TW202336074A - resin composition - Google Patents

Abstract

A resin composition comprising a biphenyl aralkyl-type phenol resin (A), an epoxy resin (B), an active ester compound (C), and an inorganic filler (D), wherein the amount of the active ester compound (C) is not less than 10 mass% with respect to 100 mass% of nonvolatile components in the resin composition, and the amount of the inorganic filler (D) is not less than 60 mass% with respect to 100 mass% of nonvolatile components in the resin composition, or is not less than 45 vol.% with respect to 100 vol.% of nonvolatile components in the resin composition.

Description

resin composition

The present invention relates to a resin composition.

As a manufacturing technology of a printed wiring board, a manufacturing method in which an insulating layer and a conductor layer are overlapped with each other is known to be a build-up method. In the manufacturing method by the accumulation method, the insulating layer is generally formed from a cured product of a cured resin composition (Patent Document 1). [Prior technical literature] [Patent Document]

[Patent Document 1] Japanese Patent Application Publication No. 2020-23714

[Problem solved by the invention]

The hardened material contained in the insulating layer is expected to reduce the dielectric loss tangent. One method of obtaining a hardened product with a low dielectric loss tangent is to add a high concentration of an active ester compound and an inorganic filler to the resin composition. However, when a resin composition containing a high concentration of an active ester compound and an inorganic filler is used, cracks (cracks) are likely to occur in the cured product, or the elongation at the breaking point of the cured product tends to be reduced.

The present invention was devised in view of the above-mentioned problems, and aims to obtain a resin composition that can obtain a cured product with a low dielectric loss tangent, suppress cracking, and have a large breaking point elongation; a cured product of the resin composition; containing A sheet-like laminated material of the resin composition; a resin sheet having a resin composition layer formed of the resin composition; a printed wiring board having an insulating layer containing a cured product of the resin composition; and a printed wiring board having the resin composition. For the purpose of board semiconductor devices. [Means to solve the problem]

The inventors of the present invention conducted detailed examinations in order to solve the aforementioned problems. As a result, the inventors of the present invention found that a compound containing (A) a biphenylaralkyl phenol resin, (B) an epoxy resin, (C) an active ester compound in a specific range, and (D) an inorganic filler in a specific range. The resin composition can solve the above-mentioned problems and complete the present invention. That is, the present invention includes the following.

[1] A lipid composition containing (A) biphenyl aralkyl type phenol resin, (B) epoxy resin, (C) active ester compound, and (D) inorganic filler, (C) active ester compound The amount of the inorganic filler is 10% by mass or more based on 100% by mass of the non-volatile content of the resin composition, (D) the amount of the inorganic filler is 60% by mass or more based on 100% by mass of the non-volatile content of the resin composition, Or it is 45 volume % or more based on 100 volume % of the non-volatile content of the resin composition. [2] (A) A resin composition as described in [1] in which the amount of the biphenylaralkyl phenol resin is 0.01 mass % or more and 5 mass % or less based on 100 mass % of the non-volatile components of the resin composition. things. [3] (A) The biphenylaralkyl-type phenol resin is the resin composition described in [1] or [2] represented by the following formula (A-1). (In formula (A-1), R ¹ each independently represents an alkylene group, R ² each independently represents a univalent hydrocarbon group, R ³ each independently represents a univalent hydrocarbon group, n represents an integer from 1 to 20, and s each independently represents 0~ is an integer of 4, and t each independently represents an integer of 0 to 3.) [4] Further containing (E) a hardener including a carbodiimide-based hardener as described in any one of [1] to [3] Resin composition. [5] The resin composition according to any one of [1] to [4] containing (F) a hardening accelerator. [6] The resin composition according to any one of [1] to [5] containing (G) a thermoplastic resin. [7] (C) The resin composition described in any one of [1] to [6] in which the active ester compound contains a naphthalene-type active ester compound. [8] (C) The resin composition described in any one of [1] to [7] in which the active ester compound contains a dicyclopentadiene-type active ester compound and a naphthalene-type active ester compound. [9] The resin composition according to any one of [1] to [8] containing (H) maleimide resin. [10] (H) Maleimine resin contains one type selected from the group consisting of maleimine resin represented by formula (H-1) and maleimide resin represented by formula (H-2) The above resin composition is as described in [9]. (In the formula (H-1), R ^h1 each independently represents a divalent aliphatic group having 5 or more carbon atoms that may have a substituent, and R ^h2 each independently represents an oxygen atom, an aryl group, an alkylene group, or the like. A divalent group formed by combining 2 or more of the groups. n _h1 represents an integer from 1 to 15. In the formula (H-2), R ^h3 each independently represents a divalent fat with 5 or more carbon atoms that may have a substituent. Family group, R ^h4 each independently represents a divalent group with an aromatic ring that may have a substituent, R ^h5 each independently represents an alkyl group with more than 5 carbon atoms. _{n h2} represents an integer from 0 to 10, m _h each independently represents An integer of 0 to 4. [11] A resin composition as described in any one of [1] to [10] formed using an insulating layer. [12] A resin composition as described in any one of [1] to [11] A cured product of the resin composition described in [1] to [11]. [13] A sheet-like laminated material containing a resin composition as described in any one of [1] to [11]. [14] Having a support, and the support The resin sheet is a resin composition layer formed of the resin composition as described in any one of [1] to [11]. [15] It is provided with a resin sheet containing a resin composition layer as described in any one of [1] to [11]. A printed wiring board having an insulating layer of a cured resin composition. [16] A semiconductor device having the printed wiring board described in [15]. [Effects of the Invention]

According to the present invention, it is possible to obtain a resin composition that improves the cured product with low dielectric loss tangent, suppressed cracking, and large elongation at the breaking point; a cured product of the resin composition; and a sheet-like laminate containing the resin composition. Material; a resin sheet having a resin composition layer formed of the resin composition; a printed wiring board having an insulating layer containing a cured product of the resin composition; and a semiconductor device having the printed wiring board.

[Types of carrying out the invention]

Hereinafter, embodiments and examples of the present invention will be described. However, the present invention is not limited to the embodiments and examples shown below, and can be arbitrarily modified and implemented without departing from the scope of the claims and their equivalent scope.

[1. Overview of resin composition] A resin composition according to one embodiment of the present invention contains (A) biphenylaralkyl phenol resin, (B) epoxy resin, (C) active ester compound in a specific range, and (D) in a specific range. A combination of inorganic fillers. According to this resin composition, a hardened product can be obtained that has a low dielectric loss tangent, can suppress cracks, and has a large elongation at the breaking point. The hardened material can be suitably used as a material for an insulating layer of a printed wiring board, for example.

[2.(A) Biphenylaralkyl type phenol resin] The resin composition of this embodiment contains (A) biphenylaralkyl-type phenol resin as (A) component. (A) Biphenyl aralkyl phenol resin contains a combination of a biphenyl aralkyl structure and a phenol structure in the molecule. It generally reacts with (B) epoxy resin to harden the resin composition. . When this (A) biphenyl aralkyl type phenol resin is used in combination with the above-mentioned components (B) to (D), it can be cured with low dielectric loss tangent, suppressed cracking, and large elongation at the breaking point. things.

The so-called biphenylaralkyl structure refers to a structure in which a part of the carbon chain, except for both ends of the alkylene chain, is replaced by a biphenyl skeleton. One or more substituents may be bonded to the biphenyl skeleton as long as the effects of the present invention are not significantly impaired. Examples of the substituent include hydrocarbon groups such as alkyl groups and aryl groups.

The so-called phenol structure represents a structure in which a benzene ring is bonded to a hydroxyl group. The benzene ring of the phenol structure may be bonded with 1 or 2 or more substituents as long as the effects of the present invention are not significantly impaired. Examples of the substituent include hydrocarbon groups such as alkyl groups and aryl groups.

Preferred examples of the biphenylaralkyl-type phenol resin (A) include compounds represented by the following formula (A-1).

(In formula (A-1), R ¹ each independently represents an alkylene group, R ² each independently represents a univalent hydrocarbon group, R ³ each independently represents a univalent hydrocarbon group, n represents an integer from 1 to 20, and s each independently represents 0~ An integer of 4, t each independently represents an integer of 0~3)

In the formula (A-1), R ¹ each independently represents an alkylene group. The alkylene group may be linear or branched. The number of carbon atoms in the alkylene group is 1 to 10, preferably 1 to 8, particularly preferably 1 to 5. Examples of the alkylene group include methylene, ethylene, propylene, and the like.

In formula (A-1), R ² each independently represents a monovalent hydrocarbon group. The monovalent hydrocarbon group may be an aliphatic hydrocarbon group or an aromatic hydrocarbon group. In addition, the monovalent hydrocarbon group may be a linear or branched chain hydrocarbon group, or a ring-containing hydrocarbon group. The number of carbon atoms of the monovalent hydrocarbon group is preferably 1 to 20, more preferably 1 to 10, and particularly preferably 1 to 6. Examples of the monovalent hydrocarbon group include alkyl groups such as methyl, ethyl, propyl, and butyl; and aryl groups such as phenyl and naphthyl.

In formula (A-1), R ³ each independently represents a monovalent hydrocarbon group. The range of ^R3 may be the same as the aforementioned ^R2 .

In formula (A-1), n represents an integer from 1 to 20. n is preferably 1 to 10, more preferably 1 to 6.

In formula (A-1), s each independently represents an integer from 0 to 4. s is 0 or 1 as good, and 0 is particularly good.

In formula (A-1), t each independently represents an integer from 0 to 3. t is 0 or 1, and 0 is particularly good.

Particularly as the biphenylaralkyl-type phenol resin (A), a compound represented by the following formula (A-2) is preferred.

(In formula (A-2), R ⁴ each independently represents an alkyl group or phenyl group with 1 to 5 carbon atoms, m each independently represents an integer from 1 to 5, n1 represents an integer from 1 to 20, and t1 each independently represents 0 or 1)

In formula (A-2), R ⁴ each independently represents an alkyl group or phenyl group having 1 to 5 carbon atoms. Examples of the alkyl group include methyl, ethyl, and the like.

In Formula (A-2), m each independently represents an integer from 1 to 5. m is preferably 1 to 4, more preferably 1 to 3, and particularly preferably 1.

In formula (A-2), n1 each independently represents an integer from 1 to 20. n1 can be the same as n in formula (A-1).

In formula (A-2), t1 each independently represents 0 or 1. t1 is preferably 0.

Particularly preferred examples of the biphenylaralkyl-type phenol resin (A) include compounds represented by the following formula (A-3). In formula (A-3), n2 generally represents 1 to 20, preferably an integer of 1 to 6.

As (A) the biphenylaralkyl type phenol resin, a commercial product can be used. Examples of commercially available biphenylaralkyl-type phenol resins (A) include "KAYAHARD GPH-65", "KAYAHARD GPH-78", and "KAYAHARD GPH-103" manufactured by Nippon Kayaku Co., Ltd. The compound represented by the aforementioned formula (A-3)).

(A) Biphenylaralkyl type phenol resin may be used individually by 1 type, or in combination of 2 or more types.

(A) The hydroxyl equivalent of the biphenylaralkyl phenol resin is preferably 50g/eq.~500g/eq., more preferably 50g/eq.~400g/eq., and more preferably 100g/eq.~ 300g/eq. The hydroxyl equivalent weight represents the mass of the resin per hydroxyl equivalent.

When the number of epoxy groups of (B) the epoxy resin is 1, the number of hydroxyl groups of (A) the biphenylaralkyl phenol resin is preferably 0.01 or more, more preferably 0.02 or more, and more preferably 0.05 or more. , preferably 1.5 or less, preferably 1.0 or less, preferably 0.9 or less, particularly preferably 0.8 or less. The "number of hydroxyl groups of (A) biphenyl aralkyl type phenol resin" means the mass of non-volatile components of (A) biphenyl aralkyl type phenol resin present in the resin composition divided by the hydroxyl equivalent weight The total of all calculated values. In addition, "the number of epoxy groups of (B) epoxy resin" means the total value calculated by dividing the mass of non-volatile components of (B) epoxy resin present in the resin composition by the epoxy equivalent.

It is preferable if the mass ratio W _A /W _B of the mass W A of the (A) biphenylaralkyl-type phenol resin and the mass W _B of the ( _B ) epoxy resin in the resin composition is within a specific range. The specific mass ratio W _A /W _B is preferably 0.01 or more, more preferably 0.03 or more, particularly preferably 0.05 or more, and 1.0 or less, preferably 0.7 or less, and particularly preferably 0.6 or less. When the mass ratio W _A /W _B is in the above range, the effects of reducing the dielectric loss tangent, suppressing cracks, and increasing the elongation at the breaking point of the cured product of the resin composition can be significantly obtained.

It is preferable that the mass ratio W _A /WC of the mass W _A of (A) the biphenylaralkyl-type phenol resin and the mass W _C of the ( _C ) active ester compound in the resin composition is within a specific range. The specific mass ratio W _A /W _C is preferably 0.01 or more, more preferably 0.02 or more, particularly preferably 0.03 or more, and preferably 0.80 or less, preferably 0.50 or less, and particularly preferably 0.40 or less. When the mass ratio W _A /W _C is within the aforementioned range, the effect of reducing the dielectric loss tangent, suppressing cracks, and increasing the elongation at the breaking point of the cured product of the resin composition can be significantly obtained.

The amount of (A) biphenylaralkyl-type phenol resin in the resin composition is preferably 0.01 mass% or more, more preferably 0.1 mass% or more, based on 100 mass% of the non-volatile components of the resin composition. Particularly preferably, the content is 0.5% by mass or more, preferably 10% by mass or less, more preferably 6% by mass or less, and particularly preferably 5% by mass or less. (A) When the amount of the biphenylaralkyl-type phenol resin is within the above range, the dielectric loss tangent of the cured product of the resin composition can be significantly reduced, cracking can be suppressed, and the elongation at the breaking point can be increased. Effect.

The amount of (A) biphenylaralkyl-type phenol resin in the resin composition is preferably 0.1 mass% or more, more preferably 1 mass% or more, based on 100 mass% of the resin component of the resin composition. Preferably it is 2 mass % or more, more preferably 30 mass % or less, more preferably 20 mass % or less, and particularly preferably 15 mass % or less. The resin component of the resin composition means the component excluding (D) the inorganic filler from the non-volatile components of the resin composition. (A) When the amount of the biphenylaralkyl-type phenol resin is within the above range, the dielectric loss tangent of the cured product of the resin composition can be significantly reduced, cracks can be suppressed, and the elongation at the breaking point can be increased. Big effect.

[3.(B) Epoxy resin] The resin composition according to this embodiment contains (B) epoxy resin as (B) component. (B) Epoxy resin is a curable resin having an epoxy group. (B) The epoxy resin does not contain components equivalent to the above-mentioned (A).

Examples of (B) epoxy resin include bisxylenol type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, and bisphenol AF type epoxy resin. Oxygen resin, dicyclopentadiene type epoxy resin, ginseng phenol type epoxy resin, naphthol novolak type epoxy resin, phenol novolak type epoxy resin, tert-butyl-catechol type epoxy resin , Naphthalene type epoxy resin, naphthol type epoxy resin, anthracene type epoxy resin, glycidyl amine type epoxy resin, glycidyl ester type epoxy resin, cresol novolak type epoxy resin, phenol aralkane Base epoxy resin, biphenyl epoxy resin, linear aliphatic epoxy resin, epoxy resin with butadiene structure, alicyclic epoxy resin, heterocyclic epoxy resin, spiro ring containing Epoxy resin, cyclohexane type epoxy resin, cyclohexane dimethanol type epoxy resin, naphthylene ether type epoxy resin, trimethylol type epoxy resin, tetraphenylethane type epoxy resin, Isocyanurate epoxy resin, phenol phthalazine epoxy resin, etc. (B) Epoxy resin can be used individually by 1 type, or in combination of 2 or more types.

(B) The epoxy resin preferably contains an epoxy resin containing an aromatic structure from the viewpoint of obtaining a cured product having excellent heat resistance. The so-called aromatic structure is a chemical structure generally defined as aromatic, and also contains polycyclic aromatic and aromatic heterocycles. Examples of the epoxy resin containing an aromatic structure include bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, bisphenol S-type epoxy resin, bisphenol AF-type epoxy resin, and dicyclopentadienyl. Vinyl epoxy resin, phenol type epoxy resin, naphthol novolak type epoxy resin, phenol novolak type epoxy resin, tert-butyl-catechol type epoxy resin, naphthalene type epoxy resin, Naphthol type epoxy resin, anthracene type epoxy resin, bisphenol type epoxy resin, glycidyl amine type epoxy resin with aromatic structure, glycidyl ester type epoxy resin with aromatic structure, methane Phenol novolac type epoxy resin, biphenyl type epoxy resin, linear aliphatic epoxy resin with aromatic structure, epoxy resin containing butadiene structure with aromatic structure, and grease with aromatic structure Cyclic epoxy resin, heterocyclic epoxy resin, spiro ring containing epoxy resin with aromatic structure, cyclohexanedimethanol type epoxy resin with aromatic structure, naphthylene ether type epoxy resin, Trimethylol-type epoxy resin with aromatic structure, tetraphenylethane-type epoxy resin with aromatic structure, etc.

The resin composition preferably contains an epoxy resin having two or more epoxy groups in one molecule as (B) epoxy resin. The proportion of the epoxy resin having two or more epoxy groups per molecule is preferably 50 mass% or more, more preferably 60 mass%, based on 100 mass% of the non-volatile content of the epoxy resin (B). Above, particularly preferably 70% by mass or more.

Epoxy resins include epoxy resins that are liquid at a temperature of 20°C (hereinafter sometimes referred to as "liquid epoxy resins") and epoxy resins that are solid at a temperature of 20°C (hereinafter sometimes referred to as "solid epoxy resins"). like epoxy resin"). The resin composition may contain only liquid epoxy resin as the epoxy resin, or may contain only solid epoxy resin, or may contain a combination of liquid epoxy resin and solid epoxy resin.

As the liquid epoxy resin, one having two or more epoxy groups per molecule is preferred.

As liquid epoxy resins, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, naphthalene type epoxy resin, glycidyl ester type epoxy resin, glycidyl ester type epoxy resin, Amine-type epoxy resin, phenolic novolak-type epoxy resin, alicyclic epoxy resin with ester skeleton, cyclohexane-type epoxy resin, cyclohexanedimethanol-type epoxy resin and cyclohexane-type epoxy resin with butadiene structure Oxygen resin is preferred.

Specific examples of liquid epoxy resins include "HP4032", "HP4032D" and "HP4032SS" (naphthalene type epoxy resin) manufactured by DIC Corporation; "828US", "828EL" and "828EL" manufactured by Mitsubishi Chemical Corporation jER828EL", "825", "EPICOAT828EL" (bisphenol A type epoxy resin); "jER807", "1750" (bisphenol F type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "jER152" manufactured by Mitsubishi Chemical Corporation (Phenol novolak type epoxy resin); "630", "630LSD", "604" (glycidylamine type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "ED-523T" (mannitol ring type epoxy resin) manufactured by ADEKA oxy resin); "EP-3950L" and "EP-3980S" (glycidylamine type epoxy resin) manufactured by ADEKA; "EP-4088S" (dicyclopentadiene type epoxy resin) manufactured by ADEKA ; "ZX1059" made by Nippon Steel Chemical Materials Chemical Co., Ltd. (a mixture of bisphenol A type epoxy resin and bisphenol F type epoxy resin); "EX-721" made by Nagase Chemtex Co., Ltd. (glycidyl ester type Epoxy resin); "CELLOXIDE2021P" manufactured by Daicel Chemical Industries, Ltd. (alicyclic epoxy resin with an ester skeleton); "PB-3600" manufactured by Daicel Chemical Industries, Ltd., "JP" manufactured by Nippon Soda Corporation -100", "JP-200" (epoxy resin with butadiene structure); "ZX1658" and "ZX1658GS" manufactured by Nippon Steel Chemical Materials (liquid 1,4-glycidylcyclohexane type ring Oxygen resin) etc. One type of these may be used alone, or two or more types may be used in combination.

As the solid epoxy resin, a solid epoxy resin having three or more epoxy groups in one molecule is preferred, and an aromatic solid epoxy resin having three or more epoxy groups in one molecule is preferred. For better.

As solid epoxy resins, bisxylenol-type epoxy resin, naphthalene-type epoxy resin, naphthalene-type tetrafunctional epoxy resin, naphthol novolak-type epoxy resin, cresol novolac-type epoxy resin, di- Cyclopentadiene epoxy resin, ginseng phenol epoxy resin, naphthol epoxy resin, biphenyl epoxy resin, naphthylene ether epoxy resin, anthracene epoxy resin, bisphenol A type Epoxy resin, bisphenol AF type epoxy resin, phenol aralkyl type epoxy resin, tetraphenyl ethane type epoxy resin, phenol phthalamine type epoxy resin are preferred.

Specific examples of solid epoxy resins include "HP4032H" (naphthalene type epoxy resin) manufactured by DIC Corporation; "HP-4700" and "HP-4710" (naphthalene type tetrafunctional epoxy resin) manufactured by DIC Corporation Resin); "N-690" (cresol novolak type epoxy resin) manufactured by DIC Corporation; "N-695" (cresol novolac type epoxy resin) manufactured by DIC Corporation; "HP- 7200", "HP-7200HH", "HP-7200H", "HP-7200L" (dicyclopentadiene type epoxy resin); "EXA-7311", "EXA-7311-G3" made by DIC Corporation, "EXA-7311-G4", "EXA-7311-G4S", "HP6000" (naphthylene ether type epoxy resin); "EPPN-502H" (ginseng phenol type epoxy resin) manufactured by Nippon Kayaku Corporation; "NC7000L" (naphthol novolac type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; "NC3000H", "NC3000", "NC3000L", "NC3000FH", "NC3100" (biphenyl-based type) manufactured by Nippon Kayaku Co., Ltd. Epoxy resin); "ESN475V" and "ESN4100V" (naphthalene type epoxy resin) manufactured by Nippon Steel Chemical Materials Co., Ltd.; "ESN485" (naphthol type epoxy resin) manufactured by Nippon Steel Chemical Materials Co., Ltd.; Nippon Steel Chemical Materials Co., Ltd. "ESN375" (dihydroxynaphthalene type epoxy resin) manufactured by Iron Chemical Materials Co., Ltd.; "YX4000H", "YX4000", "YX4000HK", "YL7890" (bisxylenol type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "YL6121" manufactured by Mitsubishi Chemical Corporation (biphenyl type epoxy resin); "YX8800" manufactured by Mitsubishi Chemical Corporation (anthracene type epoxy resin); "YX7700" manufactured by Mitsubishi Chemical Corporation (phenolic aralkyl type epoxy resin) Resin); "PG-100" and "CG-500" manufactured by Osaka Gas Chemical Co., Ltd.; "YL7760" (bisphenol AF type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "YL7800" (fluorene type) manufactured by Mitsubishi Chemical Corporation Epoxy resin); "jER1010" (bisphenol A type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "jER1031S" (tetraphenylethane type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "jER1010" (bisphenol A type epoxy resin) manufactured by Mitsubishi Chemical Corporation; WHR991S" (phenol phthalazine type epoxy resin), etc. One type of these can be used alone, or two or more types can be used in combination.

(B) The epoxy equivalent of the epoxy resin is preferably 50g/eq.~5,000g/eq., more preferably 60g/eq.~3,000g/eq., and more preferably 80g/eq.~2,000g/eq. eq., the best value is 110g/eq.~1,000g/eq. Epoxy equivalents represent the mass of resin per equivalent of epoxy groups. The epoxy equivalent can be measured in accordance with JIS K7236.

(B) The weight average molecular weight (Mw) of the epoxy resin is preferably 100 to 5,000, more preferably 250 to 3,000, and more preferably 400 to 1,500. The weight average molecular weight of the resin can be measured as a polystyrene-converted value by gel permeation chromatography (GPC).

The amount of (B) epoxy resin in the resin composition is preferably 1 mass% or more, more preferably 2 mass% or more, and particularly preferably 4 mass% or more based on 100 mass% of the non-volatile components in the resin composition. , preferably 25 mass% or less, more preferably 20 mass% or less, particularly preferably 10 mass% or less. (B) When the amount of the epoxy resin is within the above range, the effects of reducing the dielectric loss tangent, suppressing cracks, and increasing the elongation at the breaking point of the cured product of the resin composition can be significantly obtained.

The amount of (B) epoxy resin in the resin composition is preferably 5 mass% or more, more preferably 10 mass% or more, and particularly preferably 20 mass%, based on 100 mass% of the resin component in the resin composition. The above content is preferably 60 mass% or less, more preferably 50 mass% or less, and particularly preferably 40 mass% or less. (B) When the amount of the epoxy resin is within the above range, the effects of reducing the dielectric loss tangent, suppressing cracks, and increasing the elongation at the breaking point of the cured product of the resin composition can be significantly obtained.

[4.(C) Active ester compound] The resin composition according to this embodiment contains the (C) active ester compound as the component (C) in a specific range. (C) The active ester compound does not contain components equivalent to the above (A) to (B). (C) The active ester compound has a function as an epoxy resin hardener that reacts with (B) epoxy resin to harden the resin composition. (C) One type of active ester compound may be used alone, or two or more types may be used in combination.

As (C) the active ester compound, generally used are highly reactive esters having at least two esters per molecule, such as phenolic esters, thiophenol esters, N-hydroxylamine esters, and esters of heterocyclic hydroxy compounds. Compounds are better. The active ester compound is preferably obtained by the condensation reaction of a carboxylic acid compound and/or a thiocarboxylic acid compound and a hydroxy compound and/or a thiol compound. Especially from the viewpoint of improving heat resistance, an active ester compound obtained from a carboxylic acid compound and a hydroxy compound is preferred, and an active ester compound obtained from a carboxylic acid compound, a phenol compound and/or a naphthol compound is preferred. Examples of carboxylic acid compounds include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, pyromellitic acid, and the like. Examples of the phenol compound or naphthol compound include hydroquinone, resorcinol, bisphenol A, bisphenol F, bisphenol S, phenolphthalazine, methylated bisphenol A, methylated bisphenol F, and toluene. Sylated bisphenol S, phenol, o-cresol, m-cresol, p-cresol, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthalene, 1,6- Dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucinol, phlorotriol, dicyclopentadienyl diphenol Compounds, phenolic novolaks, etc. The so-called "dicyclopentadiene-type diphenol compound" refers to a diphenol compound obtained by condensing one molecule of dicyclopentadiene and two molecules of phenol.

Specific examples of the active ester compound (C) include a dicyclopentadiene-type active ester compound, a naphthalene-type active ester compound containing a naphthalene structure, an active ester compound containing an acetate of phenol novolac, and a benzene-containing phenol novolak. The active ester compound of a formyl compound is preferred, and among them, at least one selected from the group consisting of dicyclopentadiene-type active ester compounds and naphthalene-type active ester compounds is also preferred, and the one containing a naphthalene-type active ester compound is particularly preferred. good. As the dicyclopentadiene-type active ester compound, an active ester compound containing a dicyclopentadiene-type diphenol structure is preferred. Furthermore, as one aspect of the present invention, it is preferable that the compound contains a dicyclopentadiene-type active ester compound and a naphthalene-type active ester compound.

Examples of commercially available active ester compounds (C) include "EXB9451", "EXB9460", "EXB9460S", and "EXB-8000L" as active ester compounds containing a dicyclopentadiene-type diphenol structure. "EXB-8000L-65M", "EXB-8000L-65TM", "HPC-8000L-65TM", "HPC-8000", "HPC-8000-65T", "HPC-8000H", "HPC-8000H-65TM" ” (manufactured by DIC Corporation); examples of active ester compounds containing a naphthalene structure include “HP-B-8151-62T”, “EXB-8100L-65T”, “EXB-8150-60T”, and “EXB-8150- 62T", "EXB-9416-70BK", "HPC-8150-60T", "HPC-8150-62T", "EXB-8" (manufactured by DIC Corporation); examples of active ester compounds containing phosphorus include " EXB9401" (manufactured by DIC Corporation); examples of the active ester compound of the acetyl compound of phenol novolac include "DC808" (manufactured by Mitsubishi Chemical Corporation); examples of the active ester compound of the benzyl compound of phenol novolac can be Examples include "YLH1026", "YLH1030", and "YLH1048" (manufactured by Mitsubishi Chemical Corporation); examples of active ester compounds containing a styrene group and a naphthalene structure include "PC1300-02-65MA" (manufactured by Air Water Co., Ltd.), etc. .

(C) The active ester group equivalent of the active ester compound is preferably 50g/eq.~500g/eq., more preferably 50g/eq.~400g/eq., more preferably 100g/eq.~300g/eq. . The active ester group equivalent represents the mass of the active ester compound per active ester group equivalent.

When the number of epoxy groups of (B) the epoxy resin is 1, the number of active ester groups of (C) the active ester compound is preferably 0.1 or more, more preferably 0.5 or more, more preferably 0.8 or more, and preferably 6.0 or less. A value of 5.0 or less is preferred, and a value of 4.0 or less is particularly preferred. The "number of active ester groups of (C) active ester compound" means the total value of all values obtained by dividing the mass of non-volatile components of (C) active ester compound present in the resin composition by the active ester group equivalent.

When the number of hydroxyl groups of (A) the biphenylaralkyl phenol resin is 1, the number of active ester groups of the (C) active ester compound is preferably 1.0 or more, more preferably 1.5 or more, particularly preferably 2.0 or more, and It is better to be below 50, preferably below 40, and particularly preferably below 30.

The amount of (C) active ester compound in the resin composition is usually 10 mass% or more, preferably 11 mass% or more, particularly preferably 12 mass%, based on 100 mass% of the non-volatile components of the resin composition. The above content is preferably 30 mass% or less, more preferably 25 mass% or less, and particularly preferably 20 mass% or less. (C) When the amount of the active ester compound is within the aforementioned range, the dielectric loss tangent of the cured product of the resin composition can be reduced, cracks can be suppressed, and the elongation at the breaking point can be increased.

The amount of (C) active ester compound in the resin composition is preferably 20 mass% or more, more preferably 30 mass% or more, and particularly preferably 40 mass%, based on 100 mass% of the resin component of the resin composition. The above content is preferably 80 mass% or less, more preferably 70 mass% or less, and particularly preferably 60 mass% or less. (C) When the amount of the active ester compound is within the above range, the effects of reducing the dielectric loss tangent of the cured product of the resin composition, suppressing cracks, and increasing the elongation at break point can be significantly obtained.

[5.(D) Inorganic filler] The resin composition according to this embodiment may contain the inorganic filler (D) as the component (D) in a specific range. (D) The inorganic filler is generally contained in the resin composition in a particle state.

As the material of (D) the inorganic filler, an inorganic compound is used. Examples of materials for the inorganic filler (D) include silica, alumina, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, and boron. Stone, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, Bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium zirconate titanate, barium zirconate, calcium zirconate, zirconium phosphate and zirconium tungstate phosphate, etc.

Furthermore, as the material of (D) the inorganic filler, an inorganic composite oxide can also be used. The inorganic composite oxide refers to an oxide containing two or more types of atoms selected from the group consisting of metal atoms and semi-metal atoms. As such an inorganic composite oxide, an oxide containing a combination of silicon and one or more types of atoms selected from the group consisting of metal atoms and semi-metal atoms other than silicon is preferred. Examples of metal atoms combined with silicon include aluminum, lead, nickel, cobalt, copper, zinc, zirconium, iron, lithium, magnesium, barium, potassium, calcium, titanium, boron, sodium, etc., among which aluminum is particularly good. Therefore, as the inorganic composite oxide, those containing silicon and aluminum are preferred, and silicate aluminates are particularly preferred.

Among these (D) inorganic filler materials, silica, alumina and silicate aluminate are also preferred, and silica is particularly preferred. Examples of silica include amorphous silica, fused silica, crystalline silica, synthetic silica, hollow silica, and the like. In addition, spherical silica is preferred as the silica. (D) Inorganic filler can be used individually by 1 type, and can also be used in combination of 2 or more types.

(D) Inorganic fillers can be classified into hollow inorganic fillers having pores inside and solid inorganic fillers having no pores inside. As (D) the inorganic filler, only a hollow inorganic filler, only a medium-solid inorganic filler, or a combination of a hollow inorganic filler and a medium-solid inorganic filler can be used. When a hollow inorganic filler is used, the specific conductivity of the hardened material of the resin composition can usually be reduced.

Since the hollow inorganic filling material has pores, it generally has a porosity greater than 0% by volume. From the viewpoint of reducing the specific conductivity of the insulating layer of the hardened material containing the resin composition, the porosity of the hollow inorganic filler is preferably 10% by volume or more, more preferably 15% by volume or more, and particularly preferably 20%. Volume% or more. Furthermore, from the viewpoint of the mechanical strength of the cured product of the resin composition, the porosity of the hollow inorganic filler is preferably 95 volume % or less, more preferably 90 volume % or less, and particularly preferably 85 volume % or less.

The porosity P (volume %) of a particle is defined as the volume basis ratio of the total volume of one or more pores inside the particle relative to the total volume of the particle using the outside of the particle as a basis ( Total volume of pores/volume of particles). The porosity P can be determined by using the measured value D _M (g/cm ³ ) of the actual density of the particles and the theoretical value D _T (g/cm ³ ) of the material density of the material forming the particles, by the following formula ( X1) and calculated.

The manufacturing method of the hollow inorganic filler is not particularly limited and can be manufactured according to common methods.

Examples of commercially available products of (D) inorganic fillers include "SP60-05" and "SP507-05" manufactured by Nippon Steel and Sumitomo Metal Materials Co., Ltd.; and "YC100C", "YA050C" and "YA050C" manufactured by Admatechs. -MJE", "YA010C", "SC2500SQ", "SO-C4", "SO-C2", "SO-C1"; "UFP-30", "DAW-03", "FB-105FD" made by Denka Corporation "; "SilfirNSS-3N", "SilfirNSS-4N", "SilfirNSS-5N" manufactured by Tokuyama Co., Ltd.; "Esferique" and "BA-1" manufactured by Nikko Catalyst Co., Ltd.; "MG-005", manufactured by Pacific Cement Co., Ltd. "MGH-005" etc.

(D) The average particle diameter of the inorganic filler is preferably 0.01 μm or more, more preferably 0.05 μm or more, more preferably 0.1 μm or more, and particularly preferably 0.2 μm, from the viewpoint of significantly obtaining the desired effects of the present invention. Above, it is preferably 10 μm or less, more preferably 5 μm or less, and more preferably 3 μm or less.

(D) The average particle size of the inorganic filler can be measured by the laser diffraction and scattering method based on the Mie scattering theory. Specifically, the particle size distribution of the inorganic filler can be prepared based on the volume basis using a laser diffraction and scattering particle size distribution measuring device, and the median diameter can be measured as the average particle size. To measure the sample, 100 mg of the inorganic filler and 10 g of methyl ethyl ketone were weighed into a sample bottle and dispersed using ultrasonic waves for 10 minutes. A laser diffraction type particle size distribution measuring device is used to measure the measurement sample. The volume-based particle size distribution of the inorganic filler is measured using a flow cell method using the light source wavelengths as blue and red. From the obtained particle size distribution, the average particle size distribution is calculated. The average particle diameter of bit diameter. Examples of the laser diffraction particle size distribution measuring device include "LA-960" manufactured by Horiba Manufacturing Co., Ltd.

(D) The specific surface area of the inorganic filler is preferably 0.1 m ² /g or more, more preferably 0.5 m ² /g or more, and more preferably 1 m ² /g, from the viewpoint of significantly obtaining the desired effects of the present invention. Above, particularly preferably it is 3m ² /g or more, preferably 100m ² /g or less, more preferably 70m ² /g or less, more preferably 50m ² /g or less, and particularly preferably 40m ² /g or less. The specific surface area of the inorganic filler can be measured based on the BET method by adsorbing nitrogen gas on the surface of a sample using a specific surface area measuring device (Macsorb HM-1210 manufactured by Mountech Corporation) and calculating the specific surface area using the BET multi-point method.

(D) The inorganic filler is preferably treated with a surface treatment agent from the viewpoint of improving moisture resistance and dispersibility. Examples of the surface treatment agent include fluorine-containing silane coupling agents, aminosilane coupling agents, epoxysilane coupling agents, mercaptosilane coupling agents, silane coupling agents, alkoxysilane, and organosilazane. compounds, titanate coupling agents, etc. One type of surface treatment agent may be used alone, or two or more types may be used in any combination.

Examples of commercially available surface treatment agents include "KBM403" (3-glycidoxypropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Industries, Ltd. and "KBM803" (3-mercaptopropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Industries, Ltd. Trimethoxysilane), "KBE903" (3-aminopropyltriethoxysilane) manufactured by Shin-Etsu Chemical Industries, Ltd., "KBM573" (N-phenyl-3-aminopropyltrimethyl Oxysilane), "SZ-31" (hexamethyldisilazane) manufactured by Shin-Etsu Chemical Industries, Ltd., "KBM103" (phenyltrimethoxysilane) manufactured by Shin-Etsu Chemical Industries, Ltd., "KBM-" manufactured by Shin-Etsu Chemical Industries, Ltd. 4803" (long-chain epoxy silane coupling agent), "KBM-7103" (3,3,3-trifluoropropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Industry Co., Ltd., etc.

From the viewpoint of improving the dispersibility of the inorganic filler, the degree of surface treatment by the surface treatment agent is preferably controlled within a specific range. Specifically, 100% by mass of the inorganic filler is preferably surface-treated with a surface treatment agent of 0.2% to 5% by mass, preferably 0.2% to 3% by mass of a surface treatment agent, and 0.3% by mass. It is better to use %~2% by mass of surface treatment agent for surface treatment.

The degree of surface treatment by the surface treatment agent can be evaluated by the amount of carbon per unit surface area of the inorganic filler. From the viewpoint of improving the dispersibility of the inorganic filler, the carbon amount per unit surface area of the inorganic filler is preferably 0.02 mg/m ² or more, more preferably 0.1 mg/m ² or more, and 0.2 mg/m ² The above is better. On the other hand, from the viewpoint of preventing an increase in the melt viscosity of the resin composition, 1.0 mg/m ² or less is preferred, 0.8 mg/m ² or less is more preferred, and 0.5 mg/m ² or less is more preferred. .

(D) The carbon amount per unit surface area of the inorganic filler can be measured after the surface-treated inorganic filler is washed with a solvent (eg, methyl ethyl ketone (MEK)). Specifically, a sufficient amount of MEK as a solvent is added to an inorganic filler surface-treated with a surface treatment agent, and ultrasonic cleaning is performed at 25° C. for 5 minutes. After removing the clear liquid and drying the solid content, the amount of carbon per unit surface area of the inorganic filler can be measured using a carbon analyzer. As a carbon analyzer, "EMIA-320V" manufactured by Horiba Manufacturing Co., Ltd., etc. can be used.

The amount of the (D) inorganic filler in the resin composition meets at least one of the following conditions (i) and (ii). Condition (i): (D) The amount (mass %) of the inorganic filler is 60 mass % or more based on 100 mass % of non-volatile components of the resin composition. Condition (ii): (D) The amount (volume %) of the inorganic filler is 45 volume % or more based on 100 volume % of the non-volatile components of the resin composition.

Condition (i) will be described in detail. (D) The amount (mass %) of the inorganic filler is generally 60 mass % or more, preferably 63 mass % or more, more preferably 65 mass % or more, based on 100 mass % of the non-volatile components of the resin composition. A particularly good one is 67 mass % or more, preferably 85 mass % or less, more preferably 80 mass % or less, and a particularly good one is 75 mass % or less.

Condition (ii) will be described in detail. (D) The amount (volume %) of the inorganic filler relative to 100 volume % of the non-volatile components of the resin composition is generally 45 volume % or more, preferably 50 volume % or more, and more preferably 55 volume % or more, It is preferably 80 volume % or less, more preferably 70 volume % or less, and particularly preferably 65 volume % or less.

(D) When the amount of the inorganic filler meets at least one of the conditions (i) and (ii), it can achieve the reduction of the dielectric loss tangent, the suppression of cracks and the elongation of the fracture point of the cured resin composition. The degree increases.

[6.(E) Any hardener] The resin composition according to this embodiment may further contain (E) any curing agent as an optional component combined with the above-mentioned components (A) to (D). The optional curing agent (E) as the component (E) does not contain components corresponding to the above-mentioned components (A) to (D). (E) The optional hardener is the same as the above-mentioned (A) biphenylaralkyl phenol resin and (C) active ester compound, and may have a ring that reacts with (B) the epoxy resin to harden the resin composition. Function of oxygen resin hardener. (E) Arbitrary hardeners may be used alone or in combination of two or more types.

Examples of the optional hardener (E) include phenol-based hardeners, carbodiimide-based hardeners, acid anhydride-based hardeners, amine-based hardeners, benzoxazine-based hardeners, and cyanate ester-based hardeners. agents, and mercaptan hardeners. However, the phenol-based hardeners classified as (E) arbitrary hardeners do not contain those equivalent to (A) biphenylaralkyl-type phenol resins. Among these, it is also preferable to use one or more types of hardeners selected from the group consisting of phenol-based hardeners and carbodiimide-based hardeners, and carbodiimide-based hardeners are particularly preferred. Therefore, it is particularly preferable that any hardener (E) contains a carbodiimide-based hardener.

As the carbodiimide-based hardener, a hardener having one or more, preferably two or more carbodiimide structures per molecule can be used. Specific examples of carbodiimide-based hardeners include tetramethylene-bis(t-butylcarbodiimide) and cyclohexanebis(methylene-t-butylcarbodiimide). aliphatic biscarbodiimides; aromatic biscarbodiimides such as phenylene-bis(xylylcarbodiimide) and other biscarbodiimides; polyhexamethylenecarbodiimide, polytrimethylcarbodiimide, etc. Aliphatic polycarbons such as methylhexamethylenecarbodiimide, polycyclohexamethylenecarbodiimide, poly(methylenebicyclohexamethylenecarbodiimide), poly(isophoronecarbodiimide), etc. Diimines; poly(phenylenecarbodiimide), poly(naphthylenecarbodiimide), poly(toluenecarbodiimide), poly(methyldiisopropylphenylenecarbodiimide) ), poly(triethylphenylenecarbodiimide), poly(diethylphenylenecarbodiimide), poly(triisopropylphenylenecarbodiimide), poly(diisopropylphenylenecarbodiimide) Carbodiimide), poly(xylylenecarbodiimide), poly(tetramethylxylylenecarbodiimide), poly(methylenediphenylenecarbodiimide), poly[methylene polycarbodiimide such as bis(methylphenylene)carbodiimide] and other aromatic polycarbodiimides. Examples of commercially available carbodiimide-based hardeners include "carbopyrite V-02B", "carbopyroxene V-03", "carbopyroxene V-04K" and "carbopyroxene V" manufactured by Nisshinbo Chemical Co., Ltd. -07" and "Carbonite V-09"; "StabaxolP", "StabaxolP400", "High Cazir510" manufactured by Line Chemie Co., Ltd., etc.

As the phenolic hardener, one having one or more, preferably two or more hydroxyl groups bonded to an aromatic ring such as a benzene ring or a naphthalene ring per molecule can be used. From the viewpoint of heat resistance and water resistance, a phenolic hardener having a novolac structure is preferred. Furthermore, from the viewpoint of adhesion, a nitrogen-containing phenol-based hardener is preferred, and a phenol-based hardener containing a triazine skeleton is preferred. Among them, phenol novolac resin containing a triazine skeleton is preferred from the viewpoint of high heat resistance, water resistance and adhesion. Specific examples of phenolic hardeners include "MEH-7700", "MEH-7810", and "MEH-7851" manufactured by Meiwa Kasei Co., Ltd., "NHN" and "CBN" manufactured by Nippon Kayaku Co., Ltd. "SN-170", "SN-180", "SN-190", "SN-475", "SN-485", "SN-495", "SN-375", manufactured by Nippon Steel Chemical Materials Co., Ltd. "SN-395", "LA-7052", "LA-7054", "LA-3018", "LA-3018-50P", "LA-1356", "TD2090", "TD-2090" made by DIC Corporation -60M" etc.

As the acid anhydride-based curing agent, a curing agent having one or more acid anhydride groups per molecule can be used, and a curing agent having two or more acid anhydride groups per molecule is preferred. Specific examples of acid anhydride-based hardeners include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, and methylhexahydrophthalic anhydride. Dicarboxylic anhydride, methyl nadic anhydride, hydrogenated methyl nadic anhydride, triyltetrahydrophthalic anhydride, dodecenylsuccinic anhydride, 5-(2,5-dioxotetrahydro-3-furan base)-3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenone tetracarboxylic dianhydride, biphenyl tetracarboxylic dianhydride, naphthalene tetracarboxylic acid Acid dianhydride, oxydiphthalic dianhydride, 3,3'-4,4'-diphenyltetracarboxylic dianhydride, 1,3,3a,4,5,9b-hexahydro-5 -(Tetrahydro-2,5-dioxo-3-furyl)-naphtho[1,2-C]furan-1,3-dione, ethylene glycol bis(anhydrous trimellitate), Polymeric acid anhydrides such as styrene and maleic acid resin copolymerized with styrene and maleic acid. Examples of commercially available acid anhydride hardeners include "HNA-100", "MH-700", "MTA-15", "DDSA", and "OSA" manufactured by New Nippon Rika Co., Ltd.; Mitsubishi Chemical Corporation's "YH-306" and "YH-307"; "HN-2200" and "HN-5500" made by Hitachi Chemical Co., Ltd.; "EF-30", "EF-40" and "EF-60" made by Clay Valley Co., Ltd. , "EF-80", etc.

As the amine-based curing agent, one having one or more, preferably two or more amine groups in one molecule can be used. Examples of amine-based hardeners include aliphatic amines, polyether amines, alicyclic amines, aromatic amines, and the like. Among them, aromatic amines are also preferred. The amine-based hardener is preferably a first-level amine or a second-level amine, and the first-level amine is more preferred. Specific examples of the amine-based hardener include 4,4'-methylenebis(2,6-dimethylaniline), 4,4'-diaminodiphenylmethane, and 4,4'- Diaminodiphenylenediamine, 3,3'-diaminodiphenylenediamine, m-phenylenediamine, m-xylylenediamine, diethyltoluenediamine, 4,4'-diamine Diphenyl ether, 3,3'-dimethyl-4,4'-diaminobiphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, 3,3 '-Dihydroxybenzidine, 2,2-bis(3-amino-4-hydroxyphenyl)propane, 3,3-dimethyl-5,5-diethyl-4,4-diphenylmethane Diamine, 2,2-bis(4-aminophenyl)propane, 2,2-bis(4-(4-aminophenoxy)phenyl)propane, 1,3-bis(3-amino) Phenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 4,4'-bis(4-aminobenzene) Oxy)biphenyl, bis(4-(4-aminophenoxy)phenyl)sine, bis(4-(3-aminophenoxy)phenyl)sine, etc. Examples of commercially available amine-based hardeners include "SEIKACURE-S" manufactured by SEIKA; "KAYABOND C-200S", "KAYABOND C-100", "Kayahard A-A", and "KAYABOND C-100" manufactured by Nippon Kayaku Co., Ltd. "KayahardA-B", "KayahardA-S"; "EpicureW" manufactured by Mitsubishi Chemical Corporation; "DTDA" manufactured by Sumitomo Seiko Chemicals, etc.

Specific examples of benzoxazine-based hardeners include "JBZ-OP100D" and "ODA-BOZ" manufactured by JFE Chemical Co., Ltd.; "HFB2006M" manufactured by Showa Polymer Co., Ltd.; " P-d", "F-a", etc.

Examples of the cyanate ester-based hardener include bisphenol A dicyanate, polyphenol cyanate (oligo(3-methylene-1,5-phenylene cyanate)), 4, 4'-methylene bis(2,6-dimethylphenyl cyanate), 4,4'-ethylene diphenyl dicyanate, hexafluorobisphenol A dicyanate, 2, 2-bis(4-cyanate)phenylpropane, 1,1-bis(4-cyanatephenylmethane), bis(4-cyanate-3,5-dimethylphenyl)methane, 1,3-bis(4-cyanatophenyl-1-(methylethylene))benzene, bis(4-cyanatophenyl)thioether, and bis(4-cyanatophenyl) ) bifunctional cyanate ester resins such as ethers, polyfunctional cyanate ester resins derived from phenol novolaks and cresol novolacs, prepolymers in which part of these cyanate ester resins are triazinized, etc. Specific examples of cyanate ester-based hardeners include "PT30" and "PT60" manufactured by Lonza Japan (both are phenol novolac type polyfunctional cyanate ester resins), "BA230", and "BA230S75" (a prepolymer that becomes a trimer in which part or all of bisphenol A dicyanate is triazinated), etc.

Examples of thiol-based hardeners include trimethylolpropane (3-mercaptopropionate), pentaerythritol (3-mercaptobutyrate), and ginseng (3-mercaptopropyl) isocyanurate. wait.

(E) The active radical equivalent of any hardener is preferably 50g/eq.~3000g/eq., preferably 100g/eq.~1000g/eq., and more preferably 100g/eq.~500g/eq., The best value is 100g/eq.~300g/eq. The active group equivalent represents the mass of hardener per active group equivalent.

The amount of the optional hardener (E) in the resin composition may be 0% by mass relative to 100% by mass of the non-volatile components of the resin composition, or may be greater than 0% by mass, 0.01% by mass or more. It is preferably 0.1 mass % or more, particularly preferably 1.0 mass % or more, 20 mass % or less is preferred, 10 mass % or less is preferred, and particularly preferably 5 mass % or less.

The amount of the optional hardener (E) in the resin composition may be 0% by mass relative to 100% by mass of the resin component of the resin composition, or may be greater than 0% by mass, and may be 0.1% by mass or more. Excellent, preferably 1.0 mass% or more, particularly preferably 5.0 mass% or more, 50 mass% or less is preferred, preferably 40 mass% or less, and particularly preferably 30 mass% or less.

[7.(F) Hardening accelerator] The resin composition according to this embodiment may further contain (F) a hardening accelerator as an optional component combined with the above-mentioned components (A) to (E). The hardening accelerator (F) as the component (F) does not contain components equivalent to the above-mentioned components (A) to (E). (F) The hardening accelerator functions as a hardening catalyst that accelerates hardening of (B) epoxy resin.

Examples of the (F) hardening accelerator include phosphorus-based hardening accelerators, urea-based hardening accelerators, guanidine-based hardening accelerators, imidazole-based hardening accelerators, metal-based hardening accelerators, and amine-based hardening accelerators. Among them, imidazole-based hardening accelerators are preferred. (F) One type of hardening accelerator may be used alone, or two or more types may be used in combination.

Examples of the phosphorus-based hardening accelerator include tetrabutylphosphonium bromide, tetrabutylphosphonium chloride, tetrabutylphosphonium acetate, tetrabutylphosphonium decanoate, tetrabutylphosphonium laurate, and (Tetrabutylphosphonium)pyromellitate, tetrabutylphosphonium hydrohexahydrophthalate, tetrabutylphosphonium 2,6-bis[(2-hydroxy-5-methylphenyl)methyl ]-4-methylphenol, di-tert-butyldimethylphosphonium tetraphenylborate and other aliphatic phosphonium salts; methyltriphenylphosphonium bromide, ethyltriphenylphosphonium bromide, propyltriphenyl Phenylphosphonium bromide, butyltriphenylphosphonium bromide, benzyltriphenylphosphonium chloride, tetraphenylphosphonium bromide, p-tolyltriphenylphosphonium tetra-p-tolylborate, tetrakisylborate Phenylphosphonium tetraphenylborate, tetraphenylphosphonium tetraphenylborate, triphenylethylphosphonium tetraphenylborate, ginseng (3-methylphenyl)ethylphosphonium tetraphenylborate , (2-methoxyphenyl)ethylphosphonium tetraphenylborate, (4-methylphenyl)triphenylphosphonium thiocyanate, tetraphenylphosphonium thiocyanate, butyl Aromatic phosphonium salts such as triphenylphosphonium thiocyanate; aromatic phosphine and borane complexes such as triphenylphosphine and triphenylborane; aromatic compounds such as triphenylphosphine and p-benzoquinone addition reactants Phosphine･quinone addition reactants; tributylphosphine, tri-tert-butylphosphine, trioctylphosphine, di-tert-butyl(2-butenyl)phosphine, di-tert-butyl(3 -Methyl-2-butenyl)phosphine, tricyclohexylphosphine and other aliphatic phosphine; dibutylphenylphosphine, di-tert-butylphenylphosphine, methyldiphenylphosphine, ethyldiphenylphosphine Phosphine, butyldiphenylphosphine, diphenylcyclohexylphosphine, triphenylphosphine, tri-o-tolylphosphine, tri-m-tolylphosphine, tri-p-tolylphosphine, ginseng (4-ethyl Phenyl) phosphine, ginseng (4-propylphenyl) phosphine, ginseng (4-isopropylphenyl) phosphine, ginseng (4-butylphenyl) phosphine, ginseng (4-tert-butylphenyl) Phosphine, ginseng (2,4-dimethylphenyl) phosphine, ginseng (2,5-dimethylphenyl) phosphine, ginseng (2,6-dimethylphenyl) phosphine, ginseng (3,5- Dimethylphenyl)phosphine, ginseng(2,4,6-trimethylphenyl)phosphine, ginseng(2,6-dimethyl-4-ethoxyphenyl)phosphine, ginseng(2-methoxyphenyl)phosphine basephenyl)phosphine, ginseng(4-methoxyphenyl)phosphine, ginseng(4-ethoxyphenyl)phosphine, ginseng(4-tert-butoxyphenyl)phosphine, diphenyl-2- Pyridylphosphine, 1,2-bis(diphenylphosphine)ethane, 1,3-bis(diphenylphosphine)propane, 1,4-bis(diphenylphosphine)butane, 1,2-bis Aromatic phosphines such as (diphenylphosphine) acetylene and 2,2'-bis(diphenylphosphine)diphenyl ether, etc.

Examples of urea-based hardening accelerators include 1,1-dimethylurea; 1,1,3-trimethylurea, 3-ethyl-1,1-dimethylurea, and 3-cyclohexyl- 1,1-dimethylurea, 3-cyclooctyl-1,1-dimethylurea and other aliphatic dimethylureas; 3-phenyl-1,1-dimethylurea, 3-(4- Chlorophenyl)-1,1-dimethylurea, 3-(3,4-dichlorophenyl)-1,1-dimethylurea, 3-(3-chloro-4-methylphenyl) -1,1-dimethylurea, 3-(2-methylphenyl)-1,1-dimethylurea, 3-(4-methylphenyl)-1,1-dimethylurea, 3-(3,4-dimethylphenyl)-1,1-dimethylurea, 3-(4-isopropylphenyl)-1,1-dimethylurea, 3-(4-methyl Oxyphenyl)-1,1-dimethylurea, 3-(4-nitrophenyl)-1,1-dimethylurea, 3-[4-(4-methoxyphenoxy) Phenyl]-1,1-dimethylurea, 3-[4-(4-chlorophenoxy)phenyl]-1,1-dimethylurea, 3-[3-(trifluoromethyl) Phenyl]-1,1-dimethylurea, N,N-(1,4-phenylene)bis(N',N'-dimethylurea), N,N-(4-methyl- 1,3-phenylene)bis(N',N'-dimethylurea)[toluene bisdimethylurea] and other aromatic dimethylureas.

Examples of the guanidine-based hardening accelerator include dicyandiamide, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-phenylguanidine, 1-(o-tolyl)guanidine, and dicyanodiamine. Methylguanidine, diphenylguanidine, trimethylguanidine, tetramethylguanidine, pentamethylguanidine, 1,5,7-triazabicyclo[4.4.0]dec-5-ene, 7-methyl -1,5,7-triazabicyclo[4.4.0]dec-5-ene, 1-methylbiguanide, 1-ethylbiguanide, 1-n-butylbiguanide, 1-n-octadecane Biguanide, 1,1-dimethylbiguanide, 1,1-diethylbiguanide, 1-cyclohexylbiguanide, 1-allylbiguanide, 1-phenylbiguanide, 1-(o-tolyl)biguanide, etc.

Examples of the imidazole-based hardening accelerator include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, and 2-ethyl-4-methyl 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-phenylmethyl-2-methyl Imidazole, 1-phenylmethyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2 -Ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl -2-Phenylimidazolium trimellitate, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4- Diamino-6-[2'-undecylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-ethyl-4' -Methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s- Triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5- Hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo[1,2-a]benzimidazole, 1-dodecyl-2-methyl-3-phenylmethylimidazolium chloride, 2 -Imidazole compounds such as methyl imidazoline and 2-phenylimidazoline and adducts of imidazole compounds and epoxy resins. Examples of commercially available imidazole-based hardening accelerators include "1B2PZ", "2E4MZ", "2MZA-PW", "2MZ-OK", "2MA-OK", and "2MA" manufactured by Shikoku Chemical Industry Co., Ltd. -OK-PW", "2PHZ", "2PHZ-PW", "Cl1Z", "Cl1Z-CN", "Cl1Z-CNS", "C11Z-A"; "P200-H50" manufactured by Mitsubishi Chemical Corporation, etc.

Examples of metal-based hardening accelerators include organic metal complexes or organic metal salts of metals such as cobalt, copper, zinc, iron, nickel, manganese, and tin. Specific examples of organometallic complexes include organic cobalt complexes such as cobalt (II) acetyl acetone and cobalt (III) acetyl acetone, organic copper complexes such as copper (II) acetyl acetone, and zinc (II). Organic zinc complexes such as acetyl acetone, organic iron complexes such as iron (III) acetyl acetone, organic nickel complexes such as nickel (II) acetyl acetone, organic manganese complexes such as manganese (II) acetyl acetone, etc. Examples of organic metal salts include zinc octylate, tin octylate, zinc naphthenate, cobalt naphthenate, tin stearate, zinc stearate, and the like.

Examples of the amine-based hardening accelerator include trialkylamines such as triethylamine and tributylamine, 4-dimethylaminopyridine, benzyldimethylamine, 2,4,6- Ghen(dimethylaminomethyl)phenol, 1,8-diazabicyclo(5,4,0)-undecene, etc. As the amine-based hardening accelerator, commercially available products can be used, and examples thereof include "MY-25" manufactured by Ajinomoto Fine Techno Co., Ltd. and the like.

The amount of (F) hardening accelerator in the resin composition may be 0% by mass relative to 100% by mass of non-volatile components of the resin composition, or may be greater than 0% by mass, preferably 0.01% by mass or more. , preferably 0.02 mass% or more, particularly preferably 0.03 mass% or more, preferably 1.0 mass% or less, preferably 0.5 mass% or less, and particularly preferably 0.1 mass% or less.

The amount of (F) hardening accelerator in the resin composition may be 0% by mass relative to 100% by mass of the resin component of the resin composition, or may be greater than 0% by mass, preferably 0.01% by mass or more. , preferably 0.05 mass% or more, particularly preferably 0.1 mass% or more, preferably 2.0 mass% or less, preferably 1.5 mass% or less, and particularly preferably 1.0 mass% or less.

[8.(G) Thermoplastic resin] The resin composition according to this embodiment may further contain (G) a thermoplastic resin as an optional component combined with the above-mentioned components (A) to (F). The thermoplastic resin (G) as the component (G) does not contain components corresponding to the above-mentioned components (A) to (F).

Examples of the (G) thermoplastic resin include phenoxy resin, polyamide imine resin, polyvinyl acetal resin, polyolefin resin, polybutadiene resin, polyamide imine resin, and polyether imide resin. Amine resin, polyester resin, polyether resin, polyphenylene ether resin, polycarbonate resin, polyether ether ketone resin, polyester resin, etc. (G) One type of thermoplastic resin may be used alone, or two or more types may be used in combination.

Examples of the phenoxy resin include those having a structure selected from the group consisting of a bisphenol A skeleton, a bisphenol F skeleton, a bisphenol S skeleton, a bisphenol acetophenone skeleton, a novolac skeleton, a biphenyl skeleton, a fluorene skeleton, and a dicyclopentane skeleton. Phenoxy resins with one or more skeletons consisting of diene skeleton, norbornene skeleton, naphthalene skeleton, anthracene skeleton, adamantane skeleton, terpene skeleton and trimethylcyclohexane skeleton. The end of the phenoxy resin can be any functional group such as phenolic hydroxyl group or epoxy group. Specific examples of phenoxy resins include "1256" and "4250" manufactured by Mitsubishi Chemical Corporation (both are phenoxy resins containing a bisphenol A skeleton); "YX8100" manufactured by Mitsubishi Chemical Corporation (bisphenol S skeleton contains phenoxy resin); "YX6954" manufactured by Mitsubishi Chemical Corporation (bisphenol acetophenone skeleton contains phenoxy resin); "FX280" and "FX293" manufactured by Nippon Steel and Sumitomo Metal Chemical Corporation; Mitsubishi Chemical Corporation "YL7500BH30", "YX6954BH30", "YX7553", "YX7553BH30", "YL7769BH30", "YL6794", "YL7213", "YL7290", "YL7482" and "YL7891BH30", etc.

Specific examples of the polyimide resin include "SLK-6100" manufactured by Shin-Etsu Chemical Industry Co., Ltd., "RIKACOATSN20" and "RIKACOATPN20" manufactured by Shin-Nihon Rika Co., Ltd., and the like.

Examples of the polyvinyl acetal resin include polyvinyl formaldehyde resin and polyvinyl butyral resin, with polyvinyl butyral resin being preferred. Specific examples of the polyvinyl acetal resin include "Electrobutyral 4000-2", "Electrobutyral 5000-A", "Electrobutyral 6000-C" and "Electrobutyral 6000-C" manufactured by Denki Chemical Industry Co., Ltd. Electrochemical butyral 6000-EP"; S-LECBH series, BX series (such as BX-5Z), KS series (such as KS-1), BL series, BM series, etc. manufactured by Sekisui Chemical Industry Co., Ltd.

Examples of the polyolefin resin include low-density polyethylene, ultra-low-density polyethylene, high-density polyethylene, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, and ethylene-methyl acrylate copolymer. Copolymerized resin; polyolefin polymers such as polypropylene, ethylene-propylene block copolymer, etc.

Examples of the polybutadiene resin include hydrogenated polybutadiene skeleton-containing resin, hydroxyl group-containing polybutadiene resin, phenolic hydroxyl group-containing polybutadiene resin, carboxyl group-containing polybutadiene resin, and acid anhydride group-containing polybutadiene resin. Butadiene resin, epoxy group-containing polybutadiene resin, isocyanate group-containing polybutadiene resin, urethane group-containing polybutadiene resin, polyphenylene ether-polybutadiene resin, etc.

Specific examples of the polyamideimide resin include "VylomaxHR11NN" and "VylomaxHR16NN" manufactured by Toyobo Co., Ltd. Specific examples of the polyamide imine resin include modified polyamide imine resins such as "KS9100" and "KS9300" (polyamide imine containing a polysiloxane skeleton) manufactured by Hitachi Chemical Co., Ltd. amine.

Specific examples of the polyether resin include "PES5003P" manufactured by Sumitomo Chemical Co., Ltd.

Specific examples of polystyrene resins include polystyrene "P1700" and "P3500" manufactured by Solvay Advanced Polymers.

Specific examples of the polyphenylene ether resin include "NORYL SA90" manufactured by SABIC. Specific examples of the polyetherimide resin include "Ultem" manufactured by GE Corporation.

Examples of the polycarbonate resin include hydroxyl group-containing carbonate resin, phenolic hydroxyl group-containing carbonate resin, carboxyl group-containing carbonate resin, acid anhydride group-containing carbonate resin, isocyanate group-containing carbonate resin, Urethane-based carbonate resin, etc. Specific examples of the polycarbonate resin include "FPC0220" manufactured by Mitsubishi Gas Chemical Co., Ltd., "T6002" and "T6001" (polycarbonate diol) manufactured by Asahi Kasei Chemical Co., Ltd., and "C-1090" manufactured by Kuraray Corporation. ”, “C-2090”, “C-3090” (polycarbonate diol), etc. Specific examples of the polyetheretherketone resin include "Sumiploy K" manufactured by Sumitomo Chemical Co., Ltd. and the like.

Examples of the polyester resin include polyethylene terephthalate resin, polyethylene naphthalate resin, polybutylene terephthalate resin, polybutylene naphthalate resin, and polyethylene naphthalate resin. Trimethylene terephthalate resin, polytrimethylene naphthalate resin, polycyclohexane dimethyl terephthalate resin, etc.

(G) The weight average molecular weight (Mw) of the thermoplastic resin is preferably greater than 5,000, more preferably 8,000 or more, more preferably 10,000 or more, particularly preferably 20,000 or more, preferably 100,000 or less, more preferably 70,000 or less, The best price is less than 60,000, and the best price is less than 50,000.

The amount of (G) thermoplastic resin in the resin composition may be 0% by mass relative to 100% by mass of non-volatile components of the resin composition, or may be greater than 0% by mass, preferably 0.01% by mass or more. , preferably 0.02 mass% or more, particularly preferably 0.03 mass% or more, preferably 1.0 mass% or less, preferably 0.5 mass% or less, and particularly preferably 0.1 mass% or less.

The amount of (G) thermoplastic resin in the resin composition may be 0% by mass relative to 100% by mass of the resin component of the resin composition, or may be greater than 0% by mass, preferably 0.01% by mass or more. More preferably, it is 0.05 mass% or more, particularly preferably, it is 0.1 mass% or more, more preferably 2.0 mass% or less, preferably 1.5 mass% or less, and particularly preferably, it is 1.0 mass% or less.

[9.(H)Maleimide resin] The resin composition according to this embodiment may further contain (H) maleimide resin as an optional component in combination with the above-mentioned components (A) to (G). The (H) maleimide resin as the (H) component does not contain components corresponding to the above-mentioned components (A) to (G). As the maleimide resin, one containing at least one, preferably two or more maleimide groups (2,5-dihydro-2,5-dioxo-1H-) per molecule can be used. Pyrrol-1-yl) compounds. (H) Maleimide resin can react with (B) epoxy resin in the presence of an appropriate catalyst such as an imidazole compound. Moreover, in (H) maleimide resin, the ethylenic double bond contained in the maleimide group causes radical polymerization. Therefore, the (H)maleimide resin can thermally harden the resin composition through such reactions. When (H) maleimide resin is used, the dielectric loss tangent of the cured product of the resin composition can be particularly effectively reduced.

As the (H) maleimine resin, an aliphatic maleimine resin containing an aliphatic amine skeleton can also be used, and an aromatic maleimine resin containing an aromatic amine skeleton can also be used. These combinations are available. Moreover, (H) maleimide resin may be used individually by 1 type, and may be used in combination of 2 or more types.

(H) The maleimide resin is selected from the group consisting of a maleimide resin represented by the following formula (H-1) and a maleimide resin represented by the following formula (H-2). More than 1 type is preferred.

(In the formula (H-1), R ^h1 each independently represents a divalent aliphatic group having 5 or more carbon atoms that may have a substituent, and R ^h2 each independently represents an oxygen atom, an aryl group, an alkylene group, or the like. A divalent group formed by combining 2 or more of the groups. n _h1 represents an integer from 1 to 15. In the formula (H-2), R ^h3 each independently represents a divalent fat with 5 or more carbon atoms that may have a substituent. Family group, R ^h4 each independently represents a divalent group with an aromatic ring that may have a substituent, R ^h5 each independently represents an alkyl group with more than 5 carbon atoms. _{n h2} represents an integer from 0 to 10, m _h each independently represents An integer from 0 to 4.)

R ^h1 each independently represents a divalent aliphatic group having 5 or more carbon atoms which may have a substituent. The number of carbon atoms of the divalent aliphatic group having 5 or more carbon atoms is preferably 6 or more, preferably 8 or more, and is preferably 50 or less, preferably 45 or less, and more preferably 40 or less. The divalent aliphatic group may be linear, branched, or cyclic, and among these, linear is preferred. Here, the term "cyclic aliphatic group" refers to a concept including a case consisting only of a cyclic aliphatic group, and a case including a case containing both a linear aliphatic group and a cyclic aliphatic group. Examples of the divalent aliphatic group include an alkylene group, an alkenylene group, and the like.

Examples of such an alkylene group include pentylene, hexylene, heptyl, octyl, nonyl, decyl, undecyl, dodecyl, and tridecyl. , Hexatriacontylene, hexatriacontylene, a group with an octyl-cyclohexylene structure, a group with an octyl-cyclohexylene-octyl structure, a group with a propylene- For those having a cyclohexylene-octyl structure, triacontylene is preferred.

Examples of the alkenylene group include pentenylene, hexenylene, heptenylene, octenylene, nonenylene, decenenyl, undecenylene, and dodecenylene. , tridecenyl, heptadecenyl, trihexenyl, groups with octenyl-cyclohexenyl structure, groups with octenyl-cyclohexenyl-octenyl structure groups, groups with a propylene-cyclohexylene-octenylene structure, etc., with trihenylene group being preferred.

Examples of the substituent of the divalent aliphatic group include a halogen atom, -OH, -OC _1-10 alkyl group, -N(C _1-10 alkyl) ₂ , C _1-10 alkyl group, C _{2- 30} alkenyl, C _2-30 alkynyl, C _6-10 aryl, -NH ₂ , -CN, -C(O)OC _1-10 alkyl, -COOH, -C(O)H, -NO ₂ wait. Among them, the term "C _xy " (x and y are positive integers, and x<y.) means that the number of carbon atoms of the organic group described immediately after the term is x~y. For example _, the so-called "C _1-10 alkyl group" represents an alkyl group with 1 to 10 carbon atoms. These substituents can form a ring when combined with each other, and the ring structure also contains a spiro ring or a condensed ring. The substituent is preferably an alkyl group having 5 or more carbon atoms.

R ^h2 each independently represents an oxygen atom, an aryl group, an alkylene group, or a divalent group in which two or more of these groups are combined. R ^h2 is preferably a divalent group or an oxygen atom formed by a combination of 2 or more of these groups.

Examples of the divalent group formed by a combination of two or more of these groups include a combination of an oxygen atom, an aryl group, and an alkylene group. Specific examples of the divalent group formed by a combination of two or more of these groups include the following groups. In the formula, "*" represents the bonding part.

n _h1 represents an integer from 1 to 15, preferably an integer from 1 to 10.

R ^h3 each independently represents a divalent aliphatic group having 5 or more carbon atoms which may have a substituent. The optionally substituted divalent aliphatic group with 5 or more carbon atoms represented by R ^h3 and R ^h1 is the same, with hexylene, heptyl, octyl, nonyl and decyl being preferred. Sinkisinyl is preferred.

R ^h4 each independently represents a divalent group of an aromatic ring which may have a substituent. R ^h4 is preferably a group formed by a combination of an alkylene group and a divalent group derived from pyromellitic acid diimide; a group formed by a combination of a divalent group derived from phthalimide and an alkylene group is preferred. A group formed by a combination of an alkylene group and a divalent group derived from pyromellitic acid diimide is preferred.

Specific examples of the group represented by R ^h4 include the following groups. In the formula, "*" represents the bonding part.

R ^h5 each independently represents an alkyl group having 5 or more carbon atoms. The number of carbon atoms of the alkyl group having 5 or more carbon atoms is preferably 6 or more, preferably 8 or more, and preferably 50 or less, preferably 45 or less, and more preferably 40 or less. The alkyl group may be linear, branched, or cyclic, and among these, linear is preferred. Examples of such alkyl groups include pentyl, hexyl, heptyl, octyl, nonyl, and decyl. The alkyl group having 5 or more carbon atoms may have an alkylene group having 5 or more carbon atoms as a substituent. Hexyl, heptyl, octyl, nonyl and decyl are preferred, and hexyl and octyl are more preferred.

m _h represents an integer from 0 to 4, with an integer from 1 to 3 being preferred, and 2 being preferred.

Specific examples of (H) maleimide resin include the following compounds (h-1) to (h-4). However, (H) maleimide resin is not limited to these specific examples. In the formula, n _h represents an integer from 1 to 10.

Specific examples of (H) maleimide resin include "BMI1500" manufactured by Designer Molecules and "SLK-1500-T80" manufactured by Shin-Etsu Chemical Industry Co., Ltd. (compound of formula (h-1)); " "BMI1700" (compound of formula (h-2)); "BMI3000J" (compound of formula (h-3)); "BMI689" manufactured by Designer Molecules, and "SLK-6895-T90" manufactured by Shin-Etsu Chemical Industry Co., Ltd. (formula (Compound of h-4)); "SLK-2600" manufactured by Shin-Etsu Chemical Industry Co., Ltd., "BMI-2500" manufactured by Designer Molecules (dimer diamine structure contains maleimine resin); Designer Molecules "BMI-6100" (aromatic maleimide resin) manufactured by Nippon Kayaku Co., Ltd.; "MIR-5000-60T" and "MIR-3000-70MT" (biphenyl aralkyl maleimide resin) manufactured by Nippon Kayaku Co., Ltd. imine resin); "BMI-70" and "BMI-80" manufactured by K･I Chemical Co., Ltd., "BMI-2300" and "BMI-TMH" manufactured by Yamato Chemical Industry Co., Ltd., etc. Moreover, as (H) maleimide resin, for example, the maleimide resin (maleimide containing an indan ring skeleton) disclosed in the Technical Publication No. 2020-500211 of the Invention Association can also be cited. amine resin).

(H) The weight average molecular weight (Mw) of the maleimide resin is preferably 150 to 5000, more preferably 300 to 2500.

(H) The maleimide group equivalent of the maleimide resin is preferably 50g/eq.~2000g/eq., preferably 100g/eq.~1000g/eq., and more preferably 150g/eq. .~500g/eq. The maleimide group equivalent represents the mass of (H) maleimide resin containing 1 equivalent of maleimide group.

The amount of (H) maleimide resin in the resin composition may be 0% by mass relative to 100% by mass of the non-volatile components in the resin composition, or may be greater than 0% by mass, with 0.01 It is preferably at least 0.02 mass% by mass, preferably at least 0.03 mass%, and preferably at most 5 mass%, preferably at most 2 mass%, and particularly preferably at most 1 mass%. (H) When the amount of the maleimide resin is within the aforementioned range, the dielectric loss tangent of the cured product of the resin composition can be particularly effectively reduced.

The amount of (H) maleimide resin in the resin composition may be 0% by mass relative to 100% by mass of the resin component of the resin composition, or may be greater than 0% by mass, such as 0.01% by mass. The above is preferred, more preferably 0.05 mass% or more, particularly preferably 0.1 mass% or more, 5 mass% or less is preferred, 2 mass% or less is preferred, and particularly preferably 1 mass% or less. (H) When the amount of the maleimide resin is within the aforementioned range, the dielectric loss tangent of the cured product of the resin composition can be particularly effectively reduced.

[10.(I) Optional additives] The resin composition according to this embodiment may further contain any additive (I) as an optional non-volatile component in combination with the above-mentioned components (A) to (H). (I) Optional additives include, for example, thermosetting resins other than epoxy resins; organic fillers such as rubber particles; organic metal compounds such as organic copper compounds, organic zinc compounds, and organic cobalt compounds; phthalocyanine blue, phthalocyanine blue, and other organic fillers; Cyanine green, iodine green, diazo yellow, crystal violet, titanium oxide, carbon black and other colorants; hydroquinone, catechol, pyrogallol, phenothiazine and other polymerization inhibitors; silicone leveling agent, Smoothing agents such as acrylic polymer-based smoothing agents; tackifiers such as bentonite and montmorillonite; silicone-based defoaming agents, acrylic-based defoaming agents, fluorine-based defoaming agents, vinyl resin-based defoaming agents, etc. Defoaming agents; UV absorbers such as benzotriazole-based UV absorbers; adhesion-improving agents such as urea silane; triazole-based adhesion-imparting agents, tetrazole-based adhesion-imparting agents, and triazine-based adhesion-imparting agents Adhesion-imparting agents such as agents; antioxidants such as hindered phenol antioxidants; fluorescent whitening agents such as stilbene derivatives; surfactants such as fluorine-based surfactants and silicone-based surfactants; phosphorus-based flame retardants ( Flame retardants such as phosphate ester compounds, phosphazene compounds, phosphonic acid compounds, red phosphorus), nitrogen-based flame retardants (such as melamine sulfate), halogen-based flame retardants, inorganic flame retardants (such as antimony trioxide); Dispersants such as phosphate ester dispersants, polyoxyalkylene dispersants, acetylene dispersants, silicone dispersants, anionic dispersants, cationic dispersants; borate stabilizers, titanate stabilizers, Stabilizers such as aluminate-based stabilizers, zirconate-based stabilizers, isocyanate-based stabilizers, carboxylic acid-based stabilizers, and carboxylic anhydride-based stabilizers. (I) Arbitrary additives may be used individually by 1 type, or in combination of 2 or more types.

[11.(J)Solvent] In the resin composition according to this embodiment, the non-volatile components combined with the above-mentioned components (A) to (I) may further contain the solvent (J) as an optional volatile component. As (J) solvent, an organic solvent is generally used. Examples of organic solvents include ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; methyl acetate, ethyl acetate, butyl acetate, isobutyl acetate, and isoacetate. Amyl ester, methyl propionate, ethyl propionate, γ-butyrolactone and other ester solvents; tetrahydropyran, tetrahydrofuran, 1,4-dioxane, diethyl ether, diisopropyl ether, diisopropyl ether, etc. Ether solvents such as butyl ether, diphenyl ether, and anisole; alcohol solvents such as methanol, ethanol, propanol, butanol, and ethylene glycol; 2-ethoxyethyl acetate, propylene glycol monomethyl ether Acid esters, diethylene glycol monoethyl ether acetate, ethyl diglycol acetate, γ-butyrolactone, methyl methoxypropionate and other ether ester solvents; methyl lactate, ethyl lactate , 2-hydroxyisobutyric acid methyl and other ester alcohol solvents; 2-methoxypropanol, 2-methoxyethanol, 2-ethoxyethanol, propylene glycol isomethyl ether, diethylene glycol monobutyl Ether alcohol solvents such as ether (butylcarbitol); amide solvents such as N,N-dimethylformamide, N,N-dimethylacetamide, N-methyl-2-pyrrolidone, etc. Solvents; dimethyl styrene and other styrene-based solvents; acetonitrile, propionitrile and other nitrile-based solvents; hexane, cyclopentane, cyclohexane, methylcyclohexane and other aliphatic hydrocarbon-based solvents; benzene, toluene, dihydrogen Aromatic hydrocarbon solvents such as toluene, ethylbenzene, and trimethylbenzene. (J) One type of solvent may be used alone, or two or more types may be used in combination.

(J) The amount of the solvent is not particularly limited, but is, for example, 60 mass% or less, 40 mass% or less, 30 mass% or less, 20 mass% or less, or 15 mass% based on 100 mass% of the total components of the resin composition. or less, 10 mass% or less, or 0 mass%.

[12. Manufacturing method of resin composition] The resin composition of this embodiment can be produced, for example, by mixing the above-mentioned components. Some or all of the above ingredients may be mixed at the same time, or may be mixed sequentially. In the process of mixing the components, the temperature can be set appropriately, and the mixture can also be heated and/or cooled temporarily or permanently. In addition, in the process of mixing the ingredients, stirring or shaking may also be performed.

[13. Physical properties of resin composition] According to the resin composition of this embodiment, a cured product having a low dielectric loss tangent can be obtained. For example, when the dielectric loss tangent of a cured product of a resin composition is measured under the conditions described in [Test Example 1: Measurement of dielectric loss tangent] in the Examples described later, a low dielectric loss tangent can be obtained. The dielectric loss tangent of the hardened material is preferably 0.0040 or less, more preferably 0.0035 or less, more preferably 0.0033 or less, and particularly preferably 0.0030 or less. The lower limit is not particularly limited, but may be 0.0010 or more, for example.

According to the resin composition of this embodiment, a cured product capable of suppressing the occurrence of cracks can be obtained. For example, when the yield, which is an indicator of the frequency of crack occurrence in the cured product of the resin composition, is measured under the conditions described in the later-described Example [Test Example 2: Crack Evaluation Test], the yield is 40% or more. Good, better is more than 60%, especially good is more than 80%.

According to the resin composition of this embodiment, a cured product having a large elongation at breaking point can be obtained. For example, when the breaking point elongation of a hardened product of a resin composition is measured under the conditions described in the later-described Example [Test Example 3: Measurement of breaking point elongation], a large breaking point elongation can be obtained. The breaking point elongation of the hardened material is preferably 1.2% or more, more preferably 1.4% or more, and particularly preferably 1.6% or more. Although the upper limit is not particularly limited, it is, for example, 10% or less.

[14.Use of resin composition] The resin composition according to this embodiment can be used as a resin composition for insulating purposes, and is particularly preferably used as a resin composition for forming an insulating layer (a resin composition for forming an insulating layer). For example, the resin composition according to this embodiment can be used as a resin composition for forming an insulating layer of a printed wiring board or as a resin composition for forming an interlayer insulating layer (a resin composition for interlayer insulation). good.

In addition, the resin composition according to this embodiment can also be used as a resin composition for forming a rewiring forming layer (resin composition for forming a rewiring forming layer). The rewiring formation layer refers to an insulating layer on which a rewiring layer is to be formed. In addition, the rewiring layer means a conductor layer formed on the rewiring formation layer which is an insulating layer. For example, when a semiconductor chip package is manufactured through the following steps (1) to (6), the resin composition according to this embodiment can also be used as a resin composition for forming a rewiring formation layer. In addition, when the semiconductor chip package is manufactured through the following steps (1) to (6), a rewiring layer may be further formed on the sealing layer. (1) The steps of laminating the temporary fixing film on the base material, (2) The step of temporarily fixing the semiconductor wafer on the temporary fixing film, (3) The step of forming a sealing layer on the semiconductor wafer, (4) The step of peeling the base material and the temporary fixing film from the semiconductor wafer, (5) The step of forming a rewiring formation layer as an insulating layer on the surface of the semiconductor chip from which the base material and the temporary fixing film are peeled off, and (6) Step of forming a rewiring layer as a conductor layer on the rewiring formation layer

The resin composition of this embodiment can be used, for example, in resin sheets, sheet-like laminates such as prepregs, solder resists, underfill materials, die bonding materials, semiconductor sealing materials, hole-filling resins, component embedding resins, etc. The resin composition can be used in a wider range of applications.

[15. Sheet-like laminated material] The resin composition according to this embodiment can be applied and used in a painted state, but industrially it is preferably used in the form of a sheet-like laminate material containing the resin composition.

As the sheet-like laminated material, resin sheets and prepregs shown below are preferred.

In one embodiment, the resin sheet includes a support and a resin composition layer provided on the support. The resin composition layer is formed of the resin composition according to this embodiment. Therefore, the resin composition layer generally contains the resin composition, preferably only the resin composition.

The thickness of the resin composition layer is preferably 50 μm or less, and is preferably 50 μm or less, from the viewpoint of improving the cured product with excellent insulating properties even when the printed wiring board is thinned and the cured product of the resin composition is a thin film. Preferably, it is below 40 μm. The lower limit of the thickness of the resin composition layer is not particularly limited, but may be 5 μm or more, 10 μm or more, or the like.

Examples of the support include films, metal foils, and release papers made of plastic materials, and films and metal foils made of plastic materials are preferred.

When a film made of a plastic material is used as the support, examples of the plastic material include polyethylene terephthalate (hereinafter sometimes referred to as "PET"), polyethylene naphthalene. Polyesters (hereinafter sometimes referred to as "PEN") and other polyesters, polycarbonates (hereinafter sometimes referred to as "PC"), acrylics such as polymethyl methacrylate (PMMA), cyclic polyolefins, tris Acetylcellulose (TAC), polyether sulfide (PES), polyetherketone, polyimide, etc. Among them, polyethylene terephthalate and polyethylene naphthalate are preferred, and cheap polyethylene terephthalate is particularly preferred.

When a metal foil is used as the support, examples of the metal foil include copper foil, aluminum foil, and the like, with copper foil being preferred. As the copper foil, foils made of copper as a single metal can also be used, or foils made of alloys of copper and other metals (such as tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.) .

The support can be subjected to matting treatment, corona treatment, and antistatic treatment on the surface bonded to the resin composition layer.

As the support, a release layer-attached support having a release layer on the surface bonded to the resin composition layer can also be used. Examples of the release agent used for the release layer of the support with the release layer include one selected from the group consisting of alkyd resins, polyolefin resins, urethane resins, and silicone resins. The above release agent. A commercially available support with a release layer can be used, and examples thereof include "SK-1" and "AL" made by Lintec Corporation, which are PET films having a release layer containing an alkyd resin release agent as a main component. -5", "AL-7", "LumirrorT60" made by Toray, "Purex" made by Teijin, "Unipeel" made by Unitika, etc.

The thickness of the support is not particularly limited, but is preferably in the range of 5 μm to 75 μm, and more preferably in the range of 10 μm to 60 μm. Furthermore, when using a support with a release layer, it is preferable that the thickness of the entire support with a release layer is within the above range.

In one embodiment, the resin sheet may further contain any layer as necessary. Examples of such arbitrary layers include a protective film based on the support provided on the surface not bonded to the support of the resin composition layer (that is, the surface opposite to the support). Although the thickness of the protective film is not particularly limited, it is, for example, 1 μm to 40 μm. By laminating a protective film, it is possible to prevent dust from adhering to or scratching the surface of the resin composition layer.

The resin sheet can be prepared by directly using a liquid (paint-like) resin composition, or by preparing a liquid (paint-like) resin composition in which the resin composition is dissolved in a solvent, and coating the resin sheet using mold coating or the like. On the support, it is further dried to form a resin composition layer and manufactured.

Examples of the solvent include the same solvents described as components of the resin composition. One type of solvent may be used alone, or two or more types may be used in combination.

Drying can be carried out by heating, blowing hot air, etc. Although the drying conditions are not particularly limited, the solvent content in the resin composition layer is generally 10 mass% or less, and preferably is dried to 5 mass% or less. Although it differs depending on the boiling point of the solvent in the resin composition, for example, when using a resin composition containing 30% to 60% by mass of the solvent, the temperature can be determined by heating at 50°C to 150°C for 3 to 10 minutes. After drying, a resin composition layer can be formed.

The resin sheet can be rolled into a roll shape and stored. When the resin sheet has a protective film, it can generally be used by peeling off the protective film.

In one embodiment, the prepreg is formed by impregnating a sheet-like fiber base material with the resin composition according to this embodiment.

The sheet-like fiber base material used for prepregs can be used, for example, as glass cloth, aryl-based nonwoven fabrics, liquid crystal polymer nonwoven fabrics, etc., which are often used as base materials for prepregs. From the viewpoint of thinning the printed wiring board, the thickness of the sheet-like fiber base material is preferably 50 μm or less, more preferably 40 μm or less, more preferably 30 μm or less, and particularly preferably 20 μm or less. The lower limit of the thickness of the sheet-like fiber base material is not particularly limited, but is generally 10 μm or more.

Prepreg can be manufactured by hot melt method, solvent method, etc.

The thickness of the prepreg may be in the same range as the resin composition layer in the above-mentioned resin sheet.

The sheet-like laminated material can be preferably used to form an insulating layer of a printed wiring board (for an insulating layer of a printed wiring board), and can be used to form an interlayer insulating layer of a printed wiring board (for an interlayer insulating layer of a printed wiring board). For the better.

[16.Printed wiring board] A printed wiring board according to an embodiment of the present invention is provided with an insulating layer containing a cured product of the resin composition according to the present embodiment. This printed wiring board can be produced by a method including the following steps (I) and (II) using, for example, the above-mentioned resin sheet. (I) The step of laminating a resin sheet on the inner substrate to form a resin composition layer of the resin sheet and bonding the inner substrate. (II) The step of hardening the resin composition layer to form an insulating layer.

The "inner layer substrate" used in step (I) is a member that becomes the substrate of a printed wiring board, and examples thereof include glass epoxy substrate, metal substrate, polyester substrate, polyimide substrate, and BT resin. Substrate, thermosetting polyphenylene ether substrate, etc. In addition, the substrate may have a conductor layer on one side or both sides, and the conductor layer may also be patterned. An inner substrate with a conductor layer (circuit) formed on one or both sides of the substrate is sometimes called an "inner circuit substrate". In addition, when manufacturing a printed wiring board, an intermediate product of an insulating layer and/or a conductor layer that must be further formed is also included in the aforementioned "inner layer substrate". If the printed wiring board has a built-in circuit board with components, an inner substrate with built-in components can also be used.

The inner layer substrate and the resin sheet can be laminated, for example, by heating and pressing the resin sheet to the inner layer substrate from the support side. Examples of a member for heating and pressing the resin sheet on the inner substrate (hereinafter also referred to as "heating and pressing member") include a heated metal plate (SUS mirror plate, etc.) or a metal roller (SUS roller, etc.) . Furthermore, it is not necessary to directly press the heat pressing member on the resin sheet. It is preferable to press the resin sheet through an elastic material such as heat-resistant rubber so that the resin sheet can fully follow the surface irregularities of the inner substrate.

The lamination of the inner substrate and the resin sheet can be carried out by vacuum lamination. In the vacuum lamination method, the heating and pressing temperature is preferably 60°C to 160°C, preferably 80°C to 140°C, and the heating and pressing pressure is preferably 0.098MPa to 1.77MPa, and preferably 0.29MPa to 1.47MPa. In the range, the heating and pressing time is preferably in the range of 20 seconds to 400 seconds, and more preferably in the range of 30 seconds to 300 seconds. Lamination is preferably performed under reduced pressure conditions of 26.7 hPa or less.

Lamination can be performed using commercially available vacuum laminates. Examples of commercially available vacuum laminates include vacuum pressurized laminates manufactured by Minki Seisakusho Co., Ltd., vacuum applicators manufactured by Nikko Materials, and batch-type vacuum pressurized laminates.

After lamination, the laminated resin sheets can be smoothed under normal pressure (atmospheric pressure), for example, by pressing a heated pressing member from the support side. The pressure conditions for the smoothing treatment may be the same as the heat pressing conditions for the above-mentioned lamination. Smoothing can be done with commercially available laminates. Furthermore, lamination and smoothing can also be performed continuously using the vacuum laminate sold above.

The support may be removed between step (I) and step (II), or may be removed after step (II).

In step (II), the resin composition layer is hardened to form an insulating layer made of a hardened product of the resin composition. The resin composition layer is generally hardened by thermal hardening. The specific hardening conditions of the resin composition layer are those generally used when forming the insulating layer of a printed wiring board.

For example, although the thermal hardening conditions of the resin composition layer vary depending on the type of the resin composition, etc., in one embodiment, the curing temperature is preferably 120°C to 240°C, more preferably 150°C to 220°C, and more preferably It is 170℃~210℃. The hardening time is preferably 5 minutes to 120 minutes, more preferably 10 minutes to 100 minutes, more preferably 15 minutes to 100 minutes.

Before thermally curing the resin composition layer, the resin composition layer may be preheated at a temperature lower than the curing temperature. For example, before thermally hardening the resin composition layer, the resin composition layer can be cured for 5 minutes at a temperature of 50°C to 150°C, preferably 60°C to 140°C, and preferably 70°C to 130°C. The above is preferably 5 minutes to 150 minutes, more preferably 15 minutes to 120 minutes, and more preferably 15 minutes to 100 minutes for preheating.

When manufacturing the printed wiring board, the steps of (III) opening holes in the insulating layer, (IV) roughening the insulating layer, and (V) forming the conductor layer may be further performed. These steps (III) to (V) can be implemented according to various methods known to the industry for use in manufacturing printed wiring boards. And, when the support is removed after step (II), the removal of the support can be between step (II) and step (III), between step (III) and step (IV), or between step (IV). and between steps (V). In addition, if necessary, the formation of the insulating layer and the conductor layer in steps (I) to (V) can be repeated to form a multilayer wiring board.

In other embodiments, a printed wiring board can be manufactured using the prepreg mentioned above. The manufacturing method is basically the same as when using resin sheets.

Step (III) is a step of opening holes in the insulating layer, whereby holes such as through holes and through holes can be formed in the insulating layer. Step (III) can be implemented by using a drill, laser, plasma, etc. in conjunction with the composition of the resin composition used to form the insulating layer. The size and shape of the hole can be appropriately determined according to the design of the printed wiring board.

Step (IV) is a step of roughening the insulating layer. Usually, stain removal is also performed in this step (IV). Although the procedures and conditions of the roughening treatment are not particularly limited, known procedures and conditions generally used when forming an insulating layer of a printed wiring board can be adopted. For example, the insulating layer may be roughened in the order of swelling treatment with a swelling liquid, roughening treatment with an oxidizing agent, and neutralization treatment with a neutralizing liquid.

Examples of the swelling liquid used in the roughening treatment include an alkali solution, a surfactant solution, and the like, with an alkali solution being preferred. As the alkali solution, sodium hydroxide solution and potassium hydroxide solution are preferred. Examples of commercially available swelling solutions include "Swelling Dip SecurigantP" and "Swelling Dip SecurigantSBU" manufactured by Atotech Japan. The swelling treatment by the swelling liquid can be performed, for example, by immersing the insulating layer in a swelling liquid of 30°C to 90°C for 1 minute to 20 minutes. From the viewpoint of controlling the swelling of the resin of the insulating layer to an appropriate level, it is better to immerse the insulating layer in a swelling liquid of 40°C to 80°C for 5 to 15 minutes.

Examples of the oxidizing agent used in the roughening treatment include an alkaline permanganic acid solution in which potassium permanganate or sodium permanganate is dissolved in an aqueous solution of sodium hydroxide. The roughening treatment by an oxidizing agent such as an alkaline permanganic acid solution is preferably performed by immersing the insulating layer in an oxidizing agent solution heated at 60°C to 100°C for 10 to 30 minutes. In addition, the concentration of permanganate in the alkaline permanganic acid solution is preferably 5% to 10% by mass. Examples of commercially available oxidizing agents include alkaline permanganic acid solutions such as "Concentrate CompactCP" and "Dosing Solution SecurityP" manufactured by Atotech Japan.

As a neutralizing liquid used for roughening treatment, an acidic aqueous solution is preferable. As a commercial product, "Reduction Solution SecurigantP" manufactured by Atotech Japan Co., Ltd. is mentioned, for example. The treatment with the neutralizing liquid can be performed by immersing the treated surface that has been roughened by the oxidant in a neutralizing liquid at 30°C to 80°C for 5 to 30 minutes. From the viewpoint of workability, etc., the method of immersing the object roughened by the oxidizing agent in a neutralizing solution at 40°C to 70°C for 5 to 20 minutes is preferred.

In one embodiment, the arithmetic mean roughness (Ra) of the surface of the insulating layer after roughening is preferably 500 nm or less, preferably 400 nm or less, and more preferably 300 nm or less. Although the lower limit is not particularly limited, it may be 1 nm or more, 2 nm or more, etc., for example. In addition, the root mean square roughness (Rq) of the surface of the insulating layer after roughening treatment is preferably 500 nm or less, more preferably 400 nm or less, and more preferably 300 nm or less. Although the lower limit is not particularly limited, it may be 1 nm or more, 2 nm or more, etc., for example. The arithmetic mean roughness (Ra) and root mean square roughness (Rq) of the insulation layer surface can be measured using a non-contact surface roughness meter.

Step (V) is a step of forming a conductor layer, and the conductor layer is formed on the insulating layer. The conductor material used for the conductor layer is not particularly limited. In a preferred embodiment, the conductor layer contains one or more metals selected from the group consisting of gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin and indium. The conductor layer may be a single metal layer or an alloy layer. Examples of the alloy layer include an alloy of two or more metals selected from the above group (for example, nickel･chromium alloy, copper･nickel alloy, and copper･ titanium alloy). Among them, also from the viewpoint of the versatility, cost, ease of drawing of the conductor layer, etc., a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver or copper, or a nickel-chromium alloy , copper･nickel alloy, copper･titanium alloy alloy layer is preferred, a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver or copper, or an alloy layer of nickel･chromium alloy is preferred , a single metal layer of copper is better.

The conductor layer may be a single-layer structure, or may be a multi-layer structure obtained by laminating two or more layers of a single metal layer or alloy layers made of different types of metals or alloys. When the conductor layer has a multi-layer structure, the layer in contact with the insulating layer is preferably a single metal layer of chromium, zinc or titanium, or an alloy layer of nickel-chromium alloy.

The thickness of the conductor layer may depend on the design of the desired printed wiring board, but is generally 3 μm to 35 μm, preferably 5 μm to 30 μm.

In one embodiment, the conductor layer may be formed by plating. For example, the surface of the insulating layer can be plated using conventionally known techniques such as a semi-additive method and a fully additive method to form a conductor layer having a desired wiring pattern. From the viewpoint of ease of production, the semi-additive method is preferred. The following shows an example in which the conductor layer is formed by a semi-additive method.

First, a plating seed layer is formed on the surface of the insulating layer by electroless plating. Next, on the formed plating seed layer, a mask pattern is formed corresponding to the desired wiring pattern and exposing a part of the plating seed layer. After forming a metal layer on the exposed plating seed layer by electrolytic plating, the photomask pattern is removed. Thereafter, the unnecessary plating seed layer is removed by etching, etc., and a conductor layer having a desired wiring pattern can be formed.

In other embodiments, the conductor layer may be formed using metal foil. When the conductor layer is formed using metal foil, step (V) is preferably performed between step (I) and step (II). For example, after step (I), the support is removed, and a metal foil is laminated on the surface of the exposed resin composition layer. The resin composition layer and the metal foil can be laminated by a vacuum lamination method. The conditions for lamination may be the same as those described in step (I). Next, step (II) is performed to form an insulating layer. Thereafter, using the metal foil on the insulating layer, a conductor layer with a desired wiring pattern can be formed by using known techniques such as subtractive methods and modified semi-additive methods.

The metal foil can be produced by known methods such as electrolysis and rolling. Examples of commercially available metal foils include HLP foil and JXUT-III foil manufactured by JX Nippon Mining & Metals Co., Ltd., 3EC-III foil and TP-III foil manufactured by Mitsui Metal Mining Co., Ltd., and the like.

[17.Semiconductor device] A semiconductor device according to an embodiment of the present invention includes the printed wiring board. The semiconductor device can be manufactured using a printed wiring board.

Examples of semiconductor devices include various semiconductor devices provided in electrical products (such as computers, mobile phones, digital cameras, and televisions) and vehicles (such as motorcycles, automobiles, trains, ships, and aircraft). [Example]

The present invention will be described in detail below using examples. However, the present invention is not limited to these examples. In the following description, "parts" and "%" indicating amounts respectively mean "parts by mass" and "% by mass" unless otherwise specified. In addition, the temperature conditions and pressure conditions unless there is a special temperature specification are room temperature (25°C) and atmospheric pressure (1atm). In the following examples, the volume of each component was calculated by dividing the mass by the specific gravity. The volume of each component thus obtained was calculated to obtain (D) the volume reference amount (volume %) of the inorganic filler.

[Example 1] Mix 10 parts of a phenolic hardener with a biphenyl aralkyl structure ("GPH-65" manufactured by Nippon Kayaku Co., Ltd., phenolic equivalent: about 198g/eq.), and biphenyl-type epoxy resin (Nippon Kayaku Co., Ltd. Add 30 parts of "NC-3000" (produced by a pharmaceutical company, epoxy equivalent (approximately 275g/eq.)) to 40 parts of MEK and heat it while stirring to obtain a dissolved composition. This was cooled to room temperature, and an active ester compound ("HPC-8000-65T" manufactured by DIC Corporation, a toluene solution with an active ester group equivalent weight of approximately 223 g/eq. and a non-volatile content rate of 65%) was mixed into the dissolved composition. 73 parts, 260 parts of spherical silica ("SO-C2" made by Admatechs, average particle size 0.5 μm) surface-treated with a silane coupling agent ("KBM-573" made by Shin-Etsu Chemical Industry Co., Ltd.), carbodiimide 15 parts of hardening agent ("V-03" manufactured by Nisshinbo Chemical Co., Ltd., active radical equivalent of about 216g/eq., non-volatile content rate of 50%), imidazole-based hardening accelerator ("1B2PZ" manufactured by Shikoku Chemical Industry Co., Ltd. ", 1-benzyl-2-phenylimidazole) 0.2 part, phenoxy resin (Mitsubishi Chemical Corporation "YX7553BH30", 1:1 solution of MEK and cyclohexanone with 30 mass% non-volatile content) 0.2 part , use a high-speed rotating mixer to disperse evenly and prepare a resin composition (resin paint).

[Example 2] The amount of spherical silica ("SO-C2" manufactured by Admatechs) was reduced to 200 parts by mass. Moreover, 49 parts by mass of hollow silicate aluminate particles ("MGH-005" manufactured by Pacific Cement Co., Ltd., average particle diameter: 1.6 μm, porosity: 80% by volume) were added to the resin composition. Except for the above matters, a resin composition (resin paint) was prepared in the same manner as in Example 1.

[Example 3] The amount of spherical silica ("SO-C2" manufactured by Admatechs) was reduced to 200 parts by mass. Furthermore, 11.2 parts by mass of hollow silica particles (average particle diameter: 2.6 μm, porosity: 25% by volume) were added to the resin composition. Except for the above matters, a resin composition (resin paint) was prepared in the same manner as in Example 1.

[Example 4] Substitute 10 parts of a phenolic compound having a biphenyl aralkyl structure ("GPH-65" manufactured by Nippon Kayaku Co., Ltd., phenolic equivalent: approximately 198 g/eq.), and use a phenol compound having a biphenyl aralkyl structure ( A resin composition (resin paint) was prepared in the same manner as in Example 1 except for 10 parts of "GPH-103" manufactured by Nippon Kayaku Co., Ltd., with a phenolic equivalent of about 231 g/eq.).

[Example 5] The amount of the phenol compound having a biphenylaralkyl structure ("GPH-65" manufactured by Nippon Kayaku Co., Ltd., phenolic equivalent: approximately 198 g/eq.) was reduced to 2 parts by mass. Moreover, the amount of spherical silica ("SO-C2" manufactured by Admatechs) was reduced to 240 parts by mass. Except for the above matters, a resin composition (resin paint) was prepared in the same manner as in Example 1.

[Example 6] The amount of the phenolic compound having a biphenyl aralkyl structure ("GPH-65" manufactured by Nippon Kayaku Co., Ltd., phenolic equivalent: about 198 g/eq.) was increased to 15 parts by mass, and the same procedure as in Example 1 was performed. A resin composition (resin paint) is prepared.

[Example 7] 30 parts of substituted biphenyl-type epoxy resin ("NC-3000" manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent weight is about 275g/eq.), and use naphthalene-type epoxy resin ("HP-4032-SS" manufactured by DIC Corporation, A resin composition (resin paint) was prepared in the same manner as in Example 1 except that the epoxy equivalent was about 145 g/eq.) 30 parts.

[Example 8] 73 parts of a substituted active ester compound ("HPC-8000-65T" manufactured by DIC Corporation) was used, and a different active ester compound ("HPC-8150-62T manufactured by DIC Corporation") was used. The active ester group equivalent was approximately 229g/eq. The non-volatile component rate was 62 % toluene solution) 73 parts. The amount of spherical silica ("SO-C2" manufactured by Admatechs) was also reduced to 255 parts by mass. Except for the above matters, a resin composition (resin paint) was prepared in the same manner as in Example 1.

[Example 9] 10 parts of naphthalene-type phenol hardener ("SN-485" manufactured by Nippon Steel Chemical Materials, phenol equivalent weight: approximately 215 g/eq.) was added to the resin composition. Furthermore, the amount of spherical silica ("SO-C2" manufactured by Admatechs) was increased to 288 parts. Except for the above matters, a resin composition (resin paint) was prepared in the same manner as in Example 1.

[Example 10] Add 20 parts of a phenol-based hardener containing a triazine skeleton ("LA-3018-50P" manufactured by DIC Corporation, an active group equivalent of approximately 151g/eq., and a 2-methoxypropanol solution with a non-volatile content rate of 50%). Resin composition. Furthermore, the amount of spherical silica ("SO-C2" manufactured by Admatechs) was increased to 288 parts. Except for the above matters, a resin composition (resin paint) was prepared in the same manner as in Example 1.

[Example 11] The amount of the phenolic compound having a biphenylaralkyl structure ("GPH-65" manufactured by Nippon Kayaku Co., Ltd., phenolic equivalent: approximately 198 g/eq.) was increased to 25 parts. Furthermore, the amount of spherical silica ("SO-C2" manufactured by Admatechs) was increased to 290 parts. Except for the above matters, a resin composition (resin paint) was prepared in the same manner as in Example 1.

[Example 12] 0.2 part of substituted phenoxy resin ("YX7553BH30" manufactured by Mitsubishi Chemical Corporation, a 1:1 solution of MEK and cyclohexanone with a non-volatile content of 30% by mass), using a maleimide resin containing a cyclohexane ring (Shin-Etsu A resin composition (resin paint) was prepared in the same manner as in Example 1, except that "SLK-6895-T90" (manufactured by Chemical Industry Co., Ltd., a toluene solution with 90% by mass of non-volatile content) was used.

[Example 13] Substitute 10 parts of a phenolic compound having a biphenyl aralkyl structure ("GPH-65" manufactured by Nippon Kayaku Co., Ltd., phenolic equivalent: approximately 198 g/eq.), and use a phenol compound having a biphenyl aralkyl structure ( "GPH-103" manufactured by Nippon Kayaku Co., Ltd., phenolic equivalent is about 231g/eq.) 10 parts. In addition, 73 parts of the active ester compound ("HPC-8000-65T" manufactured by DIC Corporation) was substituted, and the active ester group equivalent of a different active ester compound ("HPC-8150-62T" manufactured by DIC Corporation) was used. The non-volatile content was approximately 229 g/eq. 62% toluene solution) 73 parts. The amount of spherical silica ("SO-C2" manufactured by Admatechs) was further reduced to 255 parts by mass. Except for the above matters, a resin composition (resin paint) was prepared in the same manner as in Example 1.

[Example 14] The amount of the phenol compound having a biphenylaralkyl structure ("GPH-65" manufactured by Nippon Kayaku Co., Ltd., phenolic equivalent: approximately 198 g/eq.) was increased to 25 parts. In addition, 73 parts of the active ester compound ("HPC-8000-65T" manufactured by DIC Corporation) was substituted, and the active ester group equivalent of a different active ester compound ("HPC-8150-62T" manufactured by DIC Corporation) was used. The non-volatile content was approximately 229 g/eq. 62% toluene solution) 73 parts. The amount of spherical silica ("SO-C2" manufactured by Admatechs) was further increased to 285 parts by mass. Except for the above matters, a resin composition (resin paint) was prepared in the same manner as in Example 1.

[Example 15] 73 parts of a substituted active ester compound ("HPC-8000-65T" manufactured by DIC Corporation) was used, and a different active ester compound ("HPC-8150-62T manufactured by DIC Corporation") was used. The active ester group equivalent was approximately 229g/eq. The non-volatile component rate was 62 % toluene solution) 73 parts. Furthermore, the amount of spherical silica ("SO-C2" manufactured by Admatechs) was increased to 282 parts by mass. Furthermore, 20 parts of a phenolic hardener containing a triazine skeleton ("LA-3018-50P" manufactured by DIC Corporation, a 2-methoxypropanol solution with an active group equivalent of approximately 151 g/eq. and a non-volatile content rate of 50%) was added. Added to resin composition. Except for the above matters, a resin composition (resin paint) was prepared in the same manner as in Example 1.

[Example 16] 73 parts of a substituted active ester compound ("HPC-8000-65T" manufactured by DIC Corporation) was used, and a different active ester compound ("HPC-8150-62T manufactured by DIC Corporation") was used. The active ester group equivalent was approximately 229g/eq. The non-volatile component rate was 62 % toluene solution) 73 parts. Furthermore, the amount of spherical silica ("SO-C2" manufactured by Admatechs) was reduced to 255 parts by mass. Further, 0.2 part of a phenoxy resin ("YX7553BH30" manufactured by Mitsubishi Chemical Corporation, a 1:1 solution of MEK and cyclohexanone with a non-volatile content of 30% by mass) was substituted, and a maleimide resin containing a cyclohexane ring was used ( "SLK-6895-T90" manufactured by Shin-Etsu Chemical Industry Co., Ltd., 90% by mass non-volatile toluene solution) 0.2 part. Except for the above matters, a resin composition (resin paint) was prepared in the same manner as in Example 1.

[Example 17] The amount of the phenol compound having a biphenylaralkyl structure ("GPH-65" manufactured by Nippon Kayaku Co., Ltd., phenolic equivalent: approximately 198 g/eq.) was increased to 25 parts. In addition, 73 parts of the active ester compound ("HPC-8000-65T" manufactured by DIC Corporation) was substituted, and the active ester group equivalent of a different active ester compound ("HPC-8150-62T" manufactured by DIC Corporation) was used. The non-volatile content was approximately 229 g/eq. 62% toluene solution) 73 parts. The amount of spherical silica ("SO-C2" manufactured by Admatechs) was further increased to 285 parts by mass. In addition, 0.2 parts of substituted phenoxy resin ("YX7553BH30" manufactured by Mitsubishi Chemical Corporation, a 1:1 solution of MEK and cyclohexanone with a non-volatile content of 30% by mass) was used, and a maleimide resin containing a cyclohexane ring was used. ("SLK-6895-T90" manufactured by Shin-Etsu Chemical Industry Co., Ltd., toluene solution with 90 mass% non-volatile content) 0.2 part. Except for the above matters, a resin composition (resin paint) was prepared in the same manner as in Example 1.

[Example 18] 30 parts of substituted biphenyl-type epoxy resin ("NC-3000" manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent weight is about 275g/eq.), and use naphthalene-type epoxy resin ("HP-4032-SS" manufactured by DIC Corporation, Epoxy equivalent is about 145g/eq.) 30 parts. In addition, 73 parts of the active ester compound ("HPC-8000-65T" manufactured by DIC Corporation) was substituted, and the active ester group equivalent of a different active ester compound ("HPC-8150-62T" manufactured by DIC Corporation) was used. The non-volatile content was approximately 229 g/eq. 62% toluene solution) 73 parts. Furthermore, the amount of spherical silica ("SO-C2" manufactured by Admatechs) was reduced to 255 parts by mass. Except for the above matters, a resin composition (resin paint) was prepared in the same manner as in Example 1.

[Example 19] 0.2 part of substituted phenoxy resin ("YX7553BH30" manufactured by Mitsubishi Chemical Corporation, a 1:1 solution of MEK and cyclohexanone with a non-volatile content of 30% by mass), and maleimide resin ("SLK" manufactured by Shin-Etsu Chemical Industry Co., Ltd. -1500-T80", 0.2 part of toluene solution with 80 mass% non-volatile content. Except for the above matters, a resin composition (resin paint) was prepared in the same manner as in Example 1.

[Example 20] 73 parts of a substituted active ester compound ("HPC-8000-65T" manufactured by DIC Corporation) was used, and a different active ester compound ("HPC-8150-62T manufactured by DIC Corporation") was used. The active ester group equivalent was approximately 229g/eq. The non-volatile component rate was 62 % toluene solution) 73 parts. Furthermore, the amount of spherical silica ("SO-C2" manufactured by Admatechs) was reduced to 255 parts by mass. Further, 0.2 part of a phenoxy resin ("YX7553BH30" manufactured by Mitsubishi Chemical Corporation, a 1:1 solution of MEK and cyclohexanone with a non-volatile content of 30% by mass) was substituted, and maleimide resin ("YX7553BH30" manufactured by Shin-Etsu Chemical Industry Co., Ltd. was used) SLK-1500-T80", 0.2 part of toluene solution with 80 mass% non-volatile content. Except for the above matters, a resin composition (resin paint) was prepared in the same manner as in Example 1.

[Example 21] 73 parts of a substituted active ester compound ("HPC-8000-65T" manufactured by DIC Corporation) was used, and a different active ester compound ("HPC-8150-62T manufactured by DIC Corporation") was used. The active ester group equivalent was approximately 229g/eq. The non-volatile component rate was 62 % toluene solution) 73 parts. Furthermore, the amount of spherical silica ("SO-C2" manufactured by Admatechs) was increased to 285 parts by mass. Furthermore, 20 parts of a phenolic hardener containing a triazine skeleton ("LA-3018-50P" manufactured by DIC Corporation, an active group equivalent of about 151g/eq., and a 2-methoxypropanol solution with a non-volatile content rate of 50%) Added to resin composition. Also, 0.2 part of substituted phenoxy resin ("YX7553BH30" manufactured by Mitsubishi Chemical Corporation, a 1:1 solution of MEK and cyclohexanone with a non-volatile content of 30% by mass) was used, and maleimine resin (manufactured by Shin-Etsu Chemical Industry Co., Ltd. "SLK-1500-T80", 80 mass% non-volatile content toluene solution) 1 part. Except for the above matters, a resin composition (resin paint) was prepared in the same manner as in Example 1.

[Example 22] 30 parts of substituted biphenyl-type epoxy resin ("NC-3000" manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent weight is about 275g/eq.), and use naphthalene-type epoxy resin ("HP-4032-SS" manufactured by DIC Corporation, Epoxy equivalent is about 145g/eq.) 30 parts. In addition, 73 parts of the active ester compound ("HPC-8000-65T" manufactured by DIC Corporation) was substituted, and the active ester group equivalent of a different active ester compound ("HPC-8150-62T" manufactured by DIC Corporation) was used. The non-volatile content was approximately 229 g/eq. 62% toluene solution) 73 parts. The amount of spherical silica ("SO-C2" manufactured by Admatechs) was further reduced to 258 parts by mass. Furthermore, the amount of phenoxy resin ("YX7553BH30" manufactured by Mitsubishi Chemical Corporation, a 1:1 solution of MEK and cyclohexanone with a non-volatile content of 30% by mass) was increased to 1 part by mass. Furthermore, 1 part of maleimide resin ("SLK-1500-T80" manufactured by Shin-Etsu Chemical Industry Co., Ltd., a toluene solution with a non-volatile content of 80% by mass) was added to the resin composition. Except for the above matters, a resin composition (resin paint) was prepared in the same manner as in Example 1.

[Example 23] 30 parts of substituted biphenyl-type epoxy resin ("NC-3000" manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent weight is about 275g/eq.), and use naphthalene-type epoxy resin ("HP-4032-SS" manufactured by DIC Corporation, Epoxy equivalent is about 145g/eq.) 30 parts. Moreover, instead of 73 parts of the active ester compound ("HPC-8000-65T" manufactured by DIC Corporation), 52 parts of the active ester compound ("HPC-8000-65T" manufactured by DIC Corporation) and the active ester compound ("HPC-8000-65T" manufactured by DIC Corporation) were used. 8150-62T" A combination of 18 parts of a toluene solution with an active ester group equivalent of approximately 229g/eq. and a non-volatile content rate of 62%. The amount of spherical silica ("SO-C2" manufactured by Admatechs) was further reduced to 255 parts by mass. Except for the above matters, a resin composition (resin paint) was prepared in the same manner as in Example 1.

[Example 24] Instead of 73 parts of the active ester compound ("HPC-8000-65T" manufactured by DIC Corporation), 35 parts of the active ester compound ("HPC-8000-65T" manufactured by DIC Corporation) and the active ester compound ("HPC-8150-" manufactured by DIC Corporation) were used. 62T" is a combination of 36 parts of a toluene solution with an active ester group equivalent of approximately 229g/eq. and a non-volatile content rate of 62%. The amount of spherical silica ("SO-C2" manufactured by Admatechs) was further increased to 285 parts by mass. Furthermore, a phenol-based hardener containing a triazine skeleton ("LA-3018-50P" manufactured by DIC Corporation, an active group equivalent of about 151 g/eq., a 2-methoxypropanol solution with a non-volatile content rate of 50%) 20 Added to the resin composition. Further, 0.2 part of a phenoxy resin ("YX7553BH30" manufactured by Mitsubishi Chemical Corporation, a 1:1 solution of MEK and cyclohexanone with a non-volatile content of 30% by mass) was substituted, and maleimide resin ("YX7553BH30" manufactured by Shin-Etsu Chemical Industry Co., Ltd. was used) SLK-1500-T80", 1 part of toluene solution with 80 mass% non-volatile content. Except for the above matters, a resin composition (resin paint) was prepared in the same manner as in Example 1.

[Example 25] In place of 73 parts of the active ester compound ("HPC-8000-65T" manufactured by DIC Corporation), 18 parts of the active ester compound ("HPC-8000-65T" manufactured by DIC Corporation) and the active ester compound ("HPC-8150-" manufactured by DIC Corporation) were used. 62T" is a combination of 54 parts of a toluene solution with an active ester group equivalent of approximately 229g/eq. and a non-volatile content rate of 62%. The amount of spherical silica ("SO-C2" manufactured by Admatechs) was further reduced to 255 parts by mass. In addition, 0.2 parts of substituted phenoxy resin ("YX7553BH30" manufactured by Mitsubishi Chemical Corporation, a 1:1 solution of MEK and cyclohexanone with a non-volatile content of 30% by mass) was used, and a maleimide resin containing a cyclohexane ring was used. ("SLK-6895-T90" manufactured by Shin-Etsu Chemical Industry Co., Ltd., toluene solution with 90 mass% non-volatile content) 0.2 part. Except for the above matters, a resin composition (resin paint) was prepared in the same manner as in Example 1.

[Comparative example 1] 10 parts of a phenolic hardener having a biphenylaralkyl structure ("GPH-65" manufactured by Nippon Kayaku Co., Ltd., phenolic equivalent: approximately 198 g/eq.) was not used. Furthermore, 10 parts of a naphthalene-type phenol hardener ("SN-485" manufactured by Nippon Steel Chemical Materials, phenolic hydroxyl equivalent equivalent: approximately 215 g/eq.) was added to the resin composition. Except for the above matters, a resin composition (resin paint) was prepared in the same manner as in Example 1.

[Comparative example 2] 10 parts of a phenolic hardener having a biphenylaralkyl structure ("GPH-65" manufactured by Nippon Kayaku Co., Ltd., phenolic equivalent: approximately 198 g/eq.) was not used. Furthermore, a phenol-based hardener containing a triazine skeleton ("LA-3018-50P" manufactured by DIC Corporation, a 2-methoxypropanol solution with an active group equivalent of approximately 151 g/eq. and a non-volatile content rate of 50%) 20 Added to the resin composition. Except for the above matters, a resin composition (resin paint) was prepared in the same manner as in Example 1.

[Comparative example 3] The amount of the active ester compound ("HPC-8000-65T" manufactured by DIC Corporation) was reduced to 30 parts by mass. In addition, since the ratio of the inorganic filler in the resin composition is set to be substantially the same as in the Example, the amount of spherical silica ("SO-C2" manufactured by Admatechs Co., Ltd.) is reduced to 182 parts. Except for the above matters, a resin composition (resin paint) was prepared in the same manner as in Example 1.

[Comparative example 4] The amount of the active ester compound ("HPC-8000-65T" manufactured by DIC Corporation) was reduced to 30 parts by mass. Furthermore, the amount of spherical silica ("SO-C2" manufactured by Admatechs) was reduced to 98 parts. Except for the above matters, a resin composition (resin paint) was prepared in the same manner as in Example 1.

[Manufacturing of resin sheets] As a support, a polyethylene terephthalate film ("Lumirror R80" manufactured by Toray Corporation) whose surface was subjected to release treatment with an alkyd resin release agent ("AL-5" manufactured by Lintec Corporation) was prepared; Thickness 38μm, softening point 130℃). The resin composition was evenly applied on the support until the thickness of the dried resin composition layer became 40 μm, and dried at 90° C. for 3 minutes. Next, on the exposed surface of the resin composition layer (the surface not joined to the support), the same polyethylene terephthalate film as the support used as the protective film is bonded to obtain a support/resin composition. A resin sheet composed of layers of layers/protective films. Using the resin sheet thus obtained, evaluation was performed by the following method.

[Test Example 1: Measurement of dielectric loss tangent] The resin sheet peeling protective film produced in the Examples and Comparative Examples is heated at 200° C. for 90 minutes to thermally harden the resin composition layer, and then the support is peeled off to obtain a cured product of the resin composition. The hardened film formed. A hardened material A for evaluation was obtained by cutting out the hardened material film with a width of 2 mm and a length of 80 mm.

For the obtained hardened material A for evaluation, the value of the dielectric loss tangent (Df value) was measured at a measurement frequency of 5.8 GHz and a measurement temperature of 23°C using the cavity resonance perturbation method using "HP8362B" manufactured by Agilent Technologies. Three test pieces were measured and the average value was calculated.

[Test Example 2: Crack Evaluation Test] <Lamination of Resin Sheets> An inner-layer substrate (Hitachi) having a circuit conductor (copper) forming a wiring pattern with a line/space ratio (L/S) = 8 μm/8 μm on both sides was prepared. "MCL-E700G" manufactured by Kasei Co., Ltd., the thickness of the conductor layer is 35μm, the total thickness is 0.4mm, and the residual copper rate is 40%). The protective film is peeled off from the resin sheet, and the resin sheet is laminated on both sides of the inner substrate so that the resin composition layer contacts the inner substrate. This lamination uses a vacuum pressurized laminate ("MVLP-500" manufactured by Meiki Seisakusho Co., Ltd.). After vacuum adsorption for 30 seconds at a temperature of 120°C, it is then placed under the conditions of a temperature of 120°C and a pressure of 7.0kg/ ^cm2 . , by applying pressure to the self-supporting body for 30 seconds through the heat-resistant rubber. Secondly, use the SUS mirror plate under atmospheric pressure and pressurize it for 60 seconds at a temperature of 120°C and a pressure of 5.5kg/ ^cm2 .

＜Thermal hardening of the resin composition layer＞ The support is peeled off from the laminated resin sheet. Using a hot air circulation oven, the resin composition layer is thermally hardened under thermal hardening conditions of 170° C. and 30 minutes to form an insulating layer. Thereby, a sample substrate having a layer structure of an inner substrate/insulating layer was obtained. Next, the sample substrate was placed and cooled to room temperature (25°C).

＜Stain removal treatment＞ The sample substrate was immersed in a swelling solution ("Swelling Dip Securiganth P" manufactured by Atotech Japan, pH: 11) at 60° C. for 10 minutes.

The sample substrate was immersed in an oxidizing agent ("Concentrate Compact CP" manufactured by Atotech Japan) at 80° C. for 20 minutes. Furthermore, the sample substrate was immersed in a neutralizing solution ("Reducing Solution Safener P" manufactured by Atotech Japan) at 40° C. for 5 minutes. Thereafter, the sample substrate was dried at 80° C. for 30 minutes.

＜How to evaluate cracks＞ On the surface of the insulating layer of the sample substrate after stain removal treatment, observe the L/S pattern of the inner substrate. Among 100 parts on the pattern of the inner substrate, it was confirmed whether cracks were produced on the surface along the shape of the pattern, and the number of parts on the pattern without cracks was calculated. Among the 100 parts, the ratio of the parts without cracks was calculated as the "yield". The higher the yield, the better. Points are assigned to the calculated yield according to the following. 1 point: above 0% but less than 20%. 2 points: more than 20% but less than 40%. 3 points: More than 40% but less than 60%. 4 points: More than 60% but less than 80%. 5 points: more than 80%. Those with 3 points or more are evaluated as crack evaluation "○". In addition, those with 2 or less points were evaluated as crack evaluation "×".

[Test Example 3: Measurement of Elongation at Breaking Point] For the hardened material A for evaluation obtained in Test Example 1, a tensile test was performed with a tensile universal testing machine ("RTC-1250A" manufactured by Oriental Technology Co., Ltd.) in accordance with Japanese Industrial Standards JIS K7127, and the elongation at breaking point (%) was measured. .

[result] The compositions and results of the above examples and comparative examples are shown in the following table. In the table below, the abbreviations have the following meanings. Active ester group/epoxy group: When the number of epoxy groups of (B) epoxy resin is taken as 1, the number of active ester groups of (C) active ester compound can be obtained.

[Review] In Comparative Examples 1 and 2 in which (A) the biphenylaralkyl-type phenol resin was not used, poor results were seen in the breaking point strength or crack test. Moreover, in Comparative Example 3 in which (C) the active ester compound was in a small amount, both the crack test and the elongation at breaking point showed good results, but the dielectric loss tangent could not be reduced. Furthermore, in Comparative Example 4 in which (D) the inorganic filler was used in a small amount, although the elongation at breaking point showed a high value, the crack test was poor and the dielectric loss tangent could not be reduced. On the other hand, in Examples 1 to 25 in which the components (A) to (D) were combined, the dielectric loss tangent, the crack test, and the elongation at the breaking point all showed good results. Compared with Example 11, which contains a large amount of (A) biphenylaralkyl-type phenol resin, in Example 1, when considering the reduction in dielectric loss tangent, it can be understood that (A) biphenylaralkyl-type The amount of phenolic resin has a better range when it can reduce the dielectric loss tangent.

Claims (16)

A resin composition containing (A) biphenylaralkyl phenol resin, (B) epoxy resin, (C) active ester compound, and (D) inorganic filler, wherein (C) The amount of the active ester compound is 10% by mass or more based on 100% by mass of the non-volatile components of the resin composition, (D) The amount of the inorganic filler is 60% by mass or more based on 100% by mass of the non-volatile content of the resin composition, or 45% by volume or more based on 100% by volume of the non-volatile content of the resin composition. The resin composition of Claim 1, wherein the amount of (A) biphenylaralkyl-type phenol resin is 0.01 mass% or more and 5 mass% or less based on 100 mass% of non-volatile components of the resin composition. The resin composition of claim 1, wherein (A) the biphenylaralkyl phenol resin is represented by the following formula (A-1); (In formula (A-1), R ¹ each independently represents an alkylene group, R ² each independently represents a univalent hydrocarbon group, R ³ each independently represents a univalent hydrocarbon group, n represents an integer from 1 to 20, and s each independently represents 0~ An integer of 4, t each independently represents an integer of 0~3). The resin composition according to claim 1, further containing (E) a hardener including a carbodiimide hardener. The resin composition of claim 1, which contains (F) a hardening accelerator. The resin composition of claim 1, which contains (G) thermoplastic resin. The resin composition of claim 1, wherein (C) the active ester compound contains a naphthalene-type active ester compound. The resin composition of claim 1, wherein (C) the active ester compound contains a dicyclopentadiene-type active ester compound and a naphthalene-type active ester compound. The resin composition of claim 1, which contains (H) maleimide resin. The resin composition of claim 9, wherein (H) maleimide resin contains a maleimide resin represented by formula (H-1) and a maleimide resin represented by formula (H-2). More than one type of resin group; (In the formula (H-1), R ^h1 each independently represents a divalent aliphatic group having 5 or more carbon atoms that may have a substituent, and R ^h2 each independently represents an oxygen atom, an aryl group, an alkylene group, or the like. A divalent radical formed by combining 2 or more of the radicals; n _h1 represents an integer from 1 to 15; in formula (H-2), R ^h3 each independently represents a divalent fat with 5 or more carbon atoms that may have a substituent Family group, R ^h4 each independently represents a divalent radical with an aromatic ring that may have a substituent, R ^h5 each independently represents an alkyl group with more than 5 carbon atoms; n _h2 represents an integer from 0 to 10, m _h each independently represents an integer from 0 to 4). The resin composition of claim 1 is used for forming an insulating layer. A hardened product of the resin composition according to any one of claims 1 to 11. A sheet-like laminated material containing the resin composition according to any one of claims 1 to 11. A resin film having a support and a resin composition layer formed on the support with the resin composition according to any one of claims 1 to 11. A printed wiring board provided with an insulating layer containing a cured product of the resin composition according to any one of claims 1 to 11. A semiconductor device including the printed wiring board according to claim 15.