized.

此外,實施型態的基板處理單元45係具備:可分別配置基板4的洗淨槽34及藥液槽32(處理槽)、以沿Y軸方向(第一方向)排列的狀態來收容洗淨槽34及藥液槽32的匯集槽47、以及用以進行洗淨槽34及藥液槽32之校平的校平機構91、90;其中,校平機構91、90具有:設置於洗淨槽34、藥液槽32的接觸部96、93;與接觸部96、93接觸並承載接觸部96、93的支持部97、94;以及用以變更洗淨槽34及藥液槽32之高度的至少兩個高度變更部95A、95B、92A、92B。根據如此的構成,可達成與實施型態的化學模組7同樣的功效(參照第0196段)。 In addition, the substrate processing unit 45 of the embodiment is equipped with a cleaning tank 34 and a chemical tank 32 (processing tank) that can separately arrange the substrate 4 and accommodate the cleaning tank in a state of being arranged along the Y-axis direction (first direction). The collecting tank 47 of the tank 34 and the chemical liquid tank 32, and the leveling mechanisms 91 and 90 used to level the cleaning tank 34 and the chemical liquid tank 32; among them, the leveling mechanisms 91 and 90 have: The contact parts 96 and 93 of the tank 34 and the chemical solution tank 32; the support parts 97 and 94 that are in contact with the contact parts 96 and 93 and carry the contact parts 96 and 93; and used to change the height of the cleaning tank 34 and the chemical solution tank 32 At least two height changing parts 95A, 95B, 92A, 92B. According to such a structure, the same effect as that of the chemical module 7 of the embodiment can be achieved (see paragraph 0196).

此外,實施型態的基板處理單元45中,匯集槽47係可與化學模組7的殼體20分離並相對於殼體20進行抽出。根據如此的構成,有助於實現維護性較高的基板處理模組。 In addition, in the substrate processing unit 45 of the embodiment, the collection tank 47 can be separated from the housing 20 of the chemical module 7 and extracted relative to the housing 20 . This configuration contributes to realizing a highly maintainable substrate processing module.

另外,在實施型態中,雖然針對如圖26所示支持部94、97具有凹狀之球面110的情形進行說明,但支持部94、97的形狀不限定於此,只要為可承載凸狀之球面108的形狀,任意的形狀均可。例如,如圖29的變形例所示,亦可為具有凹狀的多面體形狀210,以取代凹狀的球面。多面體形狀210係由複數條直線構成圖29所示的縱剖面。 In addition, in the embodiment, although the case where the supporting parts 94 and 97 have the concave spherical surface 110 is explained as shown in FIG. 26, the shape of the supporting parts 94 and 97 is not limited to this, as long as it is a convex shape capable of carrying The shape of the spherical surface 108 can be any shape. For example, as shown in the modification of FIG. 29 , a concave polyhedron shape 210 may be used instead of a concave spherical surface. The polyhedral shape 210 is composed of a plurality of straight lines and forms a longitudinal section as shown in FIG. 29 .

此外,在實施型態中,雖然針對設置於匯集槽47的支持部94、97為凹狀之球承載部、設置於處理槽的接觸部93、96為凸狀之球部的情形加以說明,但沒有限定如上述的情形,亦可將球承載部與球部的關係予以對調。例如,如圖30的變形例所示,亦可為:設置於匯集槽47的支持部304、307為凸狀的球部,設置於處理槽的接觸部303、306為凹狀的球承載部。在圖30所示之例中,由設置於藥液槽32的接觸部303來承載支持部304,而由設置於洗淨槽34的接觸部306來承載支持部307。如此一來,接觸部及支持部,只要任何一方至少為一部分為球狀的球部,而另一方為承載球部的球承載部即可。 In addition, in the embodiment, the case where the support portions 94 and 97 provided in the collection tank 47 are concave ball receiving portions and the contact portions 93 and 96 provided in the processing tank are convex ball portions will be described. However, it is not limited to the above situation, and the relationship between the ball bearing part and the ball part can also be reversed. For example, as shown in the modification of FIG. 30 , the supporting parts 304 and 307 provided in the collecting tank 47 may be convex ball parts, and the contact parts 303 and 306 provided in the processing tank may be concave ball receiving parts. . In the example shown in FIG. 30 , the support part 304 is supported by the contact part 303 provided in the chemical solution tank 32 , and the support part 307 is supported by the contact part 306 provided in the washing tank 34 . In this way, as long as either one of the contact portion and the supporting portion is at least a partially spherical ball portion, the other one is a ball bearing portion that supports the ball portion.

在圖30所示之例中,還例示:省略前述的安裝部107,並且由接觸部303、306來兼具安裝部107的型態。不限定於此,亦可與實施型態同樣地設置安裝部107,且將接觸部303、306安裝於安裝部107。 In the example shown in FIG. 30 , the above-mentioned mounting portion 107 is omitted and the mounting portion 107 is also provided by the contact portions 303 and 306 . It is not limited to this, and the mounting part 107 may be provided similarly to the embodiment, and the contact parts 303 and 306 may be mounted on the mounting part 107.

圖31顯示省略安裝部107的其他變形例。在圖31所示之例中,接觸部393直接地安裝於藥液槽32的下表面,而接觸部396直接地安裝於洗淨槽34的下表面。 FIG. 31 shows another modification example in which the mounting portion 107 is omitted. In the example shown in FIG. 31 , the contact portion 393 is directly installed on the lower surface of the chemical solution tank 32 , and the contact portion 396 is directly installed on the lower surface of the cleaning tank 34 .

此外,雖然在實施型態中,針對設置兩個校平機構91、90的情形加以說明,惟不限定於如此的情形。如圖32A、圖32B的變形例所示, 亦可為將藥液槽432與洗淨槽434一體地構成,並且藉由一個校平機構490來同時地進行兩個處理槽之校平的情形。在圖32A、圖32B所示之例中,藥液槽432與洗淨槽434係一體地構成,並且校平機構490係具備:高度變更部492、接觸部493、以及支持部494。高度變更部492係設置於藥液槽432的背面側N2,以支持藥液槽432的一方側的角部,而接觸部493及支持部494係設置於洗淨槽434的正面側N1。如圖32B所示,高度變更部492係設置兩個(高度變更部492A、492B)以支持藥液槽432的兩個部位的角部。 In addition, although in the embodiment, the case where two leveling mechanisms 91 and 90 are provided is described, it is not limited to this case. As shown in the modifications of Fig. 32A and Fig. 32B, The chemical solution tank 432 and the cleaning tank 434 may be integrally formed, and the two treatment tanks may be leveled simultaneously by one leveling mechanism 490 . In the example shown in FIGS. 32A and 32B , the chemical solution tank 432 and the cleaning tank 434 are integrally configured, and the leveling mechanism 490 includes a height changing part 492 , a contact part 493 , and a supporting part 494 . The height change part 492 is provided on the back side N2 of the chemical solution tank 432 to support one corner of the chemical solution tank 432 , while the contact part 493 and the support part 494 are provided on the front side N1 of the cleaning tank 434 . As shown in FIG. 32B , two height changing portions 492 (height changing portions 492A and 492B) are provided to support the two corner portions of the chemical solution tank 432 .

根據圖32A、圖32B所示的構成,只要利用兩個高度變更部492A、492B來變更高度,就可同時進行屬於兩個處理槽的藥液槽432與洗淨槽434的校平。只要從匯集槽47的背面78接近即可,完全不需由匯集槽47的正面58進行接近。藉此,使用簡單的構成就可容易地進行校平作業。 According to the structure shown in FIGS. 32A and 32B , by changing the height using the two height change parts 492A and 492B, the chemical solution tank 432 and the cleaning tank 434 belonging to the two treatment tanks can be leveled simultaneously. It is only necessary to approach from the back surface 78 of the collecting tank 47 , and there is no need to approach from the front surface 58 of the collecting tank 47 . Thereby, the leveling operation can be easily performed using a simple structure.

另外,不限定為將高度變更部492設置於藥液槽432,且將接觸部493及支持部494設置於洗淨槽434的情形,亦可將配置關係予以顛倒,而將接觸部及支持部設置於藥液槽432,且將兩個高度變更部設置於洗淨槽434。 In addition, it is not limited to the case where the height changing part 492 is provided in the chemical solution tank 432, and the contact part 493 and the support part 494 are provided in the washing tank 434. The arrangement relationship may also be reversed, and the contact part and the support part may be arranged. It is provided in the chemical solution tank 432, and two height changing parts are provided in the washing tank 434.

此外,在實施型態中,雖然如圖27所示,針對將高度變更部92A、92B設置於藥液槽32之Y軸方向的一方側的端部(接觸部93的相反側),且將高度變更部95A、95B設置於洗淨槽34之Y軸方向的一方側的端部(接觸部96的相反側)的情形加以說明,但不限定於如此的情形。例如,如圖33所示,亦可將高度變更部500設置於藥液槽32之Y軸方向的兩端 部之間的位置,且將高度變更部501設置於洗淨槽34之Y軸方向的兩端部之間的位置。在圖33所示之例中,分別在藥液槽32之X軸方向的一端和另一端設置高度變更部500,且分別在洗淨槽34之X軸方向的一端和另一端設置高度變更部501。高度變更部500只要相對於屬於藥液槽32之Y軸方向的中央位置的中心線X1配置於接觸部93的對面側(紙面上側)即可,高度變更部501只要相對於屬於洗淨槽34之Y軸方向的中央位置的中心線X2配置於接觸部96的對面側(紙面下側)即可。即使如此的情形,亦可使用高度變更部500來變更藥液槽32的兩個部位的高度藉此調整藥液槽32的姿勢,且可使用高度變更部501來變更洗淨槽34的兩個部位的高度藉此調整洗淨槽34的姿勢。 In addition, in the embodiment, as shown in FIG. 27 , the height changing portions 92A and 92B are provided at one end of the chemical solution tank 32 in the Y-axis direction (opposite to the contact portion 93 ), and the Although the case where the height change parts 95A and 95B are provided in the end part on one side of the Y-axis direction of the washing tank 34 (the side opposite to the contact part 96) is demonstrated, it is not limited to this case. For example, as shown in FIG. 33 , the height changing parts 500 may also be provided at both ends of the chemical solution tank 32 in the Y-axis direction. The height changing part 501 is provided at a position between both ends of the washing tank 34 in the Y-axis direction. In the example shown in FIG. 33 , height changing portions 500 are provided at one end and the other end of the chemical solution tank 32 in the X-axis direction, and height changing portions are provided at one end and the other end of the washing tank 34 in the X-axis direction. 501. The height changing part 500 only needs to be arranged on the opposite side (upper side of the paper) of the contact part 93 with respect to the center line The center line X2 at the center position in the Y-axis direction only needs to be arranged on the opposite side (lower side of the paper) of the contact portion 96 . Even in this case, the height changing part 500 can be used to change the height of the two parts of the chemical solution tank 32 to adjust the posture of the chemical solution tank 32, and the height changing part 501 can be used to change the two parts of the cleaning tank 34. The height of the part thereby adjusts the posture of the washing tank 34.

7A,7B,7C:化學模組(基板處理模組) 7A, 7B, 7C: Chemical module (substrate processing module)

20:殼體 20: Shell

32:藥液槽(處理槽、第二槽) 32: Chemical liquid tank (processing tank, second tank)

34:洗淨槽(處理槽、第一槽) 34: Washing tank (processing tank, first tank)

37:側方壁 37:Side wall

43:旋動臂部 43: Rotating arm

45:基板處理單元 45:Substrate processing unit

47:匯集槽 47: Collection tank

49:開口部 49:Opening part

54:面板 54:Panel

56:配管 56:Piping

58:正面 58:front

60:開口 60:Open your mouth

62:開口部 62:Opening part

64:面板 64:Panel

66,68:槽開口部 66,68: Groove opening

N1:正面側 N1: Front side

N2:背面側 N2: Back side

S1:第一收容空間 S1: The first containment space

S2:第二收容空間 S2: Second Containment Space

Claims (11)

一種基板處理模組,係具備; A substrate processing module having; 殼體;以及 housing; and 匯集槽,係以沿第一方向排列的狀態來收容可分別配置基板的兩個處理槽;其中 The collection tank is arranged in a first direction to accommodate two processing tanks that can respectively arrange the substrates; wherein 前述匯集槽係配置於前述殼體的內部; The aforementioned collecting tank is arranged inside the aforementioned housing; 前述匯集槽及前述處理槽係與前述殼體分離。 The aforementioned collection tank and the aforementioned treatment tank are separated from the aforementioned housing. 如請求項1所述之基板處理模組,前述匯集槽係可相對於前述殼體沿前述第一方向進行抽出。 In the substrate processing module of claim 1, the collecting tank can be extracted along the first direction relative to the housing. 如請求項1或2所述之基板處理模組,其中,前述匯集槽係可朝前述殼體的正面側進行抽出。 The substrate processing module according to claim 1 or 2, wherein the collecting tank is retractable toward the front side of the housing. 如請求項1或2所述之基板處理模組,更具有與前述處理槽連接的配管; The substrate processing module according to claim 1 or 2, further has a pipe connected to the aforementioned processing tank; 前述匯集槽係形成:收容前述處理槽的第一收容空間;以及收容自前述處理槽延伸而來的前述配管的第二收容空間。 The collecting tank forms a first accommodation space for accommodating the treatment tank, and a second accommodation space for accommodating the piping extending from the treatment tank. 如請求項4所述之基板處理模組,其中,前述第二收容空間係設置於前述第一收容空間的下方。 The substrate processing module according to claim 4, wherein the second accommodation space is provided below the first accommodation space. 如請求項4所述之基板處理模組,更具備連接器,該連接器係可裝卸地連接從前述第二收容空間延伸而來的前述配管。 The substrate processing module according to claim 4 further includes a connector that is removably connected to the pipe extending from the second accommodation space. 如請求項1或2所述之基板處理模組,其中,前述框體係具有使前述匯集槽行進的軌道。 The substrate processing module according to claim 1 or 2, wherein the frame system has a track for advancing the collection tank. 如請求項1或2所述之基板處理模組,其設為可於與前述第一方向交叉之第二方向連接另一個模組;該基板處理模組更具備: The substrate processing module as described in claim 1 or 2 is configured to be connected to another module in a second direction crossing the aforementioned first direction; the substrate processing module further has: 第一搬運部,係使前述基板沿前述第一方向移動;以及 The first conveying part moves the substrate in the first direction; and 第二搬運部,係使前述基板沿前述第二方向移動。 The second conveying unit moves the substrate in the second direction. 一種基板處理裝置,係具備: A substrate processing device having: 請求項1或2所述之前述基板處理模組、以及於與前述第一方向交差之前述第二方向與前述基板處理模組連結的其他模組。 The aforementioned substrate processing module according to claim 1 or 2, and other modules connected to the aforementioned substrate processing module in the second direction that intersects with the aforementioned first direction. 一種基板處理單元,係具備: A substrate processing unit is provided with: 可分別配置基板的兩個處理槽;以及 Two processing tanks that can be configured separately for substrates; and 匯集槽,係以沿第一方向排列的狀態來收容前述處理槽; The collection tank is for accommodating the aforementioned treatment tank in a state arranged along the first direction; 前述匯集槽及前述處理槽係與基板處理模組之殼體分離,該基板處理模組係將前述匯集槽配置於內部者。 The collecting tank and the processing tank are separated from the casing of the substrate processing module, and the substrate processing module has the collecting tank disposed inside. 如請求項10所述之基板處理單元,其中,前述匯集槽係可相對於前述殼體沿著前述第一方向進行抽出。 The substrate processing unit according to claim 10, wherein the collecting tank is extractable along the first direction relative to the housing.
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JPH0521414A (en) * 1991-07-13 1993-01-29 Sony Corp Processor
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