CN216942960U

CN216942960U - Domain controller host heat abstractor and be used for domain controller host computer of intelligent passenger cabin

Info

Publication number: CN216942960U
Application number: CN202123442459.1U
Authority: CN
Inventors: 刘成武; 陈黎
Original assignee: Yuanfeng Technology Co Ltd
Current assignee: Yuanfeng Technology Co Ltd
Priority date: 2021-12-30
Filing date: 2021-12-30
Publication date: 2022-07-12
Anticipated expiration: 2031-12-30

Abstract

The utility model discloses a domain controller host heat dissipation device and a domain controller host used for an intelligent cabin, wherein the heat dissipation device comprises a host shell and a fan assembly, a mounting area is formed on the main shell surface of the host shell, a plurality of heat dissipation fins extending towards the mounting area are convexly arranged on the periphery of the mounting area of the main shell surface at certain intervals, heat dissipation gaps communicated with the mounting area are formed between the adjacent heat dissipation fins, and the mounting area is concavely arranged between the peripheral heat dissipation fins; the fan assembly comprises a heat dissipation fan arranged in the mounting area and a fan cover arranged above the heat dissipation fan, and heat dissipation flow channels of the heat dissipation fan are respectively communicated with heat dissipation gaps on the periphery of the mounting area. Compared with the prior art, the utility model has the advantages of large heat dissipation area, good heat dissipation effect and small volume.

Description

Domain controller host heat abstractor and be used for domain controller host computer of intelligent passenger cabin

Technical Field

The utility model relates to an intelligent cabin, in particular to a domain controller host in the intelligent cabin.

Background

Due to the fact that electronic and electric appliances of the whole vehicle are increasingly complex, dozens or even hundreds of ECUs are needed to control the whole vehicle, and the ECUs are staggered in an intricate mode, so that not only is the wiring harness design very complex, but also logic control is very mixed, and the traditional distributed architecture cannot meet the increasing computing requirements.

With the development of vehicle-mounted electronics in these years, high-performance MCUs are used in particular. The vehicle-mounted electronic appliances mainly form the architecture of a functional "Domain", i.e. the architecture of Domain. The typical electronic and electric architecture of the whole vehicle is divided into 5 main domains of a power assembly, chassis control, vehicle body control, ADAS and entertainment system. Each Domain has a main high-performance ECU (that is, Domain Controller) responsible for handling intra-Domain functional processing and forwarding. The interior of the domain generally uses a low-speed bus, and the domains are interconnected by using a high-speed bus or a relatively large number of vehicle-mounted Ethernet networks.

Compared with the traditional controller, the domain controller needs more high-power ICs and interfaces, and along with the rapid development of the intelligent cabin in the forward direction of multi-functionalization of the car machine industry, the mainstream platform is a high-power consumption platform, the requirement on heat dissipation performance of a host machine is higher, the compatibility is better, and the requirement on volume and weight is lower Stability, low yield, high after-sale maintenance cost and the like.

Referring to chinese patent CN202023139313, a heat dissipation structure and a host of a vehicle-mounted information entertainment system are disclosed, in order to increase heat dissipation, a heat dissipation fan is added in the host housing, however, because the heat dissipation fan is installed in the host housing, the heat dissipation fan inevitably occupies the original space in the host housing, and the seal of the heat dissipation air channel can only be arranged at a part of the position of the host housing, the heat dissipation effect is poor, the size is large, and when devices inside the host such as a PCB are assembled, a fan assembly must be assembled at the same time, and the assembly process is complex.

Therefore, a domain controller host heat dissipation structure with small volume, good heat dissipation effect and convenient assembly is urgently needed.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a domain controller host heat dissipation device and a domain controller host used for an intelligent cabin.

In order to achieve the purpose, the utility model discloses a host heat dissipation device of a domain controller, which comprises a host shell and a fan assembly, wherein a mounting area is formed on the main shell surface of the host shell, a plurality of heat dissipation fins extending towards the mounting area are convexly arranged on the periphery of the mounting area of the main shell surface at certain intervals respectively, heat dissipation gaps communicated with the mounting area are formed between the adjacent heat dissipation fins, and the mounting area is concavely arranged between the peripheral heat dissipation fins; the fan assembly comprises a heat dissipation fan arranged in the mounting area and a fan cover arranged above the heat dissipation fan, and heat dissipation flow channels of the heat dissipation fan are respectively communicated with heat dissipation gaps on the periphery of the mounting area.

Compared with the prior art, the fan is arranged on the outer surface of the main machine shell, and the fan is convenient to assemble. Furthermore, the utility model arranges a plurality of heat dissipation areas around the fan, each heat dissipation area is provided with a heat dissipation gap and a heat dissipation fin which extend towards the direction of the fan, so that air fluid can flow to the installation area from the host shell around the fan when the fan sucks air, the heat dissipation area is large, the heat dissipation effect is good, and enough fluid channels and heat dissipation holes do not need to be reserved in the host shell. Moreover, the mounting area for mounting the fan assembly is concave to the radiating fins, so that the size of the host shell is small, the radiating gap is further communicated with the mounting area, and the radiating efficiency is improved.

Preferably, the main shell surface is provided with a plurality of heat dissipation areas around the mounting area, each heat dissipation area is provided with a plurality of heat dissipation fins in a protruding manner side by side along a direction towards the mounting area, and a heat dissipation gap communicated with the mounting area is formed between every two adjacent heat dissipation fins.

Specifically, the bottom surfaces of at least three continuous heat dissipation areas around the installation area are higher than the bottom surface of the installation area, so that the installation area forms a sunken air suction channel, the heat dissipation fan is a centrifugal fan, the heat dissipation efficiency is improved, the fan assembly is arranged on the main shell surface in a concave mode, and the size of the host of the domain controller is small.

More specifically, the fan cover is mounted in the mounting area in a suspended manner, and a certain distance is reserved between the fan cover and the heat dissipation area which is higher than the bottom surface of the mounting area, so that not only is the inlet of the fan assembly communicated with the heat dissipation area, but also a buffer space is reserved between the heat dissipation area and the air inlet of the fan assembly, and the phenomenon that the fluid speed is blocked due to the size of the inlet of the fan assembly is avoided.

Specifically, the bottom surface of at least one heat dissipation area around the mounting area is lower than the height of the fan cover and higher than or equal to the bottom surface of the mounting area.

Preferably, a first heat dissipation area and a second heat dissipation area are respectively formed on two opposite sides of the main shell surface along a first direction in the mounting area, a third heat dissipation area and a fourth heat dissipation area are respectively formed on two opposite sides along a second direction, the first direction and the second direction are two directions perpendicular to each other on the main shell surface, the heat dissipation fins include a plurality of first heat dissipation fins which are convexly arranged on the first heat dissipation area and the second heat dissipation area at a certain interval and extend along the first direction, a plurality of second heat dissipation fins which are convexly arranged on the third heat dissipation area and the fourth heat dissipation area at a certain interval and extend along the second direction, a first heat dissipation gap extending along the first direction is formed between adjacent first heat dissipation fins, and a second heat dissipation gap extending along the second direction is formed between adjacent second heat dissipation fins.

Preferably, the heat dissipation fan is a centrifugal fan, and the bottom surface of the mounting area is lower than the bottom surfaces of the second heat dissipation area, the third heat dissipation area and the fourth heat dissipation area, so that a concave air suction channel is formed in the mounting area, and the heat dissipation effect is good.

Specifically, the fan cover is mounted in the mounting area in a suspended manner, a certain distance is reserved between the fan cover and the second heat dissipation area, the third heat dissipation area and the fourth heat dissipation area, so that the heat dissipation flow channel is communicated with the second heat dissipation area, the third heat dissipation area and the fourth heat dissipation area, and a buffer space is reserved between the second heat dissipation area, the third heat dissipation area, the fourth heat dissipation area and an air inlet of the fan assembly, so that the fluid speed is prevented from being blocked due to the size of an inlet of the fan assembly.

More specifically, the installation height of the fan cover is equal to or lower than the bottom surfaces of the second heat dissipation area, the third heat dissipation area and the fourth heat dissipation area, the bottom surface of the first heat dissipation area is lower than the bottom surface of the second heat dissipation area, and the installation height of the fan cover is higher than the bottom surface of the first heat dissipation area.

More specifically, the bottom surface of the first heat dissipation area is as high as the bottom surface of the installation area, so that the wind in the first heat dissipation area can flow into the installation area conveniently.

Preferably, four first mounting columns are respectively convexly arranged at positions of the mounting area corresponding to the four corners of the fan cover, and the four corners of the fan cover are fixedly mounted on the four first mounting columns through screws; four second mounting columns are convexly arranged at positions of the mounting area corresponding to four corners of the fan cover respectively, the four corners of the cooling fan are fixedly mounted on the four second mounting columns through screws, and the heights of the second mounting columns are lower than those of the first mounting columns.

Preferably, a heat dissipation protrusion corresponding to the heat dissipation channel is convexly disposed on the bottom surface of the mounting region, and the heat dissipation fan is mounted on the heat dissipation protrusion, so that a fluid channel corresponding to the heat dissipation channel in shape is formed between the heat dissipation fan and the bottom surface of the mounting region.

Preferably, the host casing is an aluminum alloy casing, and has light weight, low cost and good heat dissipation effect.

The utility model also discloses a domain controller host for the intelligent cabin, which comprises a host shell, a PCB and an antenna cover arranged on the host shell, wherein the PCB comprises a main circuit board part and an antenna part, the main circuit part is arranged in the host shell, the antenna part is arranged in the antenna cover, and the host shell is provided with the domain controller host heat radiating device.

Preferably, the main housing includes a top cover, a bottom cover and a middle case, the two PCBs are a first PCB and a second PCB, respectively, the top cover is fixed to the upper side of the middle case in a matching manner to form a first mounting cavity for mounting the main circuit portion of the first PCB, and the bottom cover is fixed to the lower side of the middle case in a matching manner to form a second mounting cavity for mounting the main circuit portion of the second PCB.

Specifically, the antenna lid has the chamber that holds antenna part, the upside of antenna lid face the border of nearly entry upwards bending type form can with the first block limit of top cap block, the downside of antenna lid close on the border of entry downwards bending type form can with the second block limit of bottom block, antenna lid in the antenna part and through first block limit and second block limit block in between top cap and the bottom, the equipment of the antenna lid of being convenient for need not the fix with screw, and fixed effectual, the antenna lid is difficult for relaxing.

Preferably, the first clamping edge or the second clamping edge is provided with a plurality of slots extending to the corresponding upper side surface or the lower side surface to form a plurality of elastic arms, so that the mounting stability of the antenna cover is further improved, and the fault-tolerant rate is high during assembly.

Drawings

Fig. 1 is a perspective view of a domain controller host according to the present invention from one angle.

Fig. 2 is a perspective view of another angle of the domain controller host according to the present invention.

FIG. 3 is an exploded view of the domain controller host of the present invention.

FIG. 4 is a top view of the domain controller host of the present invention.

Fig. 5 is a sectional view taken along line a-a of fig. 4.

Fig. 6 is a sectional view taken along line B-B of fig. 4.

Fig. 7 is a structural view of the domain controller host heat sink of the present invention.

Fig. 8 is a structural view of an angle of the antenna cover of the present invention.

Figure 9 is a block diagram of another angle of the antenna cover of the present invention.

Detailed Description

In order to explain technical contents, structural features, and objects and effects of the present invention in detail, the following detailed description is given with reference to the accompanying drawings in conjunction with the embodiments.

Referring to fig. 1 to 6, the present invention discloses a domain controller host 100 for an intelligent cockpit, including a host housing 10, PCBs (21, 22), and an antenna cover 30 installed on the host housing 10, where the PCBs (21, 22) include a main circuit board portion and an antenna portion, the main circuit portion is installed in the host housing 10, the antenna portion is installed in the antenna cover 30, and a domain controller host heat sink is disposed on the host housing 10.

Referring to fig. 1 to 6, the main chassis 10 includes a top cover 11, a bottom cover 13 and a middle case 12, the PCBs are two and include a first PCB21 and a second PCB22, the top cover 11 is fittingly fixed to an upper side of the middle case 12 and forms a first mounting cavity for mounting a main circuit portion of the first PCB21, and the bottom cover 13 is fittingly fixed to a lower side of the middle case 12 and forms a second mounting cavity for mounting a main circuit portion of the second PCB 22. The main machine shell 10 is an aluminum alloy shell, and is light in weight, low in cost and good in heat dissipation effect. The utility model adopts a double-PCB structure, and the connectors are arranged on the first PCB21 and the second PCB22, so that more connectors can be arranged at the same time, and more functions are met.

The positions of the top cover 11, the bottom cover 13 and the middle shell 12 corresponding to the main circuit part are respectively provided with a shielding convex rib for shielding the main circuit part in a protruding mode, and when the top cover 11, the bottom cover 13 and the middle shell 12 are installed in a matched mode, the shielding convex ribs can surround the main circuit part for shielding.

The domain controller host heat sink includes a heat dissipation structure formed on the top cover 11 and a fan assembly 40.

Referring to fig. 1 and 7, the heat dissipation structure specifically includes a mounting region 110 formed on an outer surface of the top cover 11, and first to fourth heat dissipation regions 111 to 114 formed around the mounting region 110. Specifically, a first heat dissipation area 111 and a second heat dissipation area 112 are respectively formed on two opposite sides of the mounting area 110 along a first direction, and a third heat dissipation area 113 and a fourth heat dissipation area 114 are respectively formed on two opposite sides of the mounting area along a second direction, where the first direction and the second direction are two directions perpendicular to each other on the main housing surface. The first heat dissipation area 111 and the second heat dissipation area 112 are convexly provided with a plurality of first heat dissipation fins 141 extending along the first direction, and the plurality of first heat dissipation fins 141 are oppositely arranged at a certain interval to form first heat dissipation gaps 1411 extending along the first direction between adjacent first heat dissipation fins 141. The third heat dissipation area 113 and the fourth heat dissipation area 114 are convexly provided with a plurality of second heat dissipation fins 142 extending along the second direction, the plurality of second heat dissipation fins 142 are oppositely arranged at a certain interval to form a second heat dissipation gap 1421 extending along the second direction between the adjacent second heat dissipation fins 142, and the mounting area 110 is concavely provided with the heat dissipation fins 141, 142 of the four

heat dissipation areas

111 and 114. In this embodiment, the heat dissipation structure is formed on the outer surface of the top cover 11, but the heat dissipation structure may also be formed on the outer surface of the bottom cover.

The arrangement of the heat dissipation areas around the mounting area 110 is not limited to four, the extension risk of the heat dissipation gaps on the heat dissipation areas is not limited to the first direction and the second direction which are perpendicular to each other, six or eight heat dissipation areas can be arranged, and the extension direction of the heat dissipation gaps can be towards the direction of the mounting area 110.

Wherein, the radiating fins between adjacent radiating areas have a certain distance.

Referring to fig. 1 and 7, the fan assembly 40 includes a heat dissipation fan 41 mounted to the mounting region 110 and a fan cover 42 mounted above the heat dissipation fan 41. Referring to fig. 5 and 6, the heat dissipation flow channels of the heat dissipation fan 41 are respectively communicated with the first heat dissipation gap 1411 and the second heat dissipation gap 1421.

The heat dissipation fan 41 is a centrifugal fan. Referring to fig. 5 and 6, the bottom surface of the mounting region 110 is lower than the bottom surfaces of the second heat dissipation region 112, the third heat dissipation region 113 and the fourth heat dissipation region 114, so that a concave air suction channel is formed in the mounting region 110, and the heat dissipation effect is good. The second heat dissipation area 112, the third heat dissipation area 113 and the fourth heat dissipation area 114 form a set of blocking walls on a side adjacent to the mounting area 110 for confining the fluid in the mounting area to form a vortex. The depth of the inner surface of the top cover 11 corresponding to the second heat dissipation area 112, the third heat dissipation area 113 and the fourth heat dissipation area 114 is higher than the corresponding position of the installation area 110, so that the installation area in the host casing 10 is effectively enlarged, and the volume of the host casing 10 is not increased.

In order to increase the heat dissipation area, a distance is provided between the ends of the second heat dissipation fins 142 on the fourth heat dissipation region 114 and the third heat dissipation region 113 and the side of the first heat dissipation fins 141 on the first heat dissipation region 111, respectively, and a distance is provided between the ends of the second heat dissipation fins 142 on the third heat dissipation region 113 and the side of the first heat dissipation fins 141 on the first heat dissipation region 111, respectively.

The fan cover 42 is provided with an air outlet corresponding to the direction of the fluid generated by the heat dissipation fan 41, so that the air supply capacity of the heat dissipation fan 41 is improved to the maximum extent.

Referring to fig. 7, four first mounting posts 1101 are respectively protruded from positions of the mounting region 110 corresponding to four corners of the fan housing 42, and the four corners of the fan housing 42 are fixedly mounted on the four first mounting posts 1101 by screws so as to be suspended in the mounting region 110.

Referring to fig. 5 and 6, the fan cover 42 is installed at a height equal to or lower than the bottom surfaces of the second, third, and fourth

heat dissipation areas

112, 113, and 114, the bottom surface of the first heat dissipation area 111 is lower than the bottom surface of the second heat dissipation area 112, and the fan cover 42 is installed at a height higher than the bottom surface of the first heat dissipation area 111. The bottom surface of the first heat dissipation area 111 is equal to the bottom surface of the mounting area 110 in height, so that the wind of the first heat dissipation area 111 flows into the mounting area 110. The top surface of the fan housing 42 is as high as the top heights of the heat dissipation fins from the second heat dissipation area 112 to the fourth heat dissipation area 114. The first heat dissipation fins 141 of the first heat dissipation region 111 have a height higher than that of the heat dissipation fins at the second, third and fourth

heat dissipation regions

112, 113 and 114.

Referring to fig. 5 and 6, the second heat dissipation area 112, the third heat dissipation area 113, and the fourth heat dissipation area 114 are spaced from the fan assembly 40, so that a buffer space is formed between the second heat dissipation area 112, the third heat dissipation area 113, the fourth heat dissipation area 114, and the air inlet of the fan assembly 40, and the heat dissipation flow channel of the heat dissipation fan 41 is communicated with the second heat dissipation area 112, the third heat dissipation area 113, and the fourth heat dissipation area 114.

Four second mounting columns 1102 are respectively and convexly arranged at positions corresponding to four corners of the mounting area 110 and four corners of the fan housing 42, the four corners of the heat dissipation fan 41 are fixedly mounted on the four second mounting columns 1102 through screws, and the height of each second mounting column 1102 is lower than that of the corresponding first mounting column 1101. The heat dissipation fan 41 passes through the second mounting post 1102 in the mounting region 110 with a certain distance from the bottom surface of the mounting region 110.

The heat radiation fan 41 and the fan cover 42 are fixed on the mounting columns of the top cover 11 from four corners through four screws, so that abnormal sound of the heat radiation fan 41 and the fan cover when the heat radiation fan rotates at high speed is avoided, and the noise of the fan assembly 40 is effectively reduced.

Referring to fig. 7, a heat dissipating protrusion 1103 corresponding to the heat dissipating flow channel of the heat dissipating fan 41 is convexly disposed on the bottom surface of the mounting region 110, and the heat dissipating fan 41 is mounted on the heat dissipating protrusion 1103, such that a fluid channel corresponding to the heat dissipating flow channel of the heat dissipating fan 41 is formed between the heat dissipating fan 41 and the bottom surface of the mounting region 110. Wherein, the heat dissipating protrusion 1103 is in a spiral vortex shape.

Among the electronic devices on the PCB, the high power consumption IC is not located at the corresponding position of the mounting area, and the low power consumption device is located at a position away from the mounting area, so that the whole host casing 10 can dissipate heat uniformly, and the heat can be conducted out at the highest speed, thereby preventing the heat transfer between the ICs from affecting the performance.

The main housing 10 has a wire passing hole for passing a fan power line of the heat dissipation fan 41, and the wire passing hole is assembled and fixed by a rubber plug to prevent the fan power line from being scratched by the burr of the top cover 11.

Referring to fig. 8 and 9, the antenna cover 30 has a cavity for accommodating antenna part, the edge of the upper side of the antenna cover 30 facing the inlet is bent upward to form a first engaging edge 31 capable of engaging with the top cover 11, the edge of the lower side of the antenna cover 30 facing the inlet is bent downward to form a second engaging edge 32 capable of engaging with the bottom cover 13, the antenna cover 30 covers the antenna part and is engaged between the top cover 11 and the bottom cover 13 through the first engaging edge 31 and the second engaging edge 32, so as to facilitate the assembly of the antenna cover 30, without screw fixation, and the fixing effect is good, and the antenna cover 30 is not easy to loosen.

With reference to fig. 8 and fig. 9, the first engaging edge 31 is provided with a plurality of slots 311 extending to the corresponding upper side surface to form a plurality of elastic arms 312, so as to further improve the stability of the antenna cover 30 during installation and reduce the precision requirement of the antenna cover 30 during manufacturing. Of course, the elastic arm may be formed on the second engaging edge 32 and the lower side surface of the antenna cover 30.

Wherein, the inner surface of the top cover 11 is convexly provided with a heat dissipation boss which can remove the high-power IC at the position corresponding to the high-power IC.

When the domain controller host 100 of the present invention is assembled, the heat dissipating fan 41 is first installed on the top cover 11, the fan cover 42 is installed on the top cover 11 and covers the heat dissipating fan 41, the first PCB21 is installed in the top cover 11, the middle case 12 is locked and attached to the top cover, the first PCB21 is installed between the top cover 11 and the middle case 12, the second PCB22 is locked and attached to the middle case, the antenna cover 30 is installed in the antenna portion and clamped with the top cover 11, the bottom cover 13 is locked and attached to the lower side of the middle case 12, the second PCB22 is installed between the middle case 12 and the bottom cover 13, and the antenna cover 30 is clamped and attached between the top cover 11 and the bottom cover 13.

The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the present invention, therefore, the present invention is not limited by the appended claims.

Claims

1. A domain controller host computer heat abstractor which characterized in that: the method comprises the following steps:

the main shell surface of the main shell is convexly provided with a plurality of radiating fins extending towards the mounting area at certain intervals, a radiating gap communicated with the mounting area is formed between every two adjacent radiating fins, and the mounting area is concavely arranged among the peripheral radiating fins;

the fan assembly comprises a heat dissipation fan arranged in the mounting area and a fan cover arranged above the heat dissipation fan, and heat dissipation flow channels of the heat dissipation fan are respectively communicated with heat dissipation gaps on the periphery of the mounting area.

2. The domain controller host heat sink of claim 1, wherein: the main shell surface is provided with a plurality of radiating areas around the mounting area, each radiating area is provided with a plurality of radiating fins in a protruding mode side by side along a direction towards the mounting area, and adjacent radiating fins form radiating gaps communicated with the mounting area.

3. The domain controller host heat sink of claim 2, wherein: the bottom surfaces of at least three continuous heat dissipation areas around the installation area are higher than the bottom surface of the installation area, so that the installation area forms a sunken air suction channel, and the heat dissipation fan is a centrifugal fan.

4. The domain controller host heat sink of claim 3, wherein: the fan cover is mounted in the mounting area in a suspended mode, and a certain distance is reserved between the fan cover and the heat dissipation area which is higher than the bottom surface of the mounting area.

5. The domain controller host heat sink of claim 3, wherein: the bottom surface of at least one heat dissipation area around the installation area is lower than the height of the fan cover and is higher than or equal to the bottom surface of the installation area.

6. The domain controller host heat sink of claim 2, wherein: the main shell surface is respectively provided with a first heat dissipation area and a second heat dissipation area on two opposite sides of the mounting area along a first direction, a third heat dissipation area and a fourth heat dissipation area on two opposite sides of the mounting area along a second direction, the first direction and the second direction are two directions perpendicular to each other on the main shell surface, the heat dissipation fins comprise a plurality of first heat dissipation fins which are convexly arranged on the first heat dissipation areas and the second heat dissipation areas at a certain interval and extend along the first direction, a plurality of second heat dissipation fins which are convexly arranged on the third heat dissipation areas and the fourth heat dissipation areas at a certain interval and extend along the second direction, first heat dissipation gaps extending along the first direction are formed between adjacent first heat dissipation fins, and second heat dissipation gaps extending along the second direction are formed between adjacent second heat dissipation fins; the heat dissipation fan is a centrifugal fan, the bottom surface of the mounting area is lower than the bottom surfaces of the second heat dissipation area, the third heat dissipation area and the fourth heat dissipation area, and the fan cover is mounted in the mounting area in a hanging manner and is spaced from the second heat dissipation area, the third heat dissipation area and the fourth heat dissipation area to enable the heat dissipation flow channel to be communicated with the second heat dissipation area, the third heat dissipation area and the fourth heat dissipation area; the installation height of the fan cover is equal to or lower than the bottom surfaces of the second heat dissipation area, the third heat dissipation area and the fourth heat dissipation area; the bottom surface of the first heat dissipation area is equal to the bottom surface of the mounting area in height.

7. The domain controller host heat sink of claim 1, wherein: four first mounting columns are convexly arranged at the positions of the mounting area corresponding to the four corners of the fan cover respectively, and the four corners of the fan cover are fixedly mounted on the four first mounting columns through screws; four second mounting columns are convexly arranged at positions of the mounting area corresponding to four corners of the fan cover respectively, the four corners of the cooling fan are fixedly mounted on the four second mounting columns through screws, and the heights of the second mounting columns are lower than those of the first mounting columns; the bottom surface of the mounting area is convexly provided with a heat dissipation bulge corresponding to the heat dissipation flow channel, and the heat dissipation fan is mounted on the heat dissipation bulge, so that a fluid channel corresponding to the heat dissipation flow channel in shape is formed between the heat dissipation fan and the bottom surface of the mounting area.

8. A domain controller host for an intelligent cockpit, comprising: the domain controller host heat dissipation device comprises a host shell, a PCB and an antenna cover arranged on the host shell, wherein the PCB comprises a main circuit board part and an antenna part, the main circuit part is arranged in the host shell, the antenna part is arranged in the antenna cover, and the domain controller host heat dissipation device as claimed in any one of claims 1 to 7 is arranged on the host shell.

9. The domain controller host of claim 8, wherein: the host shell comprises a top cover, a bottom cover and a middle shell, the PCBs are a first PCB and a second PCB respectively, the top cover can be matched and fixed with the upper side of the middle shell to form a first installation cavity for installing a main circuit part of the first PCB, and the bottom cover can be matched and fixed with the lower side of the middle shell to form a second installation cavity for installing a main circuit part of the second PCB.

10. The domain controller host of claim 9, wherein: the antenna cover is provided with an accommodating cavity for accommodating an antenna part, the edge of the upper side of the antenna cover, which faces to the inlet, is bent upwards to form a first clamping edge which can be clamped with the top cover, the edge of the lower side of the antenna cover, which is close to the inlet, is bent downwards to form a second clamping edge which can be clamped with the bottom cover, and the antenna cover is covered on the antenna part and is clamped between the top cover and the bottom cover through the first clamping edge and the second clamping edge; the first clamping edge or the second clamping edge is provided with a plurality of notches extending to the corresponding upper side surface or the lower side surface to form a plurality of elastic arms.