JP7320692B1 - 中空シリカ粒子の製造方法 - Google Patents

中空シリカ粒子の製造方法 Download PDF

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Publication number
JP7320692B1
JP7320692B1 JP2023524086A JP2023524086A JP7320692B1 JP 7320692 B1 JP7320692 B1 JP 7320692B1 JP 2023524086 A JP2023524086 A JP 2023524086A JP 2023524086 A JP2023524086 A JP 2023524086A JP 7320692 B1 JP7320692 B1 JP 7320692B1
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Prior art keywords
hollow silica
silica particles
less
precursor
cationic surfactant
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Japanese (ja)
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JPWO2023140378A1 (https=
JPWO2023140378A5 (https=
Inventor
浩樹 星田
文哉 浜田
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Kao Corp
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Kao Corp
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    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C08K7/26—Silicon- containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/40—Electric properties
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/80—Compositional purity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/006—Additives being defined by their surface area

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Silicon Compounds (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2023524086A 2022-01-21 2023-01-23 中空シリカ粒子の製造方法 Active JP7320692B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022008120 2022-01-21
JP2022008120 2022-01-21
PCT/JP2023/001898 WO2023140378A1 (ja) 2022-01-21 2023-01-23 中空シリカ粒子の製造方法

Publications (3)

Publication Number Publication Date
JPWO2023140378A1 JPWO2023140378A1 (https=) 2023-07-27
JP7320692B1 true JP7320692B1 (ja) 2023-08-03
JPWO2023140378A5 JPWO2023140378A5 (https=) 2023-12-20

Family

ID=87348431

Family Applications (1)

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JP2023524086A Active JP7320692B1 (ja) 2022-01-21 2023-01-23 中空シリカ粒子の製造方法

Country Status (4)

Country Link
US (1) US20250100891A1 (https=)
JP (1) JP7320692B1 (https=)
TW (1) TW202340092A (https=)
WO (1) WO2023140378A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025187614A1 (ja) * 2024-03-08 2025-09-12 三菱瓦斯化学株式会社 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置
WO2026014446A1 (ja) * 2024-07-09 2026-01-15 株式会社日本触媒 中空シリカ粒子

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7518649B2 (ja) * 2020-03-31 2024-07-18 日揮触媒化成株式会社 外殻にフルオロポリマーを含む中空粒子とその製造方法、および樹脂組成物
WO2024122433A1 (ja) * 2022-12-05 2024-06-13 Ａｇｃ株式会社 樹脂組成物、プリプレグ、樹脂付き金属基材、及び配線板

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012136363A (ja) * 2010-12-24 2012-07-19 Kao Corp 中空シリカ粒子
JP2014055082A (ja) * 2012-09-11 2014-03-27 Kao Corp 中空シリカ粒子の製造方法
JP2014055084A (ja) * 2012-09-11 2014-03-27 Kao Corp 中空シリカ粒子の製造方法
CN111232993A (zh) * 2020-03-06 2020-06-05 山东国瓷功能材料股份有限公司 一种5g高频用超低介电常数中空二氧化硅及其制备方法
JP2021070592A (ja) * 2019-10-29 2021-05-06 日鉄ケミカル＆マテリアル株式会社 シリカ粒子、樹脂組成物、樹脂フィルム及び金属張積層板
WO2021172294A1 (ja) * 2020-02-27 2021-09-02 Ａｇｃ株式会社 中空シリカ粒子及びその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014055083A (ja) * 2012-09-11 2014-03-27 Kao Corp 中空シリカ粒子の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012136363A (ja) * 2010-12-24 2012-07-19 Kao Corp 中空シリカ粒子
JP2014055082A (ja) * 2012-09-11 2014-03-27 Kao Corp 中空シリカ粒子の製造方法
JP2014055084A (ja) * 2012-09-11 2014-03-27 Kao Corp 中空シリカ粒子の製造方法
JP2021070592A (ja) * 2019-10-29 2021-05-06 日鉄ケミカル＆マテリアル株式会社 シリカ粒子、樹脂組成物、樹脂フィルム及び金属張積層板
WO2021172294A1 (ja) * 2020-02-27 2021-09-02 Ａｇｃ株式会社 中空シリカ粒子及びその製造方法
CN111232993A (zh) * 2020-03-06 2020-06-05 山东国瓷功能材料股份有限公司 一种5g高频用超低介电常数中空二氧化硅及其制备方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025187614A1 (ja) * 2024-03-08 2025-09-12 三菱瓦斯化学株式会社 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置
WO2026014446A1 (ja) * 2024-07-09 2026-01-15 株式会社日本触媒 中空シリカ粒子

Also Published As

Publication number Publication date
TW202340092A (zh) 2023-10-16
JPWO2023140378A1 (https=) 2023-07-27
US20250100891A1 (en) 2025-03-27
WO2023140378A1 (ja) 2023-07-27

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