KR100885242B1 - Apparatus for treating substrates, and method for treating substrates using the same - Google Patents

Abstract

An apparatus for treating substrate and a method thereof are provided to perform function of a substrate reversing unit in a substrate transferring unit by installing a driving part capable of reversing a substrate in the substrate transferring unit. An apparatus for treating substrate comprises a substrate treating part, a substrate transferring unit(35), and a transferring guide. A substrate is provided from outside to the substrate treating part by the substrate transferring unit. A moving route of the substrate transferring unit is guided by the transferring guide. The substrate transferring unit includes a base body(115), an arm part(118), a pocket part(117), and a driving part(116). The arm part is coupled with the base body. The pocket part is coupled with the arm part. The driving part is coupled with at least one among the pocket part and the arm part. The substrate is loaded on the pocket part. The substrate is reversed by the driving part.

Description

Substrate processing apparatus, and substrate processing method using the same {APPARATUS FOR TREATING SUBSTRATES, AND METHOD FOR TREATING SUBSTRATES USING THE SAME}

The present invention relates to a substrate processing apparatus and a substrate processing method using the same.

A substrate processing apparatus for processing a semiconductor substrate includes a chamber for performing a predetermined processing process on the substrate. For example, when the treatment process is a cleaning process, a cleaning unit that performs a cleaning process on the semiconductor substrate is provided in the chamber.

Among the cleaning units, the single wafer cleaning unit includes a substrate reversing unit that receives a semiconductor substrate from the outside and inverts the semiconductor substrate to provide the cleaning unit side.

However, when the substrate processing apparatus includes a plurality of chambers in order to increase the number of semiconductor substrates processed in the same time, the substrate inversion unit must be installed in each chamber, and thus, the substrate inversion unit is installed, The cost of maintenance increases.

An object of the present invention is to provide a substrate processing apparatus that can reduce the manufacturing cost, and a substrate processing method using the same.

In a substrate processing apparatus for processing a substrate, a substrate processing apparatus according to the present invention for achieving the above object includes a substrate processing unit for processing the substrate, a substrate transfer unit for receiving the substrate from the outside and providing the substrate to the substrate processing unit side. And a transfer guide coupled with the substrate transfer unit to guide a movement path of the substrate transfer unit, wherein the substrate transfer unit is coupled to the base and the base body, at least one arm coupled to the base body, and the substrate And a driving part coupled to at least one of the pocket part and the arm part to reverse the substrate placed on the pocket part.

In the substrate processing method for processing a substrate, the substrate processing method according to the present invention for achieving the above object is a substrate transfer having a pocket portion on which the substrate is placed and a driving portion coupled with the pocket portion to reverse the pocket portion. Transferring the substrate to the substrate processing unit using a unit, and processing the substrate transferred by the substrate transfer unit at the substrate processing unit, and transferring the substrate to the substrate processing unit; The substrate placed on the inverted by the driving unit is characterized in that it is transferred to the substrate processing unit side.

According to the substrate processing apparatus and the substrate processing method using the same according to the present invention, the substrate transfer unit for providing the substrate to the substrate processing unit side includes a driving unit capable of inverting the substrate placed in the pocket portion. Thus, the substrate transfer unit can replace the function of the substrate inversion unit that inverts the substrate in the substrate processing portion.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The objects, features and effects of the present invention described above will be readily understood through embodiments related to the accompanying drawings. However, the present invention is not limited to the embodiments described herein and may be applied and modified in various forms. Rather, the following embodiments are provided to clarify the technical spirit disclosed by the present invention, and furthermore, to fully convey the technical spirit of the present invention to those skilled in the art having an average knowledge in the field to which the present invention belongs. Therefore, the scope of the present invention should not be construed as limited by the embodiments described below. On the other hand, the drawings presented in conjunction with the following examples are somewhat simplified or exaggerated for clarity, the same reference numerals in the drawings represent the same components.

1 is a plan view of a substrate processing apparatus according to an embodiment of the present invention.

Referring to FIG. 1, the substrate processing apparatus 10 includes an indexer 20 and a process processor 30, and the process processor 30 includes a first processor 31 and a first processor 31. It includes a second processing unit 32 facing.

Each of the first processor 31 and the second processor 32 includes a plurality of chambers 40. The chambers 40 are disposed in the first direction D1 in the first processing unit 31 and the second processing unit 32, respectively, and the first processing unit 31 and the second processing unit 32, respectively. Is divided into a plurality of layers and the chambers 40 are provided in each layer. Each of the chambers 40 performs a predetermined process on the substrate W.

In the embodiment of the present invention, the chambers 40 perform a cleaning process with respect to the substrate (W). Accordingly, the chambers 40 may be a module for cleaning the substrate W using a chemical liquid with respect to a substrate W, and a module for cleaning the substrate W using a rinse liquid with respect to the substrate W. And the like can be provided.

The indexer 20 is a part for the purpose of the interface between the user (user) to the substrate (W) and the process processor 30. The indexer 20 is installed at the front end of the first processing unit 31 and the second processing unit 32, and includes a load port 22 and an indexer robot 100 on which the cassette C is placed. The indexer robot 100 is responsible for transferring the substrate between the load port 22 and the process processor 30.

In addition, a substrate transfer unit 35 is disposed between the first processing unit 31 and the second processing unit 32. The substrate transfer unit 35 may move in the first direction D1 and in a direction perpendicular to the ground by the horizontal transfer guide 80 and the vertical transfer guide 82. Therefore, the substrate transfer unit 35 may transfer the substrate W provided from the indexer robot 100 to the chamber 40.

Meanwhile, the fan filter unit 60 may be provided at an upper portion of the region where the substrate transfer unit 35 moves. The fan filter unit 60 includes a filter therein and generates a downward airflow to purify the region.

If the substrate processing apparatus 10 having the above structure is provided with the substrate W in the cassette C of the load port 22 by an operator (or AGP), the indexer robot 100 may load the rod. The substrate W is taken out from the cassette C loaded in the port 22 to provide the substrate W to the substrate transfer unit 35.

The horizontal transfer guide 80 extends in the first direction D1, and the horizontal transfer guide 80 is coupled to a horizontal driving unit (not shown) including a transfer belt (not shown) to transfer the substrate. Guide the movement path of (35). In addition, the vertical transfer guide 82 extends in a direction perpendicular to the ground, and the vertical transfer guide 82 is coupled to a vertical driving unit (not shown) including a transfer belt (not shown) to transfer the substrate. Guide the movement path of (35).

Therefore, the substrate transfer unit 35 is perpendicular to the first direction D1 and the ground by the horizontal transfer guide 80, the horizontal direction driver, the vertical transfer guide 82, and the vertical direction driver. In the in-direction, and as a result, the substrate transfer unit 35 is disposed in the first direction D1 and provides the substrate W to the chambers 40 arranged in a plurality of layers. Can be.

2A is a view showing a substrate transfer unit for transferring a substrate into a chamber and a chamber of the substrate processing apparatus shown in FIG. 1, and FIG. 2B is an enlarged view of a portion B of FIG. 2A.

2A and 2B, the chambers 40 are disposed in a second direction D2 that is perpendicular to the ground, and a cleaning process is performed on the substrate W in each of the chambers 40. .

Each chamber 40 is provided with a substrate cleaning unit 105. The substrate cleaning unit 105 includes a housing 110, a substrate support member 120, a cleaning liquid recovery member 130, a first driver 142, and a nozzle 144.

The housing 110 provides a space for cleaning the substrate W therein. The housing 110 has a cylindrical shape with an open top. An open upper portion of the housing 110 is used as a passage for the substrate W to enter and exit the space.

The substrate support member 120 supports the substrate W in an inner space of the housing 110 during the process. A spin chuck is used as the substrate support member 120. The substrate support member 120 includes a spin head 122 and a rotating shaft 124.

The spin head 122 generally has a plate shape, and the spin head 122 is installed to be rotatable inside the housing 110. The upper surface of the spin head 122 is provided with chucking pins 122a and support pins 122b for supporting the substrate W to the spin head 122. The chucking pins 122a fix the substrate W on the spin head 122 by chucking a portion of the edge of the wafer W during the process.

The axis of rotation 124 is provided for rotation of the spin head 122. The upper end of the rotation shaft 124 is coupled to the lower center of the spin head 122, and the lower end is coupled to the first driver 142.

The recovery member 130 recovers the processing liquid supplied to the substrate W during the process. The recovery member 140 has at least one recovery container. In an embodiment of the present invention, recovery member 130 has a first recovery canister 132 and a second recovery canister 134.

The first recovery container 132 recovers a cleaning liquid for removing foreign substances on the surface of the substrate W during the process, and the second recovery container 134 rinses the cleaning liquid remaining on the surface of the substrate W during the process. A rinse liquid for recovery is recovered. The first recovery container 132 and the second recovery container 134 are installed such that the inlets 132a and 134a into which the processing liquid scattered from the substrate W flows are stacked up and down.

The cleaning liquid recovery line 132b is connected to the first recovery container 132, and the rinse liquid recovery line 134b is connected to the second recovery container 134. The cleaning liquid recovery line 132b recovers the cleaning liquid recovered into the first recovery container 132 during the process to a processing liquid regeneration unit (not shown), and the rinse liquid recovery line 134b is connected to the second recovery container ( The rinse liquid recovered in step 134) is recovered to the treatment liquid regeneration unit. The treatment liquid regeneration unit is a facility for reusing the treatment liquid used in the process to be reused.

The nozzle 144 sprays the processing liquid onto the processing surface of the substrate W placed on the substrate supporting member 120 during the process. The nozzle 144 may be provided in plurality in order to spray the cleaning liquid, the rinse liquid, and the dry gas, respectively. The nozzle 144 may spray the treatment liquid while rotating or swinging at various angles by a transfer member (not shown) during the process. Here, various kinds of chemicals are used as the cleaning liquid, deionized water (DIW) is used as the rinse liquid, and isopropyl alcohol gas (IPA gas) may be used as the drying gas. .

Meanwhile, the substrate transfer unit 35 includes a body 115, a robot arm 118 coupled with the body 115, a pocket 117 for gripping the substrate W, and the pocket 117. And a support plate (111, 112) for supporting the substrate (W) to the pocket portion 117, the support plate 113 for supporting the body portion 115 by combining with the vertical transfer guide 82, and the pocket And a second driving unit 116 coupled to the unit 117 and the robot arm 118 to invert the substrate W supported by the pocket unit 117.

 After the substrate transfer unit 35 moves in the second direction D2 along the vertical transfer guide 82, the pocket part 117 and the robot arm 117 of the substrate transfer unit 35 move to the substrate. Entering and exiting the chamber 41 through the entrance 41.

The substrate W is placed on the pocket portion 117 such that the first surface S1 of the substrate W faces upward and the second surface S2 faces downward. The first surface S1 is a processing surface of the substrate W to be processed by the processing liquid provided from the nozzle 144. When the substrate W is supported by the spin head 122, the nozzle 144 is positioned above the spin head 122, so that the first surface S1 is exposed to the outside so that the spin head may be exposed to the outside. 122).

3A is a side view of the substrate transfer unit shown in FIG. 2A, and FIG. 3B is an enlarged view of a portion B of FIG. 3A.

3A and 3B, the second driver 116 of the substrate transfer unit 35 inverts the pocket portion 117. As a result, the first surface S1 of the substrate W supported by the pocket portion 117 faces downward, and the second surface S2 faces upward.

After the second driving unit 116 inverts the substrate W supported by the pocket part 117, the substrate transfer unit 35 moves the substrate W so that the substrate W is placed on the spin head 122. The substrate W is transferred. Accordingly, the substrate W may be positioned above the spin head 122 such that the first surface S1 faces upward, and as a result, the first surface S1 is processed from the nozzle 144. A predetermined washing process may be performed by receiving the liquid.

Although described with reference to the above embodiments, those skilled in the art can be variously modified and changed within the scope of the present invention without departing from the spirit and scope of the invention described in the claims below. I can understand.

1 is a plan view of a substrate processing apparatus according to an embodiment of the present invention.

FIG. 2A is a view illustrating a substrate transfer unit for transferring a substrate into a chamber and a chamber of the substrate processing apparatus illustrated in FIG. 1.

FIG. 2B is an enlarged view of portion A of FIG. 2A.

3A is a view showing that the pocket part of the substrate transfer unit shown in FIG. 2A is reversed.

FIG. 3B is an enlarged view of a portion B of FIG. 3A.

* Description of the symbols for the main parts of the drawings *

10-Substrate Processing Unit 20-Indexer

30-process section 35-substrate transfer unit

40-chamber 80-horizontal transfer guide

82-Vertical Transfer Guide 105-Substrate Cleaning Unit

116-Second drive section 117-Pocket section

118-Robot Arm 120-Board Support Member

122-Spin Head 144-Nozzle

W-Board

Claims (7)

delete In the substrate processing apparatus which processes a board | substrate, A substrate processing unit processing the substrate; A substrate transfer unit receiving the substrate from the outside and providing the substrate to the substrate processing unit; And It includes a transfer guide coupled to the substrate transfer unit to guide the movement path of the substrate transfer unit, The substrate transfer unit, Base body; At least one arm coupled to the base body; A pocket part coupled to the arm part and on which the substrate is placed; And A driving part coupled to at least one of the pocket part and the arm part to invert the substrate placed on the pocket part, The substrate processing unit includes a plurality of chambers, Each of the plurality of chambers, A housing providing a space in which a process of processing a substrate is performed; A spin chuck positioned within the housing; A substrate support member provided on the spin chuck to support the substrate on the spin chuck; And A nozzle providing a processing liquid to a processing surface side of the substrate supported by the substrate supporting member, The substrate transfer unit transfers the substrate to the spin chuck. 3. The substrate of claim 2, wherein the nozzle is positioned above the spin chuck to provide the processing liquid toward the processing surface of the substrate supported by the spin chuck, and the substrate transfer unit moves the substrate so that the processing surface is exposed. The substrate processing apparatus characterized by the above-mentioned. In the substrate processing apparatus which processes a board | substrate, A substrate processing unit processing the substrate; A substrate transfer unit receiving the substrate from the outside and providing the substrate to the substrate processing unit; And It includes a transfer guide coupled to the substrate transfer unit to guide the movement path of the substrate transfer unit, The substrate transfer unit, Base body; At least one arm coupled to the base body; A pocket part coupled to the arm part and on which the substrate is placed; And A driving part coupled to at least one of the pocket part and the arm part to invert the substrate placed on the pocket part, The substrate processing unit, A first processor having chambers arranged in a first direction and a second direction perpendicular to the first direction; And A second processing part spaced apart from the first processing part and facing the first processing part and having chambers disposed in the first direction and the second direction, And the substrate transfer unit moves along the transfer guide extending in the first direction and the second direction between the first processor and the second processor. delete In the substrate processing method of processing a substrate, Transferring the substrate to the substrate processing unit by using a substrate transfer unit having a pocket on which the substrate is placed and a driving unit coupled to the pocket and inverting the pocket; And Processing the substrate transferred by the substrate transfer unit in the substrate processing unit; In the step of transferring the substrate to the substrate processing unit side, the substrate placed in the pocket portion is inverted by the driving unit is transferred to the substrate processing unit side, The step of processing the substrate in the substrate processing unit, Supporting the substrate on a spin chuck provided in the substrate processing unit; And And providing a processing liquid from an upper portion of the substrate to a processing surface side of the substrate. 7. The substrate processing method of claim 6, wherein the substrate transfer unit transfers the substrate to the spin chuck so that the processing surface is exposed.

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