TW202335426A - Piezoelectric oscillator and piezoelectric oscillation device - Google Patents

Abstract

In the present invention, a bonding pad for wire bonding is formed on the outer surface of a first sealing plate of a piezoelectric oscillator having the first sealing plate and a second sealing plate, which are joined to the two main surfaces of a piezoelectric oscillation plate. Non-joining regions that are not joined to each other are provided to part of the outer peripheral portion of one sealing plate among the first and second sealing plates and to part of the outer peripheral portion of the piezoelectric oscillation plate. The bonding pad overlaps the non-joining region in plan view.

Description

Piezoelectric vibrators and piezoelectric vibration elements

The present invention relates to a piezoelectric vibrator and a piezoelectric vibration element.

As a piezoelectric vibration element, such as a piezoelectric oscillator, Patent Document 1 discloses a piezoelectric oscillator in which a piezoelectric vibrator is arranged side by side with an IC (Integrated Circuit) incorporating an oscillation circuit or the like. In the recess of the package, the cover is used to airtightly seal the package.

In Patent Document 1, in the piezoelectric vibrator, the piezoelectric vibrating piece is accommodated in a recessed portion of a container, and the container is covered with a lid to airtightly seal the piezoelectric vibrating piece. The piezoelectric vibrator is turned upside down, and the lid side of the container is used as the lower surface, and is bonded to the recessed portion of the package with an adhesive, and the bottom side of the container on which the external connection terminal is formed is used as the upper surface. The above-mentioned external connection terminal and the above-mentioned IC are electrically connected using bonding wires. [Prior art documents] [Patent Document]

[Patent Document 1] Japanese Patent No. 6083214

[Problem to be solved by the invention]

In the above-mentioned Patent Document 1, since the external connection terminal formed on the bottom surface of the container of the piezoelectric vibrator is electrically connected to the IC using a bonding wire, a pressure is applied to the container of the piezoelectric vibrator when the bonding wire is connected. There is a concern that the container of the piezoelectric vibrator may be damaged due to pressure. However, in Patent Document 1, no special consideration is given to the connection of the piezoelectric vibrator by a bonding wire.

The present invention has been made in view of the above-mentioned points, and an object thereof is to prevent the piezoelectric vibrator from being damaged when the piezoelectric vibrator is wire-bonded. [Means to solve problems]

In order to achieve the above object, the present invention is configured as follows.

(1) The piezoelectric vibrator of the present invention includes a piezoelectric vibrating plate with first and second excitation electrodes respectively formed on two main surfaces, and includes a piezoelectric vibrating plate respectively joined to the two main surfaces of the piezoelectric vibrating plate. The piezoelectric vibrator of the first and second sealing plates; the outer peripheral portions of the first and second sealing plates are respectively joined to the outer peripheral portions of the two main surfaces of the piezoelectric vibrating plate, and will include the first and second sealing plates. 2. The vibration part of the piezoelectric vibrating plate of the excitation electrode is airtightly sealed; on the outer surface of the first sealing plate, there is formed a connection between the first and second excitation electrodes of the piezoelectric vibrating plate. A bonding pad for wire bonding that electrically connects any excitation electrode; a portion of the outer peripheral portion of at least one of the first and second sealing plates and a portion of the outer peripheral portion of the piezoelectric vibrating plate are provided with each other. The joint pad on the outer surface of the first sealing plate is formed so as to overlap the non-joint area when viewed from above.

According to the piezoelectric vibrator of the present invention, the first and second sealing plates are joined to both main surfaces of the piezoelectric vibrating plate to hermetically seal the vibrating portion of the piezoelectric vibrating plate on the first sealing plate. A bonding pad for line bonding is formed on the outer surface. The bonding pad is a non-joining area between the outer peripheral portion of at least one of the first and second sealing plates and the outer peripheral portion of the piezoelectric vibrating plate when viewed from above. The joint areas are formed by overlapping.

The non-joining area on the outer periphery of at least one of the first and second sealing plates and the non-joining area on the outer periphery of the piezoelectric vibrating plate are areas facing each other and not joining each other. Therefore, the at least one sealing plate is A gap is formed between the non-joining area and the non-joining area of the piezoelectric vibrating plate. Thereby, when the pressing force for connecting the bonding wire is applied to the bonding pad of the first sealing plate, the excess pressing force can be released through the gap between the at least one sealing plate and the piezoelectric vibrating plate to alleviate the pressing force. , therefore, the piezoelectric vibrating plate and the first and second sealing plates can be prevented from being deformed or damaged during wire bonding.

(2) In a preferred embodiment of the present invention, a third wire bonding wire for electrically connecting to the first and second excitation electrodes of the piezoelectric vibrating plate is formed on the outer surface of the first sealing plate. 1. The second bonding pad serves as the bonding pad mentioned above.

According to this embodiment, the first and second bonding pads for wire bonding that are electrically connected to the first and second excitation electrodes of the piezoelectric vibration plate are formed on the outer surface of the first sealing plate. 2. The bonding pad is formed so as to overlap the non-joining area of the outer peripheral portion of at least one of the first and second sealing plates and the non-joining area of the outer peripheral portion of the piezoelectric vibrating plate when viewed from above. When the first and second bonding pads of the sealing plate apply a pressing force for respectively connecting the bonding wires, the non-joining area of the outer peripheral portion of the at least one sealing plate and the non-joining area of the outer peripheral portion of the piezoelectric vibrating plate can be used The gap between them releases excess pressing force to ease the pressing force.

(3) In one embodiment of the present invention, a first non-joining area serving as the non-joining area is provided in a part of the outer peripheral part of the first sealing plate and a part of the outer peripheral part of the piezoelectric vibrating plate. A portion of the outer peripheral portion of the second sealing plate and a portion of the outer peripheral portion of the piezoelectric vibrating plate are respectively provided as second non-joining areas as the above-mentioned non-joining areas, and the above-mentioned first non-joining area and the above-mentioned second non-joining area are located between Overlap when viewed from above.

According to this embodiment, the first non-joining areas, which are mutually facing and non-joining non-joining areas respectively provided at the outer peripheral portion of the first sealing plate and the outer peripheral portion of the piezoelectric vibration plate, and the first non-joining areas respectively provided at the second sealing plate The outer peripheral portion and the second non-joining area, which are mutually facing non-joining areas of the outer peripheral portion of the piezoelectric vibrating plate, overlap in plan view. Therefore, the first gap formed between the first non-joining area on the outer peripheral part of the first sealing plate and the first non-joining area on the outer peripheral part of the piezoelectric vibrating plate and the first gap formed on the outer peripheral part of the second sealing plate The second gap between the two non-joining areas and the second non-joining area on the outer peripheral portion of the piezoelectric diaphragm overlaps in plan view. Thereby, when the pressing force for connecting the bonding line is applied to the bonding pad of the first sealing plate, the excess pressing force can be released more effectively through the first and second gaps that overlap the bonding pad when viewed from above. Therefore, the piezoelectric vibrating plate and the first and second sealing plates can be prevented from being deformed or damaged during wire bonding.

(4) In another embodiment of the present invention, a part of the non-joining area of the outer peripheral portion is at least one of the first and second sealing plates and the outer peripheral portion of the piezoelectric vibrating plate.

According to this embodiment, the non-joining regions respectively provided at the outer peripheral portion of the sealing plate and the outer peripheral portion of the piezoelectric vibration plate are respectively provided at the outer peripheral portions of the sealing plate and the piezoelectric vibration plate. Wire bonding is performed where the non-joining areas overlap. On the other hand, the sealing plate and the piezoelectric vibrating plate are firmly bonded on the inner circumferential side of the outer peripheral edge portion, thereby airtightly sealing the vibrating portion of the piezoelectric vibrating plate.

(5) In yet another embodiment of the present invention, the piezoelectric vibrating plate includes: the vibrating portion formed in a central portion of the piezoelectric vibrating plate; and an outer frame portion formed to surround the vibrating portion. The outer circumferential portion of the piezoelectric vibrating plate is thicker than the vibrating portion; the outer circumferential portions of the first and second sealing plates are respectively joined to the two main surfaces of the outer frame portion of the piezoelectric vibrating plate, and are bonded to the outer circumferential portion of the piezoelectric vibrating plate. The non-joining regions are respectively provided in a portion of the outer peripheral portion of at least one of the first and second sealing plates and a portion of the outer frame portion of the outer peripheral portion of the piezoelectric vibrating plate.

According to this embodiment, the non-bonding areas that overlap with the bonding pads on the outer surface of the first sealing plate in plan view are respectively provided on the outer peripheral portion of at least one of the first and second sealing plates and on the outer frame of the piezoelectric vibrating plate. Therefore, in the piezoelectric vibrating plate, it is not the thin-walled vibrating portion but the thick-walled outer frame portion that supports the vibrating portion that can stably withstand the force exerted on the bonding pad of the first sealing plate in order to connect the bonding wire. The pressing force.

(6) In one embodiment of the present invention, the outer frame portion of the piezoelectric vibrating plate surrounds the vibrating portion with a gap and is connected to the vibrating portion via a connecting portion.

According to this embodiment, the periphery of the vibrating portion of the central portion of the piezoelectric vibrating plate is spaced apart from the outer frame except for the connecting portion. Therefore, the stress transmitted to the vibrating portion via the outer frame can be reduced.

(7) In another embodiment of the present invention, the bonding pad on the outer surface of the first sealing plate of the piezoelectric vibrator overlaps with the non-bonding area of the outer frame portion of the piezoelectric vibrating plate when viewed from above. formed in a manner.

According to this embodiment, the bonding pad on the outer surface of the first sealing plate overlaps with the non-bonding area of the outer frame of the piezoelectric vibrating plate when viewed from above, so it can be stably supported by the thick-walled outer frame of the piezoelectric vibrating plate. The pressing force exerted on the bonding pad of the first sealing plate in order to connect the bonding wire.

(8) In a preferred embodiment of the present invention, the vibrating portion of the piezoelectric vibrating plate has a substantially rectangular shape when viewed from above, and the outer frame portion of the piezoelectric vibrating plate has a substantially rectangular annular shape when viewed from above, and the outer frame One side of the substantially rectangular shape on the inner circumferential side of the substantially rectangular annular portion is connected to the above-mentioned vibrating part via the above-mentioned connection part, and the above-mentioned non-joining area of the above-mentioned piezoelectric vibrating plate is provided on the opposite side of the above-mentioned substantially rectangular shape to the above-mentioned side. To the side of the above-mentioned outer frame.

According to this embodiment, one side of the substantially rectangular shape on the inner circumferential side of the substantially rectangular ring-shaped outer frame portion is connected to the vibrating portion of the central portion via the connecting portion, and on the other hand, the non-joining area is provided between the substantially rectangular shape and the above-mentioned One side faces the outer frame portion of the opposite side. Since the bonding pads formed on the outer surface of the first sealing plate overlap in a plan view, the non-bonding area of the outer frame portion exerts a pressing force for connecting the bonding lines. The non-joining area of the outer frame portion is not provided on one side of the substantially rectangular shape connected to the vibrating portion via the connecting portion, but is provided on the opposite side of the outer frame portion on the opposite side to the one side. Compared with being disposed on the outer frame portion on one side, the distance to the connecting portion becomes longer. Thereby, the pressing force exerted on the non-bonded area of the outer frame portion to connect the bonding wire can be reduced from being transmitted to the vibrating portion via the connecting portion.

(9) The piezoelectric vibration element of the present invention includes the piezoelectric vibrator according to any one of (1) to (8) above, and a base mounting the piezoelectric vibrator.

According to the piezoelectric vibration element of the present invention, the piezoelectric vibrator forms a bonding pad for line bonding on the outer surface of the first sealing plate, and the bonding pad is sealed with at least one of the first and second sealing plates when viewed from above. The non-joining area on the outer periphery of the plate and the non-joining area on the outer periphery of the piezoelectric vibrating plate are formed to overlap, so that a gap is formed between the non-joining area of the at least one sealing plate and the non-joining area of the piezoelectric vibrating plate. . Thereby, when the pressing force for connecting the bonding wire is applied to the bonding pad of the first sealing plate, the excess pressing force can be released through the gap between the at least one sealing plate and the piezoelectric vibrating plate to alleviate the pressing force. , which can prevent damage to the piezoelectric vibrator.

(10) In another embodiment of the present invention, electronic components are mounted on the base next to the piezoelectric vibrator.

According to this embodiment, the electronic components and the piezoelectric vibrator are not stacked but arranged laterally, so that the piezoelectric vibrator element can be made low-profile.

(11) In one embodiment of the present invention, the first and second bonding pads of the first sealing plate of the piezoelectric vibrator are wire bonded and electrically connected to the electronic component.

According to this embodiment, the second sealing plate of the piezoelectric vibrator is bonded to the base using a bonding material and is mechanically held on the base. On the other hand, the first sealing plate of the first sealing plate can be bonded by wire bonding. , the second bonding pad is electrically connected to the electronic component. [Effects of the invention]

According to the present invention, the first and second sealing plates are joined to both main surfaces of the piezoelectric vibrating plate to hermetically seal the vibrating portion of the piezoelectric vibrating plate, and the piezoelectric vibrator is provided on the outer surface of the first sealing plate. A bonding pad for wire bonding is formed so that the outer peripheral portion of at least one of the first and second sealing plates and the outer peripheral portion of the piezoelectric vibrating plate are opposed to each other and are not joined when viewed from above. Non-joined areas overlap. Thereby, when the pressing force for connecting the bonding wire is applied to the bonding pad of the first sealing plate, the non-bonding area of the outer circumference of the at least one sealing plate and the non-bonding area of the outer circumference of the piezoelectric vibrating plate are connected. The gap between them can release excess pressing force to ease the pressing force, thereby preventing the piezoelectric vibrating plate and the first and second sealing plates from being deformed and damaged during wire bonding.

Hereinafter, one embodiment of the present invention will be described in detail based on the drawings. In this embodiment, the piezoelectric vibration element including the piezoelectric vibrator is applied to a crystal oscillator.

FIG. 1 is a schematic cross-sectional view of a crystal oscillator according to an embodiment of the present invention. FIG. 2 is a schematic plan view of the crystal oscillator in FIG. 1 with the top cover 5 as the cover body omitted.

The crystal oscillator 1 of this embodiment includes: a base 2 having a recess; a crystal vibrator 3 as a piezoelectric vibrator of the present invention mounted on the inner bottom surface of the recess of the base 2; and an IC as an electronic component. 4. It is mounted next to the crystal oscillator 3; and the top cover 5 as a cover is combined with the base 2 and together with the base 2 forms a storage space 7 for the crystal oscillator 3 and IC 4.

The base 2 includes a flat bottom plate portion 2 ₁ and an annular side wall portion 2 ₂ formed on the outer periphery thereof. The base 2 is made of a ceramic material such as alumina. For example, two ceramic green sheets are laminated and fired integrally to form a concave shape with an upper part open.

As shown in FIG. 2 , a plurality of wiring patterns 8 for connecting the IC 4 are formed on the inner bottom surface of the base 2 .

The IC 4 is rectangular in plan view and forms an oscillation circuit together with the crystal vibrator 3 . A plurality of electrode pads respectively connected to the wiring pattern 8 of the base 2 through bonding wires 9 are formed on the peripheral portion of the upper surface of the IC 4 .

The top cover 5 of the crystal oscillator 1 is joined to the peripheral edge of the upper opening of the base 2 via the sealing ring 6 by seam welding, etc., whereby the storage space 7 for accommodating the crystal oscillator 3 and the IC 4 is airtightly seal. The airtight sealing is performed in a vacuum environment or an inert gas environment such as nitrogen, and the storage space 7 is set to a vacuum or inert gas environment.

FIG. 3 is an enlarged schematic cross-sectional view of the crystal vibrator 3 in FIG. 1 . The crystal vibrator 3 includes a crystal vibrating plate 10 that is a piezoelectric vibrating plate, a first sealing plate 11 covering one main surface side of the crystal vibrating plate 10 , and a second sealing plate 11 covering the other main surface side of the crystal vibrating plate 10 . Sealing plate 12.

In this crystal vibrator 3, first and second sealing plates 11 and 12 are respectively joined to both main surface sides of the crystal vibrating plate 10 to form a so-called sandwich structure package. The package body of the crystal vibrator 3 is substantially rectangular parallelepiped, and is rectangular when viewed from above. The package size of the crystal vibrator 3 in this embodiment is, for example, 1.0 mm × 0.8 mm in plan view, achieving miniaturization and low profile.

In addition, the size of the package is not limited to the above, and it can also be applied even if it is of different sizes.

Next, each structure of the crystal vibrating plate 10 and the first and second sealing plates 11 and 12 constituting the crystal vibrator 3 will be described.

FIG. 4A is a schematic plan view showing one main surface side of the crystal diaphragm 10 , and FIG. 4B is a schematic plan view showing the other main surface side of the crystal diaphragm 10 as seen through the one main surface side.

The crystal vibration plate 10 of this embodiment is an AT-cut crystal plate, and its two main surfaces are XZ' planes.

The crystal vibrating plate 10 includes a vibrating part 15 that is rectangular in plan view and has a substantially rectangular center part; and a substantially rectangular annular outer frame part 17 that has a space 16 formed of a through part to separate the vibrating part 15 and the connecting part 18, which connects the vibrating part 15 and the outer frame part 17. In addition, "substantially rectangular" means a rectangular shape except for the area where the connecting portion 18 is formed. That is, the vibrating part 15 has a rectangular shape except for the connection part 18 on the outer peripheral side, and the annular outer frame part 17 has a rectangular annular shape except for the connection part 18 on the inner peripheral side.

The vibration part 15, the outer frame part 17, and the connection part 18 are integrally formed. The vibrating part 15 and the connecting part 18 are formed thinner than the outer frame part 17 . That is, the outer frame portion 17 of the outer peripheral portion of the crystal diaphragm 10 is thicker than the vibrating portion 15 of the central portion.

In this embodiment, one side of the substantially rectangular shape (the right side in FIGS. 4A and 4B ) on the inner peripheral side of the substantially rectangular annular outer frame 17 in plan view is connected to the vibrating part 15 via the connecting part 18 .

As described above, since the vibrating part 15 is connected by one connecting part 18, the stress acting on the vibrating part 15 can be reduced compared to a configuration in which two or more connecting parts are connected.

A pair of first and second excitation electrodes 19 and 20 are respectively formed on both main surfaces of the vibrating portion 15 of the crystal vibrating plate 10 . The first and second extraction electrodes 21 and 22 are respectively led out from the first and second excitation electrodes 19 and 20.

The first extraction electrode 21 on one main surface side of the crystal diaphragm 10 shown in FIG. 4A is led out to the partially circular connecting pattern 23 formed on the outer frame portion 17 through the connecting portion 18 . On one main surface of the crystal diaphragm 10 , the vibration-side first sealing bonding pattern 25 for bonding the crystal diaphragm 10 to the first sealing plate 11 extends throughout the annular outer frame portion 17 surrounding the vibrating portion 15 The whole circumference forms a ring shape.

The vibration-side first sealing bonding pattern 25 extends along the short side of one side (the right side of FIG. 4A ) of the rectangular crystal diaphragm 10 in plan view and the short side of the other side (the left side of FIG. 4A ). Compared with the vibration-side first sealing joint pattern 25, it is partially formed to have a narrower width, and an oval connection extending along the short side is formed on the outer frame portion 17 on the inner side of the narrower portion. Joint pattern 27.

The vicinity of each corner of both ends of the short side of the first vibration-side sealing joint pattern 25 is formed such that the outer peripheral side is recessed in an arc shape toward the inner peripheral side. The above-mentioned corners are exposed on the surface of the quartz crystal plate and become non-joining areas 10a and 10a that are not joined to the first sealing plate 11. The outer frame portion 17 is substantially rectangular in plan view as described above, and one side of the substantially rectangular shape on the inner peripheral side (the right side in FIGS. 4A and 4B ) is connected to the vibrating portion 15 via the connecting portion 18 . The non-joining areas 10a, 10a are provided in the substantially rectangular annular outer frame portion 17, and are provided on one side of the substantially rectangular outer frame portion 17.

In addition, the vibrating-side first sealing joint pattern 25 extending along the short side of the other side of the crystal diaphragm 10 is formed in the vicinity of one corner of the inner circumferential side by being recessed into a partially circular shape toward the outer circumferential side. The recessed portion is formed with a circular connecting pattern 29 .

The second lead-out electrode 22 on the other main surface side of the crystal diaphragm 10 shown in FIG. 4B is led out to one end of the connection joint pattern 24 formed on the outer frame part 17 through the connection part 18. The connection joint pattern 24 is formed in a substantially elliptical shape extending along the short side of the crystal diaphragm 10 so as to overlap the above-mentioned connection joint pattern 27 on one main surface of the crystal diaphragm 10 when viewed from above.

On the other main surface of the crystal diaphragm 10 , the vibration-side second sealing bonding pattern 26 for bonding the crystal diaphragm 10 to the second sealing plate 12 extends throughout the substantially rectangular annular outer frame surrounding the vibrating portion 15 The entire circumference of the portion 17 is formed into a ring shape.

The vibration-side second sealing joint pattern 26 extends along the short side of one side of the crystal diaphragm 10 (the right side in FIG. 4B ) in the same manner as the vibration-side first sealing joint pattern 25 on one main surface. The width of the part is formed into the narrow part. The second sealing joint pattern 26 on the vibration side is formed on the outer frame portion 17 in the vicinity of the connection portion 18 so as to overlap with the above-mentioned connection joint pattern 23 on one main surface of the crystal diaphragm 10 when viewed from above. There is a circular joining pattern 28 for connection.

The vicinity of each corner of both ends of the short sides of the vibration-side second sealing joint pattern 26 is formed in such a manner that the outer peripheral side is recessed in an arc shape toward the inner peripheral side. The above-mentioned corners expose the surface of the crystal plate and are non-joining areas 10b and 10b that are not joined to the second sealing plate 12. The non-joining regions 10 b and 10 b are provided on the one side of the outer frame part 17 that is connected to the vibrating part 15 via the connecting part 18 in the outer frame part 17 that is substantially rectangular in plan view.

Furthermore, in the portion recessed toward the outer peripheral side near the corner of the inner peripheral side of the vibration-side second sealing joint pattern 26 extending along the other short side of the crystal diaphragm plate 10, it is in contact with the crystal when viewed from above. A circular connecting joint pattern 30 is formed on one main surface of the diaphragm 10 in such a manner that the above-mentioned connecting joint patterns 29 overlap.

On the crystal diaphragm 10, the first through-electrode 31 penetrating between the two main surfaces is formed on an oblong connecting pattern 27 on one main surface and a substantially oblong connecting pattern on the other main surface. 24 is the end of the connecting portion 18 side of the overlapping area in plan view. The first through electrode 31 is formed by coating the inner wall surface of the through hole with a metal film. The first through electrode 31 electrically connects the connection joint pattern 27 on one main surface of the crystal diaphragm 10 and the connection joint pattern 24 on the other main surface of the crystal diaphragm 10 . The connection joint pattern 24 on the other main surface is electrically connected to the second excitation electrode 20 as shown in FIG. 4B . Therefore, the connection joint pattern 27 on the one main surface is electrically connected to the second through electrode 31 through the first through electrode 31 . 2 Excitation electrode 20.

The first and second excitation electrodes 19 and 20 of the crystal diaphragm 10, the first and second extraction electrodes 21 and 22, the first and second sealing joint patterns 25 and 26 on the vibration side, and the connection joint patterns 23, 24, 27, 28, 29, and 30 are formed by laminating, for example, Au on a base layer made of Ti or Cr.

FIG. 5A is a schematic plan view showing one main surface side of the first sealing plate 11 , and FIG. 5B is a schematic plan view showing the other main surface side of the first sealing plate 11 seen through.

The first sealing plate 11 is a rectangular parallelepiped substrate made of an AT-cut crystal plate, which is the same as the crystal diaphragm 10 .

On the other main surface of the first sealing plate 11, as shown in FIG. 5B, a sealing-side first seal is used to join and seal with the vibration-side first sealing joint pattern 25 of one main surface of the crystal vibration plate 10. The joint pattern 33 is formed in an annular shape over the entire circumference of the first sealing plate 11 which is rectangular in plan view.

The portion of the first sealing joint pattern 33 on the sealing side that extends along the short side of one side (the right side in FIG. 5B ) has a narrow portion, and is formed on the inside of the narrower portion. An oblong connecting joint pattern 34 extending along the short side. This connection joint pattern 34 is joined to the oblong connection joint pattern 27 on one main surface of the crystal diaphragm 10 shown in FIG. 4A . The vicinity of each corner of both ends of the short sides of the first sealing joint pattern 33 on one side is formed in such a manner that the outer peripheral side is recessed in an arc shape toward the inner peripheral side. The above-mentioned corners expose the surface of the crystal plate, are opposite to the above-mentioned non-joining areas 10a, 10a on one main surface of the crystal vibration plate 10, and are non-joining areas 11a, 11a that are not joined to the crystal vibration plate 10.

In addition, on the other main surface of the first sealing plate 11, there is formed a connection joint pattern 23 drawn out from the first excitation electrode 19 on one main surface of the quartz crystal vibration plate 10 shown in FIG. 4A. Joint pattern 35. The connection joint pattern 35 is connected to the partially circular connection joint pattern 37 via the connection wiring pattern 36 extending along the long side of the first sealing plate 11 . This connection joint pattern 37 is joined to the circular connection joint pattern 29 of the crystal diaphragm 10 shown in FIG. 4A .

One main surface of the first sealing plate 11 shown in FIG. 5A becomes the upper surface of the crystal vibrator 3. On this main surface, not only are rectangular first and second external electrode terminals 40 and 41 formed at a set of opposite corners, but also a rectangular part of the first external electrode terminal 40 is formed along the first sealing plate 11 The long side extends out to the short side on one side (the right side of Figure 5A). That is, the extended portion of the first external electrode terminal 40 and the second external electrode terminal 41 are located at both ends of the short side on the same side.

The corner portions at both ends of the short sides of the first and second external electrode terminals 40 and 41 serve as positions for connecting the bonding wires, that is, the first and second bonding pads 40a and 41a for wire bonding. When viewed from above, the first and second bonding pads 40 a and 41 a are not formed with the seal-side first sealing bonding pattern 33 at the corners of the short sides of the other main surface side of the first sealing plate 11 The non-joining areas 11a and 11a overlap.

The first sealing plate 11 is formed with second and third through-electrodes 38 and 39 penetrating between the two main surfaces. Each of the through-electrodes 38 and 39 is formed by coating the inner wall surface of the through-hole with a metal film.

The second through-electrode 38 is formed in a region where the second external electrode terminal 41 on one main surface overlaps with the oblong connection bonding pattern 34 on the other main surface in plan view. The second through electrode 38 electrically connects the second external electrode terminal 41 on one main surface of the first sealing plate 11 and the connection bonding pattern 34 on the other main surface of the first sealing plate 11 .

The connection bonding pattern 34 is electrically connected to the oblong connection bonding pattern 27 on one main surface of the crystal diaphragm 10 shown in FIG. 4A . The connection bonding pattern 27 is electrically connected via the crystal as described above. The first penetrating electrode 31 and the connecting joint pattern 24 of the diaphragm 10 are electrically connected to the second excitation electrode 20 .

Therefore, the second external electrode terminal 41 of the first sealing plate 11 passes through the second through electrode 38, the connection joint pattern 34, the connection joint pattern 27 of the crystal diaphragm 10, the first through electrode 31, and the connection joint pattern 24, And is electrically connected to the second excitation electrode 20 of the crystal diaphragm 10 .

The third through-electrode 39 is formed in a region where the first external electrode terminal 40 on one main surface overlaps with the connection bonding pattern 37 on the other main surface in plan view. The third through electrode 39 electrically connects the first external electrode terminal 40 on one main surface of the first sealing plate 11 and the connection bonding pattern 37 on the other main surface of the first sealing plate 11 .

As shown in FIG. 5B , this connection bonding pattern 37 is electrically connected to the connection bonding pattern 35 via the connection wiring pattern 36 . The connection joint pattern 35 is electrically connected to the connection joint pattern 23 on one main surface of the crystal diaphragm 10 shown in FIG. 4A as described above. The connection joint pattern 23 is electrically connected to the first surface of the crystal diaphragm 10 1. The excitation electrode 19 is electrically connected.

Therefore, the first external electrode terminal 40 of the first sealing plate 11 passes through the third through-electrode 39 , the connection joint pattern 37 , the connection wiring pattern 36 , the connection joint pattern 35 , and the connection joint pattern 23 of the crystal diaphragm 10 , and is electrically connected to the first excitation electrode 19 of the crystal diaphragm 10 .

The first sealing bonding pattern 33, the connection bonding patterns 34, 35, 37, and the connection wiring pattern 36 on the sealing side of the first sealing plate 11 are formed by laminating, for example, Au on a base layer made of Ti or Cr. .

FIG. 6A is a schematic plan view of one main surface side of the second sealing plate 12 , and FIG. 6B is a schematic plan view of the other main surface side of the second sealing plate 12 as seen through the one main surface side.

The second sealing plate 12 is a rectangular parallelepiped substrate made of an AT-cut crystal plate, which is the same as the crystal diaphragm 10 or the first sealing plate 11 .

On one main surface of the second sealing plate 12, as shown in FIG. 6A, a sealing-side second seal is used to join and seal with the vibration-side second sealing joint pattern 26 on the other main surface of the crystal vibration plate 10. The joint pattern 45 is formed in an annular shape over the entire circumference of the second sealing plate 12 which is rectangular in plan view.

The portion of the second sealing joint pattern 45 on the sealing side extending along the short side of one side (the right side in FIG. 6A ) has a narrow portion, and an edge is formed on the inside of the narrower portion. The connecting pattern 46 is an oblong shape extending along the short side. This connection joint pattern 46 is joined to the oval connection joint pattern 24 on the other main surface of the crystal diaphragm 10 shown in FIG. 4B . The vicinity of each corner of both ends of the short side of the second sealing joint pattern 45 on the sealing side is formed in such a manner that the outer peripheral side is recessed in an arc shape toward the inner peripheral side. The above-mentioned corners expose the surface of the crystal plate and are not only opposite to the above-mentioned non-joining areas 10b and 10b on the other main surface of the crystal vibration plate 10, but also are non-joining areas 12b and 12b that are not joined to the crystal vibration plate 10.

In addition, on one main surface of the second sealing plate 12, a small circular joint pattern 28 and a large circular joint pattern 28 for connecting to the other main surface of the crystal diaphragm 10 shown in FIG. 4B are respectively formed. The patterns 30 are respectively joined to a small circular connecting joint pattern 47 and a large circular connecting joint pattern 48.

The second sealing bonding pattern 45 and the connection bonding patterns 46, 47, and 48 on the sealing side of the second sealing plate 12 are formed by laminating, for example, Au on a base layer made of Ti or Cr.

In the crystal vibrator 3 composed of the crystal vibrating plate 10 and the first and second sealing plates 11 and 12, the crystal vibrating plate 10 and the first sealing plate 11 are connected to each other so that the vibration side first sealing joint pattern 25 and the sealing side joint pattern 25 are connected. 1. The crystal vibration plate 10 and the second sealing plate 12 are diffusion bonded in a state where the sealing bonding pattern 33 is overlapped. The crystal vibration plate 10 and the second sealing plate 12 are in a state where the vibration side second sealing bonding pattern 26 and the sealing side second sealing bonding pattern 45 are overlaid. Diffusion bonding to form a sandwich structure package. Thereby, the storage space of the vibrating part 15 is hermetically sealed without using special joining materials such as adhesives.

Furthermore, as shown in FIG. 3 , the vibration-side first sealing bonding pattern 25 and the sealing-side first sealing bonding pattern 33 themselves become the bonding material 43 a generated after diffusion bonding, and the vibration-side second sealing bonding pattern 26 and sealing The second side sealing bonding pattern 45 itself becomes the bonding material 43b produced after diffusion bonding.

At this time, diffusion bonding is performed in a state where the above-mentioned connecting bonding patterns are also overlapped with each other. Specifically, the connection joint patterns 23, 27, and 29 of the crystal diaphragm 10 and the connection joint patterns 35, 34, and 37 of the first sealing plate 11 are diffusion-bonded.

Furthermore, the connecting bonding patterns 23, 27, and 29 and the connecting bonding patterns 35, 34, and 37 themselves become the bonding material 44a produced by diffusion bonding.

Similarly, the connection bonding patterns 24, 28, and 30 of the crystal diaphragm 10 and the connection bonding patterns 46, 47, and 48 of the second sealing plate 12 are diffusion bonded. Furthermore, the connecting bonding patterns 24, 28, and 30 and the connecting bonding patterns 46, 47, and 48 themselves become the bonding material 44b produced by diffusion bonding.

As described above, the crystal vibrating plate 10 and the three crystal plates of the first and second sealing plates 11 and 12 are laminated to obtain the crystal vibrator 3 having a package structure in which the vibrating portion 15 is accommodated. This makes it possible to achieve thinner (lower profile) crystal vibrators compared to a package structure in which a crystal vibrating piece is accommodated in a box-shaped ceramic container including a recessed portion that serves as a storage space, and the lid is joined and hermetically sealed. ).

In this embodiment, the second sealing plate 12 on the lower surface side of the first and second sealing plates 11 and 12 of the crystal vibrator 3 is bonded to the inner bottom surface of the base 2 with an adhesive, and is mounted on on base 2. The first and second bonding pads 40a and 41a of the first and second external electrode terminals 40 and 41 of the first sealing plate 11 on the upper surface side of the crystal vibrator 3 are as shown in FIGS. 1 and 2 . The two electrode pads of the IC 4 are connected by bonding wires 13 .

FIG. 7 is a partial cross-sectional view of a corner portion of the crystal vibrator 3, and is a cross-sectional view of the vicinity of the second bonding pad 41a shown in FIG. 5A as viewed in the arrow direction A-A.

In addition, in FIG. 7 , the vicinity of the second bonding pad 41a of the crystal vibrator 3 is shown, but the structure near the first bonding pad 40a is also the same.

In this embodiment, as described above, the first and second bonding pads 40 a and 41 a of the first and second external electrode terminals 40 and 41 of the first sealing plate 11 of the crystal vibrator 3 are connected to the IC through the bonding wire 13 The two electrode pads in 4 are connected, but the connection position of the first sealing plate 11 using the bonding line 13 is at the short side of the crystal vibration plate 10 and the first and second sealing plates 11 and 12 in a plan view. The positions where the non-joining areas 10a, 10b, 11a, and 12b of the corners at both ends overlap.

The non-joining areas 10a, 10b, 11a, and 12b at each corner are shown in FIG. 7 and do not form a joint pattern. They are the exposed portions of the crystal plate surfaces of the crystal vibration plate 10 and the first and second sealing plates 11 and 12. .

Each non-joining area 11a on the other main surface of the first sealing plate 11 and each non-joining area 10a on one main surface of the crystal vibration plate 10 are first non-joining areas that face each other and are not joined. Similarly, each non-joining area 10b on the other main surface of the crystal diaphragm 10 and each non-joining area 12b on one main surface of the second sealing plate 12 are second non-joining areas that face each other and are not joined.

The first non-joining areas 11a and 10a of the first sealing plate 11 and the crystal diaphragm 10 overlap with the second non-joining areas 10b and 12b of the crystal diaphragm 10 and the second sealing plate 12 in plan view. The first sealing plate 10 The first and second bonding pads 40a and 41a on one main surface overlap the first and second non-bonding regions 11a, 10a, 10b and 12b in plan view.

The first non-joining areas, that is, the non-joining areas 11a of the first sealing plate 11 and the non-joining areas 10a of the crystal vibration plate 10 are areas facing each other and not joined, so between the two 11a and 10a, as The first gap G1 is formed as shown in FIG. 7 . Similarly, a second gap G2 is formed between each non-joined area 10 b of the crystal diaphragm 10 and each non-joined area 12 b of the second sealing plate 12 . The size range of the gaps G1 and G2 is preferably a size range that does not reduce the bonding properties of the wire bonding and can alleviate its stress. Specifically, the size is preferably 1000 nm or less, and more preferably about 200 nm to 700 nm. Furthermore, especially in the structure using gold diffusion bonding like this embodiment, compared with the sealing structure using brazing material, it is easier to control the gap size in a small range, and the gap size will not be excessively large.

As described above, the first and second bonding pads 40 a and 41 a are located in the first non-joining regions 11 a and 10 a where the first gap G1 exists between the first sealing plate 11 and the crystal diaphragm 10 in a plan view. , and the overlapping regions of the second non-joining regions 10b and 12b with the second gap G2 between the quartz diaphragm 10 and the second sealing plate 12. Therefore, compared with the area where the first and second bonding pads are located in the area where the first and second sealing plates 11 and 12 and the crystal diaphragm plate 10 are completely bonded by the sealing bonding pattern and there is no gap, when the first and second bonding pads are located, When the second bonding pads 40a and 41a apply excessive pressing force, the excess pressing force can be released through the first and second gaps G1 and G2 of the first and second non-bonding areas 11a, 10a, 10b and 12b. Ease. This prevents the crystal diaphragm 10 and the first and second sealing plates 11 and 12 from deformation or cracking during wire bonding.

In addition, neither the first non-joining area 11 a of the first sealing plate 11 nor the first non-joining area 10 a of the crystal diaphragm 10 is formed with a joint pattern (metal film), but even if the first sealing plate 11 or the crystal diaphragm 10 Any one of the first non-joining areas forms a joining pattern, and a gap can be ensured between the first non-joining area of the first sealing plate 11 and the first non-joining area of the crystal vibrator 10, so that the first non-joining area can also be formed. Either the first non-joining area of the sealing plate 11 or the crystal diaphragm 10 forms a joint pattern.

Similarly, a bonding pattern may be formed in any of the second non-joint areas of the crystal diaphragm 10 or the second sealing plate 12 .

Furthermore, in this embodiment, the first and second bonding pads 40 a and 41 a are located at positions separated from each other at both ends of one side of the first sealing plate 11 which is rectangular in plan view. Therefore, even if the size of the first sealing plate 11 is small, that is, , the size of the crystal vibrator 3 is small, and wire bonding can be performed stably.

The electrode pads other than the two electrode pads of the IC 4 wire-bonded to the first and second bonding pads 40a and 41a of the crystal oscillator 3 are respectively connected to the base via the bonding wires 9 as described above. 2 wiring pattern 8.

Thereby, the IC 4 is connected to a plurality of external terminals such as power terminals, output terminals, control terminals, and GND terminals (not shown) on the bottom surface of the base 2 through the internal wiring of the base 2 , that is, the crystal oscillator. 1. Installation uses a plurality of external connection terminals for electrical connection.

As the raw material of the bonding wires 9 and 13, from the viewpoint of reliability, Au is preferred, but Cu or the like may also be used.

Since the crystal oscillator 3 and the IC 4 are electrically connected by wire bonding, compared with a configuration in which the crystal oscillator 3 and the IC 4 are electrically connected via a wiring pattern formed on the base 2, the number of components can be reduced. Stray capacitance can suppress the deterioration of characteristics caused by stray capacitance.

As described above, the vibrating portion 15 of the crystal vibrating plate 10 of the crystal vibrator 3 is airtightly sealed by the first and second sealing plates 11 and 12. Furthermore, the crystal vibrator 3 is mounted on the base 2 and is sealed by the top cover. 5 to be airtightly sealed, so the vibrating portion 15 of the crystal vibration plate 10 is double airtightly sealed. This makes it possible to suppress frequency changes caused by changes over time over a long period of time.

In this embodiment, as mentioned above, the crystal oscillator 3 is bonded to the inner bottom surface of the base 2 using an adhesive. However, due to the difference in thermal expansion coefficient between the crystal oscillator 3, the adhesive, and the base 2, the reflow problem may occur. Thermal stress generated by heat treatment such as soldering is applied to the crystal oscillator 3, which adversely affects the frequency stability.

Therefore, in this embodiment, in order to suppress frequency fluctuation due to thermal stress caused by heat treatment such as reflow processing, the following is performed.

That is, the adhesive that joins the second sealing plate 12 of the crystal vibrator 3 to the inner bottom surface of the base 2 is applied on an imaginary line that is approximately rectangular in plan view, as shown in the schematic plan view of the base 2 in FIG. 8 . The circular central area S of the second sealing plate 12 is shown.

The central region S of the second sealing plate 12 of this embodiment is formed so as to substantially cover the rectangular planar view vibrating portion 15 from the center O of the planar rectangular crystal vibration plate 10 (or the vibrating portion 15 ) joined to the second sealing plate 12 overlooking the circular area. That is, the circular central region S is a region that overlaps the vibrating portion 15 in the central portion of the crystal diaphragm 10 when viewed from above.

The central region S is preferably an area covering the first and second excitation electrodes 19 and 20 of the vibrating portion 15 of the crystal diaphragm 10 in a plan view, and more preferably is an area covering the vibrating portion 15 of the crystal diaphragm 10 .

In the circular central area S of the inner bottom surface of the base 2, a paste-like adhesive is applied. In this embodiment, a conductive adhesive, such as polyimide, epoxy, or silicon is applied. A ketone-based conductive adhesive is used, on which the crystal vibrator 3 is placed to form a conductive adhesive. Thereby, the crystal vibrator 3 is mechanically held on the base 2 . The adhesive is not limited to a conductive adhesive and may also be a non-conductive adhesive. However, by using a conductive adhesive, a conductive adhesive can be formed in the area overlapping the vibrating part 15 when viewed from above. The shielding layer of the connector can block noise, etc.

As described above, the crystal vibrating plate 3 has the circular central area S of the second sealing plate 12 joined to the base 2 by an adhesive. Therefore, as shown in the schematic side view of FIG. 9 , the crystal vibrator 3 The second sealing plate 12 is joined to the outer peripheral area around the central area S of the inner bottom surface of the base 2 by an adhesive 50, between the lower surface of the second sealing plate 12 and the inner bottom surface of the base 2 Gap G3 is formed.

The outer peripheral area of the second sealing plate 12 forming the gap G3 overlaps with the outer frame portion 17 of the outer peripheral portion of the crystal diaphragm 10 in plan view. The outer frame portion 17 of the outer peripheral portion of the crystal vibration plate 10 is as described above. The outer peripheral portions of the first and second sealing plates 11 and 12 are formed by the first and second sealing joint patterns 25 and 26 on the vibration side and the first sealing joint pattern 26 on the sealing side. 1. The area where the second sealing joint patterns 33, 45, etc. are jointed respectively.

As mentioned above, the crystal diaphragm 3 joins the circular central area S of the second sealing plate 12 to the base 2 through the adhesive 50 . Therefore, the central area S is constrained and supported by the adhesive 50 . Therefore, thermal stress caused by heat treatment such as reflow process is applied to the central region S of the second sealing plate 12 bound by the adhesive 50 .

As mentioned above, the central area S of the second sealing plate 12 is an area that overlaps the vibrating portion 15 of the central portion of the crystal vibrating plate 10 in plan view. Between the central area S of the second sealing plate 12 and the vibrating part 15 of the crystal diaphragm 10, as shown in the above-mentioned FIG. Therefore, the thermal stress applied to the central area S of the second sealing plate 12 will not be directly transmitted to the vibrating portion 15 of the crystal vibrating plate 10 .

The thermal stress applied to the central region S of the second sealing plate 12 is first transmitted to the outer peripheral portion of the second sealing plate 12 and then to the outer frame portion 17 of the quartz crystal vibration plate 10 that is joined to the outer peripheral portion of the second sealing plate 12. Thereby, it is transmitted to the vibration part 15 supported by this outer frame part 17 via the connection part 18.

In contrast, for example, consider a case where the entire surface of the second sealing plate 12 of the crystal vibrator 3 is bonded to the inner bottom surface of the base 2 with an adhesive, or the second sealing plate is bonded with an adhesive. The situation in which multiple parts of the outer peripheral part of 12 are joined to the inner bottom surface of the base 2.

In either case, the crystal vibrator 3 is joined to the base 2 with the outer peripheral portion of the second sealing plate 12, so the thermal stress caused by heat treatment such as reflow is applied to the second sealing plate constrained by the adhesive. The outer peripheral portion of the sealing plate 12 is sealed. The outer frame portion 17 of the crystal diaphragm 10 is joined to the outer peripheral portion of the second sealing plate 12 . Therefore, the thermal stress applied to the outer peripheral portion of the second sealing plate 12 is transmitted to the outer frame portion 17 of the crystal diaphragm 10 , and is exerted on the outer frame portion 17 of the crystal diaphragm 10 via The connecting portion 18 is connected to the vibrating portion 15 of the outer frame portion 17 .

As described above, compared with the thermal stress applied to the central region S of the second sealing plate 12 , the thermal stress applied to the outer peripheral portion of the second sealing plate 12 is more easily transmitted to the vibrating portion 15 in the central portion of the crystal vibrating plate 10 , causing adverse effects on the vibrating part 15.

According to this embodiment, only the central area S of the second sealing plate 12 is joined to the base 2 through the adhesive 50 . Therefore, the outer peripheral portion of the second sealing plate 12 or the second Compared with the structure in which the entire surface of the sealing plate 12 is bonded to the base 2, the impact of thermal stress generated by heat treatment such as reflow soldering on the vibrating portion 15 of the crystal vibrating plate 10 can be reduced, and frequency variation can be suppressed.

The inventor of this case conducted an experiment in order to study the influence of the bonding of the crystal oscillator 3 to the base 2 by the adhesive 50 on the frequency variation of the crystal oscillator 3 .

In the test, as described above, the crystal oscillator 1 of this embodiment was produced, in which the circular central area S of the second sealing plate 12 was bonded to the base 2 through the adhesive 50; and the crystal of the comparative example was produced. The oscillator uses adhesive 50 to connect not the circular central area S of the second sealing plate 12 but the four corners of the rectangular second sealing plate 12 to the base 2 respectively. Otherwise, the structure is the same as that of this embodiment. As the adhesive 50, a hard polyimide-based conductive adhesive is used. Hard polyimide-based adhesives can bond more firmly than soft silicone-based adhesives, so they are suitable for wire bonding and can perform wire bonding stably. IC 4 is also bonded to the base 2 using the same hard polyimide-based conductive adhesive as the crystal vibrator 3, so that it can be processed under the same hardening conditions.

80 samples of the crystal oscillator 1 of this embodiment and 80 samples of the crystal oscillator of the comparative example were heat treated to reach a peak temperature of about 260°C corresponding to the reflow process, and the frequency deviation after the heat treatment was measured.

The measurement results are shown in Fig. 10A and Fig. 10B. In Figure 10A and Figure 10B , the horizontal axis represents the elapsed time until 6 hours after the heat treatment, the vertical axis represents the frequency deviation (ppm) based on the frequency before heat treatment, and the frequency deviation (dF/F) before heat treatment is set is 0. The average value of the above 80 samples is shown.

FIG. 10A shows the frequency deviation of the crystal oscillator of the comparative example, and FIG. 10B shows the frequency deviation of the crystal oscillator of this embodiment.

Compared with the crystal oscillator of the comparative example in FIG. 10A that has a large temporal frequency deviation, the crystal oscillator of the present embodiment in FIG. 10B has a small temporal frequency deviation. It can be seen that the frequency variation is suppressed.

In addition, as the adhesive 50 , the hard polyimide-based adhesive has stronger adhesive force than the soft silicone-based adhesive and can stably maintain the crystal vibrator 3 on the base 2 , but the corresponding As the result, the binding force constraining the second sealing plate 12 of the quartz crystal vibrator 3 becomes stronger, so the frequency variation caused by the thermal stress caused by the heat treatment such as reflow soldering increases.

According to this embodiment, when a hard polyimide-based adhesive is used as the adhesive 50 compared to a case where a soft silicone-based adhesive is used, the change in frequency caused by thermal stress is reduced. The inhibitory effect is greater.

In the above embodiment, the central area of the second sealing plate 12 on which the adhesive for joining the second sealing plate 12 to the base 2 is applied is circular in plan view, but it is not limited to a circular shape and may be circular. Be oblong, oval, rectangular or other shapes. For example, the central area of the second sealing plate 12 may be a rectangular area that covers the vibration part 15 of the crystal vibration plate 10 joined to the second sealing plate 12 and does not cover the outer frame part 17, or it may be The central area of the second sealing plate 12 is a rectangular area covering the vibrating portion 15 of the crystal vibrating plate 10 .

Furthermore, in the above embodiment, the adhesive 50 is applied to the entire central area S of the second sealing plate 12 and joined to the inner bottom surface of the base 2 , but it may also be applied to a plurality of areas in the circular central area S. The parts are respectively coated with adhesive 50 and joined to the inner bottom surface of the base 2 .

In the above embodiment, the second sealing plate 12 of the crystal oscillator 3 is bonded to the inner bottom surface of the base 2 through the adhesive 50 . However, the bonding is not limited to the adhesive, and other bonding materials such as solder can also be used for bonding. .

In the above-mentioned embodiment, as shown in FIG. 5A , the first and second bonding pads 40 a and 41 a are formed at positions separated from both ends of the short sides of the second sealing plate 11 which is rectangular in plan view. However, as another embodiment of the present invention, The first and second bonding pads may also be formed in close positions.

11A and 11B are diagrams showing a crystal vibrating plate of a crystal vibrator used in a crystal oscillator according to another embodiment of the present invention. They are diagrams corresponding to the above-mentioned FIGS. 4A and 4B , and the corresponding parts are marked with the same reference numerals. and its description is omitted.

The annular first sealing joint pattern 25 ₁ on the vibration side of one main surface of the crystal diaphragm 10 ₁ shown in FIG. 11A is formed to the short side of one side of the rectangular crystal diaphragm 10 ₁ in plan view (the right side in FIG. 11A ). The outer peripheral edges of the corners at both ends are different from the corners of the crystal diaphragm 10 in FIG. 4A and are not recessed in an arc shape toward the inner circumference. The portion of the vibration-side first sealing joint pattern 25 ₁ extending along the short side of the other side of the crystal vibration plate 10 ₁ (the left side in FIG. 11A ) is from the corner of one side (the upper side in FIG. 11A ) to the short side. At approximately the middle position, the outer circumferential side enters the inner circumferential side, and the outer side becomes an exposed area where the surface of the crystal plate without a joint pattern is formed. The exposed area of the surface of the quartz crystal plate becomes the non-joining area 10 ₁ a which is not joined to the first sealing plate 11 ₁ shown in FIG. 12B described later.

The annular vibration _- side second sealing joint pattern 26 ₁ on the other main surface side of the crystal vibration plate 10 ₁ shown in FIG. 11B is formed to the short side of the above-mentioned side (the right side of FIG. 11B ) of the crystal vibration plate 10 1 The outer peripheral edges of the corners at both ends are different from the corners of the crystal diaphragm 10 in FIG. 4B and are not recessed in an arc shape toward the inner circumference. The portion of the vibration-side second sealing joint pattern 26 ₁ extending along the short side of the other side (the left side of FIG. 11B ) of the crystal diaphragm 10 ₁ is connected to the vibration-side first seal on one main surface side when viewed from above. The bonding patterns 25 ₁ are overlapped, from the corner of one side (the upper part in Figure 11B ) to the approximate middle position of the short side, from the outer peripheral side to the inner peripheral side, and the surface of the crystal plate without the bonding pattern is exposed on the outside. area. The exposed area on the surface of the crystal plate becomes a non-joining area 10 ₁ b that is not joined to the second sealing plate 12 ₁ shown in FIG. 13A described later.

As described above, in the crystal diaphragm 10 ₁ , the vibration-side first and second sealing joint patterns 25 ₁ and 26 ₁ are formed to the outer peripheral edge of each corner of the short side ends of the above-mentioned side of the crystal diaphragm 10 ₁ Nearby, the portion extending along the short side of the other side of the crystal diaphragm 10 ₁ is from the one corner to approximately the middle position of the short side, from the outer peripheral side to the inner peripheral side, and no joint is formed on the outer side. The non-bonding areas 10 ₁ a and 10 ₁ b are exposed on the surface of the patterned crystal plate.

In the crystal diaphragm 10 of FIGS. 4A and 4B , the non-joined regions 10 a , 10 a , 10 b , and 10 b are provided in the outer frame 17 in a substantially rectangular ring shape in plan view and are connected to the vibrating part via the connecting part 18 as described above. 15 on the inner peripheral side of the substantially rectangular side (the right side in FIGS. 4A and 4B ) and the outer frame portion 17 . On the outer frame part 17 on one side, it is necessary to form the extraction electrodes 21 and 22 from the excitation electrodes 19 and 20 of the vibration part 15, the connection joint patterns 23, 24, 27, and 28, and the vibration side seals. Use bonding patterns 25, 26, etc. for wiring or bonding patterns.

On the other hand, in this embodiment, as shown in FIGS. 11A and 11B , the non-joining regions 10 ₁ a and 10 ₁ b are provided on the outer frame portion 17 that is substantially rectangular in plan view and are not connected via the connecting portion 18 The outer frame portion 17 is provided on one side of the substantially rectangular shape on the inner peripheral side of the vibrating portion 15 and on the opposite side (the left side in FIGS. 11A and 11B ) opposite to the above-mentioned side.

Therefore, like the crystal diaphragm 10 of FIGS. 4A and 4B in which the non-bonded areas 10a, 10a, 10b, 10b are provided in the outer frame portion 17 on one side, it will not be affected by the various elements formed on the outer frame portion 17 on one side. The restrictions on the wiring or bonding patterns such as the extraction electrodes 21 and 22, the connection bonding patterns 23, 24, 27, and 28, and the vibration-side sealing bonding patterns 25 ₁ and 26 ₁ make it easy to fully secure the non-bonding area 10 ₁ a, 10 ₁ b space.

Other structures of this embodiment are the same as the crystal diaphragm 10 of FIGS. 4A and 4B .

12A and 12B are diagrams showing the first sealing plate joined to the crystal vibration plate 10 ₁ of FIGS. 11A and 11B. They are diagrams corresponding to the above-mentioned FIGS. 5A and 5B. The corresponding parts are marked with the same reference numerals and are omitted. its description.

The first sealing joint pattern 33 ₁ is formed on the annular sealing side of the other main surface of the first sealing plate 11 ₁ as shown in FIG. 12B to one side of the first sealing plate 11 ₁ which is rectangular in plan view (the right side of FIG. 12B ). The outer peripheral edges of the corners at both ends of the short sides are different from the corners of the first sealing plate 11 in FIG. 5B and are not recessed in an arc shape toward the inner circumference. The portion of the sealing-side first sealing joint pattern 33 ₁ extending along the short side of the other side (left side of FIG. 12B ) of the first sealing plate 11 ₁ is from the corner of one side (the upper side of FIG. 12B ) to the short side. At approximately the middle position of the edge, the outer circumferential side enters the inner circumferential side, and the outer side becomes an area where the surface of the crystal plate without a joint pattern is exposed. The exposed area on the surface of the crystal plate is opposite to the non-joining area 10 1 a on one main surface of the crystal vibration plate 10 ₁ in FIG. 11A , and becomes the non-joining area _{11 1} a which is not joined to the crystal vibration plate 10 ₁ . When viewed from above, this non-joining area 11 ₁ a is the same as the non-joining area on both main surfaces of the crystal vibration plate 10 ₁ in FIGS. 11A and 11B where the first and second vibration-side sealing joint patterns 25 ₁ and 26 ₁ are not formed. 10 ₁ a and 10 ₁ b overlap. Other structures on the other main surface side of the first sealing plate 11 ₁ are the same as the first sealing plate 11 in FIG. 5B .

A second external electrode terminal 41 ₁ is formed around the second through-electrode 38 on one main surface of the first sealing plate 11 ₁ as shown in FIG. 12A . The second external electrode terminal 41 ₁ is formed in a rectangular shape at one corner of the short side of one side of the first sealing plate 11 ₁ that is rectangular in plan view (the right side in FIG. 12A ), and a part of the second external electrode terminal 41 1 extends along one long side to The short side of the other side, further, extends slightly toward the other long side along the short side of the other side. The outer peripheral side of the extended end of the second external electrode terminal 41 ₁ extending toward the other long side along the short side of the other side becomes the second bonding pad 41 ₁ a. This second external electrode terminal 41 ₁ is the same as the first sealing plate 11 of FIGS. 5A and 5B , and is connected via the second through electrode 38 , the connection connection pattern 34 , and the connection connection of the crystal diaphragm 10 ₁ of FIGS. 11A and 11B . The pattern 27, the first through-electrode 31, and the connection bonding pattern 24 are electrically connected to the second excitation electrode 20 of the crystal diaphragm ₁₀₁ .

A first external electrode terminal 40 ₁ is formed around the third through-electrode 39 on one main surface of the first sealing plate 11 ₁ . The first external electrode terminal 40 ₁ extends from the corner of one short side (the lower side of FIG. 12A ) of the other side (left side of FIG. 12A ) of the rectangular first sealing plate 11 ₁ in plan view, along the short side. The second external electrode terminal 41 ₁ extends from the corner portion along the long side to the short side of one side (right side in FIG. 12A ). The outer peripheral side of the extension end of the first external electrode terminal 40 ₁ extending toward the second external electrode terminal 41 ₁ becomes the first bonding pad 40 ₁ a. This first external electrode terminal 40 ₁ is similar to the first sealing plate 11 in FIGS. 5A and 5B , and is connected through the third through electrode 39 , the connection joint pattern 37 , the connection wiring pattern 36 , the connection joint pattern 35 , and FIG. 11A , the connecting pattern 23 of the crystal diaphragm 10 ₁ in FIG. 11B is electrically connected to the first excitation electrode 19 of the crystal diaphragm 10 ₁ .

When viewed from above, the first and second bonding pads 40 ₁ a and 41 ₁ a of the first sealing plate 11 ₁ are in contact with the non-bonding area 11 ₁ on the other main surface where the sealing-side first sealing bonding pattern 33 ₁ is not formed. a overlaps with the non-joining regions 10 1 a and _{10 1 b} of the crystal diaphragm 10 ₁ in which the first and second vibration-side sealing joint patterns 25 ₁ and 26 ₁ are not formed.

13A and 13B are diagrams showing a second sealing plate joined to the crystal vibration plate 10 ₁ of FIGS. 11A and 11B. They are diagrams corresponding to the above-mentioned FIGS. 6A and 6B. The corresponding parts are marked with the same reference numerals and are omitted. its description.

An annular vibration- _side second sealing joint pattern 45 ₁ is formed on one main surface of the second sealing plate 12 1 as shown in FIG. 13A to one side of the rectangular second sealing plate 12 ₁ in plan view (the right side in FIG. 13A ). The vicinity of the outer periphery of the corners at both ends of the short side is different from the corners of the second sealing plate 12 in FIG. 6A and is not recessed in an arc shape toward the inner circumference. The portion of the vibration-side second sealing joint pattern 45 ₁ extending along the short side of the other side of the second sealing plate 12 ₁ (the left side in FIG. 13A ) is from the corner of one side (the upper side in FIG. 13A ) to the above-mentioned At approximately the middle position of the short side, the outer peripheral side enters the inner peripheral side, and the outer side becomes an area where the surface of the crystal plate without a joint pattern is exposed. The exposed area on the surface of the crystal plate is opposite to the non-joining area 10 ₁ b on the other main surface of the crystal vibration plate 10 ₁ in FIG. 11B and becomes the non-joining area 12 ₁ b that is not joined to the crystal vibration plate 10 ₁ . When viewed from above, this non-joining area 12 ₁ b is the same as the non-joining area on both main surfaces of the crystal vibration plate 10 ₁ in FIGS. 11A and 11B where the first and second vibration-side sealing joint patterns 25 ₁ and 26 ₁ are not formed. 10 ₁ a and 10 ₁ b overlap, and also overlap with the non-joining area 11 1 a on the other main surface of the first sealing plate 11 ₁ where the seal-side first sealing joint pattern _{33 1} is not formed. Other structures on one main surface of the second sealing plate 12 ₁ are the same as the second sealing plate 12 of FIGS. 6A and 6B .

According to this embodiment, the first and second bonding pads 40 ₁ a and 41 ₁ a of the first sealing plate 11 1 overlap with the following areas in a plan view: the other main surface of the first sealing plate 11 ₁ has no seal formed _thereon . The non-joining area 11 ₁ a of the first side sealing joint pattern 33 ₁ ; the non-joining area 10 _{1 a} of the crystal vibration plate 10 1 where the vibration side _first and second sealing joint patterns 25 ₁ and 26 ₁ are not formed. 10 ₁ b; and the non-joining area 12 1 _b of the second sealing plate 12 ₁ in which the vibration-side second sealing joint pattern 45 ₁ is not formed.

That is, the first and second bonding pads 40 ₁ a and 41 ₁ a are located in a region that is, in plan view, the first non-bonding region where the first gap exists between the first sealing plate 11 ₁ and the crystal vibration plate 10 ₁ The regions 11 ₁ a and 10 ₁ a overlap with the second non-joining regions 10 ₁ b and _{12 1} b in which a second gap exists between the crystal diaphragm 10 ₁ and the second sealing plate 12 1 .

Thereby, when the first and second bonding pads 40 ₁ a and 41 ₁ a are wire-bonded and excessive pressing force is applied to the first and second bonding pads 40 ₁ a and 41 ₁ a, it is possible to The excess pressing force is released and relaxed in the first and second gaps between the first and second non-joining regions 11 ₁ a, 10 ₁ a, 10 ₁ b, and 12 ₁ b, thereby preventing the crystal diaphragm 10 ₁ and The first and second sealing plates 11 ₁ and 12 ₁ are deformed or damaged such as cracks.

Furthermore, in this embodiment, the first and second bonding pads 40 ₁ a and 41 ₁ a are not the first and second bonding pads 40 a and 40 a of the first sealing plate 11 shown in FIGS. 5A and 5B in the above embodiment. 41a is generally provided at the corners of both ends of the short sides of the first sealing plate 11 which is rectangular in plan view, but is provided at a close position on the inside, so that wire bonding can be performed stably.

In the crystal vibrator 1 of each of the above embodiments, the first and second excitation electrodes 19 and 20 of the crystal vibrating plates 10 and 10 ₁ and the first and second external electrode terminals 40 and 40 of the first sealing plates 11 and 11 1 _are included. 41, 40 ₁ and 41 ₁ are electrically connected via through-electrodes 31, 38 and 39. However, as another embodiment of the present invention, the through-electrodes may be replaced by electrical connections via side electrodes.

14A and 14B are diagrams of a crystal vibrating plate of a crystal vibrator according to another embodiment of the present invention using side electrodes instead of through electrodes. They are diagrams corresponding to the above-mentioned FIGS. 4A and 4B , and the same reference is attached to the corresponding part. symbol and its description is omitted.

On one main surface of the crystal diaphragm 10 ₂ as shown in FIG. 14A , a first vibration-side sealing connection joint pattern 25 ₂ is formed in an annular shape on the substantially rectangular annular outer frame portion 17 surrounding the vibrating portion 15 . This vibration-side first sealing connection joint pattern 25 ₂ is _different from the vibration-side first sealing joint pattern 25 of the crystal vibration plate 10 of FIG. The magnetic electrode 19 is electrically connected.

In the vibration-side first sealing connection joint pattern 25 ₂ , one end side (the upper side of FIG. 14A ) of the short side (the upper side of FIG. 14A ) of the rectangular crystal vibration plate 10 ₂ side (the right side of FIG. 14A ) in plan view is a width extending to the outer peripheral edge. The first wide portion 25 ₂ a of the width extends to the outer peripheral edge near the corner of the other end side (the lower side of FIG. 14A ) of the short side on the other side of the crystal diaphragm 10 ₂ (the left side in FIG. 14A ). The second wide part of the web is 25 ₂ b.

A connection joint pattern 58 is formed on the outer peripheral edge of the corner of the other short side of the crystal diaphragm 10 ₂ (the left side in FIG. 14A ) opposite to the second wide portion 25 ₂ b. This connection joint pattern 58 is formed with a fourth wide portion 26 2 b that is continuous with its outer periphery and is continuous with the vibration-side second seal connection joint pattern _{26 2 described} later on the other main surface shown in FIG. 14B 1st side electrode 68.

A connection joint pattern 55 is formed on the peripheral edge portion outside the corner portion of the connection joint pattern 58 at a diagonal position.

The vibration-side first sealing connection joint pattern 25 ₂ extending along the short side of the other side (the left side in FIG. 14A ) of the crystal vibration plate 10 ₂ has a narrower width than the second wide portion 25 ₂ b. , the outer side is the exposed area on the surface of the crystal plate where no joint pattern is formed. The exposed area on the surface of the crystal plate becomes the non-joining area 10 ₂ a which is not joined to the first sealing plate 11 ₂ in FIG. 15B described later.

On the other main surface of the quartz crystal diaphragm 10 ₂ shown in FIG. 14B , the vibration-side second sealing connection joint pattern 26 ₂ is formed in an annular shape on the substantially rectangular annular outer frame portion 17 surrounding the vibrating portion 15 . This vibration-side second sealing connection joint pattern 26 ₂ is different from the vibration-side second sealing joint pattern ₂₆ of the crystal vibration plate 10 of FIG. 4B described above. The magnetic electrode 20 is electrically connected.

In the vibration-side second sealing connection joint pattern 26 ₂ , the other end side (the lower side in FIG. 14B ) of the short side of the rectangular crystal vibration plate 10 ₂ in plan view (the right side in FIG. 14B ) extends to the outer periphery. The third wide portion 26 ₂ a of the wide width, one end side (the upper side of Fig. 14B ) of the short side on the other side of the crystal diaphragm 10 ₂ (the left side in Fig. 14B ) becomes the third wide portion extending to the outer periphery. 4 wide part 26 ₂ b.

In the fourth wide portion 26 ₂ b, the first side electrode 68 is continuous at its outer peripheral edge. Therefore, the fourth wide portion 26 ₂ b of the vibration-side second sealing connection joint pattern _{26 2} is connected to the connection joint pattern 58 on one main surface of the crystal diaphragm 10 ₂ as shown in FIG. 14A via the first side electrode 68 Electrical connection. Since the second vibration-side sealing connection joint pattern 26 ₂ is electrically connected to the second excitation electrode 20 of the vibration part 15 as described above, the connection joint pattern 58 on one main surface of the crystal vibration plate 10 ₂ passes through the first The side electrode 68 and the vibration-side second sealing connection joint pattern 26 ₂ are electrically connected to the second excitation electrode 20 of the vibration part 15 .

On the other end side (the upper side of FIG. 14B ) of the short side of the other main surface shown in FIG. 14B of the crystal diaphragm 10 ₂ (the right side of FIG. 14B ), there are formed along the short side. The connecting joint pattern 56 extends to the outer periphery.

The vibration-side second sealing connection joint pattern 26 ₂ extending along the short side of the other side (the left side in FIG. 14B ) of the crystal vibration plate 10 ₂ is narrower in width than the fourth wide portion 26 ₂ b. , the outer side is the exposed area on the surface of the crystal plate where no joint pattern is formed. The exposed area on the surface of the crystal plate becomes the non-joining area 10 ₂ b that is not joined to the second sealing plate 12 ₂ in FIG. 16A described later.

The non-joining area 10 ₂ a on one main surface of the crystal diaphragm 10 ₂ and the non-joining area 10 ₂ b on the other main surface are on the other side of the crystal diaphragm 10 ₂ when viewed from above (Fig. 14A, Fig. 14B The middle part of the short side (left side) except the two end parts overlaps.

15A and 15B are diagrams showing the first sealing plate joined to the crystal diaphragm ₁₀₂ of FIGS. 14A and 14B, and correspond to the above-mentioned FIGS. 5A and 5B.

In the annular first sealing connection joint pattern 33 ₂ on the other main surface of the first sealing plate 11 ₂ shown in FIG. 15B , one side of the rectangular first sealing plate 11 ₂ in plan view (shown in FIG. 15B One end side of the short side (the upper side in Figure 15B) becomes the first wide portion _332a extending to the outer peripheral edge, and the other side of the first sealing plate ₁₁₂ (the left side in Figure 15B) The other end side of the short side (the lower side in FIG. 15B ) becomes a wide second wide portion 33 ₂ b extending to the outer peripheral edge.

The seal-side first seal connection joint pattern 33 ₂ is substantially the same as the vibration-side first seal connection joint pattern 25 _{2 on one main surface of the crystal diaphragm 10 2 in} FIG. 14A except for the vibration part 15. And it is joined to the first sealing connection joining pattern 25 ₂ on the vibration side of one main surface of the crystal diaphragm 10 ₂ to be electrically connected. As mentioned above, the first sealing connection joint pattern _{25 2 on} the vibration side of one main surface of the crystal vibration plate 10 2 is electrically connected to the first excitation electrode 19 of the vibration part 15 , so the other side of the first sealing plate 11 ₂ The first sealing connection joint pattern 33 ₂ on the sealing side of the main surface is electrically connected to the first excitation electrode 19 of the vibrating part 15 .

The second wide portion 33 ₂ b of the first seal-side seal connection joint pattern 33 ₂ is formed with a second side electrode 70 that is continuous at its outer periphery. The second side electrode 70 is connected through the seal-side first seal connection. It is electrically connected to the first excitation electrode 19 of the vibration part 15 by the bonding pattern 33 ₂ . The second side electrode 70 is also connected to the fourth side electrode 66 which is continuous at the outer periphery of the second wide portion 25 ₂ b of the first sealing connection joint pattern 25 ₂ on the vibration side of the quartz crystal diaphragm 10 ₂ shown in FIG. 14A Electrical connection.

A connecting joint is formed at the outer peripheral edge of the corner of the short side of the other side (the left side in Figure _15B ) of the other main surface of the first sealing plate 112 on the one end side (the upper side in Figure 15B) Pattern 59. This connection joint pattern 59 is joined to the connection joint pattern 58 on one main surface of the crystal diaphragm ₁₀₂ in FIG. 14A. As described above, this connection joint pattern 58 is electrically connected to the second excitation electrode 20 of the vibrating part 15 via the first side electrode 68 and the second sealing connection joint pattern _{26 2 on} the vibration side of the crystal diaphragm 10 2 in FIG. 14B . sexual connection. Therefore, the connection joint pattern 59 on the other main surface of the first sealing plate 11 ₂ is also electrically connected to the second excitation electrode 20 of the vibration part 15 of the crystal vibration plate 10 ₂ . The connecting bonding pattern 59 is provided with a third side electrode 72 that is continuous at its outer periphery. Therefore, the third side electrode 72 is also electrically connected to the second excitation electrode 20 of the vibration part 15 of the crystal vibration plate 10 ₂ .

A connection joint pattern 57 is formed at a peripheral edge portion outside the corner portion of the connection joint pattern 59 at a diagonal position.

The sealing-side first sealing connection joint pattern 33 ₂ extending along the short side of the other side (the left side in FIG. 15B ) of the first sealing plate 11 ₂ is wider than the second wide portion 33 ₂ b. Narrow, the outer side is the exposed area on the surface of the crystal plate without a joint pattern. The exposed area on the surface of the crystal plate becomes _the non-joining area 11 ₂ a that is opposite to the non-joining area 10 ₂ a on one main surface of the crystal vibration plate 10 2 in FIG. 14A and is not joined to the crystal vibration plate 10 ₁ . When viewed from above, this non-joining area 11 ₂ a is a non-joining area on both main surfaces of the crystal vibration plate 10 ₂ in FIGS. 14A and 14B where the first and second vibration-side sealing connection joint patterns 25 ₂ and 26 ₂ are not formed. Areas 10 ₂ a and 10 ₂ b roughly overlap.

On one main surface of the first sealing plate 11 ₂ as shown in Figure 15A, corners are formed from both ends of the short side of the other side (the left side of Figure _15A ) of the rectangular first sealing plate 112 in plan view. The first and second external electrode terminals 40 ₂ and 41 ₂ respectively extend to the vicinity of the middle position along the short side.

The above-mentioned second side electrode 70 is continuous on the outer periphery of the first external electrode terminal 40 ₂ . As mentioned above, the second side electrode 70 is electrically connected to the first excitation electrode 19 of the vibration part ₁₅ of the crystal vibration plate 10 2 , therefore the first external electrode terminal 40 ₂ is also electrically connected to the first excitation electrode 19 of the vibrating part 15 of the crystal vibration plate 10 ₂ .

The above-mentioned third side electrode 72 is continuous on the outer periphery of the second external electrode terminal 41 ₂ . As mentioned above, the third side electrode 72 is electrically connected to the second excitation electrode 20 of the vibration part 15 of the crystal vibration plate 10 ₂ , therefore the second external electrode terminal 41 ₂ is also electrically connected to the second excitation electrode 20 of the vibrating part 15 of the crystal vibration plate 10 ₂ .

As shown in FIG. 15A , the first and second external electrode terminals 40 ₂ and 41 ₂ are formed at approximately the middle position of the short side of the other side of the rectangular first sealing plate 11 2 in plan view (the left side _in FIG. 15A ). , the second bonding pads 40 ₂ a and 41 ₂ a.

When viewed from above, the first and second bonding pads 40 ₂ a and 41 ₂ a of the first sealing plate 11 ₂ are connected to the non-joining area 11 on the other main surface where the sealing-side first sealing connection joint pattern 33 ₂ is not formed. ₂ a overlaps with the non-joining regions 10 2 a and _{10 2} of the crystal vibration plate 10 ₂ shown in FIGS. 14A and 14B where the first and second vibration-side sealing connection joint patterns _{25 2} and 26 ₂ are not formed. b overlap.

16A and 16B are diagrams showing a second sealing plate joined to the crystal diaphragm ₁₀₂ of FIGS. 14A and 14B, and correspond to the above-mentioned FIGS. 6A and 6B.

The second sealing joint pattern 45 ₂ on the annular sealing side of one main surface of the second sealing plate 12 ₂ shown in FIG. 16A is the same as that shown in FIG. 14B of the crystal vibration plate 10 ₂ except for the vibration part 15 . The annular vibration-side second sealing connection joint pattern 26 ₂ on the other main surface is substantially the same joint pattern, and is joined to the vibration-side second sealing connection joint pattern 26 ₂ on the other main surface of the crystal diaphragm 10 ₂ . In the seal-side second sealing joint pattern 45 ₂ , one end side (the lower side of FIG. 16A ) of the short side (the lower side of FIG. 16A ) of one side of the rectangular second sealing plate 12 ₂ in plan view extends to the outer peripheral edge. In the wide first wide portion 45 ₂ a, the other end side (the upper side in Fig. 16A ) of the short side on the other side (the left side in Fig. 16A ) of the second sealing plate 12 ₂ becomes a wide portion extending to the outer peripheral edge. The second wide portion 45 ₂ b.

The first sealing joint _pattern 45 2 on the sealing side of the short side of the other side (the left side in FIG. 16A ) of the second sealing plate 12 ₂ is narrower than the second wide portion 45 ₂ b, and the outer side is not The exposed area on the surface of the crystal plate where the joint pattern is formed. The exposed area of the surface of the quartz crystal plate becomes the non-joining area 12 ₂ b of the quartz crystal vibration plate 10 ₂ that is not joined to the vibration-side second sealing connection joining pattern 26 ₂ .

The non-joining region 12 ₂ b partially overlaps the non-joining regions _{10 2 a} and 10 ₂ b of the crystal diaphragm 10 2 when viewed from above, and partially overlaps the non-joining region 11 ₂ a of the first sealing plate 11 ₂ .

On the other end side (the upper side of FIG. 16A ) of the short side of one main surface of the second sealing plate 12 ₂ on the above-mentioned side (the right side in FIG. 16A ), there is formed a seal along the above-mentioned short side and extending to the outer peripheral edge. Joint pattern 60 for connection.

According to this embodiment, similarly to each of the above embodiments, when wire bonding the first and second bonding pads 40 ₂ a and 41 2 a, the first and second bonding pads 40 ₂ a and _{41 2 a} are wire-bonded. When excess pressing force is applied, _the excess pressing force can be applied to the non-joining areas 11 ₂ a, 10 ₂ a, _{10 2} b, _and 12 ₂ b is released and relaxed in the first and second gaps, thereby preventing the crystal vibration plate 10 ₂ and the first and second sealing plates 11 ₂ and 12 ₂ from being deformed or damaged.

The non-joined areas 10 _{2 a} and 10 ₂ b of the quartz crystal vibration plate 10 2 are provided in a substantially rectangular shape on the inner circumferential side of the outer frame portion 17 that is substantially rectangular in plan view and is connected to the vibration portion 15 via the connecting portion 18 . One side (the right side in FIGS. 14A and 14B ) faces the opposite side (the left side in FIGS. 14A and 14B ) on the outer frame portion 17 .

As described above, the non-joined areas 10 _{2 a} and 10 ₂ b of the crystal vibration plate 10 2 are provided on the outer frame part 17 on the side opposite to the side connected to the vibration part 15 via the connection part 18 , that is, on the opposite side. On the outer frame part 17. In the crystal vibration plate 10 of the above-mentioned FIGS. 4A and 4B , the non-joining areas 10a, 10a, 10b, and 10b are provided on the outer frame part 17 and are provided on one side connected to the vibration part 15 via the connection part 18 (FIG. 4A, 4B On the outer frame part 17 on the right side), in contrast, in this embodiment, the non-joining areas 10 ₂ a and 10 ₂ b are provided on the outer frame part 17 on the opposite side facing one side, The distance from the connecting part 18 is long.

As mentioned above, the non-joining areas 10 ₂ a and 10 ₂ b overlap the first and second joining pads 40 ₂ a and 41 ₂ a of the first sealing plate 11 ₂ in plan view. Therefore, in the non-joining areas 10 ₂ a and 10 ₂ b, a pressing force is applied to connect the bonding wires. However, in this embodiment, since the distance from the connecting part 18 is long, the non-joining area to the outer frame part 17 can be reduced. The pressing force exerted by 10 ₂ a and 10 ₂ b is transmitted to the vibrating part 15 via the connecting part 18 .

Furthermore, in this embodiment, as shown in FIG. 15A , the first and second bonding pads 40 ₂ a and 41 ₂ a are formed approximately on the short side of the other side of the first sealing plate 11 ₂ (the left side in FIG. 15A ). middle position. One end of the short side is a joint between the connection joint pattern 59 shown in Fig. 15B and the connection joint pattern 58 of the crystal diaphragm ₁₀₂ shown in Fig. 14A, and the other end of the short side is shown in Fig. The joint portion between the second wide portion 33 ₂ b shown in FIG. 15B and the second wide portion 25 ₂ b of the crystal diaphragm 10 ₂ shown in FIG. 14A. As described above, both ends of the short sides are firmly joined. Since wire bonding is performed using the first and second bonding pads 40 ₂ a and 41 2 a located approximately in the middle of the two ends, similar to the first and second bonding pads 40 _a and 41 a of FIG. 5A described above, short Compared with wire bonding at the corners of both ends of the side, wire bonding can be performed more stably.

In addition, in this embodiment, test terminals 75 and 76 for testing are formed on one main surface of the first sealing plate ₁₁₂ , as shown in FIG. 15A. One test terminal 75 is electrically connected to the first excitation electrode 19 of the vibrating part 15 via the side electrode 69 , the sealing side first sealing connection joint pattern 33 ₂ , and the vibration side first sealing connection joint pattern 25 ₂ . The above-mentioned side electrode 69 is also electrically connected to the side electrode 65 that is continuous at the outer periphery of the first wide portion 25 _{2 a} of the first vibration-side sealing connection bonding pattern 25 2 . The other test terminal 76 is electrically connected to the second excitation electrode 20 of the vibrating part 15 via the side electrode 71 , the connection joint pattern 57 , the connection joint pattern 55 , the side electrode 67 , and the vibration-side second sealing connection joint pattern 26 ₂ . sexual connection.

FIG. 17 is a schematic side view showing a state in which a crystal vibrator according to another embodiment of the present invention is joined to a base, and corresponds to the above-mentioned FIG. 9 ; FIG. 18 shows a second seal of the crystal vibrator in FIG. 17 The schematic top view of the other main surface side of the plate corresponds to the above-mentioned figure 6B.

On the other main surface of the second sealing plate 12 ₃ , that is, the main surface of the side that is joined to the inner bottom surface of the base 2 through the adhesive 50 , apply the adhesive 50 to the central area of the circle. A circular annular groove 55 is formed outside S so as to surround the entire circumference of the central area S.

As mentioned above, the second sealing plate 12 ₃ of the crystal vibrator 3 ₃ is formed with a circular annular groove 55 outside the central area S where it is joined to the base 2 . Therefore, the thermal stress caused by heat treatment such as reflow soldering is eliminated. When applied to the central area S of the second sealing plate 12 ₃ constrained by the adhesive 50 , it is relaxed and absorbed by the annular groove 55 , thereby reducing the thermal stress transmitted to the outer peripheral portion of the second sealing plate 12 ₃ . Thereby, the thermal stress transmitted from the outer peripheral part of the second sealing plate 12 ₃ to the vibrating part 15 via the outer frame part 17 of the crystal vibrating plate 10 can be reduced, and the frequency variation can be effectively suppressed.

In addition, the groove formed outside the area where the adhesive is applied is not limited to an annular groove, but may also be a plurality of divided grooves or recesses, and its planar shape may also be linear or circular. other shapes.

In the above-mentioned embodiment, the crystal vibrator 3 and the IC 4 are placed horizontally and mounted on the base 2. However, the crystal vibrator and electronic components such as ICs may be laminated and arranged.

FIG. 19 is a schematic structural diagram of a constant temperature bath type crystal oscillator according to another embodiment of the present invention.

The crystal oscillator 80 of this embodiment has an oscillation IC 83, a crystal oscillator 84, and a heater IC 85 laminated in this order from the upper side on an insulating substrate 82 housed in a recessed portion of a base 81. The upper opening edge of 81 joins the top cover 86 for airtight sealing. The oscillation IC 83 is mounted on the crystal vibrator 84 via a plurality of metal bumps.

Like the above-mentioned embodiment, the crystal vibrator 84 has a three-layer sandwich structure including a crystal vibrating plate and a first and second sealing plate.

The heater IC 85 has an integrated structure including a heating element, a control circuit for controlling the temperature of the heating element, and a temperature sensor for detecting the temperature of the heating element.

The crystal vibrator 84 and the heater IC 85 are wire-bonded to the connection electrodes on the upper surface of the step portion on the inner peripheral side of the base 81 via bonding wires 87 and 88, respectively.

The connection position of the crystal vibrator 84 by the bonding wire 87 overlaps the non-joined area where the crystal vibrator plate and the first and second sealing plates are not joined when viewed from above, as in each of the above-described embodiments.

In each of the above embodiments, a first gap is formed between the non-joining area of the first sealing plate and the non-joining area of the crystal vibration plate, and between the non-joining area of the second sealing plate and the non-joining area of the crystal vibration plate The second gap is formed, but as another embodiment of the present invention, the non-joining area of the first sealing plate and the non-joining area of the crystal diaphragm can also be omitted and the two are joined to eliminate the first sealing plate and the crystal diaphragm. The first gap, or the non-joining area of the second sealing plate and the non-joining area of the crystal vibration plate can be omitted and the two are joined to eliminate the second gap between the second sealing plate and the crystal vibration plate.

In the above embodiment, the vibration part 15 of the crystal vibration plate 10 is connected to the outer frame part 17 of the outer peripheral part through one connection part 18, but the connection part may also be formed in a plurality of places and connected to the outer frame part 15 in a plurality of places. The outer frame part 17 may also omit the space 16 caused by the penetration part between the vibrating part 15 and the outer frame part 17, and connect the entire circumference of the thin-walled vibrating part 15 to the outer frame part 17.

Furthermore, in the above-described embodiment, the vibrating portion 15 in the central portion of the crystal vibrating plate 10 is formed to be thinner than the outer frame portion 17. However, the vibrating portion and the outer frame portion of the crystal vibrating plate may have the same wall thickness. In this case, for example, the joining material joining the crystal diaphragm and the first and second sealing plates may be thickened to form a space between the vibrating part of the crystal diaphragm and the first and second sealing plates.

In the above-described embodiment, crystal is used for the first and second sealing plates 11 and 12, but the invention is not limited to this, and other insulating materials such as glass may also be used.

In the above-described embodiment, AT cut crystal is used for the crystal diaphragm 10, but the invention is not limited to this, and crystals other than AT cut crystal may be used. In addition, it is not limited to a crystal vibration plate, and a piezoelectric vibration plate containing piezoelectric materials such as lithium tantalate and lithium niobate can also be used.

In the above embodiment, each of the through electrodes 31, 38, and 39 is formed by coating the inner wall surface of the through hole with a metal film. However, the present invention is not limited to this, and the through hole may also be filled with a conductive material.

In the above embodiment, the base 2 has a recess for mounting the crystal vibrator 3 and the like, and the top cover 5 is flat. However, as other embodiments of the present invention, a crystal vibrator etc. can also be mounted on a flat base, and The top cover having the concave portion is covered in such a manner as to cover the crystal vibrator on the base.

Alternatively, the base may be made into a flat plate shape, the top cover may be omitted, and the crystal vibrator and the like on the base with warp joints may be molded using resin. The base is not limited to ceramic, and may also be a glass epoxy substrate, a silicon substrate, a glass substrate, a crystal substrate, or the like.

In the above embodiment, the IC 4 as an electronic component is mounted on the base 2 together with the crystal vibrator 3, and the top cover 5 is joined to perform airtight sealing. However, as other embodiments of the present invention, the electronic component may be omitted and only the IC 4 may be omitted. The crystal vibrator is mounted on the base, and the top cover is joined to perform airtight sealing.

In the above embodiment, the IC 4 and the crystal vibrator 3 as electronic components are arranged side by side on the base 2. However, for example, electronic components may be stacked on the crystal vibrator.

Furthermore, by using a base with an H-shaped cross section as the base, a crystal vibrator can be mounted in one of the upper and lower concave portions, and an electronic component can be mounted in the other.

The crystal oscillator is not limited to the above embodiment, and may also be a temperature compensated crystal oscillator (TCXO, Temperature Compensating Quartz Oscillator) or the like.

1. 80: Crystal oscillator 2. 81: Base 2 ₁ : Bottom plate 2 ₂ : Side wall 3. 3 _3. 84: Crystal oscillator 4: IC 5. 86: Top cover (cover) 6: Sealing ring 7: Storage space 8: Wiring pattern 9: Bonding wires 10, 10 ₁ , 10 ₂ : Crystal diaphragm 10a, 10 ₁ a, 10 ₂ a: Non-joining area (first non-joining area) 10b, 10 ₁ b, 10 ₂ b: Non-joining area (2nd non-joining area) 11, 11 ₁ , 11 ₂ : 1st sealing plate 11a, 11 ₁ a, 11 ₂ a: Non-joining area (1st non-joining area) 12, 12 ₁ , 12 ₂ : Second sealing plate 12b, 12 ₁ b, 12 ₂ b: Non-joining area (second non-joining area) 12 ₃ : Second sealing plate 13: Joining line 15: Vibrating part 16: Spacing 17: Outer frame part 18: Connection part 19: First excitation electrode 20: Second excitation electrode 21, 21 ₂ : First extraction electrode 22, 22 ₂ : Second extraction electrode 23, 24, 27, 28, 29, 30: for connection Joint patterns 25, 25 ₁ : Joint patterns for the first sealing on the vibration side 25 ₂ : Joint patterns for the first sealing connection on the vibration side 25 ₂ a, 33 ₂ a, 45 ₂ a: First wide portions 25 ₂ b, 33 ₂ b, 45 ₂ b: 2nd wide portion 26 ₁ : 2nd vibration-side sealing joint pattern 26 ₂ : 2nd vibration-side sealing joint pattern 26 ₂ a: 3rd wide portion 26 ₂ b: 4th wide Width portion 31: First through-electrodes 33, 33 ₁ : Sealing side first sealing bonding pattern 33 ₂ : Sealing side first sealing bonding pattern 34, 35, 37: Connection bonding pattern 36: Connection wiring pattern 38 : 2nd through-electrode 39 : 3rd through-electrode 40, 40 ₁ , 40 ₂ : 1st external electrode terminal 41, 41 ₁ , 41 ₂ : 2nd external electrode terminal 40a, 40 ₁ a, 40 ₂ a : 1st joint Pads 41a, 41 ₁ a, 41 ₂ a: 2nd bonding pads 43a, 43b, 44a, 44b: Bonding material 45: Sealing side second sealing bonding pattern 45 ₁ : Vibration side second sealing bonding pattern 45 ₂ : Sealing Second side sealing bonding pattern 46, 47, 48: Connection bonding pattern 50: Adhesive 55, 56, 57, 58, 59, 60: Connection bonding pattern 65: Side electrode 66: Fourth side electrode 67: Side electrode 68: 1st side electrode 69: Side electrode 70: 2nd side electrode 71: Side electrode 72: 3rd side electrode 75, 76: Test terminal 82: Substrate 83: Oscillation IC 83 85: Heater IC 87, 88: Bonding line G1: 1st gap G2: 2nd gap G3: Gap S: Central area

[Fig. 1] is a schematic cross-sectional view of a crystal oscillator according to an embodiment of the present invention. [Fig. 2] is a schematic plan view of the crystal oscillator in Fig. 1 with the cover body omitted. [Fig. 3] is an enlarged schematic cross-sectional view of the crystal vibrator in Fig. 1. [Fig. 4A] is a schematic plan view showing one main surface side of the crystal diaphragm. [Fig. 4B] is a schematic plan view showing the other main surface side of the crystal diaphragm from one main surface side. [Fig. 5A] is a schematic plan view showing one main surface side of the first sealing plate. [Fig. 5B] is a schematic plan view showing one main surface side of the first sealing plate as seen through the other main surface side. [Fig. 6A] is a schematic plan view showing one main surface side of the second sealing plate. [Fig. 6B] is a schematic plan view showing one main surface side of the second sealing member and showing the other main surface side thereof. [Fig. 7] is a partial cross-sectional view of the corner of the crystal vibrator 3. [Fig. 8] is a schematic plan view of the base showing an area where an adhesive is applied for joining the crystal oscillator. [Fig. 9 is a schematic side view of the crystal vibrator connected to the base. [Fig. 10A] is a graph showing the frequency deviation of the crystal oscillator of the comparative example after heat treatment. [Fig. 10B] is a diagram showing the frequency deviation of the crystal oscillator of this embodiment after heat treatment. [Fig. 11A] is a schematic plan view showing one main surface side of a crystal diaphragm according to another embodiment of the present invention. 11B is a schematic plan view showing the other main surface side of a crystal diaphragm according to another embodiment of the present invention as viewed from one main surface side. [Fig. 12A] is a schematic plan view showing one main surface side of the first sealing plate joined to the crystal vibration plate of Figs. 11A and 11B. 12B is a schematic plan view showing the other main surface side of the first sealing plate joined to the crystal diaphragm plate of FIGS. 11A and 11B . [Fig. 13A] is a schematic plan view showing one main surface side of the second sealing plate joined to the crystal vibration plate of Figs. 11A and 11B. 13B is a schematic plan view showing the other main surface side of the second sealing plate joined to the crystal diaphragm plate of FIGS. 11A and 11B . [Fig. 14A] is a schematic plan view showing one main surface side of a crystal diaphragm according to still another embodiment of the present invention. 14B is a schematic plan view showing the other main surface side of a crystal diaphragm according to another embodiment of the present invention as seen from one main surface side. [Fig. 15A] is a schematic plan view showing one main surface side of the first sealing plate joined to the crystal vibration plate of Figs. 14A and 14B. [Fig. 15B] is a schematic plan view showing the other main surface side of the first sealing plate joined to the crystal diaphragm plate of Figs. 14A and 14B. [Fig. 16A] is a schematic plan view showing one main surface side of the second sealing plate joined to the crystal vibration plate of Figs. 14A and 14B. [Fig. 16B] is a schematic plan view showing the other main surface side of the second sealing plate joined to the crystal vibration plate of Figs. 14A and 14B. [Fig. 17] is a schematic side view showing a state in which a crystal vibrator according to another embodiment of the present invention is joined to a base. [Fig. 18] A schematic plan view showing the other main surface side of the second sealing plate of the crystal vibrator of Fig. 17. [Fig. [Fig. 19] is a schematic cross-sectional view of a constant temperature bath type crystal oscillator according to another embodiment of the present invention.

10:Crystal vibration plate

10a: Non-joint area (1st non-joint area)

10b: Non-joint area (second non-joint area)

11: 1st sealing plate

11a: Non-joint area (1st non-joint area)

12:Second sealing plate

12b: Non-joining area (second non-joining area)

13:Joining wire

41: 2nd external electrode terminal

41a: 2nd bonding pad

43a, 43b: joint material

G1: 1st gap

G2: 2nd gap

Claims (11)

A piezoelectric vibrator, which includes a piezoelectric vibrating plate with first and second excitation electrodes respectively formed on two main surfaces, and includes the first and second excitation electrodes respectively joined to the two main surfaces of the piezoelectric vibrating plate. 2 sealing plate; The outer peripheral portions of the first and second sealing plates are respectively joined to the outer peripheral portions of the two main surfaces of the piezoelectric vibrating plate, and the vibrating portion of the piezoelectric vibrating plate including the first and second excitation electrodes is One who seals airtightly; A bonding pad for wire bonding electrically connected to any one of the first and second excitation electrodes of the piezoelectric vibrating plate is formed on the outer surface of the first sealing plate; A non-joining area is provided on a portion of the outer peripheral portion of at least one of the first and second sealing plates and a portion of the outer peripheral portion of the piezoelectric vibrating plate that faces each other and does not join; and The bonding pad on the outer surface of the first sealing plate is formed so as to overlap the non-bonding area when viewed from above. Such as the piezoelectric vibrator of claim 1, wherein As the bonding pads, first and second bonding pads for wire bonding are formed on the outer surface of the first sealing plate and are electrically connected to the first and second excitation electrodes of the piezoelectric vibration plate, respectively. . Such as the piezoelectric vibrator of claim 1, wherein A first non-joining area as the non-joining area is provided on a part of the outer peripheral part of the above-mentioned first sealing plate and a part of the outer peripheral part of the above-mentioned piezoelectric vibrating plate, and on a part of the outer peripheral part of the above-mentioned second sealing plate and the above-mentioned non-joining area A portion of the outer peripheral portion of the piezoelectric vibrating plate is respectively provided with a second non-joining area as the non-joining area, and the first non-joining area and the second non-joining area overlap in a plan view. Such as the piezoelectric vibrator of claim 1, wherein The non-joining area of part of the outer peripheral portion is at least one of the first and second sealing plates and the outer peripheral portion of the piezoelectric vibrating plate. Such as the piezoelectric vibrator of claim 1, wherein The piezoelectric vibrating plate includes: the vibrating portion formed at a central portion of the piezoelectric vibrating plate; and an outer frame portion formed at an outer peripheral portion of the piezoelectric vibrating plate to surround the vibrating portion, and is larger than the piezoelectric vibrating plate. The above-mentioned vibrating part is thick; The outer peripheral portions of the first and second sealing plates are respectively joined to both main surfaces of the outer frame portion of the piezoelectric vibrating plate; and The non-joining regions are respectively provided in a portion of the outer peripheral portion of at least one of the first and second sealing plates and in a portion of the outer frame portion of the outer peripheral portion of the piezoelectric vibrating plate. Such as the piezoelectric vibrator of claim 5, wherein The outer frame portion of the piezoelectric vibrating plate surrounds the vibrating portion with a gap therebetween and is connected to the vibrating portion via a connecting portion. Such as the piezoelectric vibrator of claim 6, wherein The bonding pad on the outer surface of the first sealing plate of the piezoelectric vibrator is formed so as to overlap the non-bonding area of the outer frame portion of the piezoelectric vibrating plate when viewed from above. Such as the piezoelectric vibrator of claim 7, wherein The vibrating portion of the piezoelectric vibrating plate is substantially rectangular in plan view; The outer frame portion of the piezoelectric vibrating plate is substantially rectangular annular in plan view; One substantially rectangular side of the inner peripheral side of the substantially rectangular annular shape of the outer frame portion is connected to the vibrating portion via the connecting portion; and The non-joining area of the piezoelectric vibrating plate is provided on the outer frame portion on the opposite side of the substantially rectangular shape that is opposite to the one side. A piezoelectric vibration element, including: The piezoelectric vibrator according to any one of the above claims 1 to 8, and A base equipped with the above-mentioned piezoelectric vibrator. The piezoelectric vibration element of claim 9, wherein On the above-mentioned base, electronic components are mounted next to the above-mentioned piezoelectric vibrator. The piezoelectric vibration element of claim 10, wherein The first and second bonding pads of the first sealing plate of the piezoelectric vibrator are wire bonded and electrically connected to the electronic component.