TW202340092A - 中空二氧化矽粒子之製造方法 - Google Patents

中空二氧化矽粒子之製造方法 Download PDF

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Publication number
TW202340092A
TW202340092A TW112103042A TW112103042A TW202340092A TW 202340092 A TW202340092 A TW 202340092A TW 112103042 A TW112103042 A TW 112103042A TW 112103042 A TW112103042 A TW 112103042A TW 202340092 A TW202340092 A TW 202340092A
Authority
TW
Taiwan
Prior art keywords
hollow silica
silica particles
less
precursor
cationic surfactant
Prior art date
Application number
TW112103042A
Other languages
English (en)
Chinese (zh)
Inventor
星田浩樹
浜田文哉
Original Assignee
日商花王股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商花王股份有限公司 filed Critical 日商花王股份有限公司
Publication of TW202340092A publication Critical patent/TW202340092A/zh

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    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C08K7/26—Silicon- containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/40—Electric properties
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/80—Compositional purity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/006—Additives being defined by their surface area

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Silicon Compounds (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW112103042A 2022-01-21 2023-01-30 中空二氧化矽粒子之製造方法 TW202340092A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-008120 2022-01-21
JP2022008120 2022-01-21

Publications (1)

Publication Number Publication Date
TW202340092A true TW202340092A (zh) 2023-10-16

Family

ID=87348431

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112103042A TW202340092A (zh) 2022-01-21 2023-01-30 中空二氧化矽粒子之製造方法

Country Status (4)

Country Link
US (1) US20250100891A1 (https=)
JP (1) JP7320692B1 (https=)
TW (1) TW202340092A (https=)
WO (1) WO2023140378A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7518649B2 (ja) * 2020-03-31 2024-07-18 日揮触媒化成株式会社 外殻にフルオロポリマーを含む中空粒子とその製造方法、および樹脂組成物
WO2024122433A1 (ja) * 2022-12-05 2024-06-13 Ａｇｃ株式会社 樹脂組成物、プリプレグ、樹脂付き金属基材、及び配線板
WO2025187614A1 (ja) * 2024-03-08 2025-09-12 三菱瓦斯化学株式会社 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置
WO2026014446A1 (ja) * 2024-07-09 2026-01-15 株式会社日本触媒 中空シリカ粒子

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5513364B2 (ja) * 2010-12-24 2014-06-04 花王株式会社 中空シリカ粒子
JP2014055083A (ja) * 2012-09-11 2014-03-27 Kao Corp 中空シリカ粒子の製造方法
JP2014055082A (ja) * 2012-09-11 2014-03-27 Kao Corp 中空シリカ粒子の製造方法
JP2014055084A (ja) * 2012-09-11 2014-03-27 Kao Corp 中空シリカ粒子の製造方法
JP7529392B2 (ja) * 2019-10-29 2024-08-06 日鉄ケミカル＆マテリアル株式会社 シリカ粒子、樹脂組成物、樹脂フィルム及び金属張積層板
EP4112551A4 (en) * 2020-02-27 2024-08-28 Agc Inc. HOLLOW SILICA PARTICLES AND METHOD FOR MANUFACTURING HOLLOW SILICA PARTICLES
CN111232993B (zh) * 2020-03-06 2021-09-14 山东国瓷功能材料股份有限公司 一种5g高频用超低介电常数中空二氧化硅及其制备方法

Also Published As

Publication number Publication date
JPWO2023140378A1 (https=) 2023-07-27
US20250100891A1 (en) 2025-03-27
JP7320692B1 (ja) 2023-08-03
WO2023140378A1 (ja) 2023-07-27

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