TW202332996A - Positioning device, lithography device, and article production method - Google Patents

Abstract

To provide a positioning device includes: a substrate supporting portion that supports a substrate in a non-contact state by jetting gas against a lower surface of the substrate to levitate the substrate; a plurality of suction-holding portions for sucking the lower surface of the substrate supported in a non-contact state by the substrate supporting portion to restrict displacement of the substrate in a direction parallel to the substrate surface; a support member for supporting the plurality of suction-holding portions; and a rotating mechanism for rotating the substrate via the plurality of suction-holding portions by rotating the support member about an axis intersecting with the substrate surface.

Description

Positioning device, photolithography device and article manufacturing method

The present invention relates to a positioning device, a photolithography device and an article manufacturing method.

In photolithography apparatuses such as exposure apparatuses, it is required to control the position of the substrate with high precision and at high speed. As substrates have become larger and thinner in recent years, deformation of the substrate has become something that cannot be ignored more than ever. The deformation of the substrate occurs when the substrate is transported, and may remain after the substrate is placed on the substrate placement portion, or after the substrate is adsorbed after being placed. If the substrate is exposed while the substrate is deformed, the exposure result will also be deformed, and the overlay accuracy may be reduced. In addition, although additional steps for reducing the deformation of the substrate can be considered, such steps will also lead to an increase in the production lead time.

Patent Document 1 discloses a technology (theta correction drive) in which a substrate is adsorbed and supported while the substrate is floated by air, and the substrate is rotated. Patent Document 2 discloses a technology in which spoke-shaped adsorption and holding portions driven in the normal direction of the substrate adsorb and hold the substrate above the substrate placement portion and rotate the substrate. [Prior technical literature] [Patent Document]

[Patent Document 1] Japanese Patent Application Publication No. 2013-221961 [Patent Document 2] Japanese Patent Application Publication No. 2000-100895

[Problem to be solved by the invention]

However, in the conventional technology, the substrate or the center of the substrate placement portion is sucked and held to rotate the substrate. Therefore, a large load is applied to the suction and holding portion, which may cause misalignment between the substrate and the suction and holding portion.

For example, the present invention provides a positioning device that is beneficial to reducing the deviation between the substrate and the suction holding part. [Means used to solve problems]

According to a first aspect of the present invention, there is provided a positioning device, which has: a substrate support portion that sprays gas against the lower surface of the substrate to float the substrate, thereby supporting the substrate in a non-contact state; and a plurality of suction and holding portions, It attracts the lower surface of the substrate supported in a non-contact state through the substrate support portion, thereby limiting the displacement of the substrate in a direction parallel to the substrate surface; a support member that supports the plurality of attraction and holding portions; and a rotation mechanism that rotates the support member around an axis intersecting the surface of the substrate to rotate the substrate via the plurality of suction and holding parts without rotating the substrate support part.

According to a second aspect of the present invention, there is provided a photolithography apparatus, which is provided with the positioning device according to the first aspect, and is configured to transfer a pattern of a master plate to a substrate positioned by the positioning device.

According to a third aspect of the present invention, there is provided an article manufacturing method, which includes: a process of transferring a pattern to a substrate using the photolithography apparatus of the second aspect; and a process of processing the substrate onto which the pattern has been transferred. ; Manufacturing articles from the aforementioned processed substrate. [Compare the effectiveness of previous technologies]

According to the present invention, a positioning device can be provided, which is beneficial to reducing the deviation between the substrate and the suction and holding part.

Hereinafter, embodiments will be described in detail with reference to the drawings. In addition, the following embodiments do not limit the scope of the patent claims of the inventor. Although a plurality of features are described in the embodiments, it is not limited to the case where all of the features are necessary for the invention; in addition, the features may be combined arbitrarily. In addition, in the drawings, the same or identical components are denoted by the same reference symbols, and repeated explanations are omitted.

FIG. 1 is a schematic diagram of the exposure device 1 according to the embodiment. In this specification and the drawings, the direction is expressed in the XYZ coordinate system in which the horizontal plane is the XY plane. Generally speaking, the substrate W which is the substrate to be exposed is placed on the substrate stage 5 so that its surface becomes parallel to the horizontal plane (XY plane). Therefore, in the following description, the directions orthogonal to each other in the plane along the surface of the substrate W are referred to as the X-axis and the Y-axis, and the direction perpendicular to the X-axis and the Y-axis is referred to as the Z-axis. In addition, in the following, the directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system will be referred to as the X-direction, the Y-direction, and the Z-direction. The directions of rotation around the Z-axis are called θx direction, θy direction, and θz direction respectively.

<First Embodiment> In the embodiment, an example will be described in which the positioning device of the substrate is used in a photolithography apparatus (exposure apparatus, imprint apparatus, etc.) that transfers a pattern of a master plate to a substrate. The imprint device forms a pattern on the substrate by solidifying the imprint material supplied to the substrate while the mold (original plate) is in contact with the imprint material. The exposure device exposes the photoresist supplied to the substrate through a master plate (reduction mask) that is an exposure mask, thereby forming a latent image corresponding to the pattern of the master plate on the photoresist. The substrate processed by these devices can be, for example, a silicon wafer, or other glass substrates, copper substrates, resin substrates, SiC substrates, sapphire substrates, etc. Hereinafter, in order to provide a specific example, an example in which the photolithography apparatus is configured as an exposure apparatus will be described.

(Construction of exposure device) FIG. 1 schematically shows the structure of an exposure device 1 to which the positioning device of the present invention is applied. The exposure device 1 is a device that transfers a pattern formed on a mask to a photosensitive substrate (for example, a photosensitive substrate formed on the surface thereof) via a projection optical system in a photolithography process that is a process for manufacturing semiconductor devices, liquid crystal display devices, etc. glass plate with resistive layer). The exposure device 1 may include a light source unit L, an illumination optical system 2, a mask stage 3 that supports a mask M (master plate), a projection optical system 4, a substrate stage 5 that supports a substrate W, a detector 19, and a control unit 6. The control part 6 is electrically connected to the light source unit L, the mask stage 3, the substrate stage 5, and the detector 19, and controls these. The control unit 6 can be configured by, for example, a PLD such as an FPGA, an ASIC, a general-purpose computer embedded with a program, or a combination of all or part of these. For example, the controller 6 may include a processor 6 and a memory 62 for storing programs and data.

The illumination optical system 2 uses light from the light source unit L to illuminate the mask M on which the transfer circuit pattern is formed. The illumination optical system 2 can have a function of uniformly illuminating the mask M and a deformation illumination function. The light source unit L uses a laser, for example. As laser, ArF excimer laser with a wavelength of about 193 nm, KrF excimer laser with a wavelength of about 248 nm, etc. can be used, but the type of light source is not limited to excimer laser. For example, F2 laser with a wavelength of about 157 nm and EUV (Extreme ultraviolet: far ultraviolet) light with a wavelength of 20 nm or less can be used.

The mask M is made of, for example, quartz, on which a circuit pattern to be transferred is formed, and is supported and driven by the mask table 3 . The diffracted light emitted from the mask M passes through the projection optical system 4 and is projected onto the substrate W. The mask M and the substrate W are arranged in an optically conjugate relationship. By scanning the mask M and the substrate W at a speed ratio that reduces the magnification ratio, the pattern of the mask M is transferred to the substrate W.

The masking table 3 supports the mask M through a mask suction cup (not shown) and is connected to a moving mechanism (not shown). The moving mechanism is composed of a linear motor or the like and has multiple degrees of freedom (for example, three axes of X, Y, and θz, preferably six axes of X, Y, Z, θx, θy, and θz), and drives the masking table 3 This allows the mask M to move.

The projection optical system 4 has the function of imaging the light beam from the object plane on the image plane, and imaging the diffracted light passing through the pattern formed on the mask M on the substrate W. As for the projection optical system 4, an optical system composed of a plurality of lens elements, an optical system having a plurality of lens elements and at least one concave mirror (catadioptric optical system), or an optical system having a plurality of lens elements and at least one diffraction structure can be used. (kinoform) and other diffractive optical elements and optical systems.

The substrate stage 5 has a plurality of degrees of freedom (for example, three axes of X, Y, and θz, preferably six axes of X, Y, Z, θx, θy, and θz), and moves the substrate W. In this embodiment, the substrate stage 5 is provided with a drive mechanism 13 that moves the substrate W in a direction parallel to the substrate surface (XY direction), and a θ correction drive mechanism 14 (rotation mechanism) that rotates the substrate W. Rotation of an axis (such as the Z-axis) that intersects the substrate surface (theta correction drive). After placing the substrate W on the substrate placement portion at the receiving position, the substrate stage 5 can be moved to the exposure start position in the XY direction by the drive mechanism 13 and perform θ correction drive by the θ correction drive mechanism 14 .

The detector 19 detects the X, Y, and θ positions of the substrate W. In one example, the detector 19 may include a light irradiation unit that irradiates the side surface of the substrate W with light; and a detection unit that detects the light reflected by the side surface of the substrate W. As shown in FIG. 2A , a plurality of detectors 19 can be arranged. The control unit 6 determines the X, Y, and θ positions of the substrate W based on the detection results of each detector 19 .

First, the conventional θ correction drive method will be described. Conventionally, θ correction driving is performed by rotating the substrate mounting portion holding the substrate in the θz direction. During theta correction driving, the substrate placing portion is brought into a state of reduced frictional resistance or a non-contact state by the jet of compressed gas from an air cushion formed on the upper surface of the holding portion that supports the substrate placing portion from below. . After the θ correction drive, the air cushion is switched to suction, and the substrate placing part is restrained by the holding part. The above series of operations from the θ correction drive to the constraint of the substrate mounting portion are executed in parallel with the XY drive of the substrate stage.

However, when the substrate stage is driven XY in a state where the binding force of the air cushion (the frictional force between the air cushions) does not reach the inertial force generated by the XY drive, the substrate mounting portion is deflected due to the inertial force. As a result, the positioning accuracy of the substrate decreases and the exposure performance may decrease. Therefore, after the substrate stage moves to the exposure start position, it is necessary to wait for the complete restraint by the air cushion, which hinders the shortening of the throughput time.

Since the deviation of the substrate placement portion is the cause of this problem, a countermeasure is considered to rotate the substrate while the substrate placement portion is fixed by the holding portion. As a technique for performing θ correction on a substrate on a substrate stage, there is a method of adsorbing and holding the substrate on the upper side of the substrate mounting portion and rotating the substrate. However, in the conventional mechanism for θ correction of the substrate, since the substrate is sucked at one central point, a large load is applied to the suction and holding part, and there is a risk of deviation between the substrate and the suction and holding part.

In addition, since the conventional suction and holding part is a mechanism that simply moves up and down, when the substrate mounting part suctions the substrate after theta correction drive, the substrate will be deformed according to the height of the suction and holding part protruding from the substrate mounting part. In order to prevent deformation from remaining on the substrate, the following steps are required: the substrate mounting portion absorbs the substrate, drives the suction and holding portion downwards of the substrate mounting portion, and then blows the compressed gas to the entire lower surface of the substrate. However, since the substrate is not restrained during the step of applying the compressed gas, the substrate may run away (move in the horizontal direction) when the substrate stage is driven horizontally.

Therefore, in this embodiment, the XY drive of the substrate stage and the θ correction drive of the substrate are implemented in parallel using a mechanism as shown below, so that the lead time can be shortened.

(Construction of theta correction drive mechanism) FIG. 2A is a plan view of the substrate stage 5 (viewed from above in the Z direction). FIG. 2B is a cross-sectional view along line A-A shown in FIG. 2A (a cross-sectional view when viewed from the X direction), showing the structure of the θ correction drive mechanism 14 . The substrate stage 5 has a substrate support portion 7 that supports the substrate W. The substrate support part 7 may also be called a substrate placement part or a substrate suction cup. The substrate support portion 7 can support the substrate W in a non-contact state by ejecting gas onto the lower surface of the substrate W to float the substrate W. The substrate support portion 7 can further absorb the gas below the substrate W and support the substrate W in a contact state. The control unit 6 can switch between non-contact support and contact support of the substrate W passing through the substrate support unit 7 .

The substrate support portion 7 is formed with a plurality of holes 28 penetrating the upper and lower surfaces. A plurality of holes 28 communicate with the passage 33 . The passage 33 is connected to the first pressure adjustment part 29 .

As shown in FIG. 2A , the θ correction drive mechanism 14 is arranged under the substrate support part 7 . The θ correction drive mechanism 14 may include a plurality of suction and holding parts 24 . The plurality of suction and holding portions 24 attract the lower surface of the substrate W supported in a non-contact state by the substrate support portion 7 and restrict the displacement of the substrate W in a direction (first direction) parallel to the substrate surface (typically the XY direction). The plurality of suction and holding parts 24 are supported by the support member 23 . As will be described later, the support member 23 is rotatably supported by the rotating portion 25 around an axis that intersects the substrate surface. In the example of FIGS. 2A and 2B , the four suction and holding parts 24 are arranged at positions separated from the rotation center of the support member 23 . The position separated from the rotation center can be determined based on the size of the gap provided in the center of the substrate support portion 7 , the necessary drive amount for θ correction of the substrate, and the like. The number of suction and holding parts 24 is determined by the friction coefficient between the pad 24g ( FIG. 3 ) and the substrate W and the applied pressure of the vacuum source 30 relative to the inertial force when the substrate stage 17 is driven in XYθ of the substrate W. In the example of FIG. 2A , the supporting member 23 may be a long member that passes through the center of the substrate supporting part 7 and extends in the Y direction in a plan view when the substrate supporting part 7 is viewed from above.

FIG. 3 shows a structural example of the suction and holding part 24. The suction and holding part 24 includes a shaft 24d extending in the Z direction, and a pad 24g that is provided at the upper end of the shaft 24d and is a contact member that comes into contact with the lower surface of the substrate W. The shaft 24d is a hollow member formed with an air flow path for vacuum suction of the substrate W via the pad 24g, and is a member that moves the pad 24g up and down. The shaft 24d can freely move in the Z direction while being guided through the guide portion 24e formed on the holder 24f. Shaft 24d (i.e., pad 24g) is driven in the +Z direction through actuator 24a. The actuator 24a may be composed of a cylinder, a linear motor, a servo motor, or the like. Even after the pad 24g is driven by the actuator 24a to a position where it can contact the substrate W and the pad 24g is adsorbed by the substrate W and the actuator 24a returns to the standby position, the pad 24g can still be moved by the guide 24e. Continue to be adsorbed on the substrate W. At this time, since the substrate W is in a state without pressing force from the suction and holding portion 24, the substrate W can be placed and attracted to the substrate support portion 7 from the θ correction drive in a highly smooth state. Thereby, the spacer 24g can be displaced following the displacement of the substrate W in the direction (second direction) intersecting the substrate surface (typically, the Z direction).

The center of the support member 23 that supports the plurality of suction and holding parts 24 is connected to the fixing member 18 arranged below the support member 23 via the rotating part 25 . Through the rotating part 25, the supporting member 23 can rotate in the θz direction relative to the fixed member 18. In addition, the end portion of the fixed member 18 and the end portion of the support member 23 are connected via the θ drive source 15 . The θ drive source 15 drives the support member 23 in the drive direction 21 so that the support member 23 can rotate in the θz direction with the rotating portion 25 as the rotation center. That is, the θ correction drive is performed by rotating the support member 23 relative to the fixed member 18 through the θ drive source 15 . Therefore, it can be understood that the rotating part 25 constitutes a rotating support part, and the rotating supporting part and the θ drive source 15 constitute a rotating part.

Furthermore, a plurality of air cushions 22 are arranged on the upper surface of the fixing member 18 , and a plurality of pads 27 are arranged on the lower surface of the support member 23 so as to face the plurality of air cushions 22 . The plurality of air cushions 22 are configured to eject gas relative to the lower surface (pad 27 ) of the support member 23 . In addition, the plurality of air cushions 22 are also configured to attract the gas under the support member 23 so that the air cushions 22 and the pad 27 are adsorbed. The injection or suction of the gas that has passed through the air cushion 22 can be switched by the control unit 6 . The θ correction drive is performed in a state where the compressed gas is ejected from the air cushion 22 so that the support member 23 and the air cushion 22 are in a non-contact state or the frictional resistance is reduced. Due to the ejection and adsorption operation of the compressed gas of the air cushion 22, the components of the θ correction drive mechanism 14 configured upward from the fixed member 18 move in the Z direction. Therefore, the rotating part 25 may also be configured to be able to follow the movement through a leaf spring or the like. Such movement in the Z direction causes expansion and contraction in the Z direction. This prevents the support member 23 from being deformed.

The gasket 24g of the suction and holding part 24 is connected to a vacuum source 30 such as a vacuum pump via a shaft 24d so that gas can flow therethrough. When the suction and holding part 24 supports the substrate W, the gas suction (vacuum) is performed through the vacuum source 30 so that the gasket 24g can be adsorbed to the lower surface of the substrate W. The upper portion (contact portion) of the spacer 24g is preferably made of a material that imitates the substrate W (for example, resin) when in contact with the substrate W.

The first pressure regulator 29 performs any one of supplying (discharging) the compressed gas to the hole 28 , restoring the atmospheric pressure of the hole 28 by connecting the hole 28 to the atmospheric space (outside), and suctioning the gas from the hole 28 . . These operations can be performed by the control unit 6 switching a solenoid valve (not shown). The first pressure adjusting part 29 exhausts the gas between the substrate W and the substrate supporting part 7 by sucking the gas, thereby adsorbing the substrate W. The flatness of the surface of the substrate W can be adjusted by changing the intensity of gas attraction at this time.

The second pressure adjustment unit 31 performs any one of supplying (discharging) the compressed gas to the air cushion 22 , restoring the atmospheric pressure of the air cushion 22 by connecting the air cushion 22 to the atmospheric space (outside), and suctioning the gas from the air cushion 22 . These operations can be performed by the control unit 6 switching a solenoid valve (not shown).

(About the theta correction driving method of the substrate) The θ correction driving method of the substrate W having passed through the θ correction driving mechanism 14 will be described. Theta correction drive is performed by the control unit 6 executing a program according to the flowchart shown in FIG. 4 . In addition, FIGS. 5 to 9 respectively illustrate the holding process of the substrate W. In FIGS. 5 to 9 , the same members as in FIGS. 1 , 2A and 2B are denoted by the same reference numerals, and detailed descriptions thereof are omitted.

At the beginning of the program, the substrate stage 5 is stationary in the substrate receiving position. Regarding the θ correction driving mechanism 14 , the pad 24 g is located below the upper surface of the substrate support part 7 , and the pad 24 g is in a state that does not attract the substrate W ( S101 ). The compressed gas is sprayed in the +Z direction through the hole 28 (S102). In addition, the air cushion 22 blows out compressed gas and enters a non-contact state or a state in which frictional resistance is reduced.

In S103, the actuator 24a of the suction holding part 24 pushes up the holder 24f in the +Z direction, so that the pad 24g moves above the substrate support part 7. At this time, the position of the tip or edge of the pad 24g is a height at which the dynamic pressure of the compressed gas ejected from the hole 28 toward the substrate W acts, and is a height where the substrate W can be received by the compressed gas from the hole 28 and the suction and holding portion 24 self-respecting position.

In S104, after the substrate W is placed on the pad 24g, or immediately before being placed, suction of the substrate W on the pad 24g starts through the vacuum source 30. This restricts the positional shift of the substrate W in the horizontal direction. FIG. 5 shows the state at the end of program S104.

In S105, the substrate stage 5 starts XY driving. In parallel with this, in S106, the detector 19 detects the X, Y, and θ positions of the substrate W. In addition, in S107, while the pad 24g is adsorbed to the substrate W, the actuator 24a is driven in the -Z direction and moves to the standby position. At this time, the force exerted on the substrate W in the +Z direction is only the compressed gas from the hole 28, and the substrate W is adsorbed on the spacer 24g. Therefore, positional deviation in the horizontal direction does not occur. In addition, the substrate W bears the dead weight of the pad 24g and the shaft 24d. The actuator 24a moves to the standby position so that the deformation of the substrate W caused by the force received from the suction holding part 24 can be reduced. Since the pad 24g is made of a material that imitates the substrate W, the upper part of the pad 24g slightly expands and contracts, so that even if the substrate W moves slightly in the Z direction, it can still follow it. FIG. 6 is a diagram illustrating the state at the end of program S107.

In S108, θ correction driving of the substrate W is performed based on the detection result of the detector 19. As described above, the θ correction drive is performed by driving the θ drive source 15 in the drive direction 21 and rotating around the rotating portion 25 . During the θ correction drive, the pad 24 g may be displaced in the horizontal direction due to the inertial force caused by the XY drive and the θ correction drive of the substrate stage 5 . In the present embodiment, as a countermeasure against the main cause of deterioration in θ correction accuracy due to this deviation, the suction and holding portion 24 can be arranged at a position as far away from the rotation center as possible. Thereby, the load applied to the rotating part 25 is reduced. In addition, by arranging the suction and holding portion 24 at a position separated from the rotation center, the resolution of the θ correction drive becomes higher than that near the rotation center, and the offset caused by the deformation of the pad 24g can be reduced from affecting the θ correction accuracy. The impact is minimal or negligible.

In S109, the first pressure adjustment part 29 is opened to the atmosphere through the hole 28. Thereby, the air supplied to the substrate supporting part 7 of the substrate W is discharged to the atmosphere substantially uniformly through the holes 28 . Thereby, the substrate W is placed on the substrate support portion 7 in a highly smooth state. When the substrate W is placed on the substrate support portion 7 , the substrate W is lowered in the −Z-axis direction by the height lifted by the compressed gas. At this time, the spacer 24g adsorbed to the substrate W descends while being guided by the guide 24e as the substrate W descends. FIG. 7 shows the state at the end of program S109.

Next, in S110 , the first pressure adjustment unit 29 starts vacuuming through the hole 28 and starts sucking the substrate W. In S110, the vacuum source 30 stops adsorbing the substrate W to the pad 24g. That is, the exhaust operation is stopped.

In S111, since the exhaust operation was stopped in S110, the pad 24g is lowered to the standby position while being guided by the guide 24e until the pad 24g becomes the same as the holding position due to the dead weight of the pad 24g and the shaft 24d. The same height as the device 24f. FIG. 8 shows the state at the end of program S111.

In step S112, the second pressure adjustment unit 31 causes the pad 22 to be adsorbed to the fixing member 18. FIG. 9 shows the state at the end of program S112. In this way, after the rotation of the support member 23 in S108 is completed, the substrate support part 7 switches to support the substrate in the contact state in S110, and the air cushion 22 switches to support the support member 23 in the contact state in S112.

Based on the above, the θ correction drive of the substrate W is completed. In S113, the substrate W is moved to the exposure start position using the substrate stage 5.

In this way, the plurality of suction and holding parts 24 are arranged at positions separated from the rotation center, and the θ correction drive is performed in a state where all the suction and holding parts 24 are supported by one supporting member. Accordingly, even in a situation where the inertial force generated by the XY drive of the substrate stage 17 acts, highly accurate θ correction drive can be achieved. In addition, the above-mentioned operations can be performed without leaving any deformation on the substrate.

<Second Embodiment> FIG. 10 shows the structure of the θ correction drive mechanism 14 in the second embodiment. In the θ correction drive mechanism 14 of the second embodiment, each of the plurality of suction and holding parts 24 does not include an actuator 24 a. Instead, the actuator 32 is arranged above the fixed member 23 so that a force acts on the support member 23 . The actuator 32 drives the support member 23 in the Z direction to raise and lower the plurality of suction and holding parts 24 respectively.

<3rd Embodiment> The exposure apparatus 1 may process a plurality of substrates at the same time. In this case, as shown in FIG. 11 , the substrate stage 5 may be provided with a plurality of θ correction driving mechanisms 14 corresponding to each substrate.

<4th Embodiment> In FIG. 2A , the support member 23 is shown as an elongated member that passes through the center of the substrate support portion 7 and extends in the Y direction in a plan view when the substrate support portion 7 is viewed from above. However, the direction in which the support member 23 extends is not limited to the Y direction. The direction in which the support member 23 extends can also be set based on the exposure layout and shape of the substrate W, for example.

In addition, the support member 23 is not limited to a long rectangular shape. The support member 23 may have a shape such as a radial shape, a lattice shape, or a circular shape, for example.

＜Other embodiments＞ The actuator 24a in the first embodiment or the actuator 32 in the second embodiment may be omitted. For example, a configuration may be adopted in which the initial position of the spacer 24 g is as close as possible to the upper surface of the substrate support part 7 , and the spacer 24 g is raised to be adsorbed on the substrate W by the vacuum pressure of the vacuum source 30 .

<Embodiment of article manufacturing method> The article manufacturing method according to the embodiment of the present invention is suitable for manufacturing articles such as microdevices such as semiconductor devices and elements having a fine structure. The article manufacturing method of this embodiment includes: a process of transferring a pattern of an original plate to a substrate using the above-mentioned photolithography apparatus (exposure apparatus, imprint apparatus, drawing apparatus, etc.); and performing a process on the substrate to which the pattern has been transferred by the process. Processing procedures. Furthermore, the manufacturing method includes other well-known procedures (oxidation, film formation, evaporation, doping, planarization, etching, resist stripping, cutting, bonding, packaging, etc.). The article manufacturing method of this embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article compared to conventional methods.

The invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, the patent application is drafted to disclose the scope of the invention.

7:Substrate support part 14:θ correction drive mechanism 23:Supporting members 24:Attraction and retention department 25:Rotation part

[Fig. 1] A diagram illustrating the structure of an exposure device. [Fig. 2A] Plan view of the substrate stage. [Fig. 2B] A diagram illustrating the structure of the θ correction drive mechanism. [Fig. 3] A diagram illustrating the structure of the suction and holding portion. [Fig. 4] A flowchart illustrating the θ correction driving method. [Fig. 5] A diagram illustrating the control state in theta correction drive. [Fig. 6] A diagram illustrating the control state in theta correction drive. [Fig. 7] A diagram illustrating the control state in theta correction drive. [Fig. 8] A diagram illustrating the control state in theta correction drive. [Fig. 9] A diagram illustrating the control state in theta correction drive. [Fig. 10] A diagram illustrating the structure of the θ correction drive mechanism. [Fig. 11] A diagram illustrating a structure including a plurality of θ correction drive mechanisms.

7:Substrate support part

15:θ drive source

18: Fixed components

22: Air cushion

23:Supporting members

24:Attraction and retention department

25:Rotation part

27:Padding

28:hole

29: 1st pressure adjustment section

30:Vacuum source

31: 2nd pressure adjustment section

33:Pathway

Claims (12)

a positioning device, have: a substrate support portion that injects gas onto the lower surface of the substrate to float the substrate, thereby supporting the substrate in a non-contact state; A plurality of suction and holding parts that attract the lower surface of the substrate supported in a non-contact state through the substrate support part to limit the displacement of the substrate in a first direction parallel to the substrate surface; a support member that supports the aforementioned plurality of attraction and holding parts; and The rotation part rotates the support member around an axis intersecting the surface of the substrate, thereby rotating the substrate via the plurality of suction and holding parts without rotating the substrate support part. The positioning device according to claim 1, wherein the plurality of suction and holding portions are arranged at a plurality of positions separated from the rotation center of the support member. The positioning device according to claim 2, wherein the supporting member is an elongated member that passes through the center of the substrate supporting portion and extends in the first direction in a plan view when the substrate supporting portion is viewed from above. The positioning device according to claim 1, wherein each of the plurality of suction holding parts has a contact member that comes into contact with the lower surface of the substrate through suction of gas, and the contact member is configured to follow the direction toward the surface of the substrate. The displacement occurs due to the displacement of the aforementioned substrate in the intersecting second direction. The positioning device according to claim 4, wherein each of the plurality of suction holding portions has an actuator for causing the contact member to contact the lower surface of the substrate. The positioning device according to claim 4, further comprising an actuator for driving the support member so that the contact member contacts the lower surface of the substrate. The positioning device of claim 1, further having a driving mechanism for moving the substrate in the first direction, The support member is rotated in parallel with the movement of the substrate through the drive mechanism. The positioning device of claim 7, further having a fixing member disposed below the supporting member, The said rotating part is arranged to be fixed on the said fixed member and rotate the said support member, further having an air cushion arranged on the fixed member and ejecting gas against the lower surface of the supporting member, The air cushion blows out gas, and the support member is rotated in a non-contact state or a reduced frictional resistance state between the support member and the air cushion. The positioning device of claim 8, wherein, The substrate support portion is further configured to suck gas below the substrate and support the substrate in a contact state, The air cushion is further configured to attract air below the support member and support the support member in a contact state, After the rotation of the support member is completed, the substrate support portion switches to support the substrate in the contact state, and the air cushion switches to support the support member in the contact state. A photolithography device, Having a positioning device as in any one of requirements 1 to 9, The pattern of the original plate is transferred to the substrate positioned by the positioning device. The photolithography apparatus of claim 10 is configured as an exposure apparatus or an imprint apparatus. A method of making an item, have: A process for transferring a pattern to a substrate using the photolithography apparatus of claim 10; and A procedure for processing the substrate onto which the pattern has been transferred; An article is manufactured from the above-mentioned processed substrate.

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