TW202333020A - Electronic device assembly ,expansion component and heat dissipation module - Google Patents

Abstract

A heat dissipation module includes a diversion case and a fan. The diversion case includes an input section, an output section and a connecting section connected between the input section and the output section. An angle is defined between an extending direction of the input section and an extending direction of the output section. An end of the input section away from the connecting section and an end of the output section away from the connecting section are inclined with respect to the connecting section respectively. The fan is disposed in the connecting section. An expansion component and an electronic device assembly are provided too.

Description

Electronic device combinations and expansion components and cooling modules

This case relates to electronic devices, expansion components and cooling modules.

With the popularity of electronic products, users' performance requirements for electronic devices are becoming more and more diverse. In order to meet the various needs of users, the number of electronic components in electronic devices is increasing. This has also caused space configuration problems in electronic devices. , the problem of heat dissipation arises accordingly. How to increase the configuration of electronic components in the limited space of the electronic device to improve performance while taking into account the heat dissipation efficiency is an issue that the inventor urgently wants to solve.

This case provides an expansion component, including a casing, a partition, a plurality of electronic components and a heat dissipation module. The shell includes a bottom plate, a top plate and an accommodation space between the bottom plate and the top plate. The partition is arranged in the accommodation space and is parallel to the bottom plate, dividing the accommodation space into an upper compartment and a lower compartment. The electronic components are dispersed in the upper compartment and the lower compartment, and one of the electronic components located in the upper compartment is against the partition. The heat dissipation module is arranged in the casing and includes a flow guide casing and a fan. The diversion housing includes a connected input section and an output section. The extension direction of the input section and the extension direction of the output section have an included angle. The diversion housing is accommodated in the lower compartment, and the output section is against the partition and located below. One of the electronic components in the compartment. The fan is installed at the intersection of the input section and the output section.

In some embodiments, the aforementioned bottom plate includes a through opening, the flow guide housing includes an edge, the edge surrounds the opening, the edge is against the bottom plate, and the open mask covers the through opening.

In some embodiments, the aforementioned passage includes a first passage and a second passage, the first passage corresponds to the position of the input section, and the second passage corresponds to the position of the output section.

In some embodiments, the aforementioned air guide housing includes an inner surface, the inner surface faces the bottom plate, the output section includes a first heat dissipation section and a second heat dissipation section, the inner surface has a first height between the first heat dissipation section and the opening, and the inner surface There is a second height between the second heat dissipation section and the opening, and the first height and the second height are different.

In some embodiments, the expansion component further includes heat dissipation fins disposed on the first heat dissipation section and the second heat dissipation section.

In some embodiments, the first heat dissipation section abuts the electronic components located in the lower compartment, and the second heat dissipation section abuts the partition at a position corresponding to the electronic components located in the upper compartment.

In some embodiments, the first heat dissipation section is farther from the fan than the second heat dissipation section, and the first height is smaller than the second height.

In some embodiments, the extending direction of the inner surface between the first heat dissipation section and the second heat dissipation section is inclined to the bottom plate.

In some embodiments, the aforementioned output section further includes a third heat dissipation section, and the inner surface has a third height between the third heat dissipation section and the opening, and the third height is different from the first height and the second height.

In some embodiments, the third heat dissipation section is closer to the fan than the first heat dissipation section and the second heat dissipation section, and the third heat dissipation section is against another electronic component located in the lower compartment.

In some embodiments, the third heat dissipation section is flush with the fan, and the third height is greater than the first height and less than the second height.

In some embodiments, the input section of the air guide housing includes an inlet section. The inlet section has a first end and a second end. The inner surface of the inlet section is inclined to the bottom plate. The second end is closer to the fan than the first end. And the height of the inner surface from the second end to the opening is greater than the height of the first end from the opening.

In some embodiments, the expansion component further includes heat dissipation fins disposed in the inlet section.

In some embodiments, the input section of the air guide housing further includes a bus section. The bus section is located between the inlet section and the fan. The inner surface of the bus section has a second height from the opening, and the bus section is against the partition.

In some embodiments, the aforementioned fan includes a casing. The casing has an air inlet and an air outlet that are perpendicular to each other. The air inlet faces the inner surface and is spaced apart from the inner surface, and the air outlet faces the output section.

In some embodiments, the inner surface corresponding to the fan has a second height from the opening.

In some embodiments, the aforementioned included angle is 90 degrees.

This case provides another expansion component, including a casing, a partition, multiple electronic components and a heat dissipation module. The shell includes a bottom plate, a top plate and an accommodation space between the bottom plate and the top plate. The partition is arranged in the accommodation space and is parallel to the bottom plate, dividing the accommodation space into an upper compartment and a lower compartment. The electronic components are dispersed in the upper compartment and the lower compartment, and one of the electronic components located in the upper compartment is against the partition. The heat dissipation module is arranged in the casing and includes a flow guide casing and a fan. The flow guide housing includes an input section and an output section that are connected to form an L shape. The flow guide case is accommodated in the lower compartment and fixed to the bottom plate, and the output section is against the partition and one of the electronic components located in the lower compartment. . The fan is installed at the intersection of the input section and the output section.

This case also provides an electronic device combination, including expansion components and a host. The expansion component includes a first housing, a partition, a plurality of electronic components, a heat dissipation module and a first connector. The host includes a second housing, a main circuit board and a main connector. The first housing has a bottom plate, a top plate and a first accommodation space located between the bottom plate and the top plate. The top plate has an opening. The partition is arranged in the first accommodation space and is parallel to the bottom plate, dividing the first accommodation space into an upper compartment and a lower compartment. The electronic components are dispersed in the upper compartment and the lower compartment, and one of the electronic components located in the upper compartment is against the partition. The heat dissipation module is arranged in the casing and includes a flow guide casing and a fan. The flow guide housing includes an input section and an output section that are connected to form an L shape. The flow guide case is accommodated in the lower compartment and fixed to the bottom plate, and the output section is against the partition and one of the electronic components located in the lower compartment. . The fan is installed at the intersection of the input section and the output section. The first connector is electrically connected to the first circuit board and exposed from the opening on the top plate. The second housing has a second accommodation space. The main circuit board is located in the second accommodation space. The main connector is electrically connected to the main circuit board, and the main connector is disposed on the surface of the second housing. When the host is assembled to the expansion component, the second housing covers the top plate of the first housing and covers the opening, and the first connection The connector is electrically connected to the main connector.

This case also provides a heat dissipation module, including a flow guide housing and a fan. The diversion housing includes an input section, an output section and a connection section connected between the input section and the output section. There is an angle between the extension direction of the input section and the extension direction of the output section, and the input section and the output section are away from one end of the connection section. respectively inclined relative to the connecting section. The fan is accommodated in the connecting section.

Referring to Figures 1 to 4, Figure 1 is a schematic three-dimensional appearance diagram of an embodiment of the electronic device assembly of the present case; Figure 2 is a three-dimensional exploded schematic diagram of an embodiment of the electronic device assembly of the present case; Figure 3 is an implementation of the electronic device assembly of the present case. The second three-dimensional exploded diagram of the example; Figure 4 is a cross-sectional diagram drawn along the 4-4 cut plane line in Figure 1.

This case provides an electronic device combination, including a plurality of overlappingly arranged electronic devices E. Each electronic device E includes a housing H and an electronic component A. Each housing H has an accommodation space S. The accommodation space S of each housing H is Electronic components A are respectively assembled inside, and the electronic components A in adjacent housings H can form electrical connections at the same time when the two housings H are overlapped and assembled. Thereby, the electronic device assembly can use the accommodation space S of a plurality of electronic devices E without external wiring to increase the number and types of electronic components A assembled to meet the expansion of diversified electronic functions.

Referring to FIG. 4 , in the electronic device assembly, each housing H and the different electronic components A configured therein can be combined to form an electronic device E with different functional orientations. The electronic component A may be a circuit board, a connector, a storage component or a power supply component with different functional orientations.

Referring to FIG. 1 , in some embodiments, the electronic device combination includes two electronic devices E, and each electronic device E includes a housing H respectively. The following description takes the two electronic devices E as the expansion component E1 and the host E2 as an example, but the case is not limited to this.

Referring to Figure 4, for clear explanation, in some embodiments in which the electronic device combination includes two electronic devices E, the housing H includes a first housing H1 and a second housing H2, and the first housing H1 includes a first accommodation space. S1, the second housing H2 includes a second accommodation space S2, and the first housing H1 is part of the expansion assembly E1, and the second housing H2 is part of the host E2.

Referring to Figure 4, the electronic device assembly includes an expansion component E1 and a host E2. The expansion component E1 includes a first accommodation space S1, and the host E2 includes a second accommodation space S2. Different electronic components A are respectively installed in the first accommodation space S1 and the second accommodation space S2. When the host E2 is configured to expand When the component E1 is installed, the expansion component E1 and the host E2 are respectively abutted and electrically connected with one side thereof, thereby increasing the space in which the electronic component A can be assembled in the electronic device combination and the functions it can provide.

Referring to FIGS. 3 and 4 , in some embodiments, the electronic component A includes a first circuit board A1 and a first connector A2 disposed in the first accommodation space S1 of the expansion component E1 and a second container disposed in the host E2 . Place main circuit board A3 and main connector A4 in space S2. In these embodiments, the main circuit board A3 can be a motherboard, and the first circuit board A1 can be various expansion circuit boards that can cooperate with the motherboard, but the present case is not limited to this.

Referring to FIGS. 3 and 4 , in these embodiments, the expansion component E1 includes a first housing H1 , a first circuit board A1 and at least one first connector A2 . The first housing H1 has an opposing top plate H11 and a bottom plate H12. A first accommodation space S1 is formed between the top plate H11 and the bottom plate H12. The top plate H11 has an opening H111. The first circuit board A1 is disposed in the first accommodation space S1. The first connector A2 is electrically connected to the first circuit board A1, and the first connector A2 is exposed from the opening H111 to the top plate H11. It is worth mentioning that the opening H111 shown in Figure 3 is further equipped with a plate corresponding to the outline shape of the opening H111, and a through hole is opened on the plate for the first connector A2 to pass through, thereby avoiding external moisture or dust. It invades the inside of the first housing H1 through the opening H111. However, the opening H111 may not be provided with a plate to allow different electronic components A in the first housing H1 to pass through the opening H111, and the present case is not limited to this.

Referring to Figures 3 and 4, the host E2 includes a second housing H2, a main circuit board A3 and at least one main connector A4. The second housing H2 has a first surface H21 and a second surface H22 facing each other. A second accommodation space S2 is formed between the first surface H21 and the second surface H22. The main circuit board A3 is disposed in the second accommodation space S2. The main connector A4 is electrically connected to the main circuit board A3 and exposed on the second surface H22. When the host E2 is assembled to the expansion component E1, the second surface H22 of the second housing H2 covers the top plate H11 of the first housing H1 and The opening H111 is covered, and the first connector A2 is electrically connected to the main connector A4.

Thereby, the main circuit board A3 of the host E2 is electrically connected to the first connector A2 of the expansion component E1 through the main connector A4, so that the host E2 can be electrically connected to the first circuit board A1 in the expansion component E1 to provide functions. expansion, and the first accommodating space S1 and the second accommodating space S2 can be used together to increase the number and types of assembled electronic components A, provide more diversified functions, and meet more diversified use requirements.

Referring to FIGS. 1 to 4 , in some embodiments, the housing H of the expansion component E1 (i.e., the first housing H1 ) and the housing H (i.e., the second housing H2 ) of the host E2 are hexagonal cubes with corresponding appearance shapes. structure. In these embodiments, the first housing H1 also includes a first side H13, a second side H14, a third side H15 and a fourth side H16 connected in sequence. The first side H13, the second side H16 are connected in sequence. The side H14, the third side H15 and the fourth side H16 are respectively connected between the top plate H11 and the bottom plate H12 to form the first accommodation space S1. In these embodiments, the shape and size of the second surface H22 of the casing H (the second casing H2) of the host E2 correspond to the shape and size of the top plate H11 and the bottom plate H12 of the first casing H1, thereby making the expansion component After the E1 and the host E2 are assembled, the outer contours of the two are flush and have an integrated appearance. In addition, the position of the first connector A2 on the top plate H11 corresponds to the position of the main connector A4 on the second surface H22. In this way, when the expansion component E1 and the host E2 are overlapped and assembled, the first connector A2 can be connected to the main connector A2. The main connector A4 forms an electrical connection to achieve the purpose of expansion.

Referring to Figure 4, in some embodiments, the expansion component E1 further includes a partition 10. The partition 10 is disposed in the first accommodation space S1 parallel to the top plate H11 and the bottom plate H12. In this way, the partition 10 is located between the top plate H11 and the bottom plate H12. The first accommodation space S1 can be divided into an upper compartment S11 and a lower compartment S12 between the bottom plates H12. Thereby, the upper compartment S11 and the lower compartment S12 can respectively be configured with electronic components A with different functional orientations, providing more diversified functional expansion.

Referring to FIG. 4 , in some embodiments, the electronic component A further includes a second circuit board A5 , a plurality of batteries A6 and a second connector A7 . In these embodiments, the first circuit board A1 is disposed on the upper compartment S11 of the expansion component E1, the second circuit board A5 and each battery A6 are disposed on the lower compartment S12 and are electrically connected to each other, and the second connector A7 passes through The first circuit board A1 and the second circuit board A5 are electrically connected to the partition 10 . Thereby, the main circuit board A3, the first circuit board A1 and the second circuit board A5 can be configured in the electronic device assembly to provide diversified function expansion. In addition, the main circuit board A3 is electrically connected to the first circuit board A1, And the first circuit board A1 is electrically connected to the second circuit board A5 and each battery A6. The battery A6 disposed in the first accommodation space S1 can supply power to the first accommodation space S1 and the second accommodation space S2 at the same time. With each electronic component A, the battery A6 does not need to be installed in the second accommodation space S2, thereby improving the space utilization freedom of the second accommodation space S2. It is worth noting that the first circuit board A1 and the second circuit board A5 can be replaced with circuit boards with different functional orientations according to usage requirements, such as bus circuit boards, graphics cards, network cards or disk array cards (RAID Cards). , but this case is not limited to this.

Referring to FIG. 2 , in some embodiments, the expansion component E1 further includes a waterproof component 20 , and the waterproof component 20 is surrounding the opening H111 . This ensures that external moisture cannot invade into the first accommodation space S1 through the opening H111 of the expansion assembly E1, thereby ensuring the waterproofness of the expansion assembly E1.

Referring to Figure 5, in some embodiments, the number of openings H111 in the first housing H1 is plural. In these embodiments, the opening H111 includes a first opening H1111 and a second opening H1112. The first opening H1111 is located in the middle of the top plate H11. , here, the middle position of the top plate H11 is not limited to the centroid position of the top plate H11. The middle position of the top plate H11 means that the outer contour of the first opening H1111 is not in contact with the first side H13, the second side H14, and the third side. Any one of the three sides H15 and the fourth side H16. In these embodiments, the first connector A2 is exposed through the first opening H1111.

Referring to FIGS. 5 and 6 , the expansion component E1 of the electronic device assembly further includes a heat dissipation module 30 for dissipating heat from the internal electronic component A. In some embodiments, the heat dissipation module 30 includes a first heat dissipation module 30A and a second heat dissipation module 30B. The first heat dissipation module 30A is disposed close to the top plate H11 (as shown in FIG. 5 ), and the second heat dissipation module 30B is close to the bottom plate. H12 is provided (as shown in FIG. 6 ), thereby fully dissipating heat inside the expansion component E1 through the heat dissipation module 30 . It is worth noting that the first heat dissipation module 30A or the second heat dissipation module 30B can be set separately in the expansion component E1, or the first heat dissipation module 30A and the second heat dissipation module 30B can be set at the same time, which is not the case in this case. limit.

Referring to Figure 5, in some embodiments, the first heat dissipation module 30A includes a fan 31 and a heat dissipation pipe 32, the top plate H11 of the first housing H1 also includes an assembly slot H112, and the second opening H1112 is adjacent to the first side H13, Any two adjacent ones of the second side H14, the third side H15 and the fourth side H16. Referring to Figure 5, a second opening H1112 is adjacent to the first side H13 and the second side H14. The assembly groove H112 is located at a position corresponding to the second opening H1112 and is recessed from the top plate H11 toward the bottom plate H12.

See Figure 5 and Figure 6. In these embodiments, the fan 31 of the first heat dissipation module 30A is assembled in the assembly slot H112. One end of the heat dissipation pipe 32 corresponds to the position of the fan 31, and the other end extends from the top plate H11 and corresponds to the electronic component A inside the expansion component E1. position, whereby the heat pipe 32 can absorb the heat energy generated by the electronic component A inside the expansion component E1 and conduct it to the position corresponding to the fan 31 for heat dissipation.

Referring to Figures 5 and 6, in some embodiments, the top plate H11 of the expansion component E1 further includes a heat pipe slot H113. The heat pipe slot H113 is recessed from the top plate H11 toward the bottom plate H12. One end of the heat pipe slot H113 is connected to the second heat pipe slot H113. The other end of the opening H1112 extends to the position of the electronic component A of the expansion component E1. Thereby, even if the top plate H11 of the expansion module E1 is equipped with the heat pipe 32, the heat pipe 32 can still maintain its surface smoothness because the heat pipe 32 is accommodated in the heat pipe slot H113, ensuring that the host E2 can be smoothly assembled to the expansion module E1.

Referring to FIG. 4 and FIG. 6 , in some embodiments, the electronic component A of the electronic device assembly further includes a disk array A8. In these embodiments, the disk array A8 is accommodated in the upper compartment S11 of the expansion component E1 and is electrically connected to the first circuit board A1, and the disk array A8 is located between the assembly groove H112 and the third side H15. Here, the heat pipe 32 extends between the assembly groove H112 and the third side H15 to correspond to the position of the disk array A8, so as to fully dissipate heat for the disk array A8.

Referring to FIG. 4 and FIG. 6 , in some embodiments, the number of disk arrays A8 is two. In these embodiments, the number of second openings H1112 on the top plate H11 and the number of first heat dissipation modules 30A are the same as the number of disk arrays A8. In these embodiments, two disk arrays A8 are respectively arranged on both sides of the first circuit board A1 (Figure 4 shows one of the disk arrays A8), and a second opening H1112 is adjacent to the first side H13 and the second side H14, the other second opening H1112 is adjacent to the first side H13 and the fourth side H16, and the heat pipe 32 of each first heat dissipation module 30A extends to the third side H15 and the second side respectively. Between the two openings H1112, the first heat dissipation module 30A is able to dissipate heat from the two disk arrays A8 contained in the upper compartment S11.

Referring to Figures 7 and 8, Figure 7 is a schematic cross-sectional view drawn along line 7-7 in Figure 3; Figure 8 is a partial structural schematic view of one embodiment of the expansion component of this case. FIG. 8 is a schematic diagram of the first housing H1 without the top plate H11 to reveal the internal configuration of the upper compartment S11. In these embodiments, the electronic component A accommodated in the upper compartment S11 of the electronic device assembly and electrically connected to the first circuit board A1 is a bus device A9 (such as a PCI-E card, a PCI-E interface display card, PCI-E interface SSD or other PCI-E interface high-speed signal transmission device). In these embodiments, the first heat dissipation module 30A includes a fan 31 and is accommodated in the upper compartment S11. Here, the fan 31 is electrically connected to the first circuit board A1, and the fan 31 has an air outlet 3112. The air outlet 3112 faces the bus device A9 to dissipate heat from the bus device A9.

Referring to Figures 8 and 9, in some embodiments in which the first heat dissipation module 30A is accommodated in the upper compartment S11 rather than in the second opening H1112, the first housing H1 does not include the assembly slot H112. In these embodiments , the first housing H1 further includes a waterproof cover H17. The shape and size of the waterproof cover H17 correspond to the shape and size of the second opening H1112. The waterproof cover H17 covers the second opening H1112, thereby closing the second opening H1112. , ensuring the waterproofness inside the first housing H1.

Referring to FIGS. 10 to 12 , in some embodiments, the second heat dissipation module 30B is disposed in the lower compartment S12 and can simultaneously dissipate heat for the electronic component A in the upper compartment S11 and the lower compartment S12 . In these embodiments, the electronic component A accommodated in the upper compartment S11 is against the partition 10 .

Referring to FIGS. 10 to 12 , the second heat dissipation module 30B includes a fan 31 and a flow guide housing 33 . The flow guide housing 33 includes a connected input section 331 and an output section 332. The extension direction of the input section 331 and the extension direction of the output section 332 have an included angle. The flow guide housing 33 is accommodated in the lower compartment S12, and the output section 332 It is against the partition 10 and one of the electronic components A located in the lower compartment S12. The fan 31 is disposed at the intersection of the input section 331 and the output section 332 .

Therefore, when the fan 31 of the second heat dissipation module 30B is running, the airflow is introduced from the input section 331 of the air guide housing 33 and then output from the output section 332, and the partition 10 and the lower partition are contacted by the output section 332. The heat generated by the electronic component A on layer S12 can therefore be guided out of the expansion component E1 by the airflow. Through the second heat dissipation module 30B, the electronic component A accommodated in the upper compartment S11 and the lower compartment S12 can be simultaneously Dissipate heat, reduce the space occupied by assembling heat dissipation structures or internal flow guide devices, and improve the utilization of the internal space of electronic device combinations.

Referring to FIG. 10 and in conjunction with FIG. 13 , in some embodiments, the input section 331 and the output section 332 of the flow guide housing 33 are connected in an L shape. That is to say, the included angle between the extending directions of the input section 331 and the output section 332 is 90 degrees. Thereby, the position where the second heat dissipation module 30B introduces the airflow and the position where the airflow is taken out for heat dissipation are not located on the same straight line, thereby meeting the positional configuration requirements of different electronic components A in the lower compartment S12.

Referring to FIG. 10 and FIG. 13 , in some embodiments, the air guide housing 33 includes a connecting section 333 , the connecting section 333 is located between the input section 331 and the output section 332 , and the fan 31 is accommodated in the connecting section 333 . In these embodiments, one end of the input section 331 and the output section 332 away from the connecting section 333 is respectively inclined relative to the connecting section 333 . Thereby, the connecting section 333, the input section 331, and the portion between the output section 332 and the connecting section 333 can be configured with a depth to collect and guide the airflow, while the ends of the input section 331 and the output section 332 away from the connecting section 333 can be close to the guide airflow. The housing 33 is positioned to smoothly guide air flow input and output.

Referring to Figures 10 and 13, in some embodiments, the flow guide housing 33 as a whole includes an edge 334. The edge 334 surrounds an opening 3341, and the input section 331, the output section 332 and the connecting section 333 are located within the range of the opening 3341. In these embodiments, the bottom plate H12 of the first housing H1 of the expansion assembly E1 includes a plurality of through-holes H121 , the air guide housing 33 has an edge 334 against the bottom plate H12 of the first housing H1 , and the opening 3341 covers At Tongkou H121. Thereby, the airflow can be smoothly input into the air guide housing 33 from the bottom plate H12 of the first housing H1 and output from the air guide housing 33 , ensuring the air flow guiding and heat dissipation effects of the air guide housing 33 .

Referring to Figure 7 and Figure 10, in some embodiments, the passage H121 of the bottom plate H12 of the first housing H1 includes a plurality of first passages H1211 and a plurality of second passages H1212, and the position of each first passage H1211 corresponds to the input The position of the section 331 and the position of each second port H1212 correspond to the position of the output section 332, thereby ensuring the smoothness of the airflow in and out of the guide housing 33.

Referring to Figures 12 to 14, in some embodiments, the air guide housing 33 includes an inner surface 335. When the air guide housing 33 is assembled on the bottom plate H12 of the first housing H1, the inner surface 335 faces the bottom plate H12. The inner surface 335 has different The depth is configured to be close to different electronic components A to dissipate heat for multiple electronic components A at the same time. In these embodiments, the output section 332 includes a first heat dissipation section 3321 and a second heat dissipation section 3322. The inner surface 335 has a first height L1 between the first heat dissipation section 3321 and the opening 3341. The inner surface 335 is between the second heat dissipation section 3321 and the second heat dissipation section 3341. There is a second height L2 between 3322 and the opening 3341, and the first height L1 and the second height L2 are different, whereby the air guide housing 33 can contact the lower partition through the first heat dissipation section 3321 and the second heat dissipation section 3322 at the same time. The electronic component A in the layer S12 and the upper interlayer S11 can simultaneously dissipate heat to the electronic component A located in the upper interlayer S11 and the lower interlayer S12.

Referring to FIGS. 12 and 14 , in these embodiments, the first height L1 is smaller than the second height L2 , that is to say, the distance between the inner surface 335 between the first heat dissipation section 3321 and the opening 3341 is smaller than the distance between the inner surface 335 and the first heat dissipation section 3321 and the opening 3341 . The distance between the two heat dissipation sections 3322 and the opening 3341 is that the first heat dissipation section 3321 is closer to the base plate H12 than the second heat dissipation section 3322. Therefore, the first heat dissipation section 3321 of the air guide housing 33 abuts the electronic component A located in the lower compartment S12 , the second heat dissipation section 3322 abuts the partition 10 , and the position of the second heat dissipation section 3322 corresponds to The position of the electronic component A on the upper compartment S11.

Referring to FIG. 12 , in an embodiment in which the electronic component A located in the upper compartment S11 is a bus device A9 , the bus device A9 abuts against the partition 10 , and the second heat dissipation section 3322 of the flow guide housing 33 abuts against The partition 10 is positioned corresponding to the bus device A9 to dissipate heat from the bus device A9. In these embodiments, the electronic component A of the expansion component E1 further includes a third circuit board A10. The third circuit board A10 is disposed in the lower compartment S12 and is spaced parallel to the second circuit board A5. The third circuit board A10 is The second circuit board A5 is close to the base plate H12. Here, the first heat dissipation section 3321 of the air guide housing 33 abuts against the third circuit board A10 to dissipate heat from the third circuit board A10. Thereby, the lower compartment S12 of the expansion component E1 can be configured with a plurality of electronic components A overlappingly, and can still be fully dissipated by the second heat dissipation module 30B, ensuring that each electronic component A can operate smoothly to ensure the expansion of the expansion component E1 Function.

Referring to FIGS. 12 to 14 , in some embodiments, the output section 332 of the air guide housing 33 further includes a third heat dissipation section 3323 , and the first heat dissipation section 3321 , the second heat dissipation section 3322 and the third heat dissipation section 3323 of the output section 332 are connected in sequence, and the output section 332 is connected to the fan 31 with the third heat dissipation section 3323, whereby the gas enters from the input section 331 of the guide housing 33, and then enters the fan 31, and then sequentially passes through the third heat dissipation section 332 of the output section 332. The three heat dissipation sections 3323, the second heat dissipation section 3322 and the first heat dissipation section 3321 are discharged. In this way, the electronic component A which is against the first heat dissipation section 3321, the second heat dissipation section 3322 and the third heat dissipation section 3323 can be guided. The heat dissipation of the flow housing 33.

Referring to FIGS. 12 to 14 , in some embodiments, the inner surface 335 of the flow guide housing 33 has a third height L3 between the third heat dissipation section 3323 and the opening 3341 . The third height L3 is different from the first height L1 and the third height L3 . The second height is L2. Thereby, the electronic components A, which are dissipated by the first heat dissipation section 3321, the second heat dissipation section 3322, and the third heat dissipation section 3323, can be located at different heights, but are still fully dissipated by the air guide housing 33. . In these embodiments, the third heat dissipation section 3323 is against the second circuit board A5, but the present case is not limited to this.

Referring to Figures 12 to 14, in some embodiments, the fan 31 is a centrifugal fan and includes a casing 311. The casing 311 has an air inlet 3111 and an air outlet 3112 that are perpendicular to each other. The third heat dissipation of the output section 332 of the guide housing 33 is The section 3323 is flush with the air outlet 3112 of the fan 31, whereby the air flow output by the air outlet 3112 of the fan 31 can smoothly enter the output section 332 from the third heat dissipation section 3323, thereby improving the smoothness of the air flow.

Referring to FIGS. 12 to 14 , in some embodiments in which the third heat dissipation section 3323 of the air guide housing 33 is flush with the fan 31 , the third height L3 is greater than the first height L1 and less than the second height L2 . Thereby, the gas that enters the output section 332 from the fan 31 passes through the third heat dissipation section 3323 and is collected in a large amount in the second heat dissipation section 3322 to significantly dissipate the heat of the electronic component A at the corresponding position on the partition 10, and then from the closest heat dissipation section 3322. It is discharged from the first heat dissipation section 3321 of the bottom plate H12.

Referring to FIGS. 12 to 14 , in some embodiments, the input section 331 of the guide housing 33 includes an inlet section 3311 and a bus section 3312 connected in sequence. The bus section 3312 is connected between the inlet section 3311 and the connection section 333 and is connected with the connection section 3311 . The connecting section 333 is flush. In these embodiments, the fan 31 is disposed in the connecting section 333 with the air inlet 3111 facing the inner surface 335, and there is a distance between the air inlet 3111 of the fan 31 and the inner surface 335. Thereby, the gas is guided through the input section 331 of the air guide housing 33 and can enter the fan 31 for the fan 31 to generate active airflow.

Referring to FIGS. 12 to 14 , in some embodiments, the inner surface 335 of the flow guide housing 33 also has a second height L2 from the opening 3341 at the confluence section 3312 and the connecting section 333 . Thereby, the converging section 3312 can collect a large amount of gas introduced from the inlet section 3311 and input it into the fan 31 , thereby improving the gas flow rate and heat dissipation efficiency flowing through the guide housing 33 . In addition, since the connecting section 333 also has the second height L2, when the air guide housing 33 is assembled in the lower compartment S12, the connecting section 333 can also abut against the partition 10, increasing the distance between the partition 10 and the guide plate 10. The area of the flow housing 33 can not only improve the supportability of the partition 10 but also improve the heat dissipation efficiency of each electronic component A against the partition 10 .

Referring to FIGS. 12 to 14 , in some embodiments, the second heat dissipation module 30B further includes a plurality of heat dissipation fins 34 , and each heat dissipation fin 34 is disposed in the air guide housing 33 . In these embodiments, a plurality of heat dissipation fins 34 are respectively provided in the first heat dissipation section 3321, the second heat dissipation section 3322 and the inlet section 3311 of the air guide housing 33, and the first heat dissipation section 3321, the second heat dissipation section 3322 and the inlet section The heat dissipation fins 34 in the section 3311 are spaced parallel to each other. This increases the contact area between the gas and the flow guide housing 33 and improves the heat dissipation efficiency.

Referring to FIGS. 12 to 14 , in some embodiments, the inlet section 3311 of the input section 331 of the flow guide housing 33 has a first end 3313 and a second end 3314 , and the second end 3314 is closer to the fan 31 than the first end 3313 . And connected to the fan 31, the height of the inner surface 335 from the second end 3314 to the opening 3341 is greater than the height of the first end 3313 from the opening 3341, and the first end 3313 and the second end 3314 are connected obliquely, whereby The entrance section 3311 is made to be inclined to the bottom plate H12. In this way, the inlet section 3311 extends obliquely to the bottom plate H12, and gas is introduced through the first port H1211 of the bottom plate H12, thereby improving the smoothness of entering the flow guide housing 33.

Referring to Figures 12 to 14, in some embodiments, the output section 332 of the flow guide housing 33 further includes an outlet section 3324. The outlet section 3324 is connected to the first heat dissipation section 3321 and is inclined to the first heat dissipation section 3321, thereby making the outlet The section 3324 extends obliquely to the bottom plate H12. In this way, the outlet section 3324 extends obliquely to the bottom plate H12, and gas is introduced through the second port H1212 of the bottom plate H12, thereby improving the smoothness of the gas output from the flow guide housing 33.

Referring to FIGS. 12 to 14 , in some embodiments, the extension direction of the inner surface 335 of the flow guide housing 33 between the first heat dissipation section 3321 and the second heat dissipation section 3322 is inclined relative to the base plate H12 . This ensures that the gas in the second heat dissipation section 3322 farthest from the opening 3341 can flow smoothly to the first heat dissipation section 3321, ensuring the smoothness of the heat dissipation air flow.

Although the present disclosure has been disclosed in some embodiments, this is not intended to limit the present disclosure. Anyone with ordinary knowledge in the art may make slight changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the scope of patent protection in this case must be determined by the scope of the patent application attached to this specification.

E: Electronic device E1: expansion component E2: Host H: Shell H1: first shell H11: Top plate H111:Open your mouth H1111: First opening H1112: Second opening H112: Assembly slot H113: Heat pipe slot H12: Base plate H121: Passage H1211: First port H1212: Second port H13: first side H14: Second side H15:Third side H16: The fourth side H17: Waterproof cover H2: Second shell H21: First surface H22: Second surface A: Electronic components A1: First circuit board A2: First connector A3: Main circuit board A4: Main connector A5: Second circuit board A6:Battery A7: Second connector A8: Disk array A9: Bus device A10: Third circuit board S: Accommodation space S1: the first accommodation space S11: Upper compartment S12: Lower compartment S2: Second accommodation space 10:Partition 20: Waterproof parts 30: Cooling module 30A: The first cooling module 30B: Second cooling module 31:Fan 311: Shell 3111:Air inlet 3112:Air outlet 32:Heat pipe 33: guide housing 331:Input section 3311: Entrance section 3312:Convergence section 3313:First end 3314:Second end 332:Output section 3321: First heat dissipation section 3322: Second heat dissipation section 3323: The third heat dissipation section 3324: Exit section 333: Connecting section 334: Edge 3341:Open port 335:Inside 34: Cooling fins L1: first height L2: second height L3: The third height

Figure 1 is a schematic three-dimensional appearance diagram of one embodiment of the electronic device combination of the present invention. FIG. 2 is a three-dimensional exploded schematic diagram of an embodiment of the electronic device combination of the present invention. Figure 3 is a second three-dimensional exploded schematic view of one embodiment of the electronic device combination of the present invention. Figure 4 is a schematic cross-sectional view drawn along the 4-4 section line in Figure 1. FIG. 5 is a schematic three-dimensional view of an embodiment of the expansion component in the electronic device combination of the present invention. Figure 6 is a schematic cross-sectional view drawn along the 6-6 cut plane line in Figure 2. Figure 7 is a schematic cross-sectional view drawn along the 7-7 section line in Figure 3. Figure 8 is a partial structural diagram of an embodiment of the expansion component of this case. Figure 9 is an exploded schematic diagram of a partial structure of another embodiment of the expansion component of this case. Figure 10 is an exploded schematic diagram of the partial structure of another embodiment of the expansion component of the present invention. Figure 11 is a schematic cross-sectional view drawn along the 11-11 section line in Figure 2. FIG. 12 is a partially enlarged schematic diagram of the circled area 12 in FIG. 11 . Figure 13 is a schematic three-dimensional appearance diagram of one embodiment of the heat dissipation module in the expansion assembly of this case. Figure 14 is a schematic cross-sectional view drawn along the 14-14 section line in Figure 13.

E: Electronic device

E1: expansion component

H11: Top plate

H12: Base plate

H121: Passage

H1211: First port

H1212: Second port

H13: first side

H14: Second side

H15:Third side

H16: The fourth side

A: Electronic components

A5: Second circuit board

A6:Battery

A10: Third circuit board

S12: Lower compartment

10:Partition

30: Cooling module

30B: Second cooling module

31:Fan

33: guide housing

331:Input section

332:Output section

333: Connecting section

Claims (20)

An extension component that includes: A housing including a bottom plate, a top plate, and an accommodation space between the bottom plate and the top plate; A partition is provided in the accommodation space and parallel to the bottom plate, dividing the accommodation space into an upper compartment and a lower compartment; A plurality of electronic components are dispersed in the upper compartment and the lower compartment, and one of the electronic components located in the upper compartment is against the partition; and A heat dissipation module is installed in the housing and includes: A flow guide housing includes an input section and an output section that are connected. The extension direction of the input section and the extension direction of the output section have an included angle. The flow guide housing is accommodated in the lower compartment, and The output section is against the partition and one of the electronic components located in the lower compartment; and A fan is provided at the intersection of the input section and the output section. The expansion assembly as claimed in claim 1, wherein the bottom plate includes a plurality of through-holes, the air guide housing includes an edge surrounding the edge to form an opening, the edge is against the bottom plate, and the open cover covers the Some passages. The expansion component as described in claim 2, wherein the ports include a plurality of first ports and a plurality of second ports, the first ports correspond to the position of the input section, and the second ports correspond to the output segment location. The expansion component of claim 2, wherein the air guide housing includes an inner surface facing the bottom plate, the output section includes a first heat dissipation section and a second heat dissipation section, and the inner surface is located on the third heat dissipation section. There is a first height between a heat dissipation section and the opening. The inner surface has a second height between the second heat dissipation section and the opening. The first height is different from the second height. The expansion component of claim 4 further includes a plurality of heat dissipation fins disposed on the first heat dissipation section and the second heat dissipation section. The expansion component of claim 4, wherein the first heat dissipation section is against the electronic component located on the lower compartment, and the second heat dissipation section is against the partition corresponding to the electronic component located on the upper compartment. s position. The expansion component of claim 4, wherein the first heat dissipation section is further away from the fan than the second heat dissipation section, and the first height is smaller than the second height. The expansion assembly as claimed in claim 7, wherein the extension direction of the inner surface between the first heat dissipation section and the second heat dissipation section is inclined to the bottom plate. The expansion component of claim 4, wherein the output section further includes a third heat dissipation section, the inner surface has a third height between the third heat dissipation section and the opening, and the third height is different from the third heat dissipation section. one height and the second height. The expansion component of claim 9, wherein the third heat dissipation section is closer to the fan than the first heat dissipation section and the second heat dissipation section, and the third heat dissipation section is against another heat dissipation section located on the lower compartment. - the electronic component. The expansion assembly of claim 9, wherein the third heat dissipation section is flush with the fan, and the third height is greater than the first height and less than the second height. The expansion assembly according to claim 4, wherein the input section of the air guide housing includes an inlet section, the inlet section has a first end and a second end, and the inner surface of the inlet section is inclined to the The second end of the bottom plate is closer to the fan than the first end, and the height of the inner surface from the second end to the opening is greater than the height of the first end from the opening. The expansion component of claim 12 further includes a plurality of heat dissipation fins disposed in the entrance section. The expansion assembly as claimed in claim 13, wherein the input section of the air guide housing further includes a bus section, the bus section is located between the inlet section and the fan, and the inner surface is at a distance from the bus section to the opening. With the second height, the bus section abuts the partition. The expansion assembly as claimed in claim 4, wherein the fan includes a casing, the casing has an air inlet and an air outlet perpendicular to each other, the air inlet faces the inner surface and has a distance from the inner surface, and the air outlet The air outlet faces the output section. The expansion assembly as claimed in claim 15, wherein the inner surface corresponding to the fan has the second height from the opening. The expansion component as described in claim 1, wherein the included angle is 90 degrees. An extension component that contains: A housing including a bottom plate, a top plate, and an accommodation space between the bottom plate and the top plate; A partition is provided in the accommodation space and parallel to the bottom plate, dividing the accommodation space into an upper compartment and a lower compartment; A plurality of electronic components are dispersed in the upper compartment and the lower compartment, and one of the electronic components located in the upper compartment is against the partition; and A heat dissipation module is installed in the housing and includes: A flow guide housing includes an input section and an output section connected to form an L shape. The flow guide housing is accommodated in the lower partition and fixed to the bottom plate, and the output section is against the partition plate and One of the electronic components located in the lower compartment; and A fan is provided at the intersection of the input section and the output section. An electronic device combination including: An expansion component, including: A first housing having a bottom plate, a top plate and a first accommodation space between the bottom plate and the top plate, the top plate having an opening; A partition is provided in the first accommodation space and parallel to the bottom plate, dividing the first accommodation space into an upper compartment and a lower compartment; A plurality of electronic components are dispersed in the upper compartment and the lower compartment, and one of the electronic components located in the upper compartment is against the partition; A heat dissipation module is installed in the housing and includes: A flow guide housing includes an input section and an output section connected to form an L shape. The flow guide housing is accommodated in the lower partition and fixed to the bottom plate, and the output section is against the partition plate and One of the electronic components located in the lower compartment; and A fan located at the intersection of the input section and the output section; and a first connector electrically connected to the first circuit board and exposed from the opening to the top panel; and A host, including: a second housing with a second accommodation space; A main circuit board is accommodated in the second accommodation space; and A main connector is electrically connected to the main circuit board, and the main connector is provided on the surface of the second housing. When the host is assembled to the expansion component, the second housing covers the first housing. The top plate covers the opening, and the first connector is electrically connected to the main connector. A cooling module including: A flow guide housing includes an input section, an output section and a connecting section connected between the input section and the output section. There is an included angle between the extension direction of the input section and the extension direction of the output section, and One end of the input section and the output section away from the connecting section is respectively inclined relative to the connecting section; and A fan is accommodated in the connection section.

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