JPWO2023140378A1 - - Google Patents
Info
- Publication number
- JPWO2023140378A1 JPWO2023140378A1 JP2023524086A JP2023524086A JPWO2023140378A1 JP WO2023140378 A1 JPWO2023140378 A1 JP WO2023140378A1 JP 2023524086 A JP2023524086 A JP 2023524086A JP 2023524086 A JP2023524086 A JP 2023524086A JP WO2023140378 A1 JPWO2023140378 A1 JP WO2023140378A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/22—Expanded, porous or hollow particles
- C08K7/24—Expanded, porous or hollow particles inorganic
- C08K7/26—Silicon- containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/12—Surface area
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/40—Electric properties
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/80—Compositional purity
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/006—Additives being defined by their surface area
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Silicon Compounds (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022008120 | 2022-01-21 | ||
| JP2022008120 | 2022-01-21 | ||
| PCT/JP2023/001898 WO2023140378A1 (ja) | 2022-01-21 | 2023-01-23 | 中空シリカ粒子の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023140378A1 true JPWO2023140378A1 (https=) | 2023-07-27 |
| JP7320692B1 JP7320692B1 (ja) | 2023-08-03 |
| JPWO2023140378A5 JPWO2023140378A5 (https=) | 2023-12-20 |
Family
ID=87348431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023524086A Active JP7320692B1 (ja) | 2022-01-21 | 2023-01-23 | 中空シリカ粒子の製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250100891A1 (https=) |
| JP (1) | JP7320692B1 (https=) |
| TW (1) | TW202340092A (https=) |
| WO (1) | WO2023140378A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7518649B2 (ja) * | 2020-03-31 | 2024-07-18 | 日揮触媒化成株式会社 | 外殻にフルオロポリマーを含む中空粒子とその製造方法、および樹脂組成物 |
| WO2024122433A1 (ja) * | 2022-12-05 | 2024-06-13 | Ａｇｃ株式会社 | 樹脂組成物、プリプレグ、樹脂付き金属基材、及び配線板 |
| WO2025187614A1 (ja) * | 2024-03-08 | 2025-09-12 | 三菱瓦斯化学株式会社 | 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置 |
| WO2026014446A1 (ja) * | 2024-07-09 | 2026-01-15 | 株式会社日本触媒 | 中空シリカ粒子 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5513364B2 (ja) * | 2010-12-24 | 2014-06-04 | 花王株式会社 | 中空シリカ粒子 |
| JP2014055083A (ja) * | 2012-09-11 | 2014-03-27 | Kao Corp | 中空シリカ粒子の製造方法 |
| JP2014055082A (ja) * | 2012-09-11 | 2014-03-27 | Kao Corp | 中空シリカ粒子の製造方法 |
| JP2014055084A (ja) * | 2012-09-11 | 2014-03-27 | Kao Corp | 中空シリカ粒子の製造方法 |
| JP7529392B2 (ja) * | 2019-10-29 | 2024-08-06 | 日鉄ケミカル＆マテリアル株式会社 | シリカ粒子、樹脂組成物、樹脂フィルム及び金属張積層板 |
| EP4112551A4 (en) * | 2020-02-27 | 2024-08-28 | Agc Inc. | HOLLOW SILICA PARTICLES AND METHOD FOR MANUFACTURING HOLLOW SILICA PARTICLES |
| CN111232993B (zh) * | 2020-03-06 | 2021-09-14 | 山东国瓷功能材料股份有限公司 | 一种5g高频用超低介电常数中空二氧化硅及其制备方法 |
-
2023
- 2023-01-23 WO PCT/JP2023/001898 patent/WO2023140378A1/ja not_active Ceased
- 2023-01-23 JP JP2023524086A patent/JP7320692B1/ja active Active
- 2023-01-23 US US18/730,586 patent/US20250100891A1/en active Pending
- 2023-01-30 TW TW112103042A patent/TW202340092A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202340092A (zh) | 2023-10-16 |
| US20250100891A1 (en) | 2025-03-27 |
| JP7320692B1 (ja) | 2023-08-03 |
| WO2023140378A1 (ja) | 2023-07-27 |
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