JP2023055503A - Positioning device, lithography device, and article production method - Google Patents

Abstract

To provide a positioning device advantageous in reducing a deviation between a substrate and a suction holding section.SOLUTION: A positioning device includes: a substrate supporting portion that supports a substrate in a non-contact state by jetting gas against a lower surface of the substrate to levitate the substrate; a plurality of suction-holding portions for sucking the lower surface of the substrate supported in a non-contact state by the substrate supporting portion to restrict displacement of the substrate in a direction parallel to the substrate surface; a support member for supporting the plurality of suction-holding portions; and a rotating mechanism for rotating the substrate via the plurality of suction-holding portions by rotating the support member about an axis intersecting with the substrate surface.SELECTED DRAWING: Figure 2B

Description

The present invention relates to a positioning apparatus, a lithographic apparatus and a method of manufacturing an article.

2. Description of the Related Art A lithography apparatus such as an exposure apparatus is required to perform position control of a substrate with high precision and high speed. As substrates have become larger and thinner in recent years, the distortion occurring in substrates has become more and more unignorable. The distortion of the substrate occurs when the substrate is transported, and may remain after the substrate is placed on the substrate placement part or even after the substrate is sucked after placement. If the substrate is exposed while the substrate is distorted, the exposure result will also be distorted, and the overlay accuracy may decrease. It is also conceivable to add a sequence to reduce the strain generated in the substrate, but such a sequence also leads to an increase in tact time.

Japanese Patent Application Laid-Open No. 2002-200000 discloses a technique (θ correction drive) for rotating a substrate by sucking and supporting the substrate while the substrate is levitated by air. Japanese Patent Application Laid-Open No. 2002-200001 discloses a technique in which a spoke-like suction holding portion that is driven in the direction normal to the substrate sucks and holds the substrate above the substrate mounting portion and rotates the substrate.

JP 2013-221961 A Japanese Patent Application Laid-Open No. 2000-100895

However, in the conventional technique, the substrate is rotated by holding the substrate or the central portion of the substrate mounting portion by suction. Therefore, a large load is applied to the suction-holding portion, and a shift may occur between the substrate and the suction-holding portion.

The present invention provides, for example, a positioning device that is advantageous in reducing misalignment between the substrate and the suction holder.

According to one aspect of the present invention, a substrate supporting portion supports the substrate in a non-contact state by jetting gas against the lower surface of the substrate to levitate the substrate, and the substrate supporting portion supports the substrate in a non-contact state. a plurality of suction-holding units for sucking the lower surface of the supported substrate to restrict displacement of the substrate in a direction parallel to the surface of the substrate; a support member for supporting the plurality of suction-holding units; and a rotating mechanism for rotating the substrate via the plurality of suction holding portions by rotating around an axis that intersects the surface of the substrate.

According to the present invention, it is possible to provide a positioning device that is advantageous in reducing the displacement between the substrate and the suction holding portion.

FIG. 2 is a diagram showing the configuration of an exposure apparatus; The top view of a substrate stage. FIG. 4 is a diagram showing the configuration of a θ correction driving mechanism; FIG. 4 is a diagram showing the configuration of a suction holding unit; 4 is a flowchart showing a θ correction driving method; FIG. 5 is a diagram showing a control state in θ correction driving; FIG. 5 is a diagram showing a control state in θ correction driving; FIG. 5 is a diagram showing a control state in θ correction driving; FIG. 5 is a diagram showing a control state in θ correction driving; FIG. 5 is a diagram showing a control state in θ correction driving; FIG. 4 is a diagram showing the configuration of a θ correction driving mechanism; FIG. 4 is a diagram showing a configuration including a plurality of θ correction drive mechanisms;

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. In addition, the following embodiments do not limit the invention according to the scope of claims. Although multiple features are described in the embodiments, not all of these multiple features are essential to the invention, and multiple features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same or similar configurations are denoted by the same reference numerals, and redundant description is omitted.

FIG. 1 is a schematic diagram of an exposure apparatus 1 according to an embodiment. In this specification and drawings, directions are indicated in an XYZ coordinate system with the horizontal plane as the XY plane. Generally, the substrate W, which is a substrate to be exposed, is placed on the substrate stage 5 so that its surface is parallel to the horizontal plane (XY plane). Therefore, hereinafter, the directions perpendicular to each other in the plane along the surface of the substrate W are defined as the X-axis and the Y-axis, and the direction perpendicular to the X-axis and the Y-axis is defined as the Z-axis. Further, hereinafter, the directions parallel to the X axis, Y axis, and Z axis in the XYZ coordinate system are referred to as the X direction, Y direction, and Z direction, respectively. The directions of rotation are called the θx direction, the θy direction, and the θz direction, respectively.

<First embodiment>
In the embodiments, an example in which the substrate positioning apparatus is used in a lithography apparatus (exposure apparatus, imprint apparatus, etc.) that transfers a pattern of an original onto a substrate will be described. The imprinting apparatus forms a pattern on the substrate by curing the imprinting material while the mold (original plate) is in contact with the imprinting material supplied onto the substrate. The exposure apparatus forms a latent image corresponding to the pattern of the original on the photoresist by exposing the photoresist supplied onto the substrate through an original (reticle), which is an exposure mask. Substrates processed by these apparatuses may be, for example, silicon wafers, but may also be other substrates such as glass substrates, copper substrates, resin substrates, SiC substrates, and sapphire substrates. In the following, to provide a concrete example, an example in which the lithographic apparatus is configured as an exposure apparatus will be described.

(Configuration of exposure device)
FIG. 1 schematically shows the configuration of an exposure apparatus 1 to which the positioning device of the present invention is applied. The exposure apparatus 1 forms a mask on a photosensitive substrate (for example, a glass plate having a photoresist layer formed on its surface) via a projection optical system in a lithography process, which is a manufacturing process for semiconductor devices, liquid crystal display devices, and the like. It is a device that transcribes the printed pattern. The exposure apparatus 1 can include a light source unit L, an illumination optical system 2, a mask stage 3 that supports a mask M (original), a projection optical system 4, a substrate stage 5 that supports a substrate W, a detector 19, and a controller 6. . The controller 6 is electrically connected to the light source unit L, the mask stage 3, the substrate stage 5, and the detector 19 and controls them. The control unit 6 can be configured by, for example, a PLD such as an FPGA, an ASIC, a general-purpose computer in which a program is installed, or a combination of all or part of these. For example, controller 6 may include processor 6 and memory 62 that stores programs and data.

The illumination optical system 2 uses the light from the light source unit L to illuminate the mask M on which the circuit pattern for transfer is formed. The illumination optical system 2 can have a function of uniformly illuminating the mask M and a modified illumination function. The light source unit L uses, for example, a laser. An ArF excimer laser with a wavelength of about 193 nm, a KrF excimer laser with a wavelength of about 248 nm, or the like can be used as the laser, but the type of light source is not limited to the excimer laser. For example, an F2 laser with a wavelength of about 157 nm or EUV (Extreme Ultraviolet) light with a wavelength of 20 nm or less may be used.

The mask M is made of, for example, quartz, has a circuit pattern to be transferred formed thereon, and is supported and driven by the mask stage 3 . Diffracted light emitted from the mask M is projected onto the substrate W through the projection optical system 4 . The mask M and the substrate W are arranged so as to have an optically conjugate relationship. The pattern of the mask M is transferred onto the substrate W by scanning the mask M and the substrate W at a speed ratio corresponding to the reduction ratio.

The mask stage 3 supports the mask M via a mask chuck (not shown) and is connected to a moving mechanism (not shown). The movement mechanism is composed of a linear motor or the like, and has a plurality of degrees of freedom (for example, three axes of X, Y, and θz, preferably six axes of X, Y, Z, θx, θy, and θz), and moves the mask stage. By driving 3, the mask M can be moved.

The projection optical system 4 has a function of imaging the speed of light from the object plane onto an image plane, and forms an image of the diffracted light that has passed through the pattern formed on the mask M onto the substrate W. FIG. The projection optical system 4 includes an optical system consisting of a plurality of lens elements, an optical system having a plurality of lens blocks and at least one concave mirror (catadioptric optical system), a plurality of lens elements and at least one kinoform lens. An optical system having a diffractive optical element such as .

The substrate stage 5 has a plurality of degrees of freedom (for example, three axes of X, Y, and θz, preferably six axes of X, Y, Z, θx, θy, and θz) and moves the substrate W. In this embodiment, the substrate stage 5 includes a drive mechanism 13 that moves the substrate W in directions (XY directions) parallel to the substrate surface, and a rotation (θ correction driving mechanism 14 (rotating mechanism) for performing correction driving). After the substrate W is placed on the substrate platform at the receiving position, the substrate stage 5 can perform θ correction drive by the θ correction drive mechanism 14 while moving the substrate W in the XY directions to the exposure start position by the drive mechanism 13 .

The detector 19 detects the positions of the substrate W in X, Y, and θ. In one example, the detector 19 may include a light irradiation unit that irradiates the side surface of the substrate W with light and a detection unit that detects light reflected by the side surface of the substrate W. FIG. As shown in FIG. 2A, multiple detectors 19 may be arranged. The control unit 6 obtains the X, Y, and θ positions of the substrate W based on the detection results of the respective detectors 19 .

First, a conventional θ correction driving method will be described. Conventionally, the .theta. correction drive is performed by rotating the substrate mounting part holding the substrate in the .theta.z direction. During the θ correction drive, the substrate platform is in a state in which frictional resistance is reduced or in a non-contact state by jetting compressed gas from an air pad formed on the upper surface of the holding portion that supports the substrate platform from below. be made. After the .theta. correction drive, the air pad is switched to suction, and the substrate mounting section is restrained by the holding section. A series of operations from the above θ correction drive to restraint of the substrate platform are performed in parallel with the XY drive of the substrate stage.

However, if the substrate stage is XY-driven in a state in which the restraining force (frictional force between the air pads) by the air pads does not reach the inertial force generated by the XY driving, the inertial force causes the substrate platform to shift. As a result, the alignment accuracy of the substrate may be degraded and the exposure performance may be degraded. Therefore, after the substrate stage moves to the exposure start position, it is necessary to wait for the complete restraint by the air pad, which hinders shortening of the tact time.

Since the cause of this problem is the deviation of the substrate mounting portion, a countermeasure is conceivable in which the substrate is rotated while the substrate mounting portion is fixed by the holding portion. As a technique for correcting the θ of the substrate on the substrate stage, there is a method in which the substrate is held by suction on the upper side of the substrate platform and rotated. However, in the conventional substrate θ correction mechanism, since the substrate is sucked at one central point, a large load is applied to the suction holding portion, and there is a risk of deviation between the substrate and the suction holding portion.

In addition, since the conventional suction-holding unit is a mechanism that simply moves up and down, when the substrate mounting unit sucks the substrate after the θ correction drive, the substrate is moved by the height that the suction-holding unit protrudes from the substrate mounting unit. distortion occurs. In order to prevent the substrate from being distorted, it is necessary to perform a sequence in which the substrate mounting section sucks the substrate, the suction holding section is driven downward from the substrate mounting section, and then the compressed gas is jetted over the entire bottom surface of the substrate. Become. However, since the substrate is not restrained during the sequence of applying the compressed gas, the substrate drifts (horizontally moves) when the substrate stage is horizontally driven.

Therefore, in the present embodiment, the XY drive of the substrate stage and the .theta. correction drive of the substrate are performed in parallel using the mechanism described below, thereby making it possible to shorten the tact time.

(Structure of θ correction driving mechanism)
FIG. 2A is a plan view of the substrate stage 5 (viewed from above in the Z direction). FIG. 2B is a cross-sectional view (a cross-sectional view viewed from the X direction) taken along line AA shown in FIG. 2A, showing the configuration of the θ correction driving mechanism 14. The substrate stage 5 has a substrate supporting portion 7 that supports the substrate W. As shown in FIG. The substrate support section 7 may be called a substrate mounting section or a substrate chuck. The substrate supporting part 7 can support the substrate W in a non-contact state by ejecting gas onto the lower surface of the substrate W to float the substrate W. As shown in FIG. The substrate support section 7 can also support the substrate W in a contact state by sucking the gas under the substrate W. As shown in FIG. The control unit 6 can switch non-contact support/contact support of the substrate W by the substrate support unit 7 .

A plurality of holes 28 are formed through the upper and lower surfaces of the substrate supporting portion 7 . A plurality of holes 28 communicate with passages 33 . The passage 33 is connected to the first pressure adjustment section 29 .

As shown in FIG. 2A, the θ correction drive mechanism 14 is arranged below the substrate support section 7 . The θ correction driving mechanism 14 can include a plurality of suction holding portions 24 . The plurality of suction holding parts 24 suck the lower surface of the substrate W supported in a non-contact state by the substrate supporting part 7 to move the substrate W in a direction (first direction) (typically, XY directions) parallel to the substrate surface. The displacement of the substrate W is regulated. The plurality of suction holding portions 24 are supported by support members 23 . As will be described later, the supporting member 23 is rotatably supported by a rotating portion 25 around an axis that intersects the substrate surface. In the example of FIGS. 2A and 2B, the four suction-holding portions 24 are arranged at positions away from the rotation center of the support member 23 . The position away from the center of rotation can be determined according to the size of the gap provided in the center of the substrate supporting portion 7, the amount of drive necessary for correcting θ of the substrate, and the like. The number of suction holding portions 24 is determined by the coefficient of friction between the pad 24g (FIG. 3) and the substrate W and the applied pressure of the vacuum source 30 with respect to the inertial force of the substrate stage 17 of the substrate W when the substrate stage 17 is driven by XYθ. sell. In the example of FIG. 2A, the support member 23 can be an elongated member extending in the Y direction through the center of the substrate support portion 7 in plan view when the substrate support portion 7 is viewed from above.

FIG. 3 shows a configuration example of the suction holding portion 24. As shown in FIG. The suction holding unit 24 includes a shaft 24d extending in the Z direction, and a pad 24g which is a contact member provided on the upper end of the shaft 24d and in contact with the lower surface of the substrate W. As shown in FIG. The shaft 24d is a hollow member formed with an air flow path for performing vacuum suction of the substrate W via the pad 24g, and is a member that moves the pad 24g up and down. The shaft 24d can freely move in the Z direction while being guided by a guide portion 24e formed on the holder 24f. Shaft 24d (that is, pad 24g) is driven in the +Z direction by actuator 24a. The actuator 24a can be configured by an air cylinder, linear motor, servomotor, or the like. Even if the actuator 24a returns to the standby position after the pad 24g is driven to the position where the pad 24g can contact the substrate W by the actuator 24a and the pad 24g is attracted to the substrate W, the pad 24g continues to be attracted to the substrate W by the action of the guide 24e. be able to. At this time, since there is no pressing force from the suction holding unit 24 to the substrate W, the substrate W can be placed and sucked on the substrate support unit 7 from the θ correction drive in a state of high smoothness. can. Thereby, the pad 24g can be displaced following the displacement of the substrate W in the direction (second direction) (typically the Z direction) intersecting with the substrate surface.

The center of the supporting member 23 that supports the plurality of suction-holding portions 24 is connected to the fixed member 18 arranged below the supporting member 23 via the rotating portion 25 . The support member 23 can be rotated in the θz direction with respect to the fixed member 18 by the rotating portion 25 . Further, the end portion of the fixed member 18 and the end portion of the support member 23 are connected via the θ drive source 15 . The .theta. drive source 15 drives the support member 23 in the drive direction 21, so that the support member 23 can rotate in the .theta.z direction with the rotating portion 25 as the center of rotation. That is, the θ correction drive is performed by rotating the support member 23 with respect to the fixed member 18 by the θ drive source 15 . Therefore, it may be understood that the rotating part 25 constitutes a rotation supporting part, and the rotating part is composed of the rotation supporting part and the θ drive source 15 .

A plurality of air pads 22 are arranged on the upper surface of the fixing member 18 , and a plurality of pads 27 are arranged on the lower surface of the support member 23 so as to face the plurality of air pads 22 . The plurality of air pads 22 are configured to eject gas onto the lower surface (pad 27) of the support member 23. As shown in FIG. The plurality of air pads 22 are also configured to suck air under the support member 23 so that the air pads 22 and the pads 27 are attracted to each other. Injection or suction of gas by such an air pad 22 can be switched by the controller 6 . The .theta. correction drive is performed in a state in which compressed gas is jetted from the air pad 22 and the support member 23 and the air pad 22 are in a non-contact state or a frictional resistance is reduced. Since the members of the θ correction drive mechanism 14 arranged above the fixed member 18 move in the Z direction due to the ejection and adsorption of the compressed gas of the air pad 22, the rotating part 25 is moved in the Z direction by a plate spring or the like. It may be configured to be stretchable in the Z direction according to. Thereby, deformation of the support member 23 is prevented.

The pad 24g of the suction holding portion 24 is connected to a vacuum source 30 such as a vacuum pump through a shaft 24d so as to allow gas flow. When the suction holding part 24 supports the substrate W, gas suction (vacuum drawing) is performed by the vacuum source 30, and the pad 24g can be attracted to the lower surface of the substrate W. FIG. The upper portion (contact portion) of the pad 24g is preferably made of a material (for example, resin) that conforms to the substrate W when in contact with the substrate W. As shown in FIG.

The first pressure adjustment unit 29 supplies (spouts) compressed gas to the hole 28, releases the hole 28 to the atmosphere by connecting the hole 28 to the atmospheric space (outside), and sucks gas from the hole 28. I do. These operations can be performed by the control unit 6 switching electromagnetic valves (not shown). The first pressure adjusting unit 29 evacuates the space between the substrate W and the substrate supporting unit 7 by sucking gas, thereby causing the substrate W to be adsorbed. The flatness of the surface of the substrate W can be adjusted by changing the strength of the gas suction at this time.

The second pressure adjustment unit 31 supplies (spouts) compressed gas to the air pad 22, releases the air pad 22 to the atmosphere by connecting the air pad 22 and the atmospheric space (outside), or sucks gas from the air pad 22. I do. These operations can be performed by the control unit 6 switching electromagnetic valves (not shown).

(Regarding the substrate θ correction driving method)
A θ correction drive method for the substrate W by the θ correction drive mechanism 14 will be described. θ correction driving is performed by the control unit 6 executing a program according to the flowchart shown in FIG. 4 . 5 to 9 are diagrams showing the holding process of the substrate W, respectively. 5 to 9, the same members as those in FIGS. 1, 2A, and 2B are denoted by the same reference numerals, and detailed description thereof is omitted.

At the start of the program, the substrate stage 5 is stationary at the substrate receiving position. As for the .theta. correction drive mechanism 14, the pad 24g is positioned below the upper surface of the substrate supporting portion 7, and the pad 24g is not even attracted to the substrate W (S101). Compressed gas is jetted in the +Z direction through the hole 28 (S102). In addition, the air pad 22 is blowing compressed gas, and is in a non-contact state or a state in which frictional resistance is reduced.

In S103, the actuator 24a of the suction holding portion 24 pushes up the holder 24f in the +Z direction, thereby moving the pad 24g above the substrate support portion 7. As shown in FIG. At this time, the position of the tip or edge of the pad 24g is the height at which the dynamic pressure of the compressed gas ejected from the hole 28 toward the substrate W acts. This is the position where the holding portion 24 can receive.

In S104, after or just before the substrate W is placed on the pad 24g, the vacuum source 30 starts sucking the substrate W on the pad 24g. This restricts the positional displacement of the substrate W in the horizontal direction. FIG. 5 shows the state at the end of step S104.

In S105, the substrate stage 5 starts XY driving. In parallel with this, the detector 19 detects the X, Y, and θ positions of the substrate W in S106. Further, in S107, the actuator 24a is driven in the -Z direction to move to the standby position while the pad 24g is adhered to the substrate W. FIG. At this time, only the compressed gas from the hole 28 exerts a force on the substrate W in the +Z direction, and the substrate W is adsorbed on the pads 24g, so no horizontal displacement occurs. The substrate W receives the weight of the pad 24g and the shaft 24d. By moving the actuator 24a to the standby position, it is possible to reduce the distortion of the substrate W caused by receiving the force from the suction holder 24. FIG. Since the pad 24g is made of a material that conforms to the substrate W, the upper portion of the pad 24g is slightly expanded and contracted, so that even if the substrate W moves slightly in the Z direction, it can follow. FIG. 6 is a diagram showing the state at the end of step S107.

In S108, the substrate W is driven for θ correction based on the detection result of the detector 19. FIG. As described above, the θ correction driving is performed by rotating the rotating portion 25 by driving the θ driving source 15 in the driving direction 21 . During the θ correction drive, the pad 24g may be shifted in the horizontal direction due to the inertial force due to the XY drive and the θ correction drive of the substrate stage 5 . In the present embodiment, as a countermeasure against the reduction in the .theta. correction accuracy due to this deviation, the suction holding portion 24 can be arranged at a position as far away from the center of rotation as possible. This reduces the load on the rotating portion 25 . Further, by arranging the suction holding portion 24 at a position away from the rotation center, the resolution of the θ correction drive becomes higher than that near the rotation center, and the influence of the displacement caused by the deformation of the pad 24g on the θ correction accuracy is small or negligible. You can make it as high as you can.

In S<b>109 , the first pressure adjusting section 29 is opened to the atmosphere through the hole 28 . As a result, the air supplied to the substrate supporting portion 7 of the substrate W is substantially uniformly exhausted to the atmosphere through the holes 28 . As a result, the substrate W is placed on the substrate supporting portion 7 in a state of high smoothness. When the substrate W is placed on the substrate supporting portion 7, the substrate W is lowered in the −Z-axis direction by the height of floating due to the compressed gas. At this time, the pads 24g sucked to the substrate W follow the descent of the substrate W and descend while being guided by the guides 24e. FIG. 7 shows the state at the end of step S109.

Next, in S110, the first pressure adjustment unit 29 starts vacuuming through the hole 28, and suction of the substrate W is started. At S110, the vacuum source 30 stops sucking the substrate W on the pad 24g. That is, the exhaust operation is stopped.

In S111, the pad 24g descends to the standby position while being guided by the guide 24e until it reaches the same height as the holder 24f due to the weight of the pad 24g and the shaft 24d due to the stop of the exhaust operation in S110. FIG. 8 shows the state at the end of step S111.

In step S<b>112 , the pad 22 is adsorbed to the fixing member 18 by the second pressure adjusting section 31 . FIG. 9 shows the state at the end of step S112.
Thus, after the rotation of the support member 23 in S108 is completed, the substrate support section 7 switches to support the substrate in the contact state in S110, and the air pad 22 switches to support the support member 23 in the contact state in S112.

Thus, the θ correction driving of the substrate W is completed. In S113, the substrate stage 5 moves the substrate W to the exposure start position.

In this manner, a plurality of suction-holding portions 24 are arranged at positions away from the center of rotation, and θ correction driving is performed in a state in which all the suction-holding portions 24 are supported by one supporting member. As a result, highly accurate .theta. correction drive can be realized even under the condition where the inertial force generated by the XY drive of the substrate stage 17 acts. Also, the above operations can be performed without leaving any distortion on the substrate.

<Second embodiment>
FIG. 10 shows the configuration of the θ correction driving mechanism 14 in the second embodiment. In the θ correction driving mechanism 14 of the second embodiment, each of the plurality of suction holding portions 24 does not have an actuator 24a. Instead, an actuator 32 is arranged above the fixed member 23 so as to exert a force on the support member 23 . The actuator 32 raises and lowers each of the plurality of suction holding portions 24 by driving the support member 23 in the Z direction.

<Third Embodiment>
The exposure apparatus 1 may handle multiple substrates at the same time. In that case, as shown in FIG. 11, the substrate stage 5 may have a plurality of .theta. correction drive mechanisms 14 corresponding to the respective substrates.

<Fourth Embodiment>
In FIG. 2A, the support member 23 is shown as an elongated member extending in the Y direction through the center of the substrate support portion 7 in plan view when the substrate support portion 7 is viewed from above. However, the direction in which the support member 23 extends is not limited to the Y direction. The direction in which the support member 23 extends may be set according to the exposure layout and shape of the substrate W, for example.

Moreover, the support member 23 is not limited to an elongated rectangular shape. The support member 23 may have, for example, a radial shape, a lattice shape, a circular shape, or the like.

<Other embodiments>
The actuator 24a in the first embodiment or the actuator 32 in the second embodiment may be omitted. For example, a configuration may be adopted in which the initial position of the pad 24g is brought as close as possible to the upper surface of the substrate supporting portion 7, and the pad 24g is lifted by the vacuum pressure of the vacuum source 30 to adhere to the substrate W.

<Embodiment of article manufacturing method>
The article manufacturing method according to the embodiment of the present invention is suitable for manufacturing articles such as microdevices such as semiconductor devices and elements having fine structures. The article manufacturing method of the present embodiment comprises a step of transferring a pattern of an original onto a substrate using the above-described lithography apparatus (exposure apparatus, imprint apparatus, drawing apparatus, etc.), and processing the substrate to which the pattern has been transferred in this step. and the step of In addition, such manufacturing methods include other well-known steps (oxidation, deposition, deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The article manufacturing method of the present embodiment is advantageous in at least one of article performance, quality, productivity, and production cost compared to conventional methods.

The invention is not limited to the embodiments described above, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the claims are appended to make public the scope of the invention.

7: Substrate supporting portion, 14: θ correction driving mechanism, 23: Supporting member, 24: Suction holding portion, 25: Rotating portion

Claims (12)

a substrate supporting part that supports the substrate in a non-contact state by ejecting gas onto the lower surface of the substrate to levitate the substrate;
a plurality of suction holding units that suck the lower surface of the substrate supported in a non-contact state by the substrate supporting unit to restrict displacement of the substrate in a first direction parallel to the surface of the substrate;
a support member that supports the plurality of suction holding parts;
a rotating part that rotates the substrate via the plurality of suction holding parts by rotating the support member around an axis that intersects the surface of the substrate;
A positioning device comprising: 2. The positioning device according to claim 1, wherein said plurality of suction holding portions are arranged at a plurality of positions away from the center of rotation of said support member. 3. The positioning according to claim 2, wherein the support member is an elongated member extending in the first direction through the center of the substrate support portion in plan view when the substrate support portion is viewed from above. Device. Each of the plurality of suction holding parts has a contact member that contacts the lower surface of the substrate by gas suction, and the contact member follows displacement of the substrate in a second direction that intersects the surface of the substrate. 4. A positioning device according to any one of claims 1 to 3, characterized in that it is arranged to be displaced by 5. The positioning apparatus according to claim 4, wherein each of said plurality of suction holding parts has an actuator for bringing said contact member into contact with the lower surface of said substrate. 5. The positioning apparatus according to claim 4, further comprising an actuator for driving said support member to bring said contact member into contact with the lower surface of said substrate. further comprising a driving mechanism for moving the substrate in the first direction;
rotating the support member in parallel with the movement of the substrate by the drive mechanism;
The positioning device according to any one of claims 1 to 6, characterized in that: further comprising a fixing member disposed below the support member;
The rotating part is fixed on the fixed member and arranged to rotate the supporting member,
further comprising an air pad disposed on the fixed member and ejecting gas toward the lower surface of the support member;
The support member is rotated in a state in which the air pad ejects gas and the support member and the air pad are in a non-contact state or in a state in which frictional resistance is reduced.
The positioning device according to claim 7, characterized in that: the substrate support is further configured to suck gas under the substrate to support the substrate in contact;
The air pad is further configured to suck gas under the support member to support the support member in contact,
After the rotation of the support member is completed, the substrate support section switches to support the substrate in the contact state, and the air pad switches to support the support member in the contact state.
The positioning device according to claim 8, characterized in that: A positioning device according to any one of claims 1 to 9,
A lithographic apparatus, wherein the apparatus is configured to transfer a pattern of an original onto a substrate positioned by the positioning device. 11. A lithographic apparatus according to claim 10, configured as an exposure apparatus or an imprint apparatus. transferring a pattern to a substrate using a lithographic apparatus according to claim 10 or 11;
processing the substrate to which the pattern has been transferred;
and manufacturing an article from the processed substrate.

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